Board-to-board connection structure, on-board charger, and vehicle

By using conductive components to directly connect the Y capacitor board and the OBC main board in the vehicle-mounted OBC/DCDC integrated product, the complexity of inter-board connections is solved, improving space utilization and installation convenience.

CN224460117UActive Publication Date: 2026-07-03SUZHOU INOSA UNITED POWER SYST CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU INOSA UNITED POWER SYST CO LTD
Filing Date
2025-08-06
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In the existing technology, the connection between the Y capacitor board and the OBC main board of the vehicle OBC/DCDC integrated product is complicated, resulting in a disordered internal layout and low space utilization.

Method used

Conductive components are directly installed between the first and second circuit boards to achieve inter-board connection, replacing wire connection, simplifying the installation process and improving space utilization.

Benefits of technology

While achieving power transfer, it also improves the space utilization and installation convenience of inter-board connections.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses an inter-board connection structure, an on-board charger, and a vehicle, relating to the field of electrical equipment technology. The inter-board connection structure includes a first circuit board, a second circuit board, and a conductive component. The second circuit board is disposed on one side of the first circuit board and is positioned opposite to it. The conductive component is disposed between the first and second circuit boards, with one end electrically connected to the surface of the first circuit board facing the second circuit board, and the other end electrically connected to the surface of the second circuit board facing the first circuit board. The technical solution provided by this utility model can improve the space utilization of the inter-board connection while achieving power transfer.
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Description

Technical Field

[0001] This utility model relates to the field of electrical equipment technology, and in particular to an inter-board connection structure, an on-board charger, and a vehicle. Background Technology

[0002] With the development of technology, new energy vehicles have been widely promoted. New energy vehicles are divided into pure electric vehicles and hybrid vehicles. Among them, OBC (On-board charger), DC-DC (Direct Current-Direct Current converter), and PDU (Power Distribution Unit) are important components of electric vehicles, and the circuit board is an important part of the OBC and DC-DC.

[0003] In related technologies, the Y capacitor board at the HVDC (high-voltage direct current) port of the vehicle OBC / DCDC integrated product needs to be connected to the OBC main board to transfer power. Related technologies usually use wires to realize the connection between the Y capacitor board and the OBC main board, which is complicated to install, resulting in a messy internal layout of the connection and low space utilization. Utility Model Content

[0004] The main purpose of this utility model is to propose an inter-board connection structure, an on-board charger, and a vehicle, which aims to improve the space utilization of the inter-board connection while achieving power transfer.

[0005] To achieve the above objectives, this utility model proposes an inter-plate connection structure, comprising:

[0006] First circuit board;

[0007] The second circuit board is disposed on one side of the first circuit board and is positioned opposite to the first circuit board;

[0008] A conductive component is disposed between the first circuit board and the second circuit board. One end of the conductive component is electrically connected to the surface of the first circuit board facing the second circuit board, and the other end of the conductive component is electrically connected to the surface of the second circuit board facing the first circuit board.

[0009] In one embodiment, the second circuit board has an exposed copper area on the surface facing the first circuit board, and the end of the conductive element away from the first circuit board abuts against the exposed copper area.

[0010] In one embodiment, an elastic body is provided at the end of the conductive element away from the first circuit board, and the elastic body elastically abuts against the exposed copper area.

[0011] In one embodiment, the conductive element is a spring-loaded probe.

[0012] In one embodiment, the end of the conductive element away from the second circuit board is soldered to the first circuit board.

[0013] In one embodiment, the first circuit board includes a first board body, a connecting board body, and a second board body. One side of the second board body is connected to one side of the first board body through the connecting board body. The second board body is disposed opposite to the second circuit board, and the end of the conductive element away from the second circuit board is soldered to the second board body.

[0014] In one embodiment, the extending direction of the conductive element is perpendicular to the surface of the first circuit board and the surface of the second circuit board.

[0015] And / or, the conductive element is provided in two parts, namely a positive conductive element and a negative conductive element, which are distributed alternately between the first circuit board and the second circuit board.

[0016] In one embodiment, the first circuit board is a Y capacitor board, and the second circuit board is an OBC main board.

[0017] To achieve the above objectives, this utility model also proposes an on-board charger, comprising:

[0018] chassis;

[0019] The inter-plate connection structure described above is disposed within the housing;

[0020] The DC-DC module is located inside the housing and is connected to the first circuit board of the inter-board connection structure.

[0021] The OBC module is located inside the housing and is connected to the second circuit board of the inter-board connection structure.

[0022] To achieve the above objectives, this utility model also proposes a vehicle, including the on-board charger described above.

[0023] This invention achieves inter-board connection and power transfer by directly installing conductive components between the first and second circuit boards, replacing the wire connection method used in related technologies. This simplifies installation and allows for a more rational internal layout of the inter-board connection, effectively improving space utilization. Therefore, this solution, using conductive component connections, effectively improves space utilization while achieving power transfer. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0025] Figure 1 An exploded view of an embodiment of the inter-plate connection structure provided by this utility model;

[0026] Figure 2 A schematic diagram of the conductive component in one embodiment of the inter-plate connection structure provided by this utility model.

[0027] Explanation of icon numbers:

[0028] label name label name 100 Inter-plate connection structure 31 elastomer 10 First circuit board 30a Positive conductive component 20 Second circuit board 30b Negative conductive component 30 conductive components

[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0031] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0032] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0033] With the development of technology, new energy vehicles have been widely promoted. New energy vehicles are divided into pure electric vehicles and hybrid vehicles. Among them, OBC (On-board charger), DC-DC (Direct Current-Direct Current converter), and PDU (Power Distribution Unit) are important components of electric vehicles, and the circuit board is an important part of the OBC and DC-DC.

[0034] In related technologies, the Y capacitor board at the HVDC (high-voltage direct current) port of the vehicle OBC / DCDC integrated product needs to be connected to the OBC main board to transfer power. Related technologies usually use wires to realize the connection between the Y capacitor board and the OBC main board, which is complicated to install, resulting in a messy internal layout of the connection and low space utilization.

[0035] To address the aforementioned problems, this utility model proposes an inter-board connection structure 100, aiming to improve the space utilization rate of the inter-board connection while achieving power transfer. The specific structure of the inter-board connection structure 100 will be described in detail below:

[0036] Please see Figure 1 , Figure 2In one embodiment of the present invention, the inter-board connection structure 100 includes a first circuit board 10, a second circuit board 20, and a conductive element 30; the second circuit board 20 is disposed on one side of the first circuit board 10 and is disposed opposite to the first circuit board 10; the conductive element 30 is disposed between the first circuit board 10 and the second circuit board 20, one end of the conductive element 30 is electrically connected to the surface of the first circuit board 10 facing the second circuit board 20, and the other end of the conductive element 30 is electrically connected to the surface of the second circuit board 20 facing the first circuit board 10.

[0037] The technical solution of this utility model achieves inter-board connection and power transfer by directly installing a conductive component 30 between the first circuit board 10 and the second circuit board 20, replacing the wire connection method used in related technologies. This method is convenient to install and makes the internal layout of the inter-board connection more reasonable, effectively improving the space utilization of the inter-board connection. Therefore, the connection method using the conductive component 30 in this solution can effectively improve the space utilization of the inter-board connection while achieving power transfer.

[0038] It should be noted that the first circuit board 10 can be a small Y-capacitor board for the HVDC port or other circuit boards that need to achieve power transfer. Here, the Y-capacitor refers to a ceramic capacitor. There are two Y-capacitors in an EMI (Electromagnetic Interference) filtering circuit: one connected to the neutral and ground wires, and the other connected to the live and ground wires. The second circuit board 20 can be an OBC mainboard or other circuit boards that need to achieve power transfer.

[0039] The first circuit board 10 and the second circuit board 20 are disposed opposite to each other. It is understood that the first circuit board 10 and the second circuit board 20 can be distributed vertically, for example, the first circuit board 10 is located above the second circuit board 20, or the second circuit board 20 is located above the first circuit board 10. Alternatively, the first circuit board 10 and the second circuit board 20 can also be distributed horizontally, for example, the first circuit board 10 is located to the left of the second circuit board 20, or the second circuit board 20 is located to the left of the first circuit board 10.

[0040] The conductive component 30 refers to a conductive structural component installed between the first circuit board 10 and the second circuit board 20, which enables power transfer between the first circuit board 10 and the second circuit board 20.

[0041] In practical applications, one end of the conductive component 30 can be electrically connected to the surface of the first circuit board 10 facing the second circuit board 20 by means of welding, bonding, insertion, or abutment. Similarly, the other end of the conductive component 30 can also be electrically connected to the surface of the second circuit board 20 facing the first circuit board 10 by means of welding, bonding, insertion, or abutment.

[0042] Furthermore, the conductive element 30 can be a rigid conductive structural element, such as an aluminum strip or copper strip. Alternatively, the conductive element 30 can also be an elastic conductive structural element, such as an aluminum strip or copper strip with an elastic body 31.

[0043] Please see Figure 1 , Figure 2 In one embodiment of the present invention, the second circuit board 20 has an exposed copper area on its surface facing the first circuit board 10, and the end of the conductive component 30 away from the first circuit board 10 abuts against the exposed copper area.

[0044] With this configuration, the end of the conductive component 30 furthest from the first circuit board 10 can be directly abutted against the exposed copper area of ​​the second circuit board 20, thus achieving a conductive connection between the conductive component 30 and the second circuit board 20. This eliminates the need for additional connection structures to achieve the connection between the conductive component 30 and the second circuit board 20, while also simplifying the installation process and further improving installation convenience.

[0045] In practical applications, the end of the conductive component 30 away from the first circuit board 10 can be rigidly connected to the exposed copper area of ​​the second circuit board 20, or it can be elastically connected, as long as the conductive component 30 is in contact with the exposed copper area to achieve conductive connection.

[0046] Please see Figure 1 , Figure 2 In one embodiment of this utility model, the conductive element 30 is provided with an elastic body 31, and the conductive element 30 elastically abuts against the exposed copper area through the elastic body 31.

[0047] With this setup, during installation, one end of the conductive element 30 is first electrically connected to the surface of the first circuit board 10, and then the second circuit board 20 is installed on one side of the first circuit board 10 and pressed against the conductive element 30 with the elastic body 31. The use of the elastic body 31 can effectively offset the stress generated during the installation of the first circuit board 10 and the second circuit board 20, and at the same time improve the connection reliability between the conductive element 30 and the second circuit board 20.

[0048] In practical applications, the elastomer 31 can specifically be a spring, sheet metal, rubber, silicone, or other elastic structural components.

[0049] Please see Figure 2 In one embodiment of this utility model, the conductive element 30 is a spring-type probe.

[0050] It should be noted that the spring-loaded probe is also called a PogoPin. A PogoPin is a precision spring-loaded probe that is assembled from three basic components: a plunger, a barrel, and a spring, using an automated riveting machine. It is also called a spring pin, spring tip, or PogoPin connector.

[0051] With this setup, by using readily available standard spring-type probes as conductive elements 30, there is no need for staff to develop and design additional conductive elements 30 with elastomers 31, thereby reducing design costs.

[0052] Please see Figure 1 , Figure 2 In one embodiment of this utility model, one end of the conductive element 30 is soldered to the surface of the first circuit board 10 facing the second circuit board 20.

[0053] This configuration, by welding one end of the conductive component 30 to the surface of the first circuit board 10 facing the second circuit board 20, not only ensures the conductive connection between the conductive component 30 and the first circuit board 10, but also improves the reliability of the connection between the conductive component 30 and the first circuit board 10, thereby reducing the risk of the conductive component 30 tilting or even falling off when the second circuit board 20 is pressed onto the conductive component 30.

[0054] In practical applications, the conductive component 30 can be welded to the first circuit board 10 by laser welding, brazing or other methods. The specific method can be determined according to the actual application and is not specifically limited here.

[0055] Please see Figure 1 In one embodiment of the present invention, the first circuit board 10 includes a first board body, a connecting board body and a second board body. One side of the second board body is connected to one side of the first board body through the connecting board body. The second board body is disposed opposite to the second circuit board 20. The end of the conductive element 30 away from the second circuit board 20 is soldered to the second board body.

[0056] With this configuration, a connecting plate and a second plate extend from one side of the first plate of the first circuit board 10, and the connecting plate connects the second plate to the first plate, so that the second plate extends to a position opposite to the second circuit board 20, thereby facilitating the conductive connection between the conductive element 30 and the first circuit board 10, while ensuring that the conductive element 30 does not affect the components on the first plate.

[0057] It should be noted that the first plate, the connecting plate, and the second plate are integrally formed. The first plate is connected to the second plate through the connecting plate, and the conductive connection is achieved through copper wires, solder, and other structures on the plate.

[0058] Please see Figure 1 In one embodiment of this utility model, the extending direction of the conductive element 30 is perpendicular to the surface of the first circuit board 10 and the surface of the second circuit board 20.

[0059] With this configuration, when the second circuit board 20 is pressed against the end of the conductive element 30 away from the first circuit board 10, the pressure on the conductive element 30 is perpendicular to the surface of the first circuit board 10, thus reducing the risk of breakage between the conductive element 30 and the first circuit board 10 under pressure.

[0060] Please see Figure 1 In one embodiment of this utility model, two conductive elements 30 are provided, namely a positive conductive element 30a and a negative conductive element 30b, which are distributed at intervals between the first circuit board 10 and the second circuit board 20.

[0061] With this configuration, the conductive connection between the first circuit board 10 and the second circuit board 20 is achieved by using positive conductive element 30a and negative conductive element 30b. This allows both the positive and negative electrodes of the first circuit board 10 and the second circuit board 20 to be connected by conductive element 30, thereby making the internal layout of the inter-board connection more reasonable and further improving the space utilization of the inter-board connection.

[0062] Please see Figure 1 In one embodiment of this utility model, the first circuit board 10 is a Y capacitor board, and the second circuit board 20 is an OBC main board.

[0063] With this setup, conductive component 30 can be used to achieve a conductive connection between the Y capacitor board and the OBC main board, solving the electrical connection problem between different boards at the HVDC port, and thus realizing power transfer between the Y capacitor board and the OBC main board.

[0064] This utility model also proposes an on-board charger, which includes a housing, an inter-board connection structure 100, a DC-DC module, and an OBC module. The specific structure of the inter-board connection structure 100 is as described in the above embodiments. Since this on-board charger adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0065] The inter-board connection structure 100 is located inside the housing; the DC-DC module is located inside the housing and is connected to the first circuit board 10 of the inter-board connection structure 100; the OBC module is located inside the housing and is connected to the second circuit board 20 of the inter-board connection structure 100.

[0066] Understandably, since the conductive component 30 is directly installed between the first circuit board 10 and the second circuit board 20, the inter-board connection is realized. In addition, by connecting the DC-DC module to the first circuit board 10 and the OBC module to the second circuit board 20, power transfer between the DC-DC module and the OBC module can be realized through the conductive component 30.

[0067] This utility model also proposes a vehicle that includes an on-board charger. The specific structure of the on-board charger is as described in the above embodiments. Since this vehicle adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0068] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. An interboard connecting structure characterized by comprising: include: First circuit board; The second circuit board is disposed on one side of the first circuit board and is positioned opposite to the first circuit board; A conductive component is disposed between the first circuit board and the second circuit board. One end of the conductive component is electrically connected to the surface of the first circuit board facing the second circuit board, and the other end of the conductive component is electrically connected to the surface of the second circuit board facing the first circuit board.

2. The interboard connecting structure according to claim 1, wherein The second circuit board has an exposed copper area on its surface facing the first circuit board, and the end of the conductive element away from the first circuit board abuts against the exposed copper area.

3. The interboard connection structure according to claim 2, wherein The conductive component is provided with an elastic body, and the conductive component elastically abuts against the exposed copper area through the elastic body.

4. The interboard connection structure according to claim 3, wherein The conductive component is a spring-loaded probe.

5. The interboard connecting structure according to any one of claims 1 to 4, wherein The end of the conductive element away from the second circuit board is soldered to the first circuit board.

6. The interboard connection structure according to claim 5, wherein The first circuit board includes a first board body, a connecting board body, and a second board body. One side of the second board body is connected to one side of the first board body through the connecting board body. The second board body is disposed opposite to the second circuit board. The end of the conductive element away from the second circuit board is soldered to the second board body.

7. The interboard connecting structure according to any one of claims 1 to 4, wherein The extension direction of the conductive element is perpendicular to the surface of the first circuit board and the surface of the second circuit board. And / or, the conductive element is provided in two parts, namely a positive conductive element and a negative conductive element, which are distributed alternately between the first circuit board and the second circuit board.

8. The interboard connecting structure according to any one of claims 1 to 4, wherein The first circuit board is a Y capacitor board, and the second circuit board is an OBC main board.

9. An on-board charger, characterized by, include: chassis; The inter-plate connection structure as described in any one of claims 1 to 8, wherein the inter-plate connection structure is disposed within the housing; The DC-DC module is located inside the housing and is connected to the first circuit board of the inter-board connection structure. The OBC module is located inside the housing and is connected to the second circuit board of the inter-board connection structure.

10. A vehicle characterized by comprising: Includes the on-board charger as described in claim 9.