Control device and vehicle

Abstract

This utility model discloses a control device and a vehicle. The device includes a control chip, a power supply circuit, a drive circuit, an inverter circuit, and an insulating mounting frame. Capacitors and inductors in the power supply circuit are mounted on the insulating mounting frame. The electronic components of the control chip, drive circuit, inverter circuit, and power supply circuit, except for the capacitors and inductors, are mounted on a PCB board. A copper busbar is installed inside the insulating mounting frame, and the capacitors and inductors are electrically connected to the copper busbar. A power interface is also provided on the insulating mounting frame and is electrically connected to the copper busbar. The PCB board has a power supply terminal and a motor signal output terminal. The power supply terminal is electrically connected to the copper busbar, and the motor signal output terminal is used to electrically connect to the motor windings. The power supply circuit supplies power to the control chip, drive circuit, and inverter circuit. The control chip provides control signals to the inverter circuit through the drive circuit, and the inverter circuit provides drive signals to the motor. The motor drives the shock absorber.

Description

Technical Field

[0001] This utility model relates to the field of PCB technology, and in particular to a control device and a vehicle. Background Technology

[0002] As a component of a vehicle, the vehicle system vibration damping controller can adjust stiffness and damping in real time and proactively according to the vehicle's driving status and road conditions, thereby improving the vehicle's driving comfort, handling stability and safety.

[0003] Existing controllers present the following technical challenges: Layout difficulties: To achieve superior comfort, the controller needs a response time of less than 10ms, the motor inverter's switching frequency needs to be greater than 40kHz, and the peak current output to the motor windings needs to reach ±300A. The motor drive inverter section generates a large current-voltage change rate during switching, leading to severe electromagnetic interference. Coupled with space constraints, this makes component placement extremely difficult. Heat dissipation challenges: Under normal circumstances, surface-mount MOSFETs dissipate heat from the bottom of the MOSFET to the PCB, then through the PCB to the insulating thermal pad, and finally to the motor housing. However, the thermal resistance of the entire heat dissipation path is as high as 7K / W, causing the MOSFET temperature to rise to 140℃, far exceeding the normal operating temperature range of the MOSFET. Vibration challenges: Since the controller is mounted next to the wheel, it vibrates with the wheel's vibration. This requires the entire controller to meet the 16G vibration test requirements to ensure its reliability under complex operating conditions. Utility Model Content

[0004] This utility model provides a control device and a vehicle to solve at least one defect in the prior art.

[0005] In a first aspect, embodiments of the present invention provide a control device, comprising:

[0006] Control chip, power supply circuit, drive circuit, inverter circuit and insulating bracket;

[0007] The capacitors and inductors in the power supply circuit are mounted on the insulating bracket, while the control chip, drive circuit, inverter circuit, and other electronic components of the power supply circuit, except for the capacitors and inductors, are mounted on the PCB board.

[0008] The insulating bracket is fixedly connected to the PCB.

[0009] The insulating fixing frame is provided with a copper busbar inside, and the capacitor and inductor are electrically connected to the copper busbar.

[0010] The insulating bracket is also equipped with a power interface, which is electrically connected to the copper busbar.

[0011] The PCB is equipped with a power supply terminal and a motor signal output terminal;

[0012] The power supply terminal is electrically connected to the copper busbar, and the motor signal output terminal is used to electrically connect to the motor windings.

[0013] The power supply circuit is used to supply power to the control chip, drive circuit and inverter circuit. The control chip provides control signals to the inverter circuit through the drive circuit. The inverter circuit is used to provide drive signals to the motor.

[0014] The motor is used to drive the shock absorber.

[0015] Optionally, the copper busbar includes a positive copper busbar and a negative copper busbar, and the positive copper busbar and the negative copper busbar are stacked together.

[0016] Optionally, the PCB board is provided with a plurality of conductive pillars, which are electrically connected to the copper busbars and are used to supply power to the bridge arms in the inverter circuit.

[0017] Optionally, the motor signal output terminal adopts a terminal block, and the terminal block is set in the PCB using Press-Fit technology.

[0018] Optionally, a copper block is embedded in the PCB, and the copper block is used for heat dissipation of the PCB.

[0019] Optionally, the conductive posts are fabricated on the surface of the PCB using SMD technology.

[0020] Optionally, the PCB is mounted on the motor housing, and a thermally conductive pad is provided between the PCB and the housing.

[0021] Optionally, the insulating bracket is made of plastic sheet.

[0022] Optionally, the control chip is a ball grid array packaged chip.

[0023] Secondly, this utility model embodiment also provides a vehicle, including any of the control devices described in this utility model embodiment.

[0024] Compared with existing technologies, the advantages of this utility model are as follows: This utility model proposes a control device with an insulating mounting bracket. The insulating mounting bracket is designed to be separate from the PCB board. The copper busbar inside the insulating mounting bracket is connected to the power supply terminal of the PCB board, forming a good conductive channel. This, combined with the copper busbar, enables power transmission, shortens the critical path length of the power circuit, and reduces the generation and propagation of electromagnetic interference (EMI). Simultaneously, the rational layout reduces signal interference between circuit modules, improves the accuracy and stability of control signal transmission, and ensures the coordinated operation of the control chip, drive circuit, and inverter circuit.

[0025] The insulating bracket provides stable support for capacitors and inductors, and its fixed connection to the PCB board enhances the overall mechanical stability of the device. During vehicle operation, under complex conditions such as vibration and bumps, it effectively prevents components from loosening or shifting, ensuring normal circuit operation and improving the reliability of vibration control. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the control device structure in the embodiment;

[0027] Figure 2 This is a schematic diagram of the location of the embedded copper pillar in the embodiment. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0029] Example 1

[0030] This embodiment proposes a control device, including: a control chip, a power supply circuit, a drive circuit, an inverter circuit, and an insulating mounting bracket.

[0031] The capacitors and inductors in the power supply circuit are mounted on an insulating bracket, while the control chip, drive circuit, inverter circuit, and other electronic components of the power supply circuit, except for the capacitors and inductors, are mounted on the PCB board.

[0032] The insulating bracket is fixedly connected to the PCB.

[0033] The insulating mounting bracket has a copper busbar inside, and the capacitors and inductors are electrically connected to the copper busbar.

[0034] The insulating bracket is also equipped with a power interface, which is electrically connected to the copper busbar.

[0035] The PCB has a power supply terminal and a motor signal output terminal.

[0036] The power supply terminal is electrically connected to the copper busbar, and the motor signal output terminal is used to electrically connect to the motor windings.

[0037] The power supply circuit provides power to the control chip, drive circuit, and inverter circuit. The control chip provides control signals to the inverter circuit through the drive circuit, and the inverter circuit provides drive signals to the motor.

[0038] The motor is used to drive the shock absorber.

[0039] In this solution, the control device is used to drive and control the vehicle's vibration damping system. The vibration damping system may include an actuator and a mechanical mechanism. The actuator may be a motor. The control device sends control signals to the actuator, and the actuator precisely adjusts the stiffness, damping, or height of the mechanical mechanism to achieve active control of the vibration damping system.

[0040] In this solution, the shock absorbers can be active or semi-active. Semi-active shock absorbers are based on a passive structure with added damping adjustment function. The opening of the damping orifice is controlled by a solenoid valve or stepper motor to achieve multi-level switching of damping force (such as soft, medium, and hard modes). Active shock absorbers directly generate force through a motor (such as a servo motor or brushless DC motor) or a hydraulic servo system to offset road impacts.

[0041] In this solution, the control chip has pre-set algorithms and logic circuits that can receive external input signals (such as signals from vehicle driving status sensors, such as vehicle speed, road bumpiness, etc.), perform calculations according to the preset control strategy, and then output corresponding control commands to the actuator.

[0042] In this scheme, the drive circuit converts the low-power control signal generated by the control chip into a high-power signal that can effectively drive the power switching devices in the inverter circuit to turn on and off, thereby achieving precise control of the inverter circuit's operating state.

[0043] The drive circuit may include power amplifier circuits, isolation circuits, etc. The power amplifier circuit is used to amplify the weak control signal output by the control chip, so that it has sufficient driving capability to control the power switching devices (such as IGBTs, MOSFETs, etc.) in the inverter circuit.

[0044] The isolation circuit is used to achieve electrical isolation between the control circuit of the control chip and the power supply circuit, to prevent the high voltage and high current of the power supply circuit from interfering with and damaging the low voltage control circuit such as the control chip, and to ensure the safety and stability of the circuit.

[0045] In this design, the inverter circuit is a three-phase bridge inverter circuit composed of multiple power switching devices (such as IGBTs and MOSFETs). The control chip controls the turn-on and turn-off sequence and timing of each power switching device to enable the inverter circuit to convert DC power into AC power with variable frequency and variable voltage.

[0046] The inverter circuit converts the DC power supplied by the power supply circuit into AC power based on the control signal from the drive circuit, providing the motor with a drive signal of specific frequency and voltage, thereby controlling the motor's speed, direction, and other operating states to meet the different working requirements of the shock absorber.

[0047] In this solution, the power supply circuit converts and processes the external input power (such as the vehicle's battery power) to provide a stable and appropriate DC power supply for the control chip, drive circuit, and inverter circuit.

[0048] The circuit may include a bus capacitor and a filter inductor. The bus capacitor mainly serves the functions of filtering and energy storage. During filtering, it smooths the DC voltage, reduces voltage ripple, and provides a clean DC power supply to the downstream circuits. In terms of energy storage, it stores and releases electrical energy to maintain voltage stability when the power input fluctuates or the load changes.

[0049] A filter circuit is formed by combining a filter inductor and a capacitor. By utilizing the inductor's resistance to changes in current, high-frequency components in the current are suppressed, further reducing ripple. At the same time, the power factor of the power supply is improved to a certain extent, and electromagnetic interference is reduced.

[0050] In this solution, there are no restrictions on the specific design of the power supply circuit, drive circuit and inverter circuit, which can be the same as the existing technology. The specific structure and working principle of each circuit will not be described in detail.

[0051] In this design, the (busbar) capacitor and (filter) inductor are mounted on an insulating bracket, and they are electrically connected to the copper busbar inside the bracket through internal electrical connection structures (such as wires, solder joints, etc.). This connection method allows the capacitor and inductor to be integrated into the electrical loop of the entire power supply circuit, performing their filtering and energy storage functions, while the insulating bracket provides both physical fixation and electrical insulation.

[0052] In this solution, the insulating bracket and the PCB are fixedly connected by mechanical means (such as screw fastening, snap-fit ​​connection, etc.) to ensure the stability of their relative positions.

[0053] Meanwhile, in terms of electrical connection, the copper busbar inside the insulating bracket is electrically connected to the power supply terminal on the PCB through wires or other conductive connectors, so that the power supply circuit can supply power to electronic components such as control chips, drive circuits, and inverter circuits on the PCB.

[0054] In this design, the external power supply is connected to the insulating mounting frame via a power interface, which is electrically connected to the copper busbar inside the frame. Capacitors and inductors are connected to the copper busbar to perform preliminary filtering and energy storage on the input power. Then, the copper busbar is electrically connected to the power supply terminal on the PCB, delivering the processed and stable DC power to the PCB to power the control chip, drive circuit, and inverter circuit, enabling the entire control device to operate normally.

[0055] In this design, the relatively large and heavy bus electrolytic capacitors and filter inductors are fixed on an insulating mounting bracket. This not only optimizes the overall layout of the control device but also provides stable support, enabling the entire control device to meet the 16G vibration requirement and ensuring its reliability and stability in practical applications.

[0056] In this design, the capacitor and inductor are placed on an insulating mounting bracket, and a copper busbar is installed inside the bracket for current leakage. This design significantly improves current carrying capacity and minimizes interference between positive and negative power supplies.

[0057] This embodiment proposes a control device with an insulating mounting bracket. The bracket is separate from the PCB board, and its internal copper busbar connects to the power supply terminal of the PCB board, forming a good conductive path. This, combined with the busbar, enables power transmission, shortening the critical path length of the power circuit and reducing the generation and propagation of electromagnetic interference (EMI). Simultaneously, the rational layout reduces signal interference between circuit modules, improving the accuracy and stability of control signal transmission and ensuring the coordinated operation of the control chip, drive circuit, and inverter circuit.

[0058] The insulating bracket provides stable support for capacitors and inductors, and its fixed connection to the PCB board enhances the overall mechanical stability of the device. During vehicle operation, under complex conditions such as vibration and bumps, it effectively prevents components from loosening or shifting, ensuring normal circuit operation and improving the reliability of the vibration-resistant system control.

[0059] Based on any of the aforementioned schemes, in one possible implementation scheme, the copper busbar includes a positive copper busbar and a negative copper busbar, which are stacked together.

[0060] In this design, the positive and negative copper busbars can be stacked one on top of the other. In this layout, the positive and negative copper busbars have a certain degree of vertical overlap, and an insulating layer is usually placed in between for electrical isolation to prevent direct short circuits between the positive and negative terminals.

[0061] In this design, the positive copper busbar is connected to the positive power supply terminal on the PCB via specific conductive connectors (such as wires, solder joints, etc.). The PCB is equipped with dedicated pads or interfaces to achieve a reliable electrical connection with the positive copper busbar, ensuring that the positive voltage introduced from the insulating bracket can be accurately delivered to the circuit modules on the PCB that require power (such as control chips, drive circuits, inverter circuits, etc.).

[0062] The negative copper busbar is also connected to the negative power supply terminal on the PCB via conductive connectors. Its connection method is similar to that of the positive terminal. A corresponding connection point is set on the PCB to introduce the potential of the negative copper busbar into the PCB, thereby forming a complete power supply loop, allowing current to flow normally between the power supply circuit and various circuit modules on the PCB.

[0063] In this design, the positive and negative copper busbars are stacked with an insulating layer in between, which makes the power circuit wiring more organized. The shorter current path can reduce the parasitic inductance and resistance of the circuit, reduce energy loss and voltage drop during current transmission, improve the power supply efficiency, and also help reduce electromagnetic interference (EMI) and improve the electromagnetic compatibility (EMC) of the entire device.

[0064] This stacked connection method is also more stable in terms of mechanical structure, and can withstand a certain degree of external stress such as vibration and impact. It ensures the reliability of power connection in complex working environments, reduces the probability of failure caused by loose connections, and improves the stability and service life of the product.

[0065] Based on any of the aforementioned solutions, in one possible implementation, a number of conductive pillars are arranged on the PCB board, the conductive pillars are electrically connected to the copper busbars, and the conductive pillars are used to supply power to the bridge arms in the inverter circuit.

[0066] In this design, the conductive pillars are made of a metallic material (such as copper). They function to conduct current in the circuit, enabling stable and reliable electrical connections between different components. They also provide mechanical support for related components, preventing loosening of connections or displacement of components due to vibration or other factors.

[0067] For example, in this solution, the conductive post and the copper busbar can be connected together by welding. Welding can form a strong electrical and mechanical connection, ensuring low contact resistance and stable current transmission between the two.

[0068] Alternatively, specialized crimping tools can be used to press the conductive post into the corresponding hole in the copper busbar, ensuring a tight bond. During the crimping process, plastic deformation occurs between the conductive post and the wall of the copper busbar hole, forming a strong electrical connection. This method eliminates the need for heating, avoiding the thermal stress and deformation problems that can occur during welding, and is suitable for heat-sensitive materials or structures.

[0069] In this design, conductive posts can be installed near each bridge arm. By drawing power from the copper busbar through these conductive posts, the path of the power current can be effectively shortened, achieving the lowest possible line impedance and line inductance, thereby reducing line heating and interference.

[0070] In this design, electrical energy in the power supply circuit is first transmitted through the copper busbar. Since the conductive posts are electrically connected to the copper busbar, the electrical energy is conducted to the conductive posts. The conductive posts then transmit the electrical energy to the lines on the PCB board that are connected to the bridge arm.

[0071] Based on the aforementioned scheme of setting conductive pillars on PCB, in one possible implementation, the conductive pillars are set on the surface of the PCB using SMD technology.

[0072] In this solution, SMD is a technology that directly mounts electronic components onto the surface of a PCB (printed circuit board). SMD technology makes the components on the PCB more compact, giving the PCB high assembly density, small size, and light weight of electronic products. At the same time, SMD components have high reliability, strong vibration resistance, low solder joint defect rate, and good high-frequency characteristics, which can reduce electromagnetic and radio frequency interference.

[0073] Based on any of the aforementioned solutions, in one possible implementation, the motor signal output terminal adopts a terminal block, which is installed on the PCB using Press-Fit technology.

[0074] In this solution, the Press-Fit mounting process is based on the principle of cold extrusion. By inserting pins (terminals) with special structures into corresponding holes on the PCB, and then applying a certain pressure, a tight mechanical and electrical connection is formed between the pins and the hole walls.

[0075] In this solution, Press-Fit mounting terminals are used to form a low-resistance, stable and reliable electrical connection, which can effectively reduce signal transmission loss and interference, and is suitable for high-speed and high-frequency signal transmission.

[0076] The connection between the terminal block and the PCB is tight, providing high resistance to vibration and impact, ensuring connection stability in complex working environments, and improving product reliability.

[0077] In this design, the terminals connecting to the motor windings utilize a multi-pin Press-Fit mounting process. After being pressed into the hole, the metal pins form a reliable electrical connection with the copper foil, preventing heat damage from soldering. This type of terminal allows for mating between the copper pin and the PCB board via copper, providing greater current carrying capacity compared to soldering under the same mounting conditions.

[0078] Based on any of the aforementioned solutions, in one possible implementation, a copper block is embedded within the PCB, and the copper block is used for heat dissipation of the PCB.

[0079] In this design, the copper block can be embedded below or near areas on the PCB where heat is concentrated. For example, near control chips, power devices (such as IGBTs in inverter circuits), and other high-power components. These areas generate a significant amount of heat during operation; placing the copper block near or below them allows for more effective heat absorption and conduction, achieving excellent heat dissipation.

[0080] In this solution, embedding copper blocks is an effective heat dissipation measure. Compared to relying solely on the PCB's own heat dissipation methods, copper blocks can significantly improve heat dissipation efficiency, meeting the heat dissipation requirements of high-power, high-performance electronic devices.

[0081] In this solution, embedding a copper block inside the PCB can reduce the system's thermal resistance from 7K / W to approximately 2K / W, effectively meeting the heat dissipation requirements of power devices and ensuring that their operating temperature is within a reasonable range.

[0082] Based on any of the aforementioned solutions, in one possible implementation, the PCB is mounted on the motor housing, and a thermally conductive pad is provided between the PCB and the housing.

[0083] In this solution, a thermal pad is placed between the PCB and the motor housing. The thermal pad dissipates heat from the PCB and the motor housing, which can effectively reduce the temperature of the motor and PCB and improve the stability and reliability of the system.

[0084] Motors may vibrate during operation. Thermal pads can provide some cushioning and shock absorption, reducing the impact of vibration on the PCB, preventing electronic components on the PCB from being damaged or loosened due to vibration, and improving the mechanical stability of the PCB.

[0085] Based on any of the aforementioned solutions, in one possible implementation, the insulating fixing frame is made of plastic sheet.

[0086] In this solution, the plastic sheet is easy to process and can be made into insulating brackets of various shapes and sizes according to design requirements to meet the installation requirements of components such as capacitors, inductors and PCB boards of different specifications.

[0087] For example, an insulating bracket with a complex structure can be manufactured using injection molding to provide precise positioning and fixation for internal circuit components.

[0088] In this solution, plastic has excellent insulation properties, which can effectively isolate live components such as capacitors, inductors, and copper busbars in the power supply circuit from other metal components or the external environment, preventing leakage and short circuits and ensuring the electrical safety of the entire control device.

[0089] Based on any of the aforementioned solutions, in one possible implementation, the control chip is packaged using a ball grid array.

[0090] In this design, the pins of the BGA packaged chip are arranged in a ball array on the bottom of the chip. This structure results in a larger pin spacing and a relatively wider distance between signal transmission lines, thereby reducing interference between signals and improving the quality and stability of signal transmission.

[0091] Because the pins are distributed on a flat surface on the bottom of the chip, rather than extending from the periphery as in traditional packages, BGA packaging significantly reduces the space occupied by the chip. This compact packaging effectively improves the space utilization of the PCB board.

[0092] BGA-packaged chips can typically be directly connected to the heat dissipation structure on the PCB through the heat dissipation pads or heat sinks on the bottom of the chip, forming a good heat dissipation channel.

[0093] When the chip generates heat during operation, the heat can be quickly conducted through these heat dissipation paths to the heat dissipation copper foil or heat sink on the PCB board, and then dissipated into the surrounding environment. Compared to some traditional packaging methods, BGA packaging has a shorter heat dissipation path and higher heat dissipation efficiency, which helps maintain the chip within its normal operating temperature range and improves the chip's stability and reliability.

[0094] Figure 1 This is a schematic diagram of the control device structure in the embodiment. Figure 2 This is a schematic diagram showing the location of the embedded copper pillar in the embodiment. (Reference) Figure 1 and Figure 2 Based on any of the aforementioned solutions, in one possible implementation, the control device includes:

[0095] Control chip, power supply circuit, drive circuit, inverter circuit and insulating bracket 2.

[0096] The capacitor 11 and inductor 12 in the power supply circuit are mounted on the insulating mounting bracket 2, while the control chip, drive circuit, inverter circuit, and other electronic components of the power supply circuit, except for the capacitor 11 and inductor 12, are mounted on the PCB board 3.

[0097] The insulating mounting bracket 2 is made of plastic. The control chip uses a ball grid array package.

[0098] The insulating bracket 2 is fixedly connected to the PCB 3; the insulating bracket 2 is equipped with a copper busbar, and the capacitor 11 and the inductor 12 are electrically connected to the copper busbar; the insulating bracket 2 is also equipped with a power interface 13, which is electrically connected to the copper busbar.

[0099] PCB 3 is provided with a power supply terminal and a motor signal output terminal 34; the power supply terminal is electrically connected to the copper busbar, and the motor signal output terminal 34 is used to electrically connect to the motor windings.

[0100] The copper busbar includes a positive copper busbar and a negative copper busbar, which are stacked together.

[0101] The power supply terminal includes a positive conductive post 31 and a negative conductive post 32, which are electrically connected to the copper busbar. The positive conductive post 31 and the negative conductive post 32 are used to supply power to the bridge arm in the inverter circuit.

[0102] The positive conductive post 31 and the negative conductive post 32 are set on the surface of PCB 3 using SMD process.

[0103] The motor signal output terminal 34 uses a terminal block, which is installed on the PCB 3 using Press-Fit technology.

[0104] A copper block 33 is embedded in PCB 3, which is used for heat dissipation of PCB 3.

[0105] PCB 3 is mounted on the motor housing 5, and a thermal pad 4 is placed between the PCB and the housing 5.

[0106] refer to Figure 2 In this design, L1 to L4 represent different conductive layers of PCB 3, which can be used to lay out circuit traces and realize functions such as signal transmission and power distribution. Different layers are electrically connected through vias and other means.

[0107] Copper block 33 is a copper material pre-embedded inside PCB 3, which is integrated with other layers during the lamination process.

[0108] In this design, relatively large components such as the bus electrolytic capacitor and the inductor at the power input port are separated, while all other components are laid out on a single PCB.

[0109] The bus electrolytic capacitor and filter inductor are placed on a plastic mounting bracket, and positive and negative copper busbars are stacked inside the bracket to carry current. This design not only significantly improves the current carrying capacity but also minimizes interference between the positive and negative power supplies. For ease of description, the component consisting of this mounting bracket, bus capacitor, and filter inductor is simply referred to as the DC busbar.

[0110] In terms of component selection, chips employing advanced packaging technologies such as ball grid array (BGA) are chosen. These chips have smaller pin pitch and higher pin density, which can effectively reduce the area and thickness of the circuit board, thereby optimizing the overall layout.

[0111] SMD supports are placed close to each arm of the inverter. By drawing power from the DC bus through these supports, the path of power current can be effectively shortened, achieving the lowest possible line impedance and line inductance, thereby reducing line heating and interference.

[0112] The terminals for the motor windings utilize a multi-pin Press-Fit mounting process. After being pressed into the hole, the metal pins form a reliable electrical connection with the copper foil, preventing heat damage from soldering. This type of terminal allows for mating between the copper pillar and the copper vias on the PCB board, providing greater current carrying capacity compared to soldering under the same mounting conditions.

[0113] By embedding copper blocks within the PCB, the thermal conductivity of the PCB is significantly improved. This improvement reduces the system's thermal resistance from 7K / W to approximately 2K / W, effectively meeting the heat dissipation requirements of the MOSFET and ensuring its operating temperature remains within a reasonable range.

[0114] To meet the 16G vibration requirements, the relatively large and heavy bus electrolytic capacitors and filter inductors are fixed to the plastic DC busbar. This measure not only optimizes the overall layout but also provides stable support for the controller, enabling the entire controller to meet the 16G vibration test requirements and ensuring its reliability and stability in practical applications.

[0115] In this solution, the circuit layout design of the control device significantly improves in terms of layout rationality, heat dissipation performance, and vibration resistance. In the automotive field, this technical solution can provide vehicles with a more stable and comfortable driving experience, and has broad application prospects. At the same time, it is of great significance for improving the technical level and market competitiveness of automotive vibration damping systems.

[0116] Example 2

[0117] This embodiment proposes a vehicle, including any of the control devices described in Embodiment 1. The implementation method and beneficial effects of the control device are the same as the corresponding content described in Embodiment 1, and the specific details will not be described in detail.

[0118] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A control device characterized by comprising: include: Control chip, power supply circuit, drive circuit, inverter circuit and insulating bracket; The capacitors and inductors in the power supply circuit are mounted on the insulating bracket, while the control chip, drive circuit, inverter circuit, and other electronic components of the power supply circuit, except for the capacitors and inductors, are mounted on the PCB board. The insulating bracket is fixedly connected to the PCB. The insulating fixing frame is provided with a copper busbar inside, and the capacitor and inductor are electrically connected to the copper busbar. The insulating bracket is also equipped with a power interface, which is electrically connected to the copper busbar. The PCB is equipped with a power supply terminal and a motor signal output terminal; The power supply terminal is electrically connected to the copper busbar, and the motor signal output terminal is used to electrically connect to the motor windings. The power supply circuit is used to supply power to the control chip, drive circuit and inverter circuit. The control chip provides control signals to the inverter circuit through the drive circuit. The inverter circuit is used to provide drive signals to the motor. The motor is used to drive the shock absorber.

2. The control device of claim 1, wherein The copper busbar includes a positive copper busbar and a negative copper busbar, which are stacked together.

3. The control device of claim 1, wherein The PCB board is provided with a number of conductive pillars, which are electrically connected to the copper busbars and are used to supply power to the bridge arms in the inverter circuit.

4. The control device of claim 1, wherein The motor signal output terminal uses a terminal block, which is installed in the PCB using Press-Fit technology.

5. The control device of claim 1, wherein A copper block is embedded in the PCB, and the copper block is used for heat dissipation of the PCB.

6. The control device of claim 3, wherein The conductive pillars are fabricated on the surface of the PCB using SMD technology.

7. The control device of claim 1, wherein The PCB is mounted on the motor housing, and a thermally conductive pad is provided between the PCB and the housing.

8. The control device of claim 1, wherein The insulating bracket is made of plastic sheet.

9. The control device of claim 1, wherein The control chip is packaged using a ball grid array.

10. A vehicle characterized by comprising: Includes the control device as described in any one of claims 1 to 9.

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