Soft material heat-conducting silica gel

Abstract

This invention provides a soft thermally conductive silicone material, belonging to the field of thermally conductive silicone. It includes a heat dissipation layer, an insulating layer glued to the upper side of the heat dissipation layer, and a pressure-resistant layer glued to the upper layer of the insulating layer. The dispersed graphene structure ensures effective heat dissipation both internally and externally, rapidly dissipating conducted heat. The boron nitride insulating layer provides efficient insulation, preventing conductivity upon chip contact and improving safety. The pressure-resistant layer, composed of fine glass fibers and with alkali-free glass fibers as a support, enhances tear resistance and mechanical strength. The elastic structure of the soft silicone layer further improves overall strength and tear resistance, preventing tearing of the material itself. A flame-retardant layer composed of silica increases the flame-retardant effect of the thermally conductive silicone. A pressure-sensitive adhesive layer ensures stable adhesion and fixation between the thermally conductive silicone and the chip.

Description

Technical Field

[0001] This utility model relates to the field of thermally conductive silicone, and more specifically, to a soft thermally conductive silicone material. Background Technology

[0002] Thermally conductive silicone pads have a certain degree of flexibility, allowing them to fit well between power devices and heat sinks or machine housings, thus achieving optimal heat conduction and dissipation. They meet the current requirements of the electronics industry for thermal conductive materials and are the best product to replace the binary heat dissipation system of thermal grease and mica sheets. In the industry, they are also known as thermally conductive silicone pads, thermally conductive silicone mats, silicone thermal pads, insulating thermal pads, soft heat dissipation pads, etc.

[0003] A search revealed that Chinese patent CN206365208U discloses a "tear-resistant thermally conductive silicone sheet," comprising a thermally conductive silicone sheet body. This sheet body includes, in order from top to bottom, a rigid thermally conductive silicone layer, a fiberglass cloth layer, a soft thermally conductive silicone layer, and a release film layer, stacked sequentially. Multiple raised strips are arranged side-by-side on the surface of the rigid thermally conductive silicone layer. This utility model has a clever and reasonable structural design. The fiberglass cloth layer significantly improves the overall tear resistance, making it less prone to tearing and ensuring the integrity of repeated installations and uses. Furthermore, the raised strips on the soft thermally conductive silicone layer further enhance the overall strength and tear resistance, preventing tearing of the material itself. Simultaneously, the softness of the silicone layer allows the raised strips to hang naturally and adhere tightly to the periphery, filling and attaching well to the heating element, improving thermal conductivity. Additionally, the presence of the raised strips creates air channels on both sides, facilitating airflow and further improving heat dissipation performance. However, the following drawbacks still exist:

[0004] (1) The existing silicone pads are not strong enough. In order to ensure a stronger adhesion during installation, it is often necessary to press them hard to make them contact the chip. However, pressing will cause deformation, or even breakage and tearing, affecting the integrity. Utility Model Content

[0005] The purpose of this invention is to address the problem of insufficient pressure resistance and tear resistance of silicone pads.

[0006] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0007] A soft, thermally conductive silicone material is proposed to improve the aforementioned problems.

[0008] The present invention is as follows:

[0009] It includes a heat dissipation layer, an insulating layer is glued to the upper side of the heat dissipation layer, and an anti-compression layer is glued to the upper layer of the insulating layer.

[0010] As a preferred technical solution of this utility model, a flame-retardant layer is connected to the upper side of the pressure-resistant layer, a soft silicone layer is provided on the upper side of the flame-retardant layer, and an adhesive layer is provided on the upper side of the soft silicone layer.

[0011] As a preferred embodiment of this invention, the heat dissipation layer is a dispersed graphene structure layer.

[0012] As a preferred embodiment of this invention, the insulating layer is composed of a boron carbide structure.

[0013] As a preferred technical solution of this utility model, the compressive layer is composed of fine glass fibers, and alkali-free glass fibers are added as a support.

[0014] As a preferred technical solution of this utility model, the flame-retardant layer is composed of a silicon dioxide structure.

[0015] As a preferred technical solution of this utility model, the surface of the adhesive layer is coated with pressure-sensitive adhesive.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] In the solution of this utility model:

[0018] By incorporating a heat dissipation layer, an insulation layer, a pressure-resistant layer, a flame-retardant layer, a soft silicone layer, and an adhesive layer, the thermally conductive silicone achieves excellent heat dissipation both internally and externally through a dispersed graphene structure, rapidly dissipating conducted heat. The boron nitride insulation layer provides highly efficient insulation, preventing conductivity upon chip contact and enhancing safety. The pressure-resistant layer, composed of fine glass fibers and supplemented with alkali-free glass fibers as a support, improves tear resistance and mechanical strength. The elastic structure of the soft silicone layer further enhances overall strength and tear resistance, preventing tearing of the material itself. The flame-retardant layer, composed of silica, increases the flame retardancy of the thermally conductive silicone. Finally, the adhesive layer, coated with pressure-sensitive adhesive, ensures stable adhesion and fixation between the thermally conductive silicone and the chip. Attached Figure Description

[0019] Figure 1 A schematic diagram of the overall structure of a soft thermally conductive silicone material provided by this utility model;

[0020] The image shows:

[0021] 1. Heat dissipation layer; 2. Insulation layer; 3. Pressure resistant layer; 4. Flame retardant layer; 5. Soft silicone layer; 6. Adhesive layer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0023] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0024] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] like Figure 1 As shown, this embodiment proposes a soft thermally conductive silicone material, including a heat dissipation layer 1, an insulating layer 2 is glued to the upper side of the heat dissipation layer 1, and an anti-compression layer 3 is glued to the upper layer of the insulating layer 2.

[0027] like Figure 1 As shown, a flame-retardant layer 4 is connected to the upper side of the pressure-resistant layer 3, a soft silicone layer 5 is provided on the upper side of the flame-retardant layer 4, and an adhesive layer 6 is provided on the upper side of the soft silicone layer 5.

[0028] like Figure 1 As shown, the heat dissipation layer 1 is a dispersed graphene structure layer. The dispersed graphene structure ensures the overall external and internal heat dissipation effect of the thermally conductive silicone, and quickly dissipates the conducted heat.

[0029] like Figure 1 As shown, the insulating layer 2 is composed of a boron carbide structure. The insulating layer 2, which is set by the boron nitride structure, provides a highly efficient insulation effect, avoids conductivity after the chip comes into contact, and improves the safety of use.

[0030] like Figure 1 As shown, the compression-resistant layer 3 is composed of fine glass fibers, and alkali-free glass fibers are added as a support. The compression-resistant layer 3, which is made of fine glass fibers, and the addition of alkali-free glass fibers as a support improves tear resistance and mechanical strength.

[0031] like Figure 1As shown, the flame retardant layer 4 is composed of a silicon dioxide structure, and the flame retardant layer 4 composed of silicon dioxide increases the flame retardant effect of the thermally conductive silicone.

[0032] like Figure 1 As shown, the surface of the adhesive layer 6 is coated with pressure-sensitive adhesive. The adhesive layer 6 with pressure-sensitive adhesive on its surface ensures stable adhesion and fixation between the thermally conductive silicone and the chip.

[0033] Specifically: the dispersed graphene structure ensures the overall external and internal heat dissipation effect of the thermally conductive silicone, rapidly dissipating conducted heat; the boron nitride insulating layer 2 provides efficient insulation, preventing conductivity after chip contact and improving safety; the finely textured glass fiber anti-compression layer 3, with alkali-free glass fiber as a support, enhances tear resistance and mechanical strength; the elastic structure of the soft silicone layer 5 further improves overall strength and tear resistance, preventing tearing of the material itself; the flame-retardant layer 4 composed of silicon dioxide increases the flame-retardant effect of the thermally conductive silicone; and the pressure-sensitive adhesive layer 6 ensures stable adhesion and fixation between the thermally conductive silicone and the chip.

[0034] All technical features in this embodiment can be freely combined according to actual needs.

[0035] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A soft material heat conducting silicone gel, comprising a heat dissipation layer (1), characterized in that: An insulating layer (2) is glued to the upper side of the heat dissipation layer (1), and an anti-compression layer (3) is glued to the upper layer of the insulating layer (2).

2. The soft thermally conductive silicone material according to claim 1, characterized in that, A flame-retardant layer (4) is connected to the upper side of the pressure-resistant layer (3), a soft silicone layer (5) is provided on the upper side of the flame-retardant layer (4), and an adhesive layer (6) is provided on the upper side of the soft silicone layer (5).

3. The soft thermally conductive silicone material according to claim 1, characterized in that, The heat dissipation layer (1) is a dispersed graphene structure layer.

4. The soft thermally conductive silicone according to claim 1, characterized in that, The insulating layer (2) is composed of a boron carbide structure.

5. The soft thermally conductive silicone material according to claim 1, characterized in that, The compressive layer (3) is composed of fine glass fibers and alkali-free glass fibers are added as a support.

6. The soft thermally conductive silicone material according to claim 2, characterized in that, The flame-retardant layer (4) is composed of a silicon dioxide structure.

7. The soft thermally conductive silicone material according to claim 2, characterized in that, The surface of the adhesive layer (6) is coated with pressure-sensitive adhesive.

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