A high-sealing and interference-resistant time delay module device

By using a stepped enclosure and cover design, combined with conductive gaskets and shielding layers, the problem of non-sealing in the step delay module housing is solved, achieving high sealing performance and anti-interference capabilities, while also facilitating the installation and heat dissipation of circuit components.

CN224460403UActive Publication Date: 2026-07-03MIANYANG HAITIAN NEW MEASUREMENT & CONTROL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
MIANYANG HAITIAN NEW MEASUREMENT & CONTROL TECH CO LTD
Filing Date
2025-07-11
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

The existing step delay module's housing structure is not tight at the joints, which can easily cause electromagnetic leakage, and the one-piece molding process is inconvenient for processing and installation.

Method used

The enclosure and cover feature a stepped design and are sealed with screws. Combined with conductive gaskets and shielding layers, a closed shielded cavity is formed to enhance anti-interference capabilities. A Π-type filter circuit is set on the PCB board and grounded with the enclosure to suppress conducted interference. A heat dissipation module is used to improve heat dissipation.

Benefits of technology

The sealing and electromagnetic interference resistance of the delay module have been improved, while the installation and heat dissipation of circuit components have been facilitated, thus enhancing the overall performance of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a high-sealing and anti-interference time delay module device, belonging to the technical field of time delay modules. It includes a housing and a cover. Both the housing and the cover have steps on their edges that can cooperate with each other. The cover has several through holes, and the housing has screw holes that correspond one-to-one with the through holes on the cover. The cover is threadedly connected to the housing by screws passing through the through holes. A mounting groove is formed around the circumference of the housing on the stepped surface of the edge steps, and a conductive gasket is placed in the mounting groove. The screw-connected housing and cover facilitate the installation of circuit components in the time delay module device. When the housing and cover are closed, the steps extend the electromagnetic leakage path, and the conductive gasket on the stepped surface forms an effective closed shielding cavity within the housing, improving the anti-interference and sealing performance of the time delay module device.
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