Integrated LED MIP package structure and display unit

Abstract

This utility model discloses an integrated LED MIP packaging structure and display unit, relating to the field of LED displays. It includes a substrate, pad assemblies, LED chip modules, annular partition walls, and encapsulating blocks. Multiple pad assemblies, LED chip modules, and partition walls are included. Each pad assembly is fixed to one side of the substrate. Each LED chip module is connected to a pad assembly. Each partition wall surrounds the outside of one LED chip module. The encapsulating block is disposed on the side of the substrate near the LED chip module, encapsulating the pad assemblies and LED chip modules within the mounting grooves formed by the partition walls. Each partition wall reflects the light from its corresponding LED chip module to the encapsulating block and then emits it. By blocking the light from the LED chip modules, the partition walls prevent crosstalk. The display unit includes multiple integrated LED MIP packaging structures. This utility model has the advantages of good color mixing performance, environmental friendliness, and low cost.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and in particular to an integrated LED MIP packaging structure and display unit. Background Technology

[0002] Micro-Package (MIP) LEDs are widely used in LED micro-pitch (0.X MM) displays due to their small size and excellent color mixing effects. Current technologies typically involve packaging individual MIP LEDs and then assembling them on a display board. Because of the small physical size of LED MIPs (side length less than 0.X MM), the unit display boards assembled from them suffer from low soldering strength, easy damage to the LEDs, and poor moisture resistance, making them prone to electrical performance failures and other quality defects. These quality defects become even more pronounced as the external dimensions of LED MIP LEDs need to be further reduced to meet the requirements of LED micro-pitch displays, making it more difficult to achieve high yield and low cost in mass production of LED micro-pitch displays, thus hindering the application of LED MIPs in LED micro-pitch displays. Utility Model Content

[0003] The purpose of this invention is to provide an integrated LED MIP packaging structure and display unit to solve the problems existing in the prior art, and it has the advantages of good color mixing performance, environmental friendliness and low cost.

[0004] To achieve the above objectives, this utility model provides the following solution:

[0005] This utility model provides an integrated LED MIP packaging structure, including a substrate, pad assemblies, LED chip modules, partition walls, and encapsulating blocks. Multiple pad assemblies, LED chip modules, and partition walls are included. Each pad assembly is fixedly connected to the same side of the substrate. All LED chip modules are connected to one pad assembly. Each partition wall is annular, surrounding the outside of one LED chip module. The encapsulating block is disposed on the side of the substrate near the LED chip module, encapsulating the pad assemblies and LED chip modules within mounting grooves formed by the corresponding partition walls. Each partition wall reflects light emitted from the corresponding LED chip module to the encapsulating block and exits from the encapsulating block. By blocking the light from the corresponding LED chip module, each partition wall prevents crosstalk between the LED chip modules.

[0006] Preferably, the cross section parallel to the substrate is a cross section, and the cross section of each mounting groove is elongated; all the LED chip modules, all the pad assemblies, and all the partition walls are arranged on the substrate in a rectangular array.

[0007] Preferably, each of the partition walls includes a first partition wall, the inner sidewall of the first partition wall being inclined from the side close to the substrate to the side away from the substrate, and the end of the inner sidewall of each first partition wall away from the substrate being inclined towards the side away from the LED chip module.

[0008] Preferably, each of the partition walls further includes a second partition wall, each of the second partition walls filling the gap between adjacent pad assemblies.

[0009] Preferably, the encapsulating block has multiple rows of first grooves and multiple rows of second grooves on the side away from the substrate. Each first groove extends along the row direction of the rectangular array formed by the LED chip modules, and each second groove extends along the column direction of the rectangular array formed by the LED chip modules. Two opposing sidewalls of each partition wall extend along the row direction, and two other opposing sidewalls of each partition wall extend along the column direction. Each sidewall of each partition wall extending along the row direction is opposite to one of the first grooves, and each sidewall of each partition wall extending along the column direction is opposite to one of the second grooves.

[0010] Preferably, the widths of the first groove and the second groove are equal to the gap between the cut integrated LED MIP after mounting.

[0011] Preferably, a chip circuit is provided on the side of the substrate near the pad assembly, and an external circuit is provided on the other side of the substrate, with each chip circuit connected to each pad; a plurality of circuit vias are provided on the substrate, and the chip circuits and the external circuits are connected through the circuit vias; one end of each circuit via near the chip circuit can be covered by a side wall of a partition wall.

[0012] Preferably, an insulating adhesive is printed on the side of the substrate where the external circuit is located, and the insulating adhesive is used to encapsulate the external circuit; the insulating adhesive is connected and fused to the second partition wall through the circuit via.

[0013] This embodiment provides a display unit with the aforementioned integrated LED MIP package structure.

[0014] The present invention achieves the following technical advantages over the prior art:

[0015] This utility model provides an integrated LED MIP packaging structure and display unit, including a substrate, pad assemblies, LED chip modules, partition walls, and encapsulation blocks. Multiple pad assemblies, LED chip modules, and partition walls are included. Each pad assembly is fixedly connected to the same side of the substrate. Each LED chip module is connected to one pad assembly. Each partition wall is annular, surrounding the outside of one LED chip module. The encapsulation block is disposed on the side of the substrate near the LED chip module, encapsulating the pad assembly and LED chip module within the mounting groove formed by the corresponding partition walls. Each partition wall can reflect the light emitted by the corresponding LED chip module to the encapsulation block and then emit it out. By blocking the light from the corresponding LED chip module, each partition wall can prevent crosstalk between the LED chip module's light and the light from the LED chip module.

[0016] This invention, by setting up partition walls, places the LED chip modules in an independent, structurally robust, and enclosed space. This ensures stable light emission from individual LED chip modules, prevents color mixing, and provides excellent color reproduction performance for pixels formed by adjacent LED chip modules. Furthermore, multiple LED chip modules are integrated into a single unit using a substrate and encapsulating blocks. The integrated LEDMIP is several times larger than a single MIP LED chip, and has several times more solder pads. Its welding strength, impact resistance, and heat dissipation performance are all superior to a single LED MIP chip. The encapsulating blocks effectively block moisture and humidity, improving environmental resistance. This invention offers the advantages necessary for LED micro-pitch displays: excellent color mixing performance, environmental friendliness, and low cost. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 Top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 1 ;

[0019] Figure 2 for Figure 1 A sectional view cut along the transverse centerline;

[0020] Figure 3 Top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 2 ;

[0021] Figure 4 for Figure 3 A sectional view cut along the transverse centerline;

[0022] Figure 5 Top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 3 ;

[0023] Figure 6 for Figure 5 A sectional view cut along the transverse centerline;

[0024] Figure 7 Top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 4 ;

[0025] Figure 8 for Figure 7 A sectional view cut along the transverse centerline;

[0026] Figure 9 Top view of the integrated LED MIP package structure provided in Example 1 Figure 1 ;

[0027] Figure 10 for Figure 9 A cross-sectional view taken along the transverse centerline of the LED chip module;

[0028] Figure 11 for Figure 9 A cross-sectional view taken along the longitudinal centerline of the LED chip module;

[0029] Figure 12 Top view of the integrated LED MIP package structure provided in Example 1 Figure 2 ;

[0030] Figure 13 for Figure 12 A cross-sectional view taken along the transverse centerline of the LED chip module;

[0031] Figure 14 for Figure 12 A cross-sectional view taken along the longitudinal centerline of the LED chip module;

[0032] Figure 15 Top view of the integrated LED MIP package structure provided in Example 1 Figure 3 ;

[0033] In the diagram: 100, Integrated LED MIP package structure; 1, Substrate; 101, Circuit via; 2, Pad assembly; 3, LED chip module; 4, Separating wall; 401, Mounting groove; 402, First separating wall; 403, Second separating wall; 404, Primary printed adhesive; 405, Secondary printed adhesive; 5, Encapsulation block; 6, First groove; 7, Second groove; 8, Solder paste. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] It should be noted that in the description of this utility model, the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "center," "longitudinal," "transverse," "length," "width," "thickness," "vertical," "horizontal," "top," "bottom," "clockwise," and "counterclockwise," etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. These are merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] The purpose of this invention is to provide an integrated LED MIP packaging structure and display unit to solve the problems existing in the prior art, and it has the advantages of good color mixing performance, environmental friendliness and low cost.

[0038] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] like Figures 1-15 As shown, this embodiment provides an integrated LED MIP packaging structure 100, including a substrate 1, pad assemblies 2, LED chip modules 3, partition walls 4, and encapsulation blocks 5. Multiple pad assemblies 2, LED chip modules 3, and partition walls 4 are included. Each pad assembly 2 is fixedly connected to the same side of the substrate 1. All LED chip modules 3 are connected to one pad assembly 2. Each partition wall 4 is annular, surrounding the outside of one LED chip module 3. The encapsulation block 5 is disposed on the side of the substrate 1 near the LED chip module 3, encapsulating the pad assembly 2 and LED chip module 3 within the mounting groove 401 formed by the corresponding partition walls 4. Each partition wall 4 can reflect the light emitted by the corresponding LED chip module 3 to the encapsulation block 5 and then emit it out. By blocking the light from the corresponding LED chip module 3, each partition wall 4 can prevent crosstalk between the light emitted by the LED chip module 3.

[0041] In this embodiment, by setting up a partition wall 4, the LED chip modules 3 are placed in an independent, structurally strong, and enclosed space. This ensures stable light emission from each individual LED chip module 3, prevents color mixing, and allows adjacent LED chip modules 3 to form pixels with good color reproduction performance. Furthermore, in this embodiment, multiple LED chip modules 3 are integrated into a single unit using a substrate 1 and an encapsulating block 5. The integrated LED MIP has a size several times larger than a single MIP LED chip, and the number of solder pads is also several times that of a single MIP LED chip. Its welding strength, impact resistance, and heat dissipation performance are all superior to those of a single LED MIP LED chip. The encapsulating block 5 effectively blocks moisture and humidity, improving environmental resistance. This embodiment possesses the advantages of good color mixing performance, environmental friendliness, and low cost necessary for LED micro-pitch displays.

[0042] In this specific embodiment, the cross section parallel to the substrate 1 is the cross section, and the cross section of each mounting groove 401 is elongated. All LED chip modules 3, all pad assemblies 2 and all partition walls 4 are arranged on the substrate 1 in the form of a rectangular array (M*N array), thereby forming an independent LED MIP unit integration with M*N pixel lamps.

[0043] In this specific embodiment, each partition wall 4 includes a first partition wall 402. The inner sidewall of the first partition wall 402 is inclined from the side close to the substrate 1 to the side away from the substrate 1, and the end of the inner sidewall of each first partition wall 402 away from the substrate 1 is inclined towards the side away from the LED chip module 3.

[0044] In this specific embodiment, each partition wall 4 further includes a second partition wall 403, and each second partition wall 403 fills the gap between adjacent pad assemblies 2.

[0045] In this specific embodiment, the encapsulating block 5 has multiple rows of first grooves 6 and multiple rows of second grooves 7 on the side away from the substrate 1. Each first groove 6 extends along the row direction of the rectangular array formed by the LED chip modules 3, and each second groove 7 extends along the column direction of the rectangular array formed by the LED chip modules 3. Two opposite sidewalls of each partition wall 4 extend along the row direction, and the other two opposite sidewalls of each partition wall 4 extend along the column direction. Each sidewall of each partition wall 4 extending along the row direction is opposite to one of the first grooves 6, and each sidewall of each partition wall 4 extending along the column direction is opposite to one of the second grooves 7. When multiple integrated LED MIP package structures are mounted on the display board for assembly and splicing, there will be gaps between the LED MIP package structures. By aligning the first grooves 6 of two adjacent LED MIP package structures and aligning the first grooves 6 of two adjacent LED MIP package structures, the gaps between the spliced ​​LED MIP package structures can be kept consistent.

[0046] In this specific embodiment, the width of the first groove 6 and the second groove 7 is equal to the width of the gap between two adjacent integrated LED MIP package structures 100 when the integrated LED MIP package structure 100 is assembled and spliced ​​on the display.

[0047] In this specific embodiment, a chip circuit is provided on the side of the substrate 1 near the pad assembly 2, and an external circuit is provided on the other side of the substrate 1. Each chip circuit is connected to each pad. A plurality of circuit vias 101 are provided on the substrate 1, and the chip circuit and the external circuit are connected through the circuit vias 101. The end of each circuit via 101 near the chip circuit can be covered by a side wall of a partition wall 4.

[0048] In this specific embodiment, an insulating colloid is printed on the side of the substrate 1 where the external circuit is located. The insulating colloid is used to encapsulate the external circuit. The circuit vias 101 are filled with insulating colloid, and the insulating colloid is connected and fused with the second partition wall 403 through the circuit vias 101. This strengthens the circuit protection of the encapsulation substrate 1 and prevents moisture from entering the mounting surface of the LED chip module 3 from the external circuit surface of the encapsulation substrate 1, thereby improving the environmental resistance of the LED chip module 3. Furthermore, the end of each circuit via 101 closest to the chip circuit can be covered by a sidewall of a partition wall 4, which further strengthens the fusion of the circuit via 101, the second partition wall 403, and the insulating colloid.

[0049] In this specific embodiment, the substrate 1 is a multilayer circuit board. The substrate 1 is preferably a 0.5OZ copper-thick BT board with a thickness of 0.2-0.3MM. The electrode connection circuit of the LED chip module 3 is preferably treated with immersion gold. The fixed surface of the integrated LED MIP package structure 100 is provided with the LED chip electrodes of the array of LED chip modules 3 and the interconnected row and column circuits. The other side of the substrate 1 is also provided with the electrodes required for the LED chip array and the interconnected circuits. The leads of the LED chip electrodes on the integrated LED MIP package structure 100 are connected to the external driving circuit by the circuit pads provided on the external circuit.

[0050] In this specific embodiment, the circuit via 101 is preferably a copper via, and the diameter of the via is not greater than the width of the second partition wall 403 at the partition or intersection. The substrate 1, except for the pads that are soldered to and connected to the external drive circuit, is entirely printed with insulating adhesive.

[0051] In this specific embodiment, on the surface of the arrayed LED chip modules 3 fixed to the encapsulation substrate 1, insulating adhesive is used to form a partition wall 4 surrounding the LED chip modules 3 through multiple printing processes. Preferably, a second to a third printing process is performed on the surface of the first printed and cured surrounding wall (second partition wall 403) to form a first partition wall 402. The longitudinal cross-section of the adhesive in the row and column directions of the second and subsequent printing processes is trapezoidal or arc-shaped to reflect the optical fiber, allowing the optical fiber to exit through the encapsulation block 5. The maximum height of the partition wall 4 is equal to or lower than that of the fixed substrate 5. The height of the upper surface of the LED chip module 3 is such that the encapsulating adhesive block 5 covers the LED chip module 3 and the partition wall 4, strengthening the fusion strength between the partition wall 4 and the encapsulation substrate 1; the adhesive walls surrounding the LED chip module 3 fuse together to form an annular partition wall 4, constituting an array of porous adhesive layers that fix the LED chip module 3; the space of the mounting groove 401 of the fixed LED chip module 3 is in the shape of an inverted trapezoid, and the array of porous adhesive spaces constitutes an integrated MIP array LED chip fixing assembly.

[0052] In this specific embodiment, LED chips are fixed and soldered within an array of enclosed spaces formed by multiple printing colloids. Only one chip from an RGB chip group is fixed and soldered within a single enclosed hole on the array of multi-hole LED MIP integrated sheet. When fixing and soldering single RGB single-color chips, the array arrangement is required by the LED MIP display circuit. When fixing, the polarity of the electrodes of LED chips of the same color is kept consistent (ensuring that the positive and negative poles (anode / cathode) of all LED chips are uniformly arranged). The surface height of the LED chip after fixing and soldering is equal to or higher than the upper surface of the trapezoidal colloid wall of the multi-layer printing colloid. The LED chip electrode connection circuit piece set at the bottom of the inverted trapezoidal enclosed long strip space is larger than the LED chip surface and has space allowance for soldering pads for LED chips.

[0053] In this specific embodiment, all RGB chipset LED chips are flip-chip LED chips. The light-emitting layer of the flip-chip LED chip after soldering is located on the bottom surface of the LED chip. Since the height of the printed colloid surrounding the LED chip is equal to or lower than the height of the upper surface of the LED chip, the light emitted by the LED chip will be directed towards the upper surface of the encapsulating colloid at a certain cone angle. The hemispherical light emitted by the LED chip is laterally blocked by the surrounding colloid and reflected to the surface, thereby improving the light collection efficiency of the MIP LED chip and blocking the crosstalk between adjacent LED chips, thus improving the image reproduction quality.

[0054] In this specific embodiment, encapsulating adhesive is applied to the integrated LED MIP package substrate, where LED chip electrodes have been fixed and soldered. The adhesive fills the inverted trapezoidal mounting holes of the chip and forms an encapsulating adhesive layer of a certain thickness above the upper surface of the LED chip. The surface of the cured integrated MIP encapsulating adhesive is first ground smooth, and then crisscrossed grooves are made on the smoothed MIP encapsulating adhesive surface. The groove lines are scribed at the center of the trapezoidal cross-section formed by the multi-layer printed adhesive. The width of the grooves is equal to the gap between the integrated LED MIPs after mounting. The bottom layer of the grooves is deeper than the upper surface layer of the LED chip inside the hole, preventing light crosstalk between the LED chips and providing a certain thickness of encapsulating adhesive layer protection for the sides of the LED chips. This ensures that the light emitted by any LED chip in the mounted integrated LED MIP is equivalent to the light emitted by any adjacent mounted integrated LED MIP, guaranteeing the consistency of light mixing and color mixing between adjacent chips in adjacent integrated LED MIPs.

[0055] In this specific embodiment, the integrated MIP with scribbled grooves is cut around its four sides by a dicing machine. The cut integrated LED MIPs are then sorted, tapered, and packaged for mounting.

[0056] In this specific embodiment, the LED MIP unit uses a 3x2 unit pixel.

[0057] In this specific embodiment, the LED chip module 3 includes a GRB chip.

[0058] In this specific embodiment, the LED chip module 3 includes 3 GRB chips, which are disposed in a mounting slot 401 to form independent RGB pixels, and multiple (M*N) pixels are connected together and integrated into an LED MIP.

[0059] Example 2

[0060] This embodiment provides a packaging method for the integrated LED MIP packaging structure 100, which includes the following steps:

[0061] S1. Solder the pad assembly 2 onto the substrate 1;

[0062] S2. Form multiple partition walls 4 on substrate 1;

[0063] S3. Install each LED chip module 3 in the mounting slot 401 and connect each LED chip module 3 to the corresponding pad assembly 2.

[0064] S4. Apply encapsulating adhesive to the side of substrate 1 near the pad assembly 2.

[0065] In this specific embodiment, a partition wall 4 is fixed on the pre-fabricated packaged circuit chip printed chip. After the first printing adhesive 404 is cured, a second printing adhesive 405 is printed, and so on. Preferably, the printing adhesive for the partition wall 4 is a black epoxy resin solid adhesive. The multilayer printing adhesive equipment is a fine alignment printing equipment.

[0066] Before mounting and soldering the LED chip module 3, solder paste 8 for mounting the LED chip is printed first. Then, the die bonder places the LED chip in an inverted trapezoidal shape into the circuit chip with the solder paste already printed in the chip mounting hole, and then it is mounted and soldered in a high-temperature nitrogen reflow oven.

[0067] Preferably, the LED RGB chip is a flip-chip LED chip.

[0068] Preferably, the solder paste 8 for the chip electrode sheet is printed using precision stepped stencil printing.

[0069] Preferably, the LED chip is fixed by a general-purpose bonding machine and then bonded at high temperature in a nitrogen reflow oven.

[0070] A precision dispensing machine dispenses adhesive onto the surface of the single integrated LED MIP on the packaging circuit board. After high-temperature curing, the surface of the encapsulating adhesive is smoothed by a grinding wheel grinder. The smoothed surface of the integrated MIP is then divided into groove lines by a precision dicing machine. The integrated LED MIP is then cut and separated around its perimeter by the precision dicing machine. The separated integrated LED MIPs are then sorted and taped for mounting.

[0071] Preferably, a precision dispensing machine is used, and a black epoxy resin adhesive with a certain light transmittance is used for encapsulation.

[0072] Preferably, the groove scribing and MIP cutting and separation equipment is a precision scribing machine.

[0073] Example 3

[0074] This embodiment provides a display unit with the integrated LED MIP package structure 100 as described in Embodiment 1.

[0075] This utility model uses specific examples to illustrate its principles and implementation methods. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the idea of ​​this utility model. In summary, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. An integrated LED MIP package structure, characterized in that: The device includes a substrate, pad assemblies, LED chip modules, partition walls, and encapsulating blocks. Multiple pad assemblies, LED chip modules, and partition walls are used. Each pad assembly is fixedly connected to the same side of the substrate. All LED chip modules are connected to one pad assembly. Each partition wall is annular, surrounding the outside of one LED chip module. The encapsulating block is disposed on the side of the substrate near the LED chip module, encapsulating the pad assemblies and LED chip modules within mounting grooves formed by the corresponding partition walls. Each partition wall reflects light emitted from the corresponding LED chip module to the encapsulating block and exits from it. By blocking the light from the corresponding LED chip module, each partition wall prevents crosstalk between the LED chip modules.

2. The integrated LED MIP package structure of claim 1, wherein: The cross section parallel to the substrate is a cross section, and the cross section of each mounting groove is elongated; all the LED chip modules, all the pad assemblies, and all the partition walls are arranged in a rectangular array on the substrate.

3. The integrated LED MIP package structure of claim 2, wherein: Each of the partition walls includes a first partition wall, the inner sidewall of the first partition wall being inclined from the side close to the substrate to the side away from the substrate, and the end of the inner sidewall of each first partition wall away from the substrate being inclined towards the side away from the LED chip module.

4. The integrated LED MIP package structure of claim 3, wherein: Each of the partition walls also includes a second partition wall, each of the second partition walls filling the gap between adjacent pad assemblies.

5. The integrated LED MIP packaging structure according to claim 2, characterized in that: The encapsulating block has multiple rows of first grooves and multiple rows of second grooves on the side away from the substrate. Each first groove extends along the row direction of the rectangular array formed by the LED chip modules, and each second groove extends along the column direction of the rectangular array formed by the LED chip modules. Two opposite sidewalls of each partition wall extend along the row direction, and two other opposite sidewalls of each partition wall extend along the column direction. Each sidewall of each partition wall extending along the row direction is opposite to one of the first grooves, and each sidewall of each partition wall extending along the column direction is opposite to one of the second grooves.

6. The integrated LED MIP package structure of claim 5, wherein: The widths of the first groove and the second groove are equal to the width of the gap between two adjacent integrated LED MIP packages when the integrated LED MIP packages are assembled and spliced ​​on the display.

7. The integrated LED MIP package structure of claim 4, wherein: A chip circuit is provided on one side of the substrate near the pad assembly, and an external circuit is provided on the other side of the substrate. Each chip circuit is connected to each pad. A plurality of circuit vias are provided on the substrate, and the chip circuits are connected to the external circuits through the circuit vias. One end of each circuit via near the chip circuit can be covered by a side wall of a partition wall.

8. The integrated LED MIP package structure of claim 7, wherein: An insulating colloid is printed on one side of the substrate where the external circuit is located. The insulating colloid is used to encapsulate the external circuit. The insulating colloid is connected and fused to the second partition wall through the circuit via.

9. A display unit, characterized by: An integrated LED MIP package structure according to any one of claims 1-8 is provided.

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