A drying device in the wafer cleaning process

Abstract

This utility model relates to the field of wafer cleaning and drying technology, and discloses a drying device in the wafer cleaning process, including a robotic arm body and a cleaning tank disposed on one side of the robotic arm body. Two second connecting valve pipes and two first connecting valve pipes are respectively disposed at the top and bottom of one side of the cleaning tank. An adjustment platform is driven to the output end of the robotic arm body. This utility model, by setting two clamping components, can clamp the wafer basket and its front and rear end limit rods in a fitted manner under the support of the adjustment platform, achieving an anti-detachment effect. Subsequently, during transfer driven by the robotic arm body, the wafer basket and the multiple wafers carried inside it can be cleaned and moved and dried in multiple stages within the cleaning tank, significantly improving the drying effect and solving the wafer readjustment problem in the prior art, ensuring the safety of the wafers during the integrated cleaning and drying process.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning and drying technology, specifically a drying device for the wafer cleaning process. Background Technology

[0002] In the semiconductor manufacturing process, wafers are usually placed in dedicated baskets for cleaning, drying, and transfer to the production line in basket units. This batch processing method can effectively protect wafers and reduce direct contact between people and wafers during the process. With the increase in automation, using robotic arms to grab baskets for centralized transfer between workstations has become the mainstream of the production line. This method significantly improves handling efficiency and avoids contamination or scratches caused by end effectors directly contacting the wafer surface.

[0003] Currently, regarding wafer lifting in the drying tank, the patent document with application number CN202220228869.1 discloses a wafer vertical lifting mechanism for a wafer drying device. The specification proposes that the wafer is vertically lifted from the tank liquid by the lifting mechanism to complete the drying, avoiding liquid level disturbance caused by horizontal movement.

[0004] However, in practical applications, when the lifting mechanism performs the drying action, it must apply a direct lifting force to the wafer body, and there is a mechanical docking link between the lifting path and the subsequent basket removal action. If the docking mechanism has a stroke deviation or positioning error, it will not only cause the wafer to slide or collide in the basket, causing damage to the edge of the wafer body, but may even cause microcracks due to uneven force, which will seriously affect the subsequent processing quality and yield.

[0005] Therefore, designing a solution that allows the wafer to be dried without directly lifting the wafer body after cleaning and drying, thus achieving a smooth and non-destructive transition between cleaning, drying and transfer, has become a pressing technical problem in this field. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a drying device for the wafer cleaning process, which solves the problems mentioned in the background section.

[0007] This utility model provides the following technical solution: a drying device in the wafer cleaning process, including a robotic arm body and a cleaning box disposed on one side of the robotic arm body. Two second connecting valve pipes and two first connecting valve pipes are respectively disposed on the top and bottom of one side of the cleaning box. An adjustment platform is driven to the output end of the robotic arm body. A wafer basket is disposed on the top of the cleaning box, and limit rods are fixed at both the front and rear ends of the middle of the wafer basket. Clamping components are disposed at both the front and rear ends of the adjustment platform, and the two clamping components can be respectively fitted with the two limit rods to clamp and limit the wafer basket. Sealing covers are slidably connected to both sides of the top of the cleaning box, and displacement transmission components are disposed at both the front and rear ends of the cleaning box. The two displacement transmission components are respectively driven to one side of the two sealing covers and can drive the two sealing covers to reciprocate to open and close the space at the top of the cleaning box. The opposite sides of the two sealing covers can be engaged with the output structure of the clamping components.

[0008] Preferably, both clamping components include a first electric push rod and a clamping plate. The top structure of the clamping plate is connected to the output end of the first electric push rod installed on the top of the adjustment platform. The bottom of the clamping plate is provided with a positioning hole that can be movably engaged with the limiting rod.

[0009] Preferably, reinforcing plates are fixed on both sides of the top of the clamping plate, and assembly holes are opened in the front and rear ends of the adjustment platform. An auxiliary rod that can be received and accommodated in the assembly hole is fixed at the end of the reinforcing plate away from the clamping plate.

[0010] Preferably, the assembly hole can completely accommodate the auxiliary rod, and the adjustment platform and the auxiliary rod are made of ferrous material and magnetic material, respectively.

[0011] Preferably, a trapezoidal reinforcing plate is fixed between the end of the limiting rod near the surface of the wafer basket and the surface of the wafer basket, and one side of the two trapezoidal reinforcing plates are spliced ​​together to form an auxiliary platform that fits and connects with the bottom surface of the clamping plate.

[0012] Preferably, the displacement transmission assembly includes a support guide and a second electric push rod. The middle part of the support guide and the middle part of the housing of the second electric push rod are both fixed to the front or rear surface of the cleaning tank. The output end of the second electric push rod is connected to a linkage plate that is engaged with the support guide. The top of the linkage plate is fixed to the bottom of one side of the sealing cover.

[0013] Preferably, the front and rear ends of the sealing cover are provided with sliding grooves, and guide rails fixed to the top of the corresponding side of the cleaning tank are engaged in the sliding grooves. The guide rails are made of rubber material.

[0014] Preferably, each of the two sealing covers has a clearance groove on one side of its opposite side, and a C-shaped rubber sleeve is nested in the clearance groove. The C-shaped rubber sleeve can be engaged with the middle or top of the clamping plate.

[0015] Preferably, when the two sealing covers are in contact and close the top space of the cleaning tank, the two C-shaped rubber sleeves located on the left and right sides combine to seal the middle or top of the same clamp.

[0016] Preferably, the valves inside the first connecting valve pipe and the valves inside the second connecting valve pipe are both solenoid valves, and a clearance gap is provided between the first connecting valve pipe and the second connecting valve pipe and the linkage plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. This utility model, by setting two clamping components, can clamp the wafer basket and the limiting rods set at its front and rear ends while supporting the adjustment platform, thus achieving an anti-detachment effect. When the wafer basket and the multiple wafers carried inside the wafer basket are transferred under the drive of the robotic arm, they can be cleaned and moved and dried in multiple stages inside the cleaning box. This not only greatly improves the drying effect, but also solves the wafer readjustment problem in the prior art, ensuring the safety of the wafers in the integrated cleaning and drying process.

[0019] 2. The two displacement transmission components and their corresponding sealing covers, along with the C-shaped rubber sleeves inside the two sealing covers, are integrated and used in this utility model. This ensures that the wafer basket moves and is adjusted within the cleaning chamber without interfering with the clamping components, while maintaining a relatively sealed effect inside the cleaning chamber. This guarantees that the drying gas introduced into the cleaning chamber can fully contact the wafer, thereby improving drying efficiency. Attached Figure Description

[0020] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a three-dimensional schematic diagram of the cleaning box structure of this utility model;

[0022] Figure 3 This is a rear view schematic diagram of the wafer flower basket structure of this utility model;

[0023] Figure 4 This is a left-side view of the structure of this utility model;

[0024] Figure 5 This utility model Figure 3 Enlarged view of point A in the middle;

[0025] Figure 6 This is a partial cross-sectional schematic diagram of the structural adjustment platform of this utility model.

[0026] In the diagram: 1. Robotic arm body; 2. Cleaning tank; 3. Wafer basket; 4. Limiting rod; 5. Adjustment platform; 6. First electric push rod; 7. Clamping plate; 8. Sealing cover plate; 9. C-type rubber sleeve; 10. Support guide frame; 11. Linkage plate; 12. First connecting valve pipe; 13. Second connecting valve pipe; 14. Second electric push rod; 15. Reinforcing plate; 16. Auxiliary rod. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-5 A drying device for wafer cleaning process includes a robotic arm body 1 and a cleaning tank 2 disposed on one side of the robotic arm body 1. Two second connecting valve pipes 13 and two first connecting valve pipes 12 are respectively disposed on the top and bottom of one side of the cleaning tank 2. The valves inside the first connecting valve pipes 12 and the valves inside the second connecting valve pipes 13 are both solenoid valves to facilitate subsequent unified control. The first connecting valve pipes 12 and the second connecting valve pipes 13 are provided with clearance gaps between them and the linkage plate 11 to avoid structural interference and further improve the reliability of multiple structures used in linkage.

[0029] The output end of the robotic arm body 1 is connected to an adjustment platform 5. A wafer basket 3 is mounted on the top of the cleaning tank 2, and limit rods 4 are fixed to the front and rear ends of the wafer basket 3. Clamping components are mounted on the front and rear ends of the adjustment platform 5, and the two clamping components can be fitted with the two limit rods 4 respectively to clamp and limit the wafer basket 3. Each clamping component includes a first electric push rod 6 and a clamping plate 7. The top structure of the clamping plate 7 is connected to the output end of the first electric push rod 6 mounted on the top of the adjustment platform 5, thereby providing a clamping part. One specific implementation scheme of the device improves the automation effect of the overall device. The bottom of the clamping plate 7 is provided with a positioning hole that can be movably connected with the limiting rod 4. The positioning hole can ensure that the two clamping plates 7 clamp the wafer basket 3 under the drive of their respective first electric push rods 6, while avoiding structural interference between the clamping plate 7 and the limiting rod 4. Furthermore, the fitting of the clamping plate 7 and the limiting rod 4 can also prevent the wafer basket 3 from falling directly off the clamping plate 7 in case of clamping abnormality, thereby improving the reliability of the overall device during use.

[0030] Both sides of the top of the cleaning box 2 are slidably connected to sealing cover plates 8, and the front and rear ends of the cleaning box 2 are provided with displacement transmission components. The two displacement transmission components are respectively connected to one side of the two sealing cover plates 8 and can drive the two sealing cover plates 8 to move back and forth to open and close the space at the top of the cleaning box 2. The opposite sides of the two sealing cover plates 8 can be engaged with the output structure of the clamping component.

[0031] The displacement transmission assembly includes a support guide 10 and a second electric push rod 14. The middle part of the support guide 10 and the middle part of the housing of the second electric push rod 14 are both fixed to the front or rear surface of the cleaning tank 2. The output end of the second electric push rod 14 is connected to a linkage plate 11 that is engaged with the support guide 10. The top of the linkage plate 11 is fixed to the bottom of one side of the sealing cover 8. This provides a specific implementation of the displacement transmission assembly, further improving the automation effect of the overall device. Furthermore, during the reciprocating movement of the sealing cover 8, due to the engagement between the linkage plate 11 and the support guide 10, the sealing cover 8 can obtain good support and guidance assistance, fully ensuring the stability and reliability of its own movement and adjustment process. The front and rear ends of the sealing cover 8 are provided with sliding grooves, and guide rails fixed to the top of the corresponding side of the cleaning tank 2 are engaged in the sliding grooves. The guide rails are made of rubber material.

[0032] In use, multiple wafers to be processed are placed inside the wafer basket 3. Then, the existing conveying equipment, such as a conveyor belt device, automatically transports the wafer basket 3 to the pre-set picking point of the robotic arm body 1. There are many existing examples of the use of the robotic arm body 1, and the relevant technologies have been disclosed in detail, so they will not be elaborated here. The combination formed by the transmission adjustment platform 5 of the robotic arm body 1 and the two clamping components is automatically displaced until the clamping plates 7 in the two clamping components are respectively located at the front and rear ends of the wafer basket 3, and the positioning holes inside the two clamping plates 7 are aligned with the limit rods 4 set at the front and rear ends of the wafer basket 3. The two first electric push rods 6, which were originally in the open state, are closed. The two first electric push rods 6 drive their respective corresponding clamping plates 7 to clamp the wafer basket 3. The clamping plates 7 and the corresponding limit rods 4 are clamped synchronously to protect the wafer basket 3 from detachment.

[0033] Similarly, the mechanical arm body 1 starts the adjustment platform 5, the wafer basket 3 and other structures to move automatically into the cleaning tank 2. After the wafer basket 3 is in the bottom area of ​​the cleaning tank 2, the mechanical arm body 1 stops driving and closes the two second electric push rods 14 that were originally in the open state. The two second electric push rods 14 drive their respective linkage plates 11, which in turn drive their respective sealing cover plates 8 to move close together until the two sealing cover plates 8 are in contact and seal the top space of the cleaning tank 2. The sealing cover plates 8 are also engaged with the two clamping plates 7 to make room.

[0034] Cleaning fluid is injected into the cleaning tank 2 through a first connecting valve pipe 12. In this embodiment, deionized water is selected as the cleaning fluid. The deionized water is used to wet the wafer surface and clean the wafer. At the same time, room temperature nitrogen is supplied into the cleaning tank 2 through a second connecting valve pipe 13.

[0035] After the deionized water has completely submerged the wafer for a certain period of time, the wafer basket 3, the adjustment platform 5 and other structures are moved upward synchronously by the robotic arm body 1. At the same time, the deionized water is discharged at a controlled speed through another first connecting valve pipe 12, and the drying gas formed by the mixture of isopropanol and nitrogen is delivered into the cleaning tank 2 through the second connecting valve pipe 13. The drying gas performs preliminary drying on the wafer during the lifting process.

[0036] Once the wafer has completely detached from the cleaning chamber and reached the top of the cleaning tank 2, the drive output of the robotic arm body 1 is paused, and dry gas is continuously supplied into the cleaning tank 2 through the second connecting valve pipe 13. At the same time, another second connecting valve pipe 13 is opened, thereby using the circulating dry gas to fully dry the wafer. After completion, the input of dry gas is stopped.

[0037] Restart the two second electric push rods 14, which drive their respective linkage plates 11. The linkage plates 11 then move their respective sealing covers 8 away from each other until the two sealing covers 8 completely clear the top space of the cleaning tank 2. Restart the robotic arm body 1, which automatically moves the cleaned and dried wafer basket 3 and the multiple wafers inside the wafer basket 3 to the designated position on the conveyor belt. Restart the two first electric push rods 6, which drive their respective clamping plates 7 to release the wafer basket 3. The conveyor belt then transports the wafer basket 3 to the next process. Repeat the above steps for subsequent operations.

[0038] Please see Figures 1-5 Both sides of the top of the clamping plate 7 are fixed with reinforcing plates 15. Assembly holes are opened in the front and rear ends of the adjustment platform 5. An auxiliary rod 16 that can be received in the assembly hole is fixed at the end of the reinforcing plate 15 away from the clamping plate 7. By using the engagement of the auxiliary rod 16 with the corresponding assembly hole, the movement of the clamping plate 7 can be assisted and supported, further improving the stability of the clamping plate 7 during the clamping and movement process.

[0039] The assembly hole can completely accommodate the auxiliary rod 16, avoiding structural interference. The adjustment platform 5 and the auxiliary rod 16 are made of iron and magnet materials, respectively, which further enhances the connection strength between the auxiliary rod 16 and the adjustment platform 5. The end of the limiting rod 4 near the surface of the wafer basket 3 is fixed with a trapezoidal reinforcing plate between it and the surface of the wafer basket 3. The two trapezoidal reinforcing plates are spliced ​​together on one side to form an auxiliary platform that fits and connects with the bottom surface of the clamping plate 7. This further enhances the structural strength of the wafer basket 3 and also avoids interference with the clamping of the clamping plate 7.

[0040] When in use, considering the auxiliary support requirements of the clamping plate 7 during the reciprocating clamping process, the reinforcing plate 15 and auxiliary rod 16 are used as auxiliary support conditions, so that the top structure of the clamping plate 7 can form a triangular reinforcing structure relative to the side of the platform 5, thereby improving the stability and reliability of the clamping plate 7 during use.

[0041] Similarly, by using the trapezoidal reinforcing plate, the structural strength of the connection between the limiting rod 4 and the wafer basket 3 is improved, ensuring the long-term use of the limiting rod 4 while also improving and optimizing the structural strength of the wafer basket 3.

[0042] Please see Figures 1-3 Each of the two sealing covers 8 has a clearance groove on one side of its opposite side, and a C-shaped rubber sleeve 9 is nested in the clearance groove. The C-shaped rubber sleeve 9 can be engaged with the middle or top of the clamping plate 7. In addition to improving the sealing effect after the sealing cover 8 and the clamping plate 7 are engaged, it can also avoid hard friction between the sealing cover 8 and the clamping plate 7, and improve the service life of the clamping plate 7. When the two sealing covers 8 are in contact and close the top space of the cleaning box 2, the two C-shaped rubber sleeves 9 in the left and right adjacent positions combine to seal the middle or top of the same clamping plate 7, improving the sealing effect of the internal space of the cleaning box 2 during the drying process.

[0043] In use, considering the sealing requirements of the two sealing covers 8 for the top space of the cleaning tank 2 and the clearance requirements between the sealing cover 8 and the clamping plate 7, multiple C-shaped rubber sleeves 9 are used as buffers and filling sealing conditions for the clamping plate 7 and the sealing cover 8 to engage and make clearance. Thus, without interfering with the movement and use of the clamping plate 7 and the sealing cover 8, the sealing effect of the two sealing covers 8 on the top space of the cleaning tank 2 can be improved at the same time, and the movement friction between the clamping plate 7 and the sealing cover 8 can be reduced, thus extending the service life of the clamping plate 7.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Additionally, in the accompanying drawings of this utility model, the fill patterns are merely for distinguishing layers and do not constitute any other limitation.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A drying device for a wafer cleaning process, comprising a robotic arm body (1) and a cleaning tank (2) disposed on one side of the robotic arm body (1), wherein two second connecting valve pipes (13) and two first connecting valve pipes (12) are respectively disposed on the top and bottom of one side of the cleaning tank (2), characterized in that: The output end of the robotic arm body (1) is connected to an adjustment platform (5). The top of the cleaning box (2) is provided with a wafer basket (3), and the front and rear ends of the wafer basket (3) are fixed with limit rods (4). The front and rear ends of the adjustment platform (5) are provided with clamping components, and the two clamping components can be fitted with the two limit rods (4) respectively, and clamp and limit the wafer basket (3). The two sides of the top of the cleaning box (2) are slidably connected with sealing covers (8), and the front and rear ends of the cleaning box (2) are provided with displacement transmission components. The two displacement transmission components are respectively connected to one side of the two sealing covers (8) and can drive the two sealing covers (8) to move back and forth to open and close the space at the top of the cleaning box (2). The opposite sides of the two sealing covers (8) can be engaged with the output structure of the clamping components.

2. The drying apparatus in the wafer cleaning process according to claim 1, characterized in that: Both clamping components include a first electric push rod (6) and a clamping plate (7). The top structure of the clamping plate (7) is connected to the output end of the first electric push rod (6) installed on the top of the adjustment platform (5). The bottom of the clamping plate (7) is provided with a positioning hole that can be movably sleeved with the limiting rod (4).

3. The drying apparatus in the wafer cleaning process according to claim 2, characterized in that: Both sides of the top of the clamping plate (7) are fixed with reinforcing plates (15), and the front and rear ends of the adjustment platform (5) are provided with assembly holes. The end of the reinforcing plate (15) away from the clamping plate (7) is fixed with an auxiliary rod (16) that can be received in the assembly hole.

4. The drying apparatus in the wafer cleaning process according to claim 3, characterized in that: The assembly hole can completely accommodate the auxiliary rod (16), and the adjustment platform (5) and the auxiliary rod (16) are made of iron and magnet materials, respectively.

5. A drying apparatus for a wafer cleaning process according to claim 2, characterized in that: The end of the limiting rod (4) near the surface of the wafer basket (3) is fixed with a trapezoidal reinforcing plate, and one side of the two trapezoidal reinforcing plates is spliced ​​together to form an auxiliary platform that fits and connects with the bottom surface of the clamping plate (7).

6. The drying apparatus in the wafer cleaning process according to claim 1, characterized in that: The displacement transmission assembly includes a support guide (10) and a second electric push rod (14). The middle part of the support guide (10) and the middle part of the housing of the second electric push rod (14) are both fixed to the front or rear surface of the cleaning tank (2). The output end of the second electric push rod (14) is connected to a linkage plate (11) that is engaged with the support guide (10). The top of the linkage plate (11) is fixed to the bottom of one side of the sealing cover plate (8).

7. A drying apparatus for a wafer cleaning process according to claim 1, characterized in that: The sealing cover (8) has grooves at both the front and rear ends, and guide rails fixed to the top of the corresponding side of the cleaning box (2) are engaged in the grooves. The guide rails are made of rubber material.

8. A drying apparatus for a wafer cleaning process according to claim 2, characterized in that: Both sealing covers (8) have relief grooves on opposite sides, and C-shaped rubber sleeves (9) are nested in the relief grooves. The C-shaped rubber sleeves (9) can be engaged with the middle or top of the clamping plate (7).

9. A drying apparatus for a wafer cleaning process according to claim 2, characterized in that: When the two sealing covers (8) are in a closed state over the top space of the cleaning tank (2), two C-shaped rubber sleeves (9) located on the left and right sides combine to seal the middle or top of the same clamp (7).

10. A drying apparatus for a wafer cleaning process according to claim 6, characterized in that: The valve inside the first connecting valve pipe (12) and the valve inside the second connecting valve pipe (13) are both set as solenoid valves. The first connecting valve pipe (12) and the second connecting valve pipe (13) are provided with clearance gaps between them and the linkage plate (11).

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