Electrostatic filter device and electrostatic filter system

Abstract

The utility model relates to a kind of electrostatic filtration device and electrostatic filtration system.Electrostatic filtration device includes multiple positive electrode plate, multiple negative electrode plate, at least one continuous support structure.For at least one continuous support structure at least one pair of adjacent first electrode plate connected, one of first electrode plate in the first area corresponding to the continuous support structure connection position of the continuous support structure connected with this, at least part of internal conductive material is led out to make the first area exist bare conductive material, another first electrode plate in the first area corresponding to the continuous support structure connection position of the continuous support structure connected with this, at least one second area adjacent to the continuous support structure connection position of the continuous support structure connected with this, at least part of internal conductive material is led out to make the second area exist bare conductive material, and, the distance of bare conductive material of adjacent first electrode plate in the vertical direction with electrode plate spacing is greater than or equal to first threshold value.

Description

Technical Field

[0001] This utility model relates to the field of air conditioning, and in particular to an electrostatic filtration device and electrostatic filtration system that incorporates electrostatic dust removal technology. Background Technology

[0002] Electrostatic filters have been widely used and developed due to their advantages such as low air resistance and the ability to be repeatedly cleaned and reused.

[0003] An electrostatic filter is a filter that uses alternating positive and negative electrode components to create an electrostatic field, thereby achieving a purification function.

[0004] Flat-plate electrostatic filters are a common type of filter. They are characterized by alternating positive and negative electrodes arranged in flat plates to apply an electric field to the ventilated area, thereby adsorbing pollutants. The electrode plates are the core component of the electrostatic filter; their material and structure determine the filter's purification capacity, cost, lifespan, byproducts, reliability, and safety.

[0005] Air has a pressure withstand limit, which varies with air humidity and is also related to the flatness and surface finish of the electrostatic filter plates. It is generally considered that the air withstand pressure is 3 kV per millimeter. When the voltage between the electrodes exceeds this voltage, the air will break down. In designing air filters, conductive materials are typically used as electrode plates. However, due to environmental changes, manufacturing processes, and dust adsorption, the voltage that can usually be applied between the plates is only half the air withstand pressure. Some newer processes can improve this, but ultimately, the voltage that can be applied cannot exceed the air withstand pressure.

[0006] Filters using conductive electrode plates encased in insulating material (hereinafter referred to as "high-field filters") are one of the mainstream electrostatic filter solutions currently available. Because the conductive electrodes are encased in insulating material and not exposed to the air, air breakdown will not occur even when a voltage higher than the air's withstand voltage is applied. Filters where the voltage applied to the air is higher than the air's withstand voltage can be called high-field electrostatic filters. Since the voltage applied to the air is positively correlated with purification efficiency—the higher the voltage, the higher the purification efficiency—high-field electrostatic filters have higher purification efficiency and smaller size. Furthermore, due to the insulating material encapsulation, high-field electrostatic filters have extremely low operating current and do not produce ozone, exhibiting excellent performance characteristics.

[0007] Figure 1A A side cross-sectional view of the plate electrode in the strong electric field scheme is shown.

[0008] Figure 1B A top-view cross-sectional view of the plate electrode in the strong electric field scheme is shown.

[0009] like Figure 1A , Figure 1B As shown, the plate-shaped electrode consists of two layers, an inner and an outer layer. The inner layer is a conductive layer 110 made of conductive material, and the outer layer is an insulating layer 120 made of insulating material.

[0010] Figure 1C A schematic diagram of the connection between the plate electrode and the power supply in a strong electric field scheme is shown.

[0011] like Figure 1C As shown, the conductive layer 110 extends a section of conductive material in at least one direction for connecting to a power source.

[0012] Arranging the electrodes of the above structure in parallel with alternating positive and negative electrodes creates a flat-plate high-electric-field electrostatic filter.

[0013] Because the electrodes require a relatively precise relative position to function properly, they need to be supported. Typically, insulating materials are chosen for the support, but contamination can cause this material to become conductive. If the positive and negative electrodes and the support material form a closed loop, a Faraday cage is created, shielding the internal electric field and causing the electrostatic filter to fail.

[0014] To avoid this situation, independent support structures can be used for the positive and negative electrodes, with the other electrode positioned to avoid them. This support method can be called dual-phase support. Figure 2 A schematic diagram of a dual-phase support structure is shown. Figure 2 Only the dual-phase support structure on one side of the electrode plate is shown. It should be understood that a dual-phase support structure can also be used on the other side.

[0015] Figure 2 The blue line 210 in the diagram represents the support structure used to connect a positive electrode plate of one polarity (such as all positive electrode plates). Figure 2 The red line 220 indicates the support structure used to connect the positive electrode plate of another polarity (such as all negative electrode plates). This polarity-separated support structure is called a two-phase support structure. Figure 2 As shown, multiple groove-shaped support structures need to be provided on the electrode plate to avoid the support structure with a polarity different from that of the electrode plate to be connected.

[0016] Therefore, in practical engineering, the structure of dual-phase support is complex, and because the support structure of the reverse electrode needs to be avoided, the effective charged area of ​​the filter will be lost, thus affecting the initial purification efficiency of the filter.

[0017] Figure 3 A cross-sectional schematic diagram of an electrode plate with dual-phase support is shown.

[0018] like Figure 3As shown, when the electrode width is already relatively narrow, using a structure with separate positive and negative electrodes for support may reduce the effective current-carrying area of ​​the filter by more than 10%, and in some areas (such as the groove-shaped support structure at position 310), the width of the current-carrying area may be reduced by more than 50%, which seriously affects the filter efficiency.

[0019] Another support method corresponding to the two-phase support method is the single-phase support method. The single-phase support method directly connects the positive and negative electrodes. With single-phase support, the electrodes do not need to be offset, and the number of support components can be reduced by half. Therefore, compared to two-phase support, filters using single-phase support have higher initial efficiency and lower resistance.

[0020] Single-phase support is generally safe for use in electrostatic filters where the electrode plate surface is conductive. This is primarily because, while contaminants are conductive, they are typically semiconductors with a surface resistivity between 1E6 and 1E10 Ω. When the electrodes themselves possess good conductivity, a Faraday cage will not form. However, in high-field electrostatic filters, the electrode surfaces are insulated. When contaminants damage the insulation between the electrodes and the support material, a Faraday cage will form, disrupting the electric field strength between the electrodes and causing the filter to fail rapidly.

[0021] Therefore, how to effectively maintain purification efficiency and extend the single-use lifespan of a strong electric field electrostatic filter under the condition of using single-phase support is a technical problem that urgently needs to be solved. Utility Model Content

[0022] One objective of this invention is to enable the strong electric field electrostatic filter to maintain its purification efficiency and extend its service life under single-phase support conditions, thus preventing rapid filter failure.

[0023] According to a first aspect of the present invention, an electrostatic filtration device is provided, comprising: a plurality of positive electrode plates and a plurality of negative electrode plates, wherein the plurality of positive electrode plates and the plurality of negative electrode plates are arranged alternately and at intervals, the positive electrode plates are connected to the positive terminal of a high-voltage power supply, and the negative electrode plates are connected to the negative terminal of a high-voltage power supply; at least one pair of adjacent electrode plates among the plurality of positive electrode plates and the plurality of negative electrode plates constitutes a first electrode plate, the first electrode plate being constructed by wrapping a conductive material with a high-resistivity material or an insulating material; at least one continuous support structure, the continuous support structure connecting at least one pair of adjacent first electrode plates, each electrode plate including a plurality of first regions and a plurality of second regions, each first region corresponding to one of the connection positions of the continuous support structure of the electrode plate, the electrode plate region near the connection position of the continuous support structure being the first region, and the region outside the first region or between two adjacent first regions being the first region. The electrode region is the second region. For at least one pair of adjacent first electrode plates connected to at least one of the continuous support structures, one of the first electrode plates exposes at least a portion of its internal conductive material in the first region corresponding to the connection position of the continuous support structure connected to the continuous support structure, so that the first region has exposed conductive material. The other first electrode plate exposes at least a portion of its internal conductive material in at least one second region adjacent to the first region corresponding to the connection position of the continuous support structure connected to the continuous support structure, so that the second region has exposed conductive material. Furthermore, the distance between the exposed conductive materials of adjacent first electrode plates in the direction perpendicular to the electrode plate spacing is greater than or equal to a first threshold. In the case where there are multiple rows of the continuous support structures in the electrode plate width direction, the first region and the second region are divided for the row of continuous support structures closest to the windward side.

[0024] Optionally, the size of the first region is less than or equal to that of the second region; and the exposed conductive material in the first region and the exposed conductive material in the second region are both close to the corresponding continuous support structure connection position.

[0025] Optionally, each pair of adjacent first electrode plates connected to each of the continuous support structures is configured such that: in a first region corresponding to the connection position of the continuous support structure connected to the continuous support structure, at least a portion of the internal conductive material is led out so that the first region has exposed conductive material; and in at least one second region adjacent to the first region corresponding to the connection position of the continuous support structure connected to the continuous support structure, at least a portion of the internal conductive material is led out so that the second region has exposed conductive material.

[0026] Optionally, each of the positive electrode plates and each of the negative electrodes are the first electrode plates, and all electrode plates are connected by the same continuous support structure. One type of electrode plate is configured to expose at least a portion of the internal conductive material in each of the first regions so that the first regions have exposed conductive material. Another type of electrode plate is configured to expose at least a portion of the internal conductive material in each of the second regions so that the second regions have exposed conductive material.

[0027] Optionally, each of the negative electrode plates is configured such that at least a portion of the internal conductive material is led out in each of the first regions of the negative electrode plate to expose the conductive material in the first region, and each of the positive electrode plates is configured such that at least a portion of the internal conductive material is led out in each of the second regions of the positive electrode plate to expose the conductive material in the second region.

[0028] Optionally, the at least one continuous support structure includes: a first row of continuous support structures, wherein the connection positions of each of the positive electrode plates and each of the negative electrode plates with the continuous support structure of the first row of continuous support structures are located on the side closer to the windward side; and a second row of continuous support structures, wherein the connection positions of each of the positive electrode plates and each of the negative electrode plates with the continuous support structure of the second row of continuous support structures are located on the side closer to the leeward side.

[0029] Optionally, the number of continuous support structures in the first row and the second row are the same, and their positions are distributed in the same direction along the electrode length; or the number of continuous support structures in the first row is less than that in the second row.

[0030] Optionally, the exposed conductive material is located at the edge of the electrode plate or at the center of the electrode plate.

[0031] Optionally, the first threshold is the electrode spacing; and / or the surface resistivity of the conductive material is less than 1E5Ω.

[0032] According to a second aspect of the present invention, an electrostatic filtration system is provided, comprising an air inlet channel, an electrostatic filtration device, a fan, and an air outlet channel. Air flows through the air inlet channel and the electrostatic filtration device under the drive of the fan, and then flows out through the air outlet channel. The electrostatic filtration device is the electrostatic filtration device described in the first aspect above.

[0033] This invention configures at least one pair of adjacent first electrode plates connected to at least one continuous support structure. In one first electrode plate, at least a portion of its internal conductive material is exposed in a first region corresponding to the connection position of the continuous support structure to the continuous support structure, resulting in exposed conductive material in that first region. In another first electrode plate, at least a portion of its internal conductive material is exposed in at least one second region adjacent to the first region corresponding to the connection position of the continuous support structure to the continuous support structure, resulting in exposed conductive material in that second region. Furthermore, the distance between the exposed conductive materials of adjacent first electrode plates in the direction perpendicular to the electrode plate spacing is greater than or equal to a first threshold. This disrupts the Faraday cage structure, thereby maintaining the electric field strength. Attached Figure Description

[0034] The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings, in which like reference numerals generally represent like parts.

[0035] Figure 1A A side cross-sectional view of the plate electrode in the strong electric field scheme is shown.

[0036] Figure 1B A top-view cross-sectional view of the plate electrode in the strong electric field scheme is shown.

[0037] Figure 1C A schematic diagram of the connection between the plate electrode and the power supply in a strong electric field scheme is shown.

[0038] Figure 2 A schematic diagram of a dual-phase support structure is shown.

[0039] Figure 3 A cross-sectional schematic diagram of an electrode plate with dual-phase support is shown.

[0040] Figure 4 The diagram shows a strong electric field electrostatic filter device with single-phase support in the uncontaminated state and after full contamination.

[0041] Figure 5 A schematic diagram of a pair of positive and negative electrodes is shown from different perspectives.

[0042] Figure 6 This demonstrates a way to disrupt the Faraday cage structure.

[0043] Figure 7 This demonstrates another way to disrupt a Faraday cage structure.

[0044] Figure 8 Two feasible specific support methods for continuous support structures are shown.

[0045] Figure 9 A schematic diagram of three support positions for a continuous support structure is shown.

[0046] Figure 10 Schematic diagrams of three two-row continuous support structures are shown.

[0047] Figures 11 to 13 A schematic diagram showing the division of the first and second regions of the electrode plate is shown.

[0048] Figure 14 A schematic diagram of one configuration of a pair of adjacent first electrode plates is shown.

[0049] Figure 15A and Figure 15B Two schematic diagrams of the exposed conductive material locations are shown.

[0050] Figures 16A to 16C The diagram shows three ideal configurations for the exposed conductive material location.

[0051] Figure 17A , Figure 17B A schematic diagram showing two types of exposed conductive materials with opposite configurations for positive and negative electrodes is presented.

[0052] Figure 18A A schematic diagram is shown showing the placement of the exposed positive electrode near the support structure.

[0053] Figure 18B A schematic diagram is shown showing the placement of the exposed negative electrode near the support structure.

[0054] Figures 19A to 19D Several schematic diagrams of exposed conductive material configurations are shown.

[0055] Figure 20 A schematic diagram of an electrostatic filtration device according to an embodiment of the present invention is shown. Detailed Implementation

[0056] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0057] A complete electrostatic filter requires two parts: a charging device and a filtering device. The function of the charging device is to charge fine particulate matter in the air, making it electrically charged. The filtering device uses an electrostatic field to adsorb charged particles, achieving the effect of air purification. This utility model only relates to the improvement of the filtering device, not the improvement of the charging device. Therefore, this utility model does not describe the charging device, but focuses on describing the filtering device (i.e., the electrostatic filtering device). It should be understood that the electrostatic filtering device described in this utility model can be used in conjunction with the charging device to form a complete electrostatic filter. Or, the electrostatic filtering device described in this utility model can also include the charging device to form a complete electrostatic filter. In addition, some test cases mentioned in the text are assumed to be results of tests conducted in conjunction with the charging device. In this utility model, the terms "electrode" and "electrode plate" can be used interchangeably.

[0058] Figure 4 Schematic diagrams of a single-phase supported high-field electrostatic filtration device are shown in both uncontaminated and fully contaminated states. Reference numerals 410 and 420 denote electrode plates of different polarities. For example, reference numeral 410 may represent the positive electrode plate, and reference numeral 420 may represent the negative electrode plate. The electrode plates (partial or all) in the high-field electrostatic filtration device may be constructed by encasing conductive material in a high-resistivity or insulating material. For details regarding the structure of the electrode plates in the high-field electrostatic filtration device, please refer to [reference needed]. Figures 1A to 1C As shown. Reference numeral 230 indicates a single-phase support structure. (As shown...) Figure 4 As shown, the single-phase support structure 230 connects all the electrode plates together without distinguishing polarity.

[0059] When the electrostatic filter is uncontaminated, the surface of the electrodes and the support rod are made of insulating material, so it can work normally.

[0060] When contaminants are adsorbed by the electrostatic filter, the electrode and support rod surfaces become conductive due to the contaminants adhering to them. The contaminants on the positive and negative electrode surfaces, along with those on the support rod surface, form a closed conductive cavity, thus fulfilling the conditions for a Faraday cage. At this point, surface charges with opposite polarity to the internal conductors of the electrodes form on the electrode surfaces, disrupting the electric field between the electrodes and causing the electrostatic filter to malfunction.

[0061] The following analysis will examine the root causes of the failure of a strong electric field electrostatic filter device from a microscopic perspective.

[0062] Figure 5 A schematic diagram of a pair of positive and negative electrodes is shown from different perspectives.

[0063] Figure 5 The left-hand view in the figure specifically shows a pair of positive and negative electrodes 410 and 420, and multiple single-phase support structures 230 connecting the positive and negative electrodes 410 and 420. Figure 5 The right-hand view is a schematic projection of the positive and negative electrodes 410 and 420, as well as two single-phase support structures 230 located on the same side, onto the windward side. Figure 5 In the right-hand view, the orange parts are the positive and negative electrode plates 410 and 420, and the purple part is the single-phase support structure 230.

[0064] like Figure 5 As shown in the right-hand projection view, regardless of whether the single-phase support structure 230 uses surface support or internal support, it will form a projection on the windward side. Figure 5 The rectangular structure shown on the right.

[0065] The positive and negative electrodes 410 and 420 and the single-phase support structure 230 are all insulated, so their surface conductivity is mainly determined by the adsorbed and accumulated dust. The dust adsorbed and accumulated on the surfaces of the positive and negative electrodes 410 and 420 and the single-phase support structure 230 is charged. Due to the conductivity of the dust, a closed circuit is formed, which shields the electric field between the electrodes.

[0066] In strong electric field schemes, the electrodes are made of high-resistivity materials, insulating materials, or materials encased in conductive materials. By disrupting the insulation characteristics of the portion of the electrode near the single-phase support, exposing the internal conductive electrodes, the electric field shielding effect can be effectively suppressed.

[0067] Figure 6 This illustrates a way to disrupt a Faraday cage structure. For example... Figure 6 As shown, by exposing the internal conductive material of the positive and negative electrodes 410 and 420 near the single-phase support structure 230 to form exposed conductive material 430, the Faraday cage structure can be destroyed, thereby achieving the purpose of maintaining the electric field strength.

[0068] However, since the filter device operates under a strong electric field, the directly exposed conductive material 430 can cause air ionization, potentially leading to arcing. Therefore, the exposed conductive material 430 of adjacent electrode plates must be staggered. Typically, under strong electric field conditions, this staggering should be at least equal to the distance between the plates.

[0069] The electrode spacing, also known as the plate spacing, refers to the distance between two adjacent electrode plates. In this invention, each electrode plate may include two surfaces, two side surfaces, a connecting surface, and a facing surface. The distance between the two adjacent surfaces of two adjacent electrode plates is called the electrode spacing. The connecting surface refers to the surface where the electrode plate connects to the high-voltage power supply, and the facing surface refers to the surface parallel to the connecting surface.

[0070] The distance between different electrode plates in the same filter device can be the same or different. Furthermore, different filter devices can have different minimum electrode plate spacings. The minimum electrode plate spacing refers to the minimum distance between all two adjacent electrode plates in an electrostatic precipitator, that is, the minimum spacing between the positive and negative electrodes. For example, under strong electric field operating conditions, the plates should be staggered by a distance no less than the minimum electrode plate spacing.

[0071] Figure 7 This demonstrates another way to disrupt a Faraday cage structure.

[0072] like Figure 7 As shown, the exposed conductive material in electrode plate 410 is located relatively far from the single-phase support structure 230, while the exposed conductive material in electrode plate 420 remains near the single-phase support structure 230. In this way, the electric field shielding effect is effectively suppressed, while the risk of arcing from discharge is avoided.

[0073] Based on the above description of how to destroy the Faraday cage structure, this utility model proposes an electrostatic filtration device.

[0074] The electrostatic filtration device includes multiple positive electrode plates and multiple negative electrode plates. The positive and negative electrode plates are arranged alternately. The positive electrode plates are connected to the positive terminal of a high-voltage power supply, and the negative electrode plates are connected to the negative terminal of the high-voltage power supply.

[0075] In a plurality of positive electrode plates and a plurality of negative electrode plates, at least one pair of adjacent electrode plates is designated as a first electrode plate. The first electrode plate is constructed by encapsulating a conductive material with a high-resistivity material or an insulating material. For example, all electrode plates are first electrode plates. When the encapsulating material of the first electrode plate is a high-resistivity material, the surface resistivity of the encapsulating material can be greater than or equal to 1E¹¹ Ω. Further, when the encapsulating material of the first electrode plate is an insulating material, the surface resistivity of the encapsulating material is greater than or equal to 1E¹² Ω. For details on the structure of the first electrode plate, please refer to [link to relevant documentation]. Figures 1A to 1C As shown.

[0076] The electrostatic filtration device also includes at least one continuous support structure. The continuous support structure connects at least one pair of adjacent first electrode plates. Exemplarily, the same continuous support structure can connect all electrode plates simultaneously. That is, the same continuous support structure can connect all electrode plates together. In this case, the continuous support structure is equivalent to the single-phase support structure described above.

[0077] Figure 8 Two feasible specific support methods for continuous support structures are shown.

[0078] like Figure 8As shown, the continuous support structure 240 can, in specific support applications, provide overall support between the electrodes. Figure 8 (As shown in the left-hand view), it is also possible to utilize the strength of the electrode itself to provide localized support for the electrode. For example, the location of this localized support could be... Figure 8 The electrode side surface is shown in the right-hand view. Alternatively, the local support location can be other locations, such as the middle of the electrode plate. The continuous support structure 240 directly connects the positive and negative electrodes 410 and 420 structurally. Furthermore, Figure 8 The diagram shown is a schematic representation of an electrostatic filtration device comprising two rows of continuous support structures 240. It should be understood that the electrostatic filtration device may also include one or more rows of continuous support structures 240.

[0079] Figure 9 A schematic diagram of three support positions for a continuous support structure is shown.

[0080] like Figure 9 As shown, the continuous support structure 240 has three support positions: one is to support the entire cross-section of the electrode plate (strip support); one is to support it from both sides of the electrode plate; and one is to support it from the center of the electrode plate.

[0081] From the perspective of reducing the connection area between the positive and negative electrodes, the first support method, namely strip support, is not recommended, because strip support increases the conduction path area between the positive and negative electrodes. The preferred method is single-point support.

[0082] Single-point support can be further divided into two types: side support and center support. Both of these methods are superior to strip support, and therefore, they are preferred in practical applications. Among these two preferred support methods, center support, because its support structure is located at the center of the filter, results in lower contamination levels and thus better dust holding capacity, making it the best support method from a performance perspective. Side support, on the other hand, is a better support method from an economic perspective due to its simpler manufacturing process and lower production costs.

[0083] In some embodiments, the electrostatic filtration device may include a first row of continuous support structures and a second row of continuous support structures. The connection points of each positive electrode plate and each negative electrode plate to the continuous support structure of the first row of continuous support structures are located on the side closer to the windward side. The connection points of each positive electrode plate and each negative electrode plate to the continuous support structure of the second row of continuous support structures are located on the side closer to the leeward side. That is, a row of continuous support structures can be provided on both the windward and leeward sides of the electrode plates. In this case, the number of continuous support structures in the first and second rows of continuous support structures can be the same, and the positional distribution of the first and second rows of continuous support structures along the electrode length direction can be the same, i.e., the continuous support structures on the windward and leeward sides can be symmetrically distributed.

[0084] Since the support structure is the culprit for short-circuiting the positive and negative electrodes, its number should be minimized when designing a strong electric field electrostatic filter. While meeting the filter's mechanical strength requirements, the spacing between the support structures should be increased as much as possible. Considering that the contamination rate and degree of the support structure on the windward side are faster and higher, the number of continuous support structures on the windward side should be minimized, while the number of continuous support structures on the leeward side should be increased. That is, preferably, the number of continuous support structures in the first row is less than that in the second row.

[0085] Regarding support, the support spacing should be as large as possible, with a gap of at least 20mm between two continuous support structures to ensure proper deployment of the exposed portions of the two electrodes. Simultaneously, the support area should be as small as possible. Avoid using integral support between electrodes whenever possible, as this increases the direct conductive path between the positive and negative electrodes.

[0086] Figure 10 Schematic diagrams of three two-row continuous support structures are shown.

[0087] Figure 10 In all three types of two-row continuous support structures shown, the number of continuous support structures on the windward side is less than that on the leeward side. Specifically, Figure 10 The leftmost view shows that the number of continuous support structures in the air intake direction (i.e., the windward side) is one less than that in the air outlet direction (i.e., the leeward side). Figure 10 The middle view in the image refers to a continuous support structure that is only installed at both ends and the center of the electrode plate in the air intake direction. Figure 10 The rightmost view shows that only one continuous support structure is set at each end of the electrode plate in the air intake direction, and no continuous support structure is set in the middle.

[0088] Each electrode plate in this invention includes multiple first regions and multiple second regions. Each first region corresponds to one of the continuous support structure connection positions of the electrode plate. The electrode plate region near the continuous support structure connection position is the first region. The electrode plate region outside the first regions or between two adjacent first regions is the second region.

[0089] Figures 11 to 13 A schematic diagram showing the division of the first and second regions of the electrode plate is shown.

[0090] See Figure 11 Taking the central support (i.e., the support position of the continuous support structure 240 is the center position of the electrode plate) as an example, there is a row (e.g., 3 as shown in the figure) of continuous support structure connection positions at the center of the electrode plate. For each continuous support structure connection position, a predetermined distance can be extended along both sides of the electrode plate length direction with that connection position as the center, and the resulting electrode plate area is taken as the first region. The first regions are not adjacent to each other, and the electrode plate areas outside the first regions (such as the electrode plate area between two adjacent first regions) are the second regions.

[0091] See Figure 12 , Figure 13 In the case where there are multiple rows (two or more rows) of continuous support structures along the width of the electrode plate, the first region and the second region are divided based on the row of continuous support structures closest to the windward side. For example... Figure 12 As shown, when the windward and leeward sides each have an equal number of continuous support structures, and these two rows of continuous support structures are symmetrically distributed, the first and second regions, which are defined for the row of continuous support structures closest to the windward side, also apply to the continuous support structures on the leeward side. For example... Figure 13 As shown, when the windward and leeward sides each have a row of continuous support structures with different numbers of units, the first and second regions defined for the row of continuous support structures closest to the windward side are no longer applicable to the continuous support structures on the leeward side. The reason this invention defines the first and second regions for the row of continuous support structures closest to the windward side is that the row of continuous support structures closest to the windward side has the fastest contamination rate and the greatest contamination degree. Especially when a row of continuous support structures is set on both the windward and leeward sides, the continuous support structures farther from the windward side have a slower contamination rate and a lower contamination degree, resulting in a weaker electric field shielding effect. Therefore, the optimization focuses on the continuous support structures on the windward side, while the leeward side can be partially optimized or not optimized at all.

[0092] For at least one (e.g., all) of adjacent first electrode plates connected to at least one (e.g., all) continuous support structures, one first electrode plate exposes at least a portion of its internal conductive material in a first region corresponding to the connection position of the continuous support structure to the continuous support structure, resulting in exposed conductive material in that first region. The other first electrode plate exposes at least a portion of its internal conductive material in at least one second region adjacent to the first region corresponding to the connection position of the continuous support structure to the continuous support structure, resulting in exposed conductive material in that second region. Furthermore, the distance between the exposed conductive materials of adjacent first electrode plates in the direction perpendicular to the electrode spacing is greater than or equal to a first threshold. The first threshold is the electrode spacing, for example, it may be the minimum electrode spacing.

[0093] When multiple rows of continuous support structures exist along the width of the electrode plate, the above configuration can be applied to at least one pair of adjacent first electrode plates connected to the row of continuous support structures closest to the windward side to disrupt the Faraday cage structure formed by the row of continuous support structures closest to the windward side, thereby maintaining the electric field strength. For example, the above configuration can be applied to at least one pair of adjacent first electrode plates connected to all continuous support structures to disrupt all possible Faraday cage structures, thereby maintaining the electric field strength.

[0094] Furthermore, this invention also demonstrates whether the above configuration can meet the indoor air purification requirements, and finds that there is a certain correlation between the exposed conductive material of the adjacent first electrode plate and the efficiency of the filter. Based on this correlation, a method for optimizing filtration efficiency is proposed.

[0095] Figure 14 A schematic diagram of one configuration of a pair of adjacent first electrode plates is shown.

[0096] See Figure 14 Electrode plates 410 and 420 are a pair of adjacent first electrode plates. Electrode plate 420 has exposed conductive material 430-1 near the connection point of the continuous support structure 240-1, and exposed conductive material 430-2 near the connection point of the continuous support structure 240-2. Electrode plate 410 has exposed conductive material 430-3 at the midpoint between the connection points of the two continuous support structures 240-1 and 240-2. Exposed conductive materials 430-1 and 430-2 correspond to the blue portions shown in the figure, and exposed conductive material 430-3 corresponds to the red portions shown in the figure.

[0097] exist Figure 14Under this configuration, the blue exposed conductive materials 430-1 and 430-2 are located near the support, therefore the surface potential of electrode plate 420 is unaffected by the support. The red exposed conductive material 430-3 is far from the support, so the surface potential of electrode plate 410 decreases from the exposed portion to the support. Therefore, the potential between electrode plate 410 and electrode plate 420 will differ at different locations, exhibiting a "high in the middle and low at both ends" characteristic, with the electric field strength approximately... Figure 14 As shown in the green section, the purification efficiency is highest in the middle and gradually decreases towards the supporting sides.

[0098] exist Figure 14 In this model, the width of the exposed red conductive material 430-3 is defined as 'a', the distance between the exposed red conductive material 430-3 and the continuous support structures 240-1 and 240-2 is defined as 'b', and the electrode gap between electrode plates 410 and 420 is defined as 'd'. Assuming a worst-case scenario, a = 0 and b / d = ∞, the electric field strength is 100% only at the center, decreasing uniformly towards both sides until the electric field strength at the outermost continuous support structure connection point is 0. Assuming the one-time purification efficiency at the strongest electric field position in the center is E, the relationship between purification efficiency and electric field strength can be expressed by the following formula.

[0099] η = 1 - (1 - E)^k,

[0100] Where η is the purification efficiency, E is the purification efficiency at the strongest position, and k = [0,1] is the range of the electric field strength. Integrating the above formula over k∈[0,1], we obtain the formula for calculating the average efficiency value of the filter after contamination.

[0101]

[0102] By substituting the initial efficiency E into the formula for calculating the average efficiency value at different values ​​ranging from 50% to 99%, the filter efficiency after contamination and the percentage decrease in efficiency are calculated and summarized as follows.

[0103] Initial efficiency 50％ 60％ 70％ 80％ 90％ 95％ 99％ Post-pollution efficiency 28％ 35％ 42％ 50％ 61％ 68％ 79％ Efficiency maintenance 56％ 58％ 60％ 63％ 68％ 72％ 79％

[0104] As can be seen, the efficiency decreased after pollution, but the efficiency retention rate remained above 50%, and the higher the initial efficiency, the higher the efficiency retention rate. In indoor applications, the requirement for long-term operation of air purifiers is that the CADR should not be lower than 50% of the initial value. This configuration can fully meet the requirements, thus achieving the goal of long-term effectiveness.

[0105] The above is only a worst-case scenario. In reality, at the center, the electric field strength at point 'a' will be 100% within a certain range, and the electric field strength within this range will also reach 100%. The ratio of 'd' to 'b' determines the residual voltage at the connection points of the continuous support structure. This means that the electric field strength at the very edge of the support structure is not zero, resulting in residual efficiency.

[0106] Therefore, with this structure, the purification efficiency after pollution is far higher than 50%, which can well meet the needs of indoor air purification applications. Based on the above derivation, it can be seen that increasing 'a' or decreasing 'b' can optimize the filter efficiency. 'd' is a structural parameter of the filter itself, which will not be discussed here.

[0107] Furthermore, when considering the location of the exposed conductive material of a pair of adjacent first electrode plates connected by a continuous support structure, the exposed conductive material of one electrode plate should be located close to the connection point of the continuous support structure. This can reduce the impact of the support structure on performance; for example, it can be located at the connection point of the continuous support structure to minimize its impact on performance. Different configurations are compared when considering the location of the exposed conductive material of the other electrode plate.

[0108] Figure 15A and Figure 15B Two schematic diagrams of the exposed conductive material locations are shown.

[0109] Figure 15A The configuration can be summarized as follows: electrode plate 410 has a large exposed conductive material 430-3 near the continuous support structure 240-2, while electrode plate 420 has a large exposed conductive material 430-1 near the continuous support structure 240-1.

[0110] Figure 15B The configuration can be summarized as follows: Electrode plate 420 has a relatively large exposed conductive material 430-1 and 430-2 near the continuous support structures 240-1 and 240-2, respectively. Electrode plate 410 has a relatively small exposed conductive material 430-3 at the midpoint between the connection points of the two continuous support structures 240-1 and 240-2.

[0111] Figure 15A and Figure 15B Both of these configurations can disrupt the Faraday cage structure and satisfy the condition that "the distance between the exposed conductive material of adjacent first electrode plates in the direction perpendicular to the electrode spacing is greater than or equal to a first threshold." However, the effects of both configurations are relatively poor.

[0112] See Figure 15AAs shown in the green part, Figure 15A Since the current configuration cannot achieve the optimal efficiency range across the entire area, a configuration principle can be derived: the exposed conductive material coverage area between the connection points of two adjacent (or, in the case of multiple rows of continuous support structures, adjacent within the same row) continuous support structures should be maximized. Discontinuous coverage is also considered coverage. Discontinuous coverage refers to the area of ​​exposed conductive material that is not continuous.

[0113] See Figure 15B As shown in the green part, Figure 15B While this configuration achieves the optimal efficiency range, the area within that range is relatively small. Therefore, another configuration principle can be derived: the size of exposed conductive material near the connection points of the continuous support structure should be as small as possible.

[0114] Based on the above principles and the first and second regions defined in this invention, this invention proposes that the size of the first region should be less than or equal to that of the second region. Furthermore, the exposed conductive material in both the first and second regions is positioned close (as close as possible while still meeting the non-alignment condition) to the corresponding continuous support structure connection point. This increases the coverage area that achieves the optimal efficiency range. This coverage area includes both continuous and discontinuous coverage, which are discussed in detail below. Figures 16A to 16C The description.

[0115] Figures 16A to 16C The diagram shows three ideal configurations for the exposed conductive material location.

[0116] Figure 16A The configuration can be summarized as follows: For the continuous support structure 240-1, the electrode plate 420 has a small exposed conductive material 430-1 in the area of ​​its corresponding first region near the continuous support structure 240-1; for the continuous support structure 240-2, the electrode plate 420 has a small exposed conductive material 430-2 in the area of ​​its corresponding first region near the continuous support structure 240-2; the electrode plate 410 has a larger exposed conductive material 430-3 in the middle position of the second region between the two first regions corresponding to the continuous support structures 240-1 and 240-2. For example... Figure 16A As shown, the exposed conductive material 430-3 is a continuous exposed portion, and the coverage area of ​​the exposed conductive material 430-3 is a continuous coverage area. The coverage area of ​​the exposed conductive material 430-3 can achieve the optimal efficiency range.

[0117] Figure 16B Configuration and Figure 16AThe difference lies in that the electrode plate 410 has two discontinuous exposed conductive materials 430-3 and 430-4 in the second region; the exposed conductive material 430-3 corresponds to the continuous support structure 240-1, and the exposed conductive material 430-3 corresponds to the continuous support structure 240-2. The coverage area of ​​the exposed conductive materials 430-3 and 430-4 is a discontinuous coverage area, which can be regarded as the entire coverage area formed by the relatively far ends of the exposed conductive materials 430-3 and 430-4. Within this discontinuous coverage area, the optimal efficiency range can be considered to be achieved.

[0118] Figure 16C The configuration can be summarized as follows: For the continuous support structure 240-1, the electrode plate 420 has a small exposed conductive material 430-1 in the area near the continuous support structure 240-1 in its corresponding first region, and the electrode plate 410 has an exposed conductive material 430-3 in the area near the continuous support structure 240-1 in its corresponding second region; for the continuous support structure 240-2, the electrode plate 410 has a small exposed conductive material 430-4 in the area near the continuous support structure 240-2 in its corresponding first region, and the electrode plate 420 has an exposed conductive material 430-2 in the area near the continuous support structure 240-2 in its corresponding second region. Figure 16C In this configuration, the coverage area of ​​the exposed conductive material 430-3 in electrode plate 410 and the exposed conductive material 430-2 in electrode plate 420 is a discontinuous coverage area. This discontinuous coverage area can be regarded as the entire coverage area formed by the relatively distant ends of the exposed conductive materials 430-3 and 430-2. Within this discontinuous coverage area, the optimal efficiency range can be considered to be achieved.

[0119] Simultaneously, the resistivity of the internal conductive material must also be considered. Based on actual sampling of natural dust pollutants, they exhibit semiconductor characteristics, with surface resistivity ranging from 1E6 to 1E10 Ω. To suppress the influence of pollutants on the electric field strength by exposing the internal conductive material, the resistivity of the internal conductive material should, in principle, be significantly lower than that of the pollutant material. Therefore, at a minimum, the surface resistivity of the internal conductive material should be an order of magnitude less than that of the natural dust pollutant, i.e., less than 1E5 Ω. More preferably, the surface resistivity of the internal conductive material should be less than 1E4 Ω.

[0120] This concludes the exemplary description of how to optimize filtration efficiency. Other details relating to this invention are described below.

[0121] In some embodiments, each pair of adjacent first electrode plates connected to each continuous support structure is configured such that: one first electrode plate, in a first region corresponding to the connection position of the continuous support structure connected to the continuous support structure, exposes at least a portion of its internal conductive material so that the first region has exposed conductive material; and the other first electrode plate, in at least one second region adjacent to the first region corresponding to the connection position of the continuous support structure connected to the continuous support structure, exposes at least a portion of its internal conductive material so that the second region has exposed conductive material.

[0122] In some embodiments, each positive electrode plate and each negative electrode are both first electrode plates, and all electrode plates are connected by the same continuous support structure. One type of electrode plate is configured to expose at least a portion of the internal conductive material in each first region, thereby creating exposed conductive material in the first region; another type of electrode plate is configured to expose at least a portion of the internal conductive material in each second region, thereby creating exposed conductive material in the second region.

[0123] The deposition of pollutants is a gradual process. Most pollutants are adsorbed onto the positive electrode and then gradually deposited from the positive electrode to the negative electrode. Based on this difference in adsorption of pollutants on electrodes of different polarities, the practical application effects obtained by exposing the conductive material in the first region of the positive electrode or the first region of the negative electrode will be different.

[0124] Figure 17A , Figure 17B A schematic diagram showing two types of exposed conductive materials with opposite configurations for positive and negative electrodes is presented.

[0125] exist Figure 17A In the diagram, electrode plate 410 is the positive electrode, and electrode plate 420 is the negative electrode. Figure 17A On the contrary, Figure 17B In the figure, electrode plate 410 is the negative electrode and electrode plate 420 is the positive electrode. Figure 17A and Figure 17B The difference in configuration is that Figure 17A The exposed conductive material of the negative electrode is closer to the connection point of the continuous support structure (equivalent to the negative electrode having exposed conductive material in the first region). Figure 17B This means that the exposed conductive material of the positive electrode is closer to the connection point of the continuous support structure (equivalent to the positive electrode having exposed conductive material in the first region).

[0126] for Figure 17B In contrast, the positive electrode attracts dust more quickly, and the continuous support structure becomes contaminated rapidly due to the dust attracted by the positive electrode, causing the filter's initial efficiency to drop faster. Figure 17BThe green area in the diagram illustrates the electric field strength after partial dust adsorption. It can be seen that the electric field strength decreases on both sides of the exposed portion of the positive electrode.

[0127] for Figure 17A In its initial state, the negative electrode already covers the entire electrode area at the support positions on both sides. Therefore, although the negative electrode adsorbs conductive dust slowly, its electrode surface always maintains a negative high voltage potential. On the other hand, the positive electrode, because it adsorbs conductive dust quickly, will also rapidly enter a completely contaminated conductive state.

[0128] As can be seen, with Figure 17B compared to, Figure 17A This filter configuration offers better efficiency. Therefore, when designing the relationship between the exposed electrode positions and the support structure, the negative electrode should be placed closer to the support structure, while the positive electrode should be placed further away from the support structure to achieve optimal long-term purification efficiency.

[0129] That is, a preferred configuration is as follows: each negative electrode plate is configured such that at least a portion of the internal conductive material is brought out in each first region of the negative electrode plate so that the first region has exposed conductive material; each positive electrode plate is configured such that at least a portion of the internal conductive material is brought out in each second region of the positive electrode plate so that the second region has exposed conductive material.

[0130] In this invention, the exposed conductive material can be located at the edge or center of the electrode plate. Furthermore, the exposed conductive material in the first region can be adjacent to or not adjacent to its corresponding continuous support structure connection point.

[0131] Figure 18A A schematic diagram is shown showing the placement of the exposed positive electrode near the support structure.

[0132] Figure 18B A schematic diagram is shown showing the placement of the exposed negative electrode near the support structure.

[0133] exist Figure 18A , Figure 18B In the middle, electrode plate 410 is a positive electrode plate and electrode plate 420 is a negative electrode plate. Electrode plates 410 and 420 are connected to a row of continuous support structures 240 on both sides (i.e., the windward side and the leeward side) in the width direction.

[0134] exist Figure 18A In the positive electrode plate 410, each first region has two exposed conductive materials 430-3 (located at the two side edges of the electrode plate). Each second region of the negative electrode plate 420 has one exposed conductive material 430-1 (located at the center of the electrode plate). Figure 18BIn the positive electrode plate 410, each second region contains two exposed conductive materials 430-3. Each first region of the negative electrode plate 420 contains one exposed conductive material 430-1. Figure 18B This is the preferred configuration.

[0135] Taking an example where the electrode plate uses a row of continuous support structures on both the windward and leeward sides, and these two rows of continuous support structures are symmetrically distributed, Figures 19A to 19D Several schematic diagrams of exposed conductive material configurations are shown.

[0136] exist Figures 19A to 19D In the diagram, electrode plate 410 and electrode plate 420 represent two electrode plates with different polarities.

[0137] See Figure 19A When setting the exposed conductive material of the positive and negative electrode plates, the windward and leeward sides of the electrode plates can be symmetrically structured. For example... Figure 19A As shown, an exposed conductive material 430-3 can be respectively provided on both sides of the windward and leeward sides of each first region of the electrode plate 410, and an exposed conductive material 430-1 can be respectively provided on both sides of the windward and leeward sides of each second region of the electrode plate 420.

[0138] See Figure 19B When setting the exposed conductive material of the positive and negative electrode plates, the electrode plates can be positioned on opposite sides of the windward and leeward sides, with the exposed conductive material on one side located in a first region and the exposed conductive material on the other side located in a second region. The advantage of this configuration is that the positive and negative electrode plates have the same shape and do not need to be distinguished. For example... Figure 19B As shown, electrode plate 410 has exposed conductive material on both its windward and leeward sides. The exposed conductive material 430-3 on one side is located in a first region, and the exposed conductive material 430-4 on the other side is located in a second region. Correspondingly, electrode plate 420 also has exposed conductive material on both its windward and leeward sides. The exposed conductive material 430-1 on one side is located in a first region, and the exposed conductive material 430-2 on the other side is located in a second region.

[0139] See Figure 19C The exposed conductive material can be located not at the edge of the electrode, but also in the central region. For example... Figure 19C As shown, an exposed conductive material 430-3 can be respectively set on both sides of the windward and leeward sides of each first region of the electrode plate 410, and an exposed conductive material 430-1 can be set at the center of the electrode in each second region of the electrode plate 420. Setting the exposed conductive material at the center of the electrode can prevent people from touching the electrified part and enhance the safety of the product. Figure 19COnly one polarity of electrode plate is shown with exposed conductive material located at the center of the electrode. It should be understood that the exposed conductive material of both positive and negative electrode plates may also be located at the center of the electrode.

[0140] See Figure 19D ,and Figure 19A The difference is that, on each of the second regions of the electrode plate 420, located on the windward and leeward sides, two exposed conductive materials 430-1 can be respectively provided.

[0141] Figure 20 A schematic diagram of an electrostatic filtration device according to an embodiment of the present invention is shown.

[0142] See Figure 20 The blue portion shows electrode plate 410, which is the negative electrode plate. It extends a section of conductive material in one direction (the z-direction in the figure) and connects to the negative terminal of the high-voltage power supply. The red portion shows electrode plate 420, which is the positive electrode plate. It extends a section of conductive material in one direction (the z-direction in the figure) and connects to the positive terminal of the high-voltage power supply.

[0143] Each electrode plate employs an insulating (or high-resistance) wrapping method to encapsulate low-resistance conductive material. A single-phase support method is used, with the positive and negative electrodes directly connected by continuous support structures 240 on both sides. The negative electrode plate 410 extends a section of exposed conductive material 430-1 (located in the first region) near the edge of the continuous support structure connection point, while the positive electrode plate 410 extends a section of exposed conductive material 430-3 (located in the second region) at the edge between the two continuous support structure connection points. In the coordinate system of the figure, the x-direction represents the electrode plate thickness, the y-direction represents the electrode plate width, and the z-direction represents the electrode plate length. The airflow direction can be parallel to the electrode plate width direction.

[0144] This invention also conducted experiments to verify the effectiveness of electrostatic filtration devices with different configurations.

[0145] Option 1 is a standard strong electric field scheme, which does not include exposed conductive material to disrupt the Faraday cage; Option 2 applies the above-mentioned technical concept of this utility model, specifically by placing exposed conductive material in the first region of the positive electrode plate and in the second region of the negative electrode plate (e.g. Figure 18A (As shown in the configuration); Solution 3 also applies the above-mentioned technical concept of this utility model, but specifically, exposed conductive material is provided in the first region of the negative electrode plate and exposed conductive material is provided in the second region of the positive electrode plate (e.g., Figure 18B (Configuration shown).

[0146] For the three electrostatic filter devices described above, the CADR (Clean Air Delivery Rate) filtration performance was tested using cigarette smoke, with a test airflow of approximately 500m³. 3 / h. The test results are as follows.

[0147] Option 1 Option 2 Option 3 Initial CADR (m³ / h) 312 313 316 CADR (m3 / h) for 50 cigarettes 134 199 256 CADR (m3 / h) for 100 cigarettes -- 223 247 CADR (m3 / h) for 200 cigarettes -- 167 228

[0148] The initial CADR of this filter is approximately 300m³. 3 / h. According to the latest national standard GB18801-2022, CADR>300m 3 An air purifier with a capacity of [number] hours should have a CCM (Cumulative Clean Mass) > 12000 mg, roughly equivalent to 160 cigarettes. It can be seen that the electrostatic filtration device without the application of this invention (i.e., Solution 1) does not meet the national standard requirements. However, the electrostatic filtration device using this invention can meet the national standard CCM requirement, and the configuration of "setting exposed conductive material in the first area of ​​the negative electrode plate" performs better, with no efficiency fluctuations observed during the initial loading of 50 cigarettes.

[0149] In summary, this invention utilizes an insulating material to encapsulate a conductive material, forming a strong electric field filter, while employing a simple single-phase support structure to support the filter electrodes. The product has a simple structure, high initial efficiency, and low resistance. By rationally setting the position of the exposed electrodes, performance degradation caused by support structure contamination is minimized without increasing filter costs, thus extending the filter's lifespan per cycle.

[0150] This invention also proposes an electrostatic filtration system. The electrostatic filtration system includes an air inlet channel, an electrostatic filter device, a fan, and an air outlet channel. Air, driven by the fan, flows through the air inlet channel, passes through the electrostatic filter device, and then flows out through the air outlet channel. For details on the electrostatic filter device, please refer to the relevant description above.

[0151] The electrostatic filtration device and electrostatic filtration system according to this utility model have been described in detail above with reference to the accompanying drawings.

[0152] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. An electrostatic filter device, characterized by include: Multiple positive electrode plates and multiple negative electrode plates are arranged alternately and at intervals. The positive electrode plates are connected to the positive terminal of a high-voltage power supply, and the negative electrode plates are connected to the negative terminal of a high-voltage power supply. At least one pair of adjacent electrode plates among the multiple positive electrode plates and multiple negative electrode plates is a first electrode plate. The first electrode plate is composed of a conductive material wrapped with a high-resistivity material or an insulating material. At least one continuous support structure, said continuous support structure connecting at least a pair of adjacent first electrode plates. Each electrode plate includes multiple first regions and multiple second regions. Each first region corresponds to one of the continuous support structure connection positions of the electrode plate. The electrode plate region near the continuous support structure connection position is the first region, and the electrode plate region outside the first region or between two adjacent first regions is the second region. For at least one pair of adjacent first electrode plates connected to at least one of the continuous support structures, one first electrode plate has at least a portion of its internal conductive material exposed in a first region corresponding to the connection position of the continuous support structure to the continuous support structure, so that the first region has exposed conductive material; the other first electrode plate has at least a portion of its internal conductive material exposed in at least one second region adjacent to the first region corresponding to the connection position of the continuous support structure to the continuous support structure, so that the second region has exposed conductive material; and the distance between the exposed conductive materials of the adjacent first electrode plates in the direction perpendicular to the electrode plate spacing is greater than or equal to a first threshold. In the case where there are multiple rows of continuous support structures in the width direction of the electrode plate, the first region and the second region are divided for the row of continuous support structures closest to the windward side.

2. The electrostatic filtration device according to claim 1, characterized in that, The size of the first region is less than or equal to that of the second region; and The exposed conductive material in the first region and the exposed conductive material in the second region are both close to the corresponding continuous support structure connection positions.

3. The electrostatic filter device of claim 1, wherein, Each pair of adjacent first electrode plates connected to each of the aforementioned continuous support structures is configured as follows: In one of the first electrode plates, at a first region corresponding to the connection position with the continuous support structure, at least a portion of the internal conductive material is led out, so that there is exposed conductive material in the first region. Another first electrode plate, in at least one second region adjacent to the first region corresponding to the connection position of the continuous support structure, leads out at least part of the internal conductive material so that there is exposed conductive material in the second region.

4. The electrostatic filter device of claim 1, wherein, Each of the positive electrode plates and each of the negative electrodes is the first electrode plate, and all electrode plates are connected by the same continuous support structure. One type of electrode plate is configured such that at least a portion of the internal conductive material is brought out in each of the first regions, resulting in exposed conductive material in the first regions. Another type of electrode plate is configured such that at least a portion of the internal conductive material is drawn out in each of the second regions, so that there is exposed conductive material in the second regions.

5. The electrostatic filtration device according to claim 4, characterized in that, Each of the negative electrode plates is configured such that at least a portion of the internal conductive material is led out in each of the first regions of the negative electrode plate, so that there is exposed conductive material in the first region. Each of the positive electrode plates is configured such that at least a portion of the internal conductive material is led out in each of the second regions of the positive electrode plate, so that there is exposed conductive material in the second region.

6. The electrostatic filter device of claim 1, wherein, The at least one continuous support structure includes: The first row of continuous support structure, the connection position of each of the positive electrode plates and each of the negative electrode plates to the continuous support structure of the first row of continuous support structure is located on the side closer to the windward side; The connection points between the positive electrode plate and the negative electrode plate of the second row of continuous support structure and the continuous support structure of the second row of continuous support structure are located on the side closer to the leeward side.

7. The electrostatic filtration device according to claim 6, characterized in that, The first row of continuous support structures and the second row of continuous support structures have the same number of continuous support structures, and are distributed in the same position along the electrode length direction; or The number of continuous support structures in the first row is less than that in the second row.

8. The electrostatic filtration device according to claim 1, characterized in that, The exposed conductive material is located at the edge of the electrode plate or at the center of the electrode plate.

9. The electrostatic filtration device according to claim 1, characterized in that, The first threshold is the electrode spacing; and / or The surface resistivity of the conductive material is less than 1E5Ω.

10. An electrostatic filtration system characterized by, It includes an air inlet duct, an electrostatic filter, a fan, and an air outlet duct. Air flows through the air inlet duct, passes through the electrostatic filter, and then flows out through the air outlet duct, driven by the fan. The electrostatic filtration device is the electrostatic filtration device according to any one of claims 1 to 9.

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