Chip synthesizer reagent dispensing device

Abstract

The utility model relates to chip synthesis equipment technical field especially relates to a kind of reagent liquid feeding device of chip synthesizer, including moving guide rail, big reagent liquid feeding module and monomer reagent liquid feeding module, displacement platform drives chip support table to move to the below of pressurizing assembly along moving guide rail, the lifting pressure plate of pressurizing assembly moves downwards, so that the sealing structure and chip support table adhere, enclosed closed chamber is enclosed, reagent and chip are fully contacted by closed space, without excessive reagent can guarantee coverage effect, reduce reagent cost;Drive shaft drives ink-jet head to move along guide along ink-jet mounting support, drive shaft and spray film assembly combination installation and cooperate linear guide rail to share stress, prolong its service life;The lower end of the anti-collision baffle of ink-jet head anti-collision module is lower than the lower end of the ink-jet mounting support, and is linked by spring buffer and travel switch, trigger stop when collision occurs, avoid ink-jet head and chip support table rigid contact, reduce equipment maintenance rate.

Description

Technical Field

[0001] This utility model relates to the field of chip synthesis equipment technology, and in particular to a reagent dispensing device for a chip synthesizer. Background Technology

[0002] The reagent dispensing methods of existing chip synthesizers mainly include two types: large reagent dispensing and single reagent dispensing.

[0003] One method, large-scale reagent dispensing, involves spraying reagent onto the chip surface while simultaneously moving the chip support horizontally, utilizing the reagent's flowability to ensure it covers the entire chip surface. However, this method requires excessive reagent to guarantee full coverage, resulting in high reagent costs.

[0004] The single-reagent dispensing method relies on the coordination of the UVW platform and the small Y-axis to align the chip and the inkjet head: the small Y-axis is mounted on the UVW platform, and the chip support is mounted on the small Y-axis. The alignment accuracy between the ink droplets from the inkjet head and the chip aperture is adjusted through the coordinated movement of the two. However, in this structure, the UVW platform needs to bear multiple loads, including the small Y-axis and the chip support, which can easily lead to frequent abnormal alarms due to excessive load, seriously affecting the service life of the UVW platform.

[0005] In addition, according to the requirements of inkjet printing process, the distance between the lower end of the inkjet head and the chip needs to be controlled within 2-3mm. This space is small and the chip support needs to be moved frequently, which leads to a high risk of collision between the chip support and the inkjet head, which can easily cause equipment damage and interruption of the synthesis process.

[0006] In summary, the reagent dispensing methods of existing chip synthesizers have room for improvement in terms of reagent utilization, equipment load rationality, and operational safety. Utility Model Content

[0007] This invention addresses the shortcomings of existing technologies by developing a reagent dispensing device for a chip synthesizer. This invention improves reagent utilization, equipment load rationality, and operational safety.

[0008] The technical solution to the technical problem solved by this utility model is as follows:

[0009] This application provides a reagent dispensing device for a chip synthesizer, including...

[0010] Moving guide rail;

[0011] A large reagent dispensing module includes a fixed frame, a displacement platform, and a chip support platform. The fixed frame is positioned on one side of a moving guide rail. The displacement platform is slidably connected to the moving guide rail. The chip support platform is mounted above the displacement platform. A pressurization assembly is provided on the fixed frame. The pressurization assembly includes a base and a lifting pressure plate. The base is connected to the fixed frame, and the lifting pressure plate is movably connected to the base. A sealing structure is provided on the bottom edge of the lifting pressure plate. The chip support platform has an inlet and an outlet. The lifting pressure plate moves downward, causing the sealing structure to fit against the chip support platform, enclosing a sealed chamber.

[0012] The single reagent dispensing module, located above the moving guide rail, includes a drive shaft, an inkjet assembly, and a guide. The inkjet assembly includes an inkjet mounting bracket and an inkjet head. The inkjet head is mounted on the inkjet mounting bracket. One side of the inkjet mounting bracket is connected to the drive shaft, and the other side is connected to the guide. The drive shaft drives the inkjet head to move along the guide with the inkjet mounting bracket.

[0013] As an improvement to the above solution, the reagent dispensing device of the chip synthesizer further includes an inkjet head anti-collision module. The inkjet head anti-collision module is symmetrically arranged on both sides of the single reagent dispensing module and includes an anti-collision baffle and a guide post. The lower end of the anti-collision baffle is lower than the lower end of the inkjet mounting bracket. The anti-collision baffle is sleeved on the outside of the guide post through a linear bearing. One end of the guide post is connected to the single reagent dispensing module, and the other end extends to the outside of the anti-collision baffle and is locked with a nut. A spring and a trigger switch are provided between the anti-collision baffle and the single reagent dispensing module.

[0014] As an improvement to the above solution, the lower end of the anti-collision baffle extends 0.3mm beyond the lower end of the inkjet mounting bracket.

[0015] As an improvement to the above solution, a spring is connected between the base and the lifting pressure plate.

[0016] As an improvement to the above solution, the pressurizing assembly further includes a blowing drive for driving the lifting pressure plate to move.

[0017] As an improvement to the above solution, the sealing structure is a sealing ring.

[0018] As an improvement to the above solution, the inlet and outlet are controlled to open and close by a switching valve.

[0019] As an improvement to the above solution, the chip support platform is provided with anti-backflow devices on both sides that communicate with the sealed chamber.

[0020] As an improvement to the above solution, the fixed frame is a gantry frame.

[0021] As an improvement to the above solution, the mobile platform is a UVW platform, and the drive axis is a small Y-axis.

[0022] Compared with existing technologies, the above solution has the following advantages or beneficial effects:

[0023] 1. The large reagent dispensing module ensures full contact between the reagent and the chip through a sealed space, guaranteeing coverage without the need for excessive reagents and reducing reagent costs; the anti-backflow device prevents reagent backflow during the reaction, directly improving the chip synthesis accuracy.

[0024] 2. The small Y-axis is assembled with the inkjet head and works with the linear guide rail to share the load, transferring the load from the UVW platform to the fixed structure, reducing the load on the UVW platform and extending its service life.

[0025] 3. The inkjet head anti-collision module is linked to a spring buffer and a trigger switch. When a collision occurs, it triggers a shutdown to prevent the inkjet head from making hard contact with the chip support platform and reduce the equipment maintenance rate. Attached Figure Description

[0026] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0027] Figure 1 This is a schematic diagram of the reagent dispensing device for the chip synthesizer in this embodiment. Figure 1 .

[0028] Figure 2 This is a schematic diagram of the structure of the large reagent dispensing module involved in this embodiment. Figure 2 .

[0029] Figure 3 This is a schematic diagram of the monomer reagent dispensing module involved in this embodiment. Figure 3 .

[0030] In the diagram, 1. Large reagent dispensing module; 11. Gantry; 12. UVW platform; 13. Base; 14. Lifting pressure plate; 15. Anti-backflow device; 16. Chip support platform; 2. Individual reagent dispensing module; 21. Small Y-axis; 22. Linear guide rail; 23. Inkjet mounting bracket; 24. Inkjet head; 25. Anti-collision baffle; 26. Guide column; 27. Nut; 3. Moving guide rail. Detailed Implementation

[0031] To clearly illustrate the technical features of this solution, the present invention will be described in detail below through specific embodiments and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different examples. This repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that the components illustrated in the drawings are not necessarily drawn to scale. The present invention omits descriptions of well-known components and processing techniques and processes to avoid unnecessarily limiting the present invention. The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate orientation or positional relationships based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] See Figure 1 This embodiment provides a reagent dispensing device for a chip synthesizer, including a moving guide rail 3, a large reagent dispensing module 1, and a single reagent dispensing module 2.

[0033] See Figure 2The large reagent dispensing module 1 includes a fixed frame, a displacement platform, and a chip support platform 16. The fixed frame is a gantry frame 11, and the displacement platform is a UVW platform 12. The gantry frame 11 is mounted on the left side of the moving guide rail 3. A pressurization assembly is installed on the gantry frame 11, which includes a base 13, a blow-pressure drive, and a lifting pressure plate 14. Specifically, the blow-pressure drive can be a cylinder connected to a gas source via an air pipe. The base 13 is fixedly connected to the inside of the gantry frame 11, and the lifting pressure plate 14 is movably mounted on the base 13. Specifically, the lifting pressure plate 14 can be connected to the base 13 via a sliding guide rail or a guide column. A sealing structure is connected to the bottom edge of the lifting pressure plate 14. The sealing structure is specifically a sealing ring made of rubber. The blow-pressure drive is connected to the lifting pressure plate 14, and the blow-pressure drive drives the lifting pressure plate 14 to move downward, so that the sealing ring fits against the chip support platform 16, forming a sealed chamber. A spring is also provided between the lifting pressure plate 14 and the base 13. After the blowing and pressing drive is depressurized, the spring causes the lifting pressure plate 14 to rise and return to its original position.

[0034] The UVW platform 12 is slidably connected to the moving guide rail 3 via a slider. The chip support platform 16 is fixedly connected above the UVW platform 12 and can move with it. The chip support platform 16 has an inlet for injecting reagents into the sealed chamber and an outlet for discharging reagents from the sealed chamber. A switching valve controls the opening and closing of the inlet and outlet. The inlet is connected to an external reagent source via a pipe, and the outlet is connected to a waste liquid collection device via a pipe. Anti-backflow devices 15, communicating with the sealed chamber, are installed on both sides of the chip support platform 16 to ensure that reagents do not flow back during the entire reaction process, thus preventing interference with the synthesis results. Specifically, the anti-backflow device is a one-way valve, which allows only the gas or waste liquid in the sealed chamber to escape, preventing external fluids from flowing back into the sealed chamber.

[0035] In use,

[0036] Liquid preparation: The UVW platform moves horizontally to place the chip support stage 16 directly below the pressurization component.

[0037] Formation of a sealed space: Air is introduced by the blow-driving component, the lifting pressure plate 14 is pressed down, and the sealing ring fits with the chip support platform 16 to form a sealed chamber.

[0038] Reagent circulation: The switching valve opens the inlet, and the reagent is injected into the chamber to ensure full contact between the chip and the reagent; after the reaction, the switching valve opens the outlet to discharge the reagent.

[0039] Separation and Reset: After the reaction is completed, the blowing drive stops, and the lifting pressure plate 14 rises back under the spring force, separating from the chip support platform 16, completing one cycle.

[0040] See Figure 3The single reagent dispensing module 2 is mounted above the moving guide rail 3 via a bracket. It includes a drive shaft, an inkjet assembly, and a guide. The drive shaft is a small Y-axis 21, and the guide is a linear guide rail 22. The inkjet assembly includes an inkjet mounting bracket 23 and an inkjet head 24, with the inkjet head 24 mounted on the inkjet mounting bracket 23. The left side of the inkjet mounting bracket 23 is connected to the vertically mounted small Y-axis 21. The linear guide rail 22 is fixedly mounted on the bracket, and the right side of the inkjet mounting bracket 23 is slidably connected to the linear guide rail 22 via a slider. The linear guide rail 22 shares the force on the small Y-axis 21, allowing the inkjet head 24 to move smoothly back and forth. In use, the small Y-axis 21 drives the inkjet mounting bracket 23 to move back and forth along the linear guide rail 22, thereby driving the inkjet head 24 to move smoothly back and forth, achieving alignment adjustment between the inkjet head 24 and the chip.

[0041] Compared with existing technologies, separating the motion system of the small Y-axis 21 and the inkjet head 24 from the UVW platform (which drives the chip movement) significantly reduces the load on the UVW platform.

[0042] The inkjet head anti-collision module includes an anti-collision baffle 25 and a guide post 26. The anti-collision baffle 25 is symmetrically located on both sides of the single reagent dispensing module 2. The lower end of the anti-collision baffle 25 extends 0.3mm beyond the lower end of the inkjet mounting bracket 23 of the inkjet head 24 to intercept the risk of collision in advance.

[0043] The anti-collision baffle 25 is sleeved on the outside of the guide post 26 via a linear bearing. One end of the guide post 26 is fixedly connected to the side of the single reagent dispensing module 2, and the other end extends to the outside of the anti-collision baffle 25 and is locked by a nut 27 to ensure stable movement. A spring and a trigger switch are provided between the anti-collision baffle 25 and the single reagent dispensing module 2, with the spring located inside the anti-collision baffle 25. Specifically, the spring is sleeved on the outside of the guide post 26, with one end abutting against the side of the single reagent dispensing module 2 and the other end abutting against the inside of the anti-collision baffle 25; the trigger switch is a miniature limit switch, fixed to the side of the single reagent dispensing module 2, with its contact facing the anti-collision baffle 25. In the event of a collision, the anti-collision baffle 25 is pushed by the external force and slides axially along the guide post 26. The spring is compressed, and the inner side of the anti-collision baffle 25 presses against the contact piece, triggering the micro limit switch to conduct and sending a stop signal, causing the equipment to stop immediately. After the collision is resolved, the anti-collision baffle 25 rebounds and resets due to the spring force, the micro limit switch returns to its pre-trigger state, and the equipment can be restarted. This design ensures that the equipment can be stopped promptly after a collision, avoiding unnecessary losses.

[0044] Although the specific embodiments of the utility model have been described above in conjunction with the accompanying drawings, this is not intended to limit the scope of protection of the utility model. Based on the technical solution of the utility model, various modifications or variations that can be made by those skilled in the art without creative effort are still within the scope of protection of the utility model.

Claims

1. A reagent dispensing device for a chip synthesizer, characterized in that: include Moving guide rail (3); The large reagent dispensing module (1) includes a fixed frame, a displacement platform, and a chip support platform (16). The fixed frame is placed on one side of the moving guide rail (3). The displacement platform is slidably connected to the moving guide rail (3). The chip support platform (16) is installed above the displacement platform. The fixed frame is provided with a pressurizing component. The pressurizing component includes a base (13) and a lifting pressure plate (14). The base (13) is connected to the fixed frame. The lifting pressure plate (14) is movably connected to the base (13). The bottom edge of the lifting pressure plate (14) is provided with a sealing structure. The lifting pressure plate (14) moves down so that the sealing structure fits against the chip support platform (16) to enclose a sealed chamber. The chip support platform (16) has an inlet and an outlet that communicate with the sealed chamber. The single reagent dispensing module (2) is located above the moving guide rail (3) and includes a drive shaft, an inkjet assembly and a guide. The inkjet assembly includes an inkjet mounting bracket (23) and an inkjet head (24). The inkjet head (24) is mounted on the inkjet mounting bracket (23). One side of the inkjet mounting bracket (23) is connected to the drive shaft and the other side is connected to the guide. The drive shaft drives the inkjet head (24) to move along the guide with the inkjet mounting bracket (23).

2. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: The reagent dispensing device of the chip synthesizer also includes an inkjet head anti-collision module. The inkjet head anti-collision module is symmetrically arranged on both sides of the single reagent dispensing module (2). It includes an anti-collision baffle (25) and a guide post (26). The lower end of the anti-collision baffle (25) is lower than the lower end of the inkjet mounting bracket (23). The anti-collision baffle (25) is sleeved on the outside of the guide post (26) through a linear bearing. One end of the guide post (26) is connected to the single reagent dispensing module (2), and the other end extends to the outside of the anti-collision baffle (25) and is locked by a nut (27). A spring and a trigger switch are provided between the anti-collision baffle (25) and the single reagent dispensing module (2).

3. The reagent dispensing device for a chip synthesizer according to claim 2, characterized in that: The lower end of the anti-collision baffle (25) extends 0.3 mm beyond the lower end of the inkjet mounting bracket (23).

4. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: A spring connects the base (13) to the lifting pressure plate (14).

5. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: The pressurization assembly also includes a blow-driving component for driving the lifting pressure plate (14) to move.

6. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: The sealing structure is a sealing ring.

7. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: The inlet and outlet are controlled by a switching valve.

8. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: The chip support platform (16) is provided with anti-backflow devices (15) on both sides that are connected to the sealed chamber.

9. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: The fixed frame is a gantry frame (11).

10. The reagent dispensing device for a chip synthesizer according to claim 1, characterized in that: The displacement platform is a UVW platform (12), and the drive axis is a small Y-axis (21).

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