Substrate cutting apparatus

By introducing a limiting mechanism into the photovoltaic substrate cutting device, the problem of photovoltaic substrate offset on the cutting equipment is solved, and the yield of photovoltaic substrate after cutting is improved.

CN224464983UActive Publication Date: 2026-07-07JINWAN GAOJING SOLAR ENERGY TECH CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JINWAN GAOJING SOLAR ENERGY TECH CO LTD
Filing Date
2025-07-16
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Photovoltaic substrates are prone to shifting during transport on cutting equipment, resulting in inconsistent dimensions of the cut photovoltaic substrates and a low yield.

Method used

A substrate cutting device is designed, comprising a conveying mechanism, a limiting mechanism, and a cutting mechanism. The limiting mechanism consists of a support component and a limiting component, which can move in the width direction to adjust the position of the photovoltaic substrate and prevent it from shifting.

Benefits of technology

By adjusting the position of the photovoltaic substrate, the yield of the cut photovoltaic substrate was improved, ensuring the consistency of the cutting effect.

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Abstract

The application belongs to the technical field of photovoltaic substrate preparation, and provides a substrate cutting device. The substrate cutting device comprises a conveying mechanism, a limiting mechanism and a cutting mechanism. The conveying mechanism is used for conveying a substrate to be cut. The limiting mechanism comprises two limiting mechanisms. Each limiting mechanism comprises a supporting assembly and a limiting assembly. The supporting assemblies of the two limiting mechanisms are symmetrically arranged on the two sides of the conveying mechanism. The limiting assembly is connected with the supporting assembly and can move along the width direction relative to the supporting assembly. The limiting assembly is used for contacting the substrate to be cut and adjusting the position of the substrate to be cut. The cutting mechanism is used for cutting the substrate to be cut. The conveying mechanism and the cutting mechanism are arranged along the length direction of the substrate cutting device. The substrate cutting device provided by the application can adjust the position of the photovoltaic substrate, so that the yield of the cut photovoltaic substrate is higher.
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Description

Technical Field

[0001] This application relates to the field of photovoltaic substrate preparation technology, and in particular to a substrate cutting device. Background Technology

[0002] Photovoltaic substrates are the main material of solar cells, used to convert solar energy into electrical energy.

[0003] Photovoltaic substrates vary in shape and size, requiring cutting equipment before use or progression to the next manufacturing step. However, these differences in shape and size make it easy for photovoltaic substrates to shift during transport on the cutting equipment. This shifting makes it difficult to guarantee consistent dimensions after cutting.

[0004] In related technologies, cutting equipment has difficulty adjusting the position of photovoltaic substrates, resulting in a low yield of the cut photovoltaic substrates. Utility Model Content

[0005] This application provides a substrate cutting device that can adjust the position of a photovoltaic substrate, resulting in a higher yield of the cut photovoltaic substrate.

[0006] This application provides a substrate cutting device, including a conveying mechanism, a limiting mechanism, and a cutting mechanism. The conveying mechanism is used to convey the substrate to be cut. There are two limiting mechanisms, each of which includes a support component and a limiting component. The support components of the two limiting mechanisms are symmetrically arranged on both sides of the conveying mechanism along the width direction of the substrate cutting device. The limiting components are connected to the support components and can move relative to the support components along the width direction. The limiting components are used to contact the substrate to be cut and adjust the position of the substrate to be cut. The cutting mechanism is used to cut the substrate to be cut. The conveying mechanism and the cutting mechanism are arranged sequentially along the length direction of the substrate cutting device.

[0007] In one possible implementation, the substrate cutting device provided in this application includes a support component comprising a support frame and a stop component, the stop component being connected to the support frame, the support frame having a first mounting groove; a limiting component comprising a limiting plate and a slider connected to the limiting plate, the slider being inserted into the first mounting groove and being able to move in the width direction within the first mounting groove; and a stop component engaging with the slider.

[0008] In one possible implementation, the substrate cutting apparatus provided in this application includes a stop assembly comprising a housing and a movable plate. The housing is connected to a support frame, and the movable plate includes a plate and a stop protrusion. The slider has a plurality of stop grooves spaced apart along the width direction. The plate is connected to the housing and is movable relative to the housing so that the stop protrusion is inserted into or disengaged from the stop groove.

[0009] In one possible implementation, the substrate cutting device provided in this application further includes an elliptical adjusting plate in the stop assembly, which is rotatably connected to the housing. Two movable plates are symmetrically arranged on both sides of the elliptical adjusting plate, with stop protrusions on the two movable plates facing each other. When the two ends of the elliptical adjusting plate abut against the bodies of the two movable plates along its minor axis, the stop protrusions on both movable plates are inserted into the stop grooves. When the two ends of the elliptical adjusting plate abut against the bodies of the two movable plates along its major axis, the stop protrusions on both movable plates disengage from the stop grooves.

[0010] In one possible implementation, the substrate cutting device provided in this application further includes a handle and a connecting rod in the stop assembly. The handle and the elliptical adjusting plate are connected to both sides of the connecting rod. The connecting rod is threadedly connected to the housing. The elliptical adjusting plate and the portion of the plate body that contacts the elliptical adjusting plate are both located inside the housing, while the handle is located outside the housing.

[0011] In one possible implementation, the substrate cutting device provided in this application has a limiting rod on the inner wall of the box body and a second mounting groove on the plate body, and the limiting rod is inserted into the second mounting groove.

[0012] In one possible implementation, the substrate cutting device provided in this application further includes an elastic element in the stop assembly, with one end of the elastic element connected to the inner wall of the housing and the other end of the elastic element connected to the plate.

[0013] In one possible implementation, the substrate cutting device provided in this application has a limiting strip on the slider and a limiting groove on the support frame, the limiting groove being connected to a first mounting groove; when the slider is inserted into the first mounting groove, the limiting strip is located in the limiting groove.

[0014] In one possible implementation, the substrate cutting apparatus provided in this application further includes a body and a material box. The material box, conveying mechanism, limiting mechanism and cutting mechanism are all connected to the body. The material box is located above the conveying mechanism along the height direction of the substrate cutting apparatus.

[0015] In one possible implementation, the substrate cutting device provided in this application includes a mounting frame, a support plate and a fixing member on the mounting frame, a material box placed on the support plate, and the fixing member connecting the mounting frame and the material box.

[0016] In one possible implementation, the substrate cutting device provided in this application further includes a collection mechanism connected to the body, and the conveying mechanism, the cutting mechanism and the collection mechanism are arranged sequentially along the length direction; the collection mechanism is used to collect the cut substrate.

[0017] The substrate cutting apparatus provided in this application comprises a conveying mechanism, a limiting mechanism, and a cutting mechanism. The conveying mechanism and the cutting mechanism are arranged sequentially along the length of the substrate cutting apparatus. The conveying mechanism is used to convey the substrate to be cut. The limiting mechanism includes a support component and a limiting component. The limiting component is connected to the support component and can move relative to the support component in the width direction. When the conveying mechanism transports the substrate to be cut, the positions of the limiting component and the support component in the limiting mechanism can be adjusted, so that the limiting component can adjust the position of the substrate to be cut on the conveying mechanism to avoid the substrate to be cut from shifting. There are two limiting mechanisms, and the limiting components in the two limiting mechanisms can adjust the position of the substrate to be cut on both sides in the width direction, further reducing the risk of the substrate to be cut from shifting, so that the yield of the substrate to be cut is high when the cutting mechanism cuts the substrate. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the substrate cutting device provided in the embodiments of this application;

[0020] Figure 2 A schematic diagram of the conveying mechanism, limiting mechanism, and material box in the substrate cutting device provided in the embodiments of this application;

[0021] Figure 3 This is a schematic diagram of the limiting mechanism in the substrate cutting device provided in the embodiments of this application;

[0022] Figure 4 An exploded view of the limiting mechanism in the substrate cutting device provided in the embodiments of this application;

[0023] Figure 5 This is a schematic diagram of the internal structure of the stop assembly of the substrate cutting device provided in the embodiments of this application;

[0024] Figure 6 This is a schematic diagram of the material box and part of the machine body in the substrate cutting device provided in the embodiments of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 10-Substrate cutting device;

[0027] 100 - Conveying mechanism; 110 - First motor; 120 - First conveyor belt;

[0028] 200 - Limiting mechanism; 200a - First limiting mechanism; 200b - Second limiting mechanism;

[0029] 210 - Support components;

[0030] 211-Support frame; 2111-First mounting slot; 2112-Limiting slot;

[0031] 212-Stop component;

[0032] 2121 - Box body; 2121a - Limiting rod;

[0033] 2122-Moving plate; 2122a-Plate body; 2122b-Stop protrusion; 2122c-Second mounting slot;

[0034] 2123 - Oval adjusting plate; 2124 - Handle; 2125 - Linkage rod; 2126 - Elastic element;

[0035] 220 - Limiting component; 221 - Limiting plate; 222 - Slider; 2221 - Stop groove; 2222 - Limiting strip;

[0036] 300 - Cutting mechanism; 310 - Cutting table; 320 - Cutting assembly; 321 - Support; 322 - Cutting tool;

[0037] 400 - Body; 410 - Mounting bracket; 411 - Support plate; 412 - Fixture;

[0038] 500 - Material box; 510 - Observation window;

[0039] 600 - Collection Agency;

[0040] 610 - Handling assembly; 611 - Second motor; 612 - Clamping component;

[0041] 620 - Collection component; 621 - Third motor; 622 - Second conveyor belt;

[0042] X - Length direction; Y - Width direction; Z - Height direction. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0045] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0046] The terms "first," "second," and "third" (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0047] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such as a process, method, system, product, or maintenance tool that includes a series of steps or units, not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or maintenance tool.

[0048] Photovoltaic substrates are the main material of solar cells, used to convert solar energy into electrical energy.

[0049] Photovoltaic substrates vary in shape and size, requiring cutting equipment before use or progression to the next manufacturing step. This cutting equipment, including conveyor belts, guide rails, and rollers, transports the photovoltaic substrates. Due to these variations, the contact surface between the substrate and the conveyor belt, guide rails, or rollers changes continuously during transport, resulting in uneven stress distribution. This uneven stress causes lateral forces in the transport direction, leading to substrate misalignment. Misalignment results in poor cutting quality, and some substrates may be unusable due to dimensional defects.

[0050] In related technologies, cutting equipment has difficulty adjusting the position of photovoltaic substrates, resulting in a low yield of the cut photovoltaic substrates.

[0051] Based on this, this application provides a substrate cutting device that can adjust the position of the photovoltaic substrate, resulting in a higher yield of the cut photovoltaic substrate.

[0052] Figure 1 This is a schematic diagram of the substrate cutting device provided in the embodiments of this application. Figure 2 This is a schematic diagram of the conveying mechanism, limiting mechanism, and material box in the substrate cutting apparatus provided in the embodiments of this application. Figure 3 This is a schematic diagram of the limiting mechanism in the substrate cutting device provided in the embodiments of this application. Figure 4 An exploded view of the limiting mechanism in the substrate cutting device provided in the embodiments of this application.

[0053] See Figures 1 to 4 As shown, the substrate cutting device 10 includes a conveying mechanism 100, a limiting mechanism 200, and a cutting mechanism 300. The conveying mechanism 100 and the cutting mechanism 300 are arranged sequentially along the length direction X of the substrate cutting device 10. The conveying mechanism 100 is used to convey the substrate to be cut. There are two limiting mechanisms 200. Each limiting mechanism 200 includes a support component 210 and a limiting component 220. The support components 210 of the two limiting mechanisms 200 are symmetrically arranged on both sides of the conveying mechanism 100 along the width direction Y of the substrate cutting device 10. The limiting component 220 is connected to the support component 210 and can move relative to the support component 210 along the width direction Y. The limiting component 220 is used to contact the substrate to be cut and adjust the position of the substrate to be cut. The cutting mechanism 300 is used to cut the substrate to be cut.

[0054] The substrate cutting device 10 also includes a body 400, which supports the conveying mechanism 100, the limiting mechanism 200, and the cutting mechanism 300. The conveying mechanism 100, the limiting mechanism 200, and the cutting mechanism 300 are all connected to the body 400, and the conveying mechanism 100 and the cutting mechanism 300 are arranged sequentially along the length direction X on the body 400.

[0055] The conveying mechanism 100 can be a conveyor belt mechanism, which includes a first motor 110 and a first conveyor belt 120. The first motor 110 can be mounted on the machine body 400, and the shaft of the first motor 110 can be connected to the first conveyor belt 120. The substrate to be cut is placed on the first conveyor belt 120. The first motor 110 can drive the first conveyor belt 120 to move along the length direction X, thereby moving the substrate to be cut along the length direction X.

[0056] The cutting mechanism 300 includes a cutting table 310 and a cutting assembly 320. The cutting assembly 320 includes a support 321 and a cutting tool 322. The cutting table 310 is mounted on the machine body 400, and the support 321 is also mounted on the machine body 400. The support 321 supports the cutting tool 322 above the cutting table 310, and the cutting tool 322 can move relative to the support 321. For example, a three-axis traveling mechanism can be provided on the support 321, and the cutting tool 322 is connected to the three-axis traveling mechanism, thereby enabling the cutting tool 322 to move above the cutting table 310.

[0057] The conveying mechanism 100 conveys the substrate to be cut to the cutting table 310, and the cutting tool 322 moves above the cutting table 310 to cut the substrate.

[0058] The limiting mechanism 200 adjusts the position of the substrate to be cut while the conveying mechanism 100 is conveying the substrate to be cut. This can prevent the position of the substrate to be cut from shifting, so that the size of the cut substrate meets the usage requirements and the yield of the substrate is high.

[0059] Specifically, there are two limiting mechanisms 200, namely a first limiting mechanism 200a and a second limiting mechanism 200b. Each limiting mechanism 200 includes a support component 210 and a limiting component 220. The support components 210 of the first limiting mechanism 200a and the second limiting mechanism 200b are symmetrically arranged on both sides of the first conveyor belt 120 of the conveying mechanism 100 along the width direction Y of the substrate cutting device 10.

[0060] The limiting component 220 is supported on both sides of the first conveyor belt 120 by the supporting component 210, and the limiting component 220 can move along the width direction Y on the supporting component 210. When the substrate to be cut shifts towards the first limiting mechanism 200a on the first conveyor belt 120, the position of the limiting component 220 on the first limiting mechanism 200a relative to the supporting component 210 is adjusted so that the limiting component 220 on the first limiting mechanism 200a moves towards the second limiting mechanism 200b, thereby pushing the substrate to be cut towards the second limiting mechanism 200b on the first conveyor belt 120, thereby counteracting the shift of the substrate to be cut.

[0061] When the substrate to be cut shifts toward the second limiting mechanism 200b on the first conveyor belt 120, the position of the limiting component 220 on the second limiting mechanism 200b relative to the support component 210 is adjusted so that the limiting component 220 on the second limiting mechanism 200b moves toward the first limiting mechanism 200a, thereby pushing the substrate to be cut toward the first limiting mechanism 200a on the first conveyor belt 120, thereby offsetting the shift of the substrate to be cut.

[0062] The substrate cutting apparatus 10 provided in this application embodiment includes a conveying mechanism 100, a limiting mechanism 200, and a cutting mechanism 300. The conveying mechanism 100 and the cutting mechanism 300 are arranged sequentially along the length direction X of the substrate cutting apparatus 10. The conveying mechanism 100 is used to convey the substrate to be cut. The limiting mechanism 200 includes a support component 210 and a limiting component 220. The limiting component 220 is connected to the support component 210 and can move relative to the support component 210 along the width direction Y. When cutting the substrate, the positions of the limiting component 220 and the support component 210 in the limiting mechanism 200 can be adjusted so that the limiting component 220 can adjust the position of the substrate to be cut on the conveying mechanism 100, thus preventing the substrate to be cut from shifting. There are two limiting mechanisms 200, and the limiting components 220 in the two limiting mechanisms 200 can adjust the position of the substrate to be cut on both sides of the width direction Y, further reducing the risk of the substrate to be cut shifting, so that when the cutting mechanism 300 cuts the substrate to be cut, the yield of the substrate after cutting is high.

[0063] Please continue reading Figure 3 and Figure 4 As shown, in one possible implementation, the support assembly 210 includes a support frame 211 and a stop assembly 212, the stop assembly 212 being connected to the support frame 211, the support frame 211 having a first mounting groove 2111; the limiting assembly 220 includes a limiting plate 221 and a slider 222 connected to the limiting plate 221, the slider 222 being inserted into the first mounting groove 2111 and being able to move in the width direction Y within the first mounting groove 2111; the stop assembly 212 engaging with the slider 222.

[0064] The support frame 211 can be connected to the body 400. A first mounting groove 2111 is provided on the support frame 2111, which is a through groove extending through the support frame 2111 along the width direction Y. The position of the first mounting groove 2111 on the support frame 211 is approximately aligned with the substrate to be cut along the height direction Z. The limiting assembly 220 includes a limiting plate 221 and a slider 222. The slider 222 is inserted into the first mounting groove 2111. When the slider 222 moves in the first mounting groove 2111, it can drive the limiting plate 221 to move. The limiting plate 221 is used to contact the substrate to be cut and push the substrate to be cut to move. The insertion of the slider 222 into the first mounting groove 2111 facilitates the movement of the limiting assembly 220 relative to the support frame 211. The limiting plate 221 is a plate-shaped piece, and the contact between the plate surface of the limiting plate 221 and the substrate to be cut can prevent the limiting plate 221 from damaging the edge of the substrate to be cut.

[0065] The support component 210 also includes a stop component 212, which is also connected to the support frame 211. After the limit component 220 moves to the limit plate 221 and adjusts the position of the substrate to be cut, the stop component 212 engages with the slider 222 to prevent the limit component 220 from moving again and damaging the substrate to be cut.

[0066] In one possible implementation, the slider 222 has a limiting strip 2222, and the support frame 211 has a limiting groove 2112, which communicates with the first mounting groove 2111; when the slider 222 is inserted into the first mounting groove 2111, the limiting strip 2222 is located in the limiting groove 2112.

[0067] The structure of the limiting strip 2222 and the limiting groove 2112 can limit the sliding of the slider 222 in the first mounting groove 2111, prevent the slider 222 from shaking during the sliding process, and improve the structural stability of the limiting mechanism 200.

[0068] The following describes the specific way in which the stop component 212 and the slider 222 are engaged.

[0069] Figure 5 This is a schematic diagram of the internal structure of the stop component of the substrate cutting device provided in the embodiments of this application.

[0070] See Figure 4 and Figure 5 As shown, the stop assembly 212 includes a housing 2121 and a movable plate 2122. The housing 2121 is connected to the support frame 211. The movable plate 2122 includes a plate 2122a and a stop protrusion 2122b. The slider 222 has stop grooves 2221 arranged at intervals along the width direction Y. The plate 2122a is connected to the housing 2121 and can move relative to the housing 2121 so that the stop protrusion 2122b is inserted into or disengaged from the stop groove 2221.

[0071] The housing 2121 can be fixedly connected to the support frame 211. The housing 2121 is used to support and accommodate other components in the stop assembly 212. Specifically, the movable plate 2122 includes a plate body 2122a. The first end of the plate body 2122a extends into the housing 2121 and is connected to the inner wall of the housing 2121. The second end of the plate body 2122a is located on the outer side of the housing 2121, and the stop protrusion 2122b is connected to the second end of the plate body 2122a.

[0072] The slider 222 has multiple stop grooves 2221 arranged along the width direction Y. When the stop protrusion 2122b is inserted into one of the stop grooves 2221, the stop assembly 212 can engage with the slider 222. When it is necessary to adjust the position of the slider 222 relative to the support assembly 210, the plate 2122a moves away from the slider 222, and the plate 2122a drives the stop protrusion 2122b to move, so that the stop protrusion 2122b can disengage from the stop groove 2221. The stop assembly 212 disengages from the slider 222, and then the limiting assembly 220 is moved to the desired position, so that the plate 2122a moves toward the slider 222, and the plate 2122a drives the stop protrusion 2122b to move, so that the stop protrusion 2122b can be inserted into the stop groove 2221.

[0073] This configuration allows for easy adjustment of the position of the limiting component 220 relative to the support frame 211, and also allows for easy fixation of the limiting component 220 after it has been moved into place.

[0074] Please continue reading Figure 5 As shown, the stop assembly 212 also includes an elliptical adjusting plate 2123, which is rotatably connected to the housing 2121; there are two moving plates 2122, which are symmetrically arranged on both sides of the elliptical adjusting plate 2123, and the stop protrusions 2122b in the two moving plates 2122 face each other; when the two ends of the elliptical adjusting plate 2123 along the minor axis abut against the plate body 2122a of the two moving plates 2122, the stop protrusions 2122b on the two moving plates 2122 are inserted into the stop groove 2221; when the two ends of the elliptical adjusting plate 2123 along the major axis abut against the plate body 2122a of the two moving plates 2122, the stop protrusions 2122b on the two moving plates 2122 disengage from the stop groove 2221.

[0075] An elliptical adjusting plate 2123 can be positioned along the length direction X in the middle region of the box 2121, and two movable plates 2122 can be symmetrically positioned on both sides of the elliptical adjusting plate 2123 along the length direction X. Stop protrusions 2122b on the two movable plates 2122 can be inserted into both sides of the stop groove 2221, making the engagement between the stop assembly 212 and the limiting assembly 220 more reliable.

[0076] The length of the elliptical adjusting plate 2123 along its major axis is greater than its length along its minor axis. When the elliptical adjusting plate 2123 rotates relative to the housing 2121 until the extension direction of its minor axis aligns with the length direction X, the two ends of the elliptical adjusting plate 2123 along its minor axis abut against the plates 2122a of the two moving plates 2122, respectively. The distance between the plates 2122a of the two moving plates 2122 is small, and the two stop protrusions 2122b are inserted into the stop grooves 2221. At this time, the stop assembly 212 engages with the limiting assembly 220.

[0077] When the elliptical adjusting plate 2123 rotates relative to the box body 2121 until its major axis extends in the same direction as the length direction X, the two ends of the elliptical adjusting plate 2123 along the major axis abut against the plates 2122a of the two moving plates 2122, causing the two plates 2122a to move away from each other. The two plates 2122a can drive the two stop protrusions 2122b to move away from each other, and the distance between the plates 2122a of the two moving plates 2122 gradually increases. As a result, the two stop protrusions 2122b can simultaneously disengage from the stop groove 2221. At this time, the limiting component 220 can be moved along the width direction Y.

[0078] With this configuration, the positions of the two moving plates 2122 can be adjusted simultaneously using an elliptical adjustment plate 2123, making the position adjustment process of the limiting component 220 more convenient and efficient.

[0079] Please continue reading Figure 4 and Figure 5 As shown, the stop assembly 212 also includes a handle 2124 and a connecting rod 2125. The handle 2124 and the elliptical adjusting plate 2123 are connected to both sides of the connecting rod 2125. The connecting rod 2125 is threadedly connected to the housing 2121. The parts of the elliptical adjusting plate 2123 and the plate 2122a that contact the elliptical adjusting plate 2123 are both located inside the housing 2121, while the handle 2124 is located outside the housing.

[0080] The box 2121 can protect the part of the elliptical adjusting plate 2123 and the plate 2122a that contacts the elliptical adjusting plate 2123, so as to prevent foreign particles from falling on the part of the plate 2122a that contacts the elliptical adjusting plate 2123 and thus hindering the rotation of the elliptical adjusting plate 2123.

[0081] The handle 2124 is located outside the box, which makes it convenient for the operator to hold and rotate the handle 2124. When the operator rotates the handle 2124, the handle 2124 can drive the elliptical adjustment plate 2123 to rotate through the connecting rod 2125.

[0082] The connection method between the movable plate 2122 and the box 2121 will be described below.

[0083] Please continue reading Figure 5 As shown, a limiting rod 2121a is provided on the inner wall of the box 2121, and a second mounting groove 2122c is provided on the plate 2122a, with the limiting rod 2121a inserted into the second mounting groove 2122c.

[0084] Limiting rods 2121a and plate bodies 2122a are respectively provided. The length of the limiting rod 2121a can be greater than the moving path of the plate body 2122a. One end of the limiting rod 2121a is fixedly connected to the inner wall of the box body 2121. The limiting rod 2121a is inserted into the second mounting groove 2122c of the plate body 2122a, thereby allowing the moving plate 2122 to connect with the box body 2121 and move relative to the box body 2121. The limiting rod 2121a can also constrain the moving path of the moving plate 2122, preventing the moving plate 2122 from tilting during movement.

[0085] Please continue reading Figure 5 As shown, the stop assembly 212 also includes an elastic element 2126, one end of which is connected to the inner wall of the box 2121, and the other end of which is connected to the plate 2122a.

[0086] The elastic element 2126 can be a coil spring, an elastic sleeve, or other elastic components. When the elliptical adjusting plate 2123 rotates relative to the housing 2121 until the extension direction of its minor axis aligns with the length direction X, the restoring force of the elastic element 2126 pushes the plate 2122a, causing the stop protrusion 2122b to insert into the corresponding stop groove 2221. This avoids the need for manual pushing of the plate 2122a, making its movement easier. It is understandable that when the elliptical adjusting plate 2123 rotates relative to the housing 2121 until the extension direction of its major axis aligns with the length direction X, the elastic force of the elastic element 2126 needs to be overcome.

[0087] Please continue reading Figure 1 As shown, the substrate cutting device 10 also includes a material box 500, which is connected to the machine body 400. The material box is located above the conveying mechanism 100 along the height direction Z of the substrate cutting device 10.

[0088] Multiple substrates to be cut are stacked along the height direction Z in the material box 500. The substrates to be cut are placed one by one on the conveying mechanism 100 and transferred to the cutting mechanism 300 through the conveying mechanism 100.

[0089] An observation window 510 can be provided on the material box 500 to facilitate the operator to observe the amount of substrate to be cut stored inside the material box 500 so as to replenish the substrate to be cut in a timely manner.

[0090] Figure 6This is a schematic diagram of the material box and part of the machine body in the substrate cutting device provided in the embodiments of this application.

[0091] See Figure 1 and Figure 6 As shown, the machine body 400 includes a mounting frame 410, on which a support plate 411 and a fixing member 412 are provided. The material box 500 is placed on the support plate 411, and the fixing member 412 connects the mounting frame 410 and the material box 500.

[0092] There are two mounting brackets 410, which are arranged at both ends of the material box 500 along the width direction Y. The support plate 411 is arranged at the bottom of the material box 500 to support the material box 500.

[0093] The fastener 412 can be a bolt. The fastener 412 is threadedly connected to the mounting bracket 410. The end of the fastener 412 abuts against the material box 500, which can prevent the material box 500 from shaking during use and facilitate the disassembly and replacement of the material box 500.

[0094] Please continue reading Figure 1 As shown, the substrate cutting device 10 also includes a collection mechanism 600, which is connected to the body 400. The conveying mechanism 100, the cutting mechanism 300 and the collection mechanism 600 are arranged in sequence along the length direction X. The collection mechanism 600 is used to collect the cut substrate.

[0095] After the cutting mechanism 300 completes the cutting of the substrate, the collecting mechanism 600 collects the cut substrate. Specifically, the collecting mechanism 600 includes a conveying assembly 610 and a collecting assembly 620. The conveying assembly 610 includes a second motor 611 and a clamping member 612. The second motor 611 can be mounted on the machine body 400, and the rotating shaft of the second motor 611 is connected to the clamping member 612. The second motor 611 can drive the clamping member 612 to move along the length direction X.

[0096] After the substrate is cut by the cutting assembly 320 and placed on the cutting table 310, the second motor 611 drives the clamping member 612 to move to the position of the cutting table 310. After the clamping member 612 clamps the substrate, the second motor 611 drives the clamping member 612 to move to the position of the collecting assembly 620.

[0097] The collection assembly 620 includes a third motor 621 and a second conveyor belt 622. The third motor 621 can be mounted on the machine body 400, and its shaft is connected to the second conveyor belt 622. The third motor 621 can drive the second conveyor belt 622 to move. The clamping member 612 clamps the substrate and places it on the second conveyor belt 622. Driven by the second conveyor belt 622, the substrate leaves the substrate cutting device 10 and is collected by a subsequent collection box (not shown in the figure).

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A substrate cutting device, characterized in that, include: A conveying mechanism is used to convey the substrate to be cut; The device includes two limiting mechanisms, each comprising a support component and a limiting component. The support components of the two limiting mechanisms are symmetrically arranged on both sides of the conveying mechanism along the width direction of the substrate cutting device. The limiting component is connected to the support component and is movable relative to the support component along the width direction. The limiting component is used to contact the substrate to be cut and adjust the position of the substrate. A cutting mechanism, used to cut the substrate to be cut; The conveying mechanism and the cutting mechanism are arranged sequentially along the length of the substrate cutting device.

2. The substrate cutting apparatus according to claim 1, characterized in that, The support assembly includes a support frame and a stop assembly, the stop assembly being connected to the support frame, and the support frame having a first mounting groove; The limiting component includes a limiting plate and a slider connected to the limiting plate. The slider is inserted into the first mounting slot and can move along the width direction in the first mounting slot. The stop component engages with the slider.

3. The substrate cutting apparatus according to claim 2, characterized in that, The stop assembly includes a housing and a movable plate. The housing is connected to the support frame, and the movable plate includes a plate body and a stop protrusion. The slider has a plurality of stop grooves spaced apart along the width direction. The plate is connected to the box and can move relative to the box so that the stop protrusion is inserted into or disengaged from the stop groove.

4. The substrate cutting apparatus according to claim 3, characterized in that, The stop assembly also includes an elliptical adjusting plate, which is rotatably connected to the box body; There are two movable plates, which are symmetrically arranged on both sides of the elliptical adjustment plate, and the stop protrusions in the two movable plates are arranged facing each other. When the two ends of the elliptical adjusting plate along the minor axis abut against the plates of the two moving plates, the stop protrusions on the two moving plates are inserted into the stop grooves; when the two ends of the elliptical adjusting plate along the major axis abut against the plates of the two moving plates, the stop protrusions on the two moving plates disengage from the stop grooves.

5. The substrate cutting apparatus according to claim 4, characterized in that, The stop assembly also includes a handle and a connecting rod. The handle and the elliptical adjusting plate are connected to both sides of the connecting rod. The connecting rod is threaded to the housing. The elliptical adjusting plate and the portion of the plate that contacts the elliptical adjusting plate are both located inside the housing. The handle is located outside the housing.

6. The substrate cutting apparatus according to any one of claims 3 to 5, characterized in that, A limiting rod is provided on the inner wall of the box, and a second mounting groove is provided on the plate, in which the limiting rod is inserted.

7. The substrate cutting apparatus according to claim 6, characterized in that, The stop assembly also includes an elastic element, one end of which is connected to the inner wall of the box body, and the other end of which is connected to the plate body.

8. The substrate cutting apparatus according to any one of claims 2 to 5, characterized in that, The slider has a limiting strip, and the support frame has a limiting groove, which is connected to the first mounting groove; When the slider is inserted into the first mounting groove, the limiting strip is located in the limiting groove.

9. The substrate cutting apparatus according to any one of claims 1 to 5, characterized in that, It also includes a machine body and a material box. The material box, the conveying mechanism, the limiting mechanism and the cutting mechanism are all connected to the machine body. The material box is located above the conveying mechanism along the height direction of the substrate cutting device.

10. The substrate cutting apparatus according to claim 9, characterized in that, The machine body includes a mounting frame, on which a support plate and a fixing component are provided. The material box is placed on the support plate, and the fixing component connects the mounting frame and the material box.

11. The substrate cutting apparatus according to claim 9, characterized in that, It also includes a collection mechanism connected to the body, wherein the conveying mechanism, the cutting mechanism and the collection mechanism are arranged sequentially along the length direction; the collection mechanism is used to collect the cut substrate.