Applying device and applying apparatus
By combining flexible film vacuum adsorption and pressure roller rolling, the problem of difficult thrust control in existing bonding devices is solved, achieving uniform force on the parts to be bonded, and improving the bonding effect and user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LENS ROBOTICS (CHANGSHA) CO LTD
- Filing Date
- 2025-07-23
- Publication Date
- 2026-07-07
AI Technical Summary
In existing bonding devices, the thrust on the first part to be bonded is difficult to control, which affects the bonding effect and leads to a decrease in product quality and user experience.
The method of flexible film vacuum adsorption combined with pressure roller rolling is adopted. The first part to be bonded is adsorbed under negative pressure, and the pressure roller rolls it from one end to the other end to bond it with the second part to be bonded, thus avoiding the influence of the elasticity of the flexible film itself.
This achieves uniform force distribution on the parts to be bonded, improving the bonding effect and product quality, and enhancing the user experience.
Smart Images

Figure CN224465435U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of bonding technology, specifically relating to a bonding device and bonding equipment. Background Technology
[0002] In bonding devices, two components (such as glass and film) are typically assembled and precisely bonded together. To ensure bonding accuracy, the second component to be bonded (such as glass) is usually positioned on a platform, and then the first component to be bonded (such as film) is adsorbed and bonded. Existing bonding devices use a drive output to push a contoured surface, causing it to deform and thus pushing the first component to be bonded (such as film). This causes the force on the first component to be bonded (such as film) to gradually diffuse outwards from the center, allowing the first component to be bonded (such as film) and the second component to be bonded (such as glass) to adhere. However, this bonding method means that the outwardly diffused force on the first component to be bonded (such as film) is affected by the elasticity of the contoured surface itself. The pushing force on the first component to be bonded (such as film) is difficult to control, easily affecting the bonding effect between the two components, making it difficult for the product to meet usage requirements and reducing the user experience. Utility Model Content
[0003] The purpose of this application is to provide a bonding device and a bonding apparatus that improve the bonding effect, product quality, and user experience of the parts to be bonded.
[0004] To achieve the above objectives, the first aspect of this application provides a bonding device, which includes a mounting box module, a pressure roller module, and a negative pressure module;
[0005] The interior of the mounting box module forms an installation space. The bottom opening of the mounting box module is sealed with a flexible film. The flexible film has a vacuum adsorption area with a certain degree of air permeability. The installation space is connected to the negative pressure module and is in a negative pressure state.
[0006] The pressure roller module is movably installed inside the installation space and is in a rolling state;
[0007] In the negative pressure state, the first part to be bonded is adsorbed in the vacuum adsorption area on the outside of the flexible film. In the rolling state, the pressure roller module rolls from one end of the first part to be bonded to the other end of the first part to be bonded.
[0008] In embodiments of this application, the pressure roller module includes a first mounting base assembly and a rolling shaft;
[0009] The first mounting base assembly is laterally movably positioned in the mounting space;
[0010] The rolling shaft is rotatably mounted on the first mounting base assembly.
[0011] In embodiments of this application, the first mounting base assembly includes a first mounting base and a second mounting base;
[0012] The first mounting base is laterally movably positioned within the installation space;
[0013] The second mounting base is vertically movable on the first mounting base, and the rolling shaft is rotatably mounted on the second mounting base.
[0014] In embodiments of this application, the bonding device further includes a mounting base module and a film peeling module;
[0015] The mounting box module is movably mounted on the mounting base module;
[0016] The film-peeling module is movably disposed on one side of the mounting base module and has a film-peeling state. In the film-peeling state, the film-peeling module peels the bottom film on the first part to be bonded from the first part to be bonded.
[0017] In embodiments of this application, the film-peeling module includes a second mounting base assembly and a clamping assembly;
[0018] The second mounting bracket assembly is located on one side of the mounting bracket module;
[0019] The clamping assembly is vertically movable on the second mounting base assembly and has a clamping state. In the clamping state, the clamping assembly clamps the base film on the first piece to be bonded.
[0020] In embodiments of this application, the film-tearing module further includes a connecting rod and a stop rod;
[0021] The connecting rod is rotatably mounted on the second mounting bracket assembly;
[0022] The stop bar and the connecting rod are connected and extend in the direction of the clamping assembly. The stop bar has an auxiliary film-tearing state. In the auxiliary film-tearing state, the stop bar rotates and applies a thrust to the bottom film on the first piece to be bonded, which is used by the auxiliary clamping assembly to tear the bottom film from the first piece to be bonded.
[0023] In embodiments of this application, the bonding device further includes a hopper module, a positioning module, and a first transfer module;
[0024] The hopper module is located on one side of the mounting base module;
[0025] The positioning module is located on one side of the hopper module and forms a positioning platform;
[0026] The first transfer module is movably disposed on one side of the hopper module and the positioning platform and is in a transfer state. In the transfer state, the first transfer module transfers the first part to be bonded from the hopper module to the positioning platform.
[0027] In embodiments of this application, the bonding device further includes a bonding platform module;
[0028] The bonding platform module is movably disposed on one side of the mounting base module and has a bonding platform. The bonding platform module has an alignment state. In the alignment state, the second part to be bonded on the bonding platform matches and aligns with the first part to be bonded under the flexible film.
[0029] The second aspect of this application provides a bonding device, which includes a mounting table, a feeding module, a second transfer module, a running table module, a third transfer module, and the bonding device described above.
[0030] The feeding module is movably mounted on the mounting platform;
[0031] The second transfer module is movably mounted on the mounting platform and located above the feeding module;
[0032] The running board module is movably mounted on the mounting platform and located on one side of the feeding module and the second transfer module;
[0033] The third transfer module is movably mounted on the mounting platform and located on the side of the running platform module away from the feeding module and the second transfer module.
[0034] In embodiments of this application, the bonding device further includes:
[0035] The first image acquisition module is set on the mounting platform and located above the bonding platform module of the bonding device;
[0036] The second image acquisition module is mounted on the bonding platform module, and the bonding platform module is communicatively connected to the first image acquisition module and the second image acquisition module.
[0037] As can be seen from the above technical solution, the bonding device includes a mounting box module, a pressure roller module, and a negative pressure module. The mounting box module has an internal mounting space, and a flexible film is sealed at the bottom opening of the mounting box module. The flexible film has a vacuum adsorption area with a certain degree of air permeability. The mounting space is connected to the negative pressure module and is under negative pressure. The pressure roller module is movably disposed inside the mounting space and is in a rolling state. Specifically, in the negative pressure state, the first part to be bonded is adsorbed onto the vacuum adsorption area outside the flexible film. In the rolling state, the pressure roller module rolls from one end of the first part to be bonded to the other end. This bonding device has a simple structure. After the first part to be bonded is adsorbed onto the vacuum adsorption area of the flexible film, the rolling bonding method of the pressure roller module rolling from one end of the first part to be bonded to the other end ensures that the first and second parts to be bonded are subjected to uniform force during the bonding process and are less affected by the elasticity of the flexible film itself. This is beneficial for improving the bonding effect, product quality, and user experience of the first and second parts to be bonded.
[0038] Other features and advantages of the embodiments of this application will be described in detail in the following detailed description section. Attached Figure Description
[0039] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the following detailed description to explain the embodiments of this application, but do not constitute a limitation on the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without any inventive effort. In the drawings:
[0040] Figure 1 This is a schematic diagram of the internal structure of the mounting box module in an embodiment of this application;
[0041] Figure 2 This is a schematic diagram of the structure of the mounting box module and the mounting base module in the embodiments of this application;
[0042] Figure 3 This is a schematic diagram of the structure of the mounting box module, mounting base module, and film-removing module in the embodiments of this application;
[0043] Figure 4 This is a schematic diagram of the film-peeling module in an embodiment of this application;
[0044] Figure 5 This is a schematic diagram of the structure of the first transfer module, the hopper module, and the positioning module in the embodiments of this application;
[0045] Figure 6 This is a schematic diagram of the structure of the second transfer module, bonding platform module, running table module, and third transfer module in the embodiments of this application;
[0046] Figure 7 This is a schematic diagram of the bonding device in the embodiments of this application.
[0047] Explanation of reference numerals in the attached figures
[0048] 1- Mounting box module; 101- Mounting space; 102- Flexible film; 2- Pressure roller module; 201- First mounting seat assembly; 2011- First mounting seat; 2012- Second mounting seat; 202- Roller shaft; 203- First driving component; 3- First piece to be bonded; 4- Mounting seat module; 401- Third mounting seat; 402- First guide rail; 403- First sliding seat; 404- Third driving component; 5- Film peeling module; 501- Second mounting seat assembly; 5011- Fourth mounting seat 5012-Second guide rail; 5013-Second sliding seat; 5014-Third guide rail; 502-Clamping assembly; 5021-Clamping drive component; 5022-First gripper; 5023-Second gripper; 503-Connecting rod; 504-Stop bar; 505-Seventh drive component; 6-Hopper module; 601-Hopper base; 602-Second lead screw; 603-Eighth drive component; 7-Positioning module; 701-First positioning assembly; 8-First transfer module; 801-Fifth mounting base; 8 02-Third sliding seat; 803-Ninth driving component; 804-First suction nozzle; 9-Fitting platform module; 901-Fitting platform; 902-Moving seat; 903-Third lead screw; 904-Tenth driving component; 905-Fourth lead screw; 906-Rotating platform; 907-Second positioning component; 10-Mounting platform; 11-Feeding module; 1101-Feeding conveyor roller; 12-Second transfer module; 1201-Sixth mounting seat; 1202-Fifth guide rail; 1203-First telescopic... Drive component; 1204-Second telescopic drive component; 1205-Second suction nozzle; 13-Running platform module; 1301-Running platform support; 1302-Fourth guide rail; 1303-Third positioning component; 14-Third transfer module; 1401-Seventh mounting base; 1402-Sixth guide rail; 1403-Sixth slider; 1404-Third suction nozzle; 1405-Suction nozzle mounting base; 15-First image acquisition module; 16-Negative pressure module; 17-Discharge conveying module; 1701-Discharge conveyor belt. Detailed Implementation
[0049] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this application.
[0050] Embodiments of this application provide a bonding device, such as Figure 1 As shown, the bonding device includes a mounting box module 1, a pressure roller module 2, and a negative pressure module 16;
[0051] The interior of the mounting box module 1 forms an installation space 101. The bottom opening of the mounting box module 1 is encapsulated with a flexible film 102. The flexible film 102 is provided with a vacuum adsorption area with a certain degree of air permeability. The installation space 101 is connected to the negative pressure module 16 and has a negative pressure state.
[0052] The pressure roller module 2 is movably disposed inside the installation space 101 and is in a rolling state;
[0053] In the negative pressure state, the first part to be bonded 3 is adsorbed in the vacuum adsorption area of the flexible film 102. In the rolling state, the pressure roller module 2 rolls from one end of the first part to be bonded 3 to the other end of the first part to be bonded 3.
[0054] Specifically, the bonding device in this embodiment is suitable for bonding equipment. The first piece to be bonded 3 can be selected as film. The bonding device can bond the first piece to be bonded 3 and the second piece to be bonded (the second piece to be bonded can be glass) together and also includes a bonding platform module 9. The bonding platform module 9 is provided with a bonding platform 901. The flexible film 102 within the vacuum adsorption area is provided with multiple first negative pressure holes that connect to the outside world and the installation space 101. The negative pressure module 16 includes a vacuum component, an airflow channel and a vacuum pump. The two ends of the airflow channel are respectively connected to the vacuum component and the vacuum pump. The vacuum component is set on the installation box module 1 and has a connecting channel that connects the installation space 101 and the airflow channel. After the vacuum pump is turned on, it can perform vacuum treatment on the installation space 101, thereby forming a negative pressure state in the installation space 101 and adsorbing the vacuum adsorption area.
[0055] Before the first component to be bonded 3 and the second component to be bonded are bonded together, the second component to be bonded is on the bonding platform 901 and in a preset bonding position. When the installation space 101 is under negative pressure, the first component to be bonded 3 can be adsorbed in the vacuum adsorption area. Then, the installation box module 1 moves above the bonding platform 901 so that the first component to be bonded 3 and the second component to be bonded overlap on the horizontal plane. After the first component to be bonded 3 and the second component to be bonded overlap on the horizontal plane, the pressure roller module 2 rolls from one end of the installation space 101 to the other end of the installation space 101. During the above process, the pressure roller module 2 also rolls from one end of the first component to be bonded 3 to the other end of the first component to be bonded 3, thereby bonding the first component to be bonded 3 and the second component to be bonded together.
[0056] The bonding device in this embodiment has a simple structure. After the first part to be bonded 3 is adsorbed in the vacuum adsorption area of the flexible film 102, the roller module 2 rolls from one end of the first part to be bonded 3 to the other end of the first part to be bonded 3. This rolling bonding method can make the first part to be bonded 3 and the second part to be bonded evenly stressed during the bonding process and is not easily affected by the elasticity of the flexible film 102 itself. This is beneficial to improving the bonding effect, product quality and user experience of the first part to be bonded 3 and the second part to be bonded.
[0057] In one embodiment of this application, the pressure roller module 2 includes a first mounting base assembly 201 and a rolling shaft 202;
[0058] The first mounting base assembly 201 is laterally movably disposed in the mounting space 101;
[0059] The rolling shaft 202 is rotatably mounted on the first mounting base assembly 201.
[0060] Specifically, the pressure roller module 2 also includes a first drive member 203 and a first lead screw. The first drive member 203 can be a rotary motor and is located on the outside of the mounting box module 1. One end of the first lead screw is driven to the first drive member 203, and the other end of the first lead screw passes through the box of the mounting box module 1 and extends into the mounting space 101. The first lead screw is distributed laterally in the mounting space 101. A threaded connection is formed between the first mounting seat assembly 201 and the first lead screw. The rolling shaft 202 is distributed longitudinally on the first mounting seat assembly 201 and can pivot around its own central axis. Before rolling the first part to be bonded 3, the first mounting base assembly 201 is located at one lateral end of the mounting space 101. When the first part to be bonded 3 needs to be rolled, the first driving member 203 drives the first lead screw to rotate. The first mounting base assembly 201 moves laterally on the first lead screw, and then moves the rolling shaft 202 from one lateral end of the mounting space 101 to the other lateral end of the mounting space 101. While moving laterally, the rolling shaft 202 also pivots around its own central axis. That is, the rolling shaft 202 performs lateral movement and pivoting movement at the same time to roll the first part to be bonded 3, so that the first part to be bonded 3 and the second part to be bonded are bonded together by rolling.
[0061] In one embodiment of this application, the first mounting base assembly 201 includes a first mounting base 2011 and a second mounting base 2012;
[0062] The first mounting base 2011 is laterally movably disposed in the mounting space 101;
[0063] The second mounting base 2012 is vertically movable on the first mounting base 2011, and the rolling shaft 202 is rotatably mounted on the second mounting base 2012.
[0064] Specifically, the pressure roller module 2 also includes a vertically distributed and retractable second driving component (such as a telescopic cylinder). The first mounting base 2011 is threadedly connected to the first lead screw via a first threaded block. The second driving component is mounted on the first mounting base 2011 and drivenly connected to the second mounting base 2012. When there is no need to roll the first part to be bonded 3, the second driving component is in a retracted state; when it is necessary to roll the first part to be bonded 3, the second driving component is in an extended state so that the subsequent rolling shaft 202 can apply pressure to the first part to be bonded 3 and the second part to be bonded through the flexible membrane 102. After the second driving member is in the extended state, the first driving member 203 drives the first lead screw to rotate, and the first mounting base 2011 can move laterally with the second driving member, the second mounting base 2012 and the rolling shaft 202. This allows the rolling shaft 202 to move laterally and pivot at the same time to roll the first piece 3 to be bonded. The above arrangement allows the rolling shaft 202 to move away from the flexible film 102 when it does not need to roll, which is beneficial to maintaining the elasticity of the flexible film 102.
[0065] In one embodiment of this application, such as Figures 2-3 As shown, the bonding device also includes a mounting base module 4 and a film peeling module 5;
[0066] Mounting box module 1 is movably mounted on mounting base module 4;
[0067] The film-peeling module 5 is movably disposed on one side of the mounting base module 4 and has a film-peeling state. In the film-peeling state, the film-peeling module 5 peels the bottom film on the first piece to be bonded 3 from the first piece to be bonded 3.
[0068] Specifically, the mounting base module 4 includes a third mounting base 401, a first guide rail 402, a first slider, a first sliding seat 403, a third driving member 404, and a fourth driving member. The first guide rail 402 is horizontally disposed on the third mounting base 401. The first slider is movably disposed on the first guide rail 402. The first sliding seat 403 is connected to the first slider. The third driving member 404 is vertically disposed on the first sliding seat 403 and can extend and retract. The mounting box module 1 is connected to the extension and retraction end of the third driving member 404. The fourth driving member is drivenly connected to the first sliding seat 403. Under the driving action of the fourth driving member, the first sliding seat 403, the third driving member 404, and the mounting box module 1 can move along the axial direction of the first guide rail 402. The extension and retraction of the third driving member 404 can cause the mounting box module 1 to move vertically. In this embodiment, the bottom of the first component to be bonded 3 is provided with a bottom film, and an edge ear extending relative to the first component to be bonded 3 is formed on the bottom film. The film-tearing module 5 is disposed on the longitudinal side of the third mounting base 401 and is within the lateral movement range of the first slider. After the first component to be bonded 3 is adsorbed in the vacuum adsorption area, under the driving action of the fourth driving member, the first slider moves with the mounting box module 1 to the active area of the film-tearing module 5 and stops. The film-tearing module 5, in the film-tearing state, can tear the bottom film on the first component to be bonded 3 from the first component to be bonded 3 so that the first component to be bonded 3 and the second component to be bonded can be bonded together subsequently.
[0069] In one embodiment of this application, such as Figures 3-4 As shown, the film-tearing module 5 includes a second mounting base assembly 501 and a clamping assembly 502;
[0070] The second mounting bracket assembly 501 is disposed on one side of the mounting bracket module 4;
[0071] The clamping assembly 502 is vertically movable on the second mounting base assembly 501 and has a clamping state. In the clamping state, the clamping assembly 502 clamps the bottom film on the first piece to be bonded 3.
[0072] Specifically, the second mounting base assembly 501 is disposed on one longitudinal side of the third mounting base 401 and includes a fourth mounting base 5011, a second guide rail 5012, a second slider, a second sliding seat 5013, a third guide rail 5014, and a third slider. The second guide rail 5012 is disposed longitudinally on the fourth mounting base 5011, the second slider is movably disposed on the second guide rail 5012, the second sliding seat 5013 is connected to the second slider, the third guide rail 5014 is disposed vertically on the second sliding seat 5013, the third slider is movably disposed on the third guide rail 5014, and the clamping assembly 502 is connected to the third slider. The film-tearing module 5 also includes a fifth driving member (not shown in the figure) and a sixth driving member (not shown in the figure). The fifth driving member is driven to the second slider, and the sixth driving member is driven to the third slider. Under the driving action of the fifth driving member, the second slider can drive the various components connected to it (such as the second sliding seat 5013, the third guide rail 5014, the third slider, and the clamping assembly 502) to move longitudinally. Under the driving action of the sixth driving member, the third slider can drive the clamping assembly 502 to move along the axial direction of the third guide rail 5014, thereby allowing the clamping assembly 502 to change its vertical position according to actual needs.
[0073] When the bottom film on the first piece to be bonded 3 needs to be removed, before the mounting box module 1 adsorbs the first piece to be bonded 3 and moves laterally, the fifth and sixth driving components cooperate to make the clamping component 502 be in a preset clamping position. After the mounting box module 1 moves into place, the clamping component 502, which is in the clamping state, first clamps the bottom film on the first piece to be bonded 3. The sixth driving component then drives the third slider to move the clamping component 502 downward, so that the bottom film can be peeled off from the first piece to be bonded 3. After the bottom film is peeled off, the fifth driving component drives the second slider to move the connected components (such as the second sliding seat 5013, the third guide rail 5014, the third slider, and the clamping component 502) longitudinally so that the bottom film can be moved above the bottom film recycling bin of the bonding equipment. Then the clamping component 502 releases the bottom film, and the bottom film can fall into the bottom film recycling bin. The above settings realize automated tearing of the bottom film and reduce labor intensity.
[0074] Furthermore, the clamping assembly 502 in this embodiment includes a clamping drive 5021, a first gripper 5022, and a second gripper 5023. The clamping drive 5021 is connected to the third slider and can be selected as a clamping cylinder. The first gripper 5022 and the second gripper 5023 are both disposed at the driving end of the clamping drive 5021 and can move closer or further away from each other. When the clamping drive 5021 drives the first gripper 5022 and the second gripper 5023 to move closer to each other, the first gripper 5022 and the second gripper 5023 cooperate with each other to clamp the edge ear of the bottom film. When the clamping drive 5021 drives the first gripper 5022 and the second gripper 5023 to move further away from each other, the bottom film can be detached from the clamping assembly 502 (e.g., falling into the bottom film recycling bin).
[0075] In one embodiment of this application, the film-tearing module 5 further includes a connecting rod 503 and a stop rod 504. The connecting rod 503 is rotatably disposed on the second mounting base assembly 501. The stop rod 504 is connected to the connecting rod 503 and extends in the direction of the clamping assembly 502. The stop rod 504 has an auxiliary film-tearing state. In the auxiliary film-tearing state, the stop rod 504 rotates and applies a pushing force to the bottom film on the first piece to be bonded 3 by the auxiliary clamping assembly 502 to tear the bottom film from the first piece to be bonded 3.
[0076] Specifically, the film-peeling module 5 also includes a seventh driving component 505 (such as a rotary cylinder) connected to the third slider. One end of the connecting rod 503 is connected to the driving end of the seventh driving component 505, and the stop rod 504 is connected to the end of the connecting rod 503 away from the seventh driving component 505 and is perpendicular to the connecting rod 503. When the sixth driving component drives the third slider to move the clamping assembly 502 downward a certain distance, and the bottom film is not completely separated from the first piece to be bonded 3, the seventh driving component 505 drives the connecting rod 503 to rotate the stop rod 504. After rotating a certain angle, the stop rod 504 can move between the bottom film and the first piece to be bonded 3 and apply a pushing force to the bottom film. Then, under the driving action of the seventh driving component 505, the stop rod 504 continues to rotate, and the stop rod 504 continues to apply a pushing force to the bottom film so that the bottom film and the first piece to be bonded 3 are completely separated. The above configuration can prevent the first piece to be bonded 3 from easily shifting or falling off due to the clamping component 502 acting alone (i.e., the clamping component 502 clamping the side ear and moving downwards) tearing open the bottom film.
[0077] In one embodiment of this application, such as Figure 5 As shown, the bonding device also includes a hopper module 6, a positioning module 7, and a first transfer module 8;
[0078] The hopper module 6 is located on one side of the mounting base module 4;
[0079] The positioning module 7 is located on one side of the hopper module 6 and forms a positioning platform;
[0080] The first transfer module 8 is movably disposed on one side of the hopper module 6 and the positioning platform and has a transfer state. In the transfer state, the first transfer module 8 transfers the first part to be bonded 3 from the hopper module 6 to the positioning platform.
[0081] Specifically, the hopper module 6 has an upward-opening hopper space and includes a hopper base 601, a second lead screw 602, and an eighth drive unit 603. The hopper base 601 is located at the bottom of the hopper space. The eighth drive unit 603 can be a rotary motor and is driven by the second lead screw 602. The hopper base 601 is threadedly connected to the second lead screw 602 via a second threaded block. The hopper space is used to store the first part to be bonded 3 (at this time, the first part to be bonded 3 has a bottom film). The positioning module 7 is located on one side of the hopper module and includes multiple first positioning components 701 movably disposed on one side of the positioning platform. The first transfer module 8 includes a fifth mounting base 801, a third sliding base 802, a ninth drive unit 803, and multiple first suction nozzles 804. The fifth mounting base 801 is disposed on one side of the hopper module 6 and the positioning platform. The ninth drive unit 803 is disposed laterally on the fifth mounting base 801 and can be a rodless cylinder. The third sliding base 802 is driven by the ninth drive unit 803. The multiple first suction nozzles 804 are all connected to the first... The three sliding seats 802 are connected. Under the driving action of the ninth driving component 803, the third sliding seat 802 can move laterally with the first suction nozzle 804 to adsorb and transfer the first part to be bonded 3 from the material hopper space to the positioning platform. Then, multiple first positioning components 701 can perform the first lateral side positioning operation and the first longitudinal side positioning operation on the first part to be bonded 3 on the positioning platform so that the first part to be bonded 3 is in the correct position and posture on the positioning platform, which prepares for the subsequent installation box module to adsorb the first part to be bonded 3 into the vacuum adsorption area.
[0082] In one embodiment of this application, the bonding device further includes a bonding platform module 9;
[0083] The bonding platform module 9 is movably disposed on one side of the mounting base module 4 and has a bonding platform 901. The bonding platform module 9 has an alignment state. In the alignment state, the second part to be bonded on the bonding platform 901 matches and aligns with the first part to be bonded 3 below the flexible film 102.
[0084] Specifically, such as Figure 6As shown, the bonding platform module 9 also includes a movable seat 902, a third lead screw 903, a tenth drive member 904, a fourth lead screw 905, an eleventh drive member, and a rotary platform 906. The third lead screw 903 is longitudinally arranged on one side of the mounting base module 4. The tenth drive member 904 can be a rotary motor and is driven by the third lead screw 903. The movable seat 902 can be threadedly connected to the third lead screw 903 via a third threaded block. The fourth lead screw 905 and the eleventh drive member are both arranged on the top surface of the movable seat 902, with the fourth lead screw 905 distributed laterally. The eleventh drive member can be a rotary motor and is driven by the fourth lead screw 905. The bottom of the rotary platform 906 can be threadedly connected to the fourth lead screw 905 via a fourth threaded block. The bonding platform 901 is rotatably arranged on the rotary platform 906. After the tenth drive component 904 is activated, it can rotate the third lead screw 903. The moving seat 902 can move along the axial direction of the third lead screw 903. That is, the moving seat 902 can move longitudinally simultaneously with the fourth lead screw 905, the eleventh drive component, the rotary platform 906, and the bonding platform 901. Within the range of longitudinal movement of the bonding platform 901, the bonding platform 901 has a transfer station and a bonding station. After the eleventh drive component is activated, it can rotate the fourth lead screw 905. The rotary platform 906 can move along the axial direction of the fourth lead screw 905. That is, the rotary platform 906 can move laterally simultaneously with the bonding platform 901. When the rotary platform 906 performs the rotary function, it can rotate together with the bonding platform 901.
[0085] The bonding platform module 9 also includes multiple second positioning components 907 and negative pressure adsorption components (such as vacuum components). The multiple second positioning components 907 are movably disposed on the bonding platform 901. When the second part to be bonded is placed on the bonding platform 901, the multiple second positioning components 907 can perform a second lateral edge positioning operation and a second longitudinal edge positioning operation on the second part to be bonded on the bonding platform 901, so that the second part to be bonded is in the correct position and posture on the bonding platform 901, which is in preparation for the subsequent installation of the box module to bond the first part to be bonded 3 and the second part to be bonded together. A negative pressure cavity is formed inside the bonding platform 901, and a second negative pressure hole communicating with the negative pressure cavity is formed on the top surface of the bonding platform 901. The negative pressure adsorption component is disposed on the bonding platform 901 and communicates with the negative pressure cavity. After the negative pressure adsorption component is opened, it can adsorb and fix the second part to be bonded on the top surface of the bonding platform 901 to prevent the second part to be bonded from moving at will.
[0086] Furthermore, in this embodiment, the bonding platform 901 can be made of opaque materials such as metal. The bonding platform 901 made of the above-mentioned materials has the advantages of low cost, convenient processing and production, long service life and not being affected by dust and other impurities.
[0087] When the second part to be bonded is placed on the bonding platform 901, and under the driving action of the tenth driving component 904, the bonding platform 901, carrying the second part to be bonded, is in the bonding station, the mounting box module 1 can move the first part to be bonded 3 above the bonding platform 901. If the first part to be bonded 3 and the second part to be bonded are not in an overlapping state on the horizontal plane, the lateral position and / or longitudinal position and / or horizontal deflection angle of the second part to be bonded can be changed by controlling the cooperation of the tenth driving component 904, the eleventh driving component, and the rotary platform 906, so that the first part to be bonded 3 and the second part to be bonded are in an overlapping state on the horizontal plane, laying the foundation for accurately bonding the first part to be bonded 3 to the second part to be bonded in the subsequent process.
[0088] Another embodiment of this application provides a bonding device, such as Figure 7 As shown, the bonding equipment includes a mounting platform 10, a feeding module 11, a second transfer module 12, a running platform module 13, a third transfer module 14, and the bonding device described above.
[0089] The feeding module 11 is movably mounted on the mounting platform 10;
[0090] The second transfer module 12 is movably mounted on the mounting platform 10 and located above the feeding module 11;
[0091] The running table module 13 is movably mounted on the mounting platform 10 and located on one side of the feeding module 11 and the second transfer module 12;
[0092] The third transfer module 14 is movably mounted on the mounting platform 10 and located on the side of the running platform module 13 away from the feeding module 11 and the second transfer module 12.
[0093] Specifically, the feeding module 11, the second transfer module 12, the running table module 13, the third transfer module 14, and the bonding device are all mounted on the mounting platform 10. The feeding module 11 includes multiple feeding conveying rollers 1101 and feeding drive components (such as motors). The multiple feeding conveying rollers 1101 together form a feeding conveying channel for transmitting the second part to be bonded. The feeding conveying channel includes multiple feeding conveying branches arranged side by side along the longitudinal direction. The feeding drive component is driven to connect with the multiple feeding conveying rollers 1101 to transport the second part to be bonded from the inlet end of the feeding conveying channel to the outlet end of the feeding conveying channel. Furthermore, in this embodiment, the conveying direction of the feeding conveying channel is transverse; the running table module 13 includes a running table support 1301, a fourth guide rail 1302, a fourth slider, and a running table drive. The fourth guide rail 1302 is arranged transversely on one side of the outlet end of the feeding conveying channel, the fourth slider is movably arranged on the fourth guide rail 1302, the running table support 1301 is arranged on the fourth slider and forms a running table platform, and the running table drive is drivenly connected to the fourth slider; the second transfer module 12 includes a sixth mounting base 1201 and a fifth guide rail 120 2. A fifth slider, a twelfth driving member, a first telescopic driving member 1203, a second telescopic driving member 1204, and a second suction nozzle 1205; a sixth mounting base 1201 is disposed on the outside of the feeding module 11; a fifth guide rail 1202 is disposed on the sixth mounting base 1201 and distributed longitudinally, the fifth guide rail 1202 is located above the feeding module 11; a fifth slider is movably disposed on the fifth guide rail 1202; the first telescopic driving member 1203 can be a telescopic hydraulic cylinder and is connected to the fifth slider; the first telescopic driving member 1203... Along the horizontal distribution, the twelfth driving member is driven to connect with the first telescopic driving member 1203 to drive the first telescopic driving member 1203 to move along the fifth guide rail 1202. The second telescopic driving member 1204 can be a telescopic cylinder and is disposed at the telescopic end of the first telescopic driving member 1203. The second telescopic driving member is distributed vertically, and the second suction nozzle 1205 is disposed at the telescopic end of the second telescopic driving member 1204. The third transfer module 14 includes a seventh mounting base 1401, a sixth guide rail 1402, a sixth slider 1403, and a third suction nozzle 1405. 04 and the thirteenth drive unit, the seventh mounting base 1401 is set on the lateral side of the running platform module 13 and located above the transfer station, the sixth guide rail 1402 is on the seventh mounting base 1401 and distributed laterally, the sixth slider 1403 is movably set on the sixth guide rail 1402, the third suction nozzle 1404 is set on the sixth slider 1403 through the suction nozzle mounting base 1405, and the thirteenth drive unit is drivenly connected to the suction nozzle mounting base 1405 so that the suction nozzle mounting base 1405 can move axially along the sixth guide rail 1402.
[0094] Furthermore, the treadmill platform in this embodiment is provided with a plurality of movable third positioning components 1303. After the second part to be bonded is transferred to the treadmill platform, the plurality of third positioning components 1303 can perform a third lateral edge positioning operation and a third longitudinal edge positioning operation on the second part to be bonded on the treadmill platform, so that the second part to be bonded is in the correct position and posture on the treadmill platform, in preparation for the subsequent transfer of the second part to be bonded to the bonding platform 901 by the third transfer module 14.
[0095] The second part to be bonded enters the feeding conveyor channel from the inlet end (the second part to be bonded is located on one of the feeding conveyor branches) and is conveyed to the outlet end of the feeding conveyor channel. After the second part to be bonded is conveyed to the outlet end of the feeding conveyor channel, the twelfth drive, the first telescopic drive 1203, and the second telescopic drive 1204 cooperate to transfer the second part to be bonded on different feeding conveyor branches to the running platform (at this time, the running platform is located at the end of the fourth guide rail 1302 near the feeding module 11). After the second part to be bonded is transferred to the running platform of the running platform support 1301, the running platform drive... The component-driven running platform support 1301 moves along the fourth guide rail 1302 toward the direction of the third transfer module 14. During the lateral movement of the running platform support 1301 carrying the second component to be bonded, the second component to be bonded can be cleaned. After the running platform support 1301 moves laterally into position, under the driving action of the thirteenth driving component, the third suction nozzle 1404 can adsorb the second component to be bonded on the running platform and transfer it to the bonding platform 901 located at the transfer station. Then, under the driving action of the tenth driving component 904, the bonding platform 901 can be moved from the transfer station to the bonding station, laying the foundation for the subsequent bonding of the first component to be bonded 3 onto the second component to be bonded.
[0096] In one embodiment of this application, the bonding device further includes:
[0097] The first image acquisition module 15 is mounted on the mounting platform 10 and located above the bonding platform module 9 of the bonding device;
[0098] The second image acquisition module is mounted on the bonding platform module 9, and the bonding platform module 9 is communicatively connected to the first image acquisition module 15 and the second image acquisition module.
[0099] Specifically, the first image acquisition module 15 can be a camera and is mounted above the bonding platform module 9 via an image acquisition mounting bracket, which is mounted on the mounting platform; the second image acquisition module can also be a camera. The bonding device also includes a controller, which is communicatively connected to the first image acquisition module 15, the second image acquisition module, the tenth drive component 904, the eleventh drive component, and the rotary platform 906. Furthermore, the bonding platform 901 is also provided with multiple light source holes. In this embodiment, the bonding device also includes multiple light sources disposed below the light source holes. During image acquisition, the light from the light sources passes through the light source holes to provide multi-point supplementary lighting at the long and short sides of the workpiece to be bonded.
[0100] When the bonding platform 901 moves the second part to be bonded to the bonding station (which is also the photo-taking station in this embodiment), the controller controls the first image acquisition module 15 to take a picture of the second part to be bonded on the bonding platform 901. The first image acquisition module 15 sends the captured image of the second part to be bonded to the controller. When the mounting box module 1 moves the first part to be bonded 3 above the bonding platform 901, the controller controls the second image acquisition module to take a picture of the first part to be bonded 3 at the bottom of the mounting box module 1. The second image acquisition module sends the captured image of the first part to be bonded 3 to the controller. The controller performs image recognition on the image of the first part to be bonded 3 and the image of the second part to be bonded. Based on the image recognition results of the two images, the controller determines the current position and current posture of the first part to be bonded 3 and the deviation between the current position and current posture of the second part to be bonded. Based on the above deviation, the controller controls the tenth drive component 904, the eleventh drive component and the rotary platform 906 to cooperate with each other to adjust the position and posture of the second part to be bonded so that the first part to be bonded 3 and the second part to be bonded coincide on the horizontal plane.
[0101] Furthermore, the bonding device in this embodiment also includes a material transfer module and a material conveying module 17. The material transfer module can be a multi-axis robotic arm. The material conveying module 17 is mounted on the mounting platform 10 and includes multiple material conveyor belts 1701 and a material driving component (such as a motor). The multiple material conveyor belts 1701 together form a material conveying channel for transmitting the first material to be bonded 3 and the second material to be bonded after bonding. The material driving component is driven to connect with a material feeding conveyor roller shaft 1101 to transport the first material to be bonded 3 and the second material to be bonded after bonding from the inlet end of the material conveying channel to the outlet end of the material conveying channel.
[0102] The bonding device in this embodiment can acquire higher quality images of the first component 3 and the second component to be bonded. It can also automatically adjust the position and posture of the second component to be bonded on the bonding platform 901 according to the images of the first component 3 and the second component to be bonded, so as to further improve the bonding accuracy of the first component 3 and the second component to be bonded, realize the one-time rolling bonding of the first component 3 and the second component to be bonded, reduce labor intensity and improve the bonding quality of the first component 3 and the second component to be bonded, as well as the user experience.
[0103] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0104] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0105] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0106] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A bonding device, characterized in that, The bonding device includes a mounting box module (1), a pressure roller module (2), and a negative pressure module (16). The installation box module (1) has an installation space (101) inside. The bottom opening of the installation box module (1) is sealed with a flexible film (102). The flexible film (102) has a vacuum adsorption area with a certain air permeability. The installation space (101) is connected to the negative pressure module (16) and has a negative pressure state. The pressure roller module (2) is movably disposed inside the installation space (101) and has a rolling state; In the negative pressure state, the first piece to be bonded (3) is adsorbed in the vacuum adsorption area of the flexible film (102), and in the rolling state, the pressure roller module (2) rolls from one end of the first piece to be bonded (3) to the other end of the first piece to be bonded (3).
2. The bonding device according to claim 1, characterized in that, The pressure roller module (2) includes a first mounting base assembly (201) and a rolling shaft (202); The first mounting base assembly (201) is laterally movably disposed in the mounting space (101); The rolling shaft (202) is rotatably mounted on the first mounting base assembly (201).
3. The bonding device according to claim 2, characterized in that, The first mounting bracket assembly (201) includes a first mounting bracket (2011) and a second mounting bracket (2012); The first mounting base (2011) is laterally movably disposed in the mounting space (101); The second mounting base (2012) is vertically movable on the first mounting base (2011), and the rolling shaft (202) is rotatably mounted on the second mounting base (2012).
4. The bonding device according to claim 1, characterized in that, The bonding device also includes a mounting base module (4) and a film peeling module (5). The mounting box module (1) is movably mounted on the mounting base module (4); The film-tearing module (5) is movably disposed on one side of the mounting base module (4) and has a film-tearing state. In the film-tearing state, the film-tearing module (5) tears the bottom film on the first piece to be bonded (3) from the first piece to be bonded (3).
5. The bonding device according to claim 4, characterized in that, The film-tearing module (5) includes a second mounting base assembly (501) and a clamping assembly (502); The second mounting bracket assembly (501) is disposed on one side of the mounting bracket module (4); The clamping assembly (502) is vertically movably disposed on the second mounting base assembly (501) and has a clamping state, wherein the clamping assembly (502) clamps the bottom film on the first piece to be bonded (3).
6. The bonding device according to claim 5, characterized in that, The film-tearing module (5) also includes a connecting rod (503) and a stop rod (504). The connecting rod (503) is rotatably mounted on the second mounting base assembly (501); The stop bar (504) and the connecting rod (503) are connected and extend in the direction of the clamping assembly (502). The stop bar (504) has an auxiliary film-tearing state. In the auxiliary film-tearing state, the stop bar (504) rotates and applies a thrust to the bottom film on the first piece to be bonded (3) to assist the clamping assembly (502) in tearing the bottom film from the first piece to be bonded (3).
7. The bonding device according to claim 5, characterized in that, The bonding device also includes a hopper module (6), a positioning module (7), and a first transfer module (8). The hopper module (6) is located on one side of the mounting base module (4); The positioning module (7) is located on one side of the hopper module (6) and forms a positioning platform; The first transfer module (8) is movably disposed on one side of the hopper module (6) and the positioning platform and has a transfer state. In the transfer state, the first transfer module (8) transfers the first piece to be bonded (3) from the hopper module (6) to the positioning platform.
8. The bonding device according to claim 4, characterized in that, The bonding device also includes a bonding platform module (9). The bonding platform module (9) is movably disposed on one side of the mounting base module (4) and has a bonding platform (901). The bonding platform module (9) has an alignment state in which the second part to be bonded on the bonding platform (901) is matched and aligned with the first part to be bonded (3) below the flexible film (102).
9. A bonding device, characterized in that, The bonding equipment includes a mounting platform (10), a feeding module (11), a second transfer module (12), a running platform module (13), a third transfer module (14), and a bonding device according to any one of claims 1-8; The feeding module (11) is movably mounted on the mounting platform (10); The second transfer module (12) is movably disposed on the mounting platform (10) and located above the feeding module (11); The running platform module (13) is movably mounted on the mounting platform (10) and located on one side of the feeding module (11) and the second transfer module (12); The third transfer module (14) is movably disposed on the mounting platform (10) and located on the side of the running platform module (13) away from the feeding module (11) and the second transfer module (12).
10. The bonding device according to claim 9, characterized in that, The bonding device also includes: The first image acquisition module (15) is disposed on the mounting platform (10) and located above the bonding platform module (9) of the bonding device; The second image acquisition module is disposed on the bonding platform module (9), and the bonding platform module (9) is communicatively connected to the first image acquisition module (15) and the second image acquisition module.