Leveling device of a rotary heating plate and semiconductor equipment

Abstract

The utility model discloses a kind of leveling device of rotary heating disc and semiconductor equipment, leveling device includes lifting unit, rotating unit, driving shaft unit, driven shaft unit, coarse adjustment unit and fine adjustment unit, lifting unit is used to drive heating disc to move along vertical direction, rotating unit is connected with lifting unit, the input end of driving shaft unit is connected with the output end of rotating unit, the output end of driven shaft unit is connected with heating disc, coarse adjustment unit is set at the pedestal of lifting unit;Fine adjustment unit is set between driving shaft unit and driven shaft unit, for compensating the disc surface bounce of heating disc when heating disc rotates.Coarse adjustment unit solves the initial horizontal reference problem of device in stationary state, fine adjustment unit introduces the interface of the inclination angle that can be accurately adjusted between driving shaft unit and driven shaft unit, directly compensate the deviation of the perpendicularity of rotating shaft and heating disc disc surface due to machining assembly error, to improve the uniformity of deposited film.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a leveling device for a rotating heating plate and a semiconductor device. Background Technology

[0002] In semiconductor manufacturing equipment, rotary heating disks are widely used in thin film deposition processes. Current technology employs a coarse leveling mechanism consisting of three sets of ball nuts to adjust the static level of the heating disk, ensuring its parallelism with the overhead spray plate or cover plate at a fixed angle. However, due to component machining errors and accumulated assembly tolerances, there is an actual perpendicularity deviation between the rotation axis and the heating disk surface, causing periodic vibrations between the disk surface and the overhead components during rotation. For deposition equipment rotating at a constant speed, this vibration disrupts film uniformity; for deposition equipment requiring multiple rotations for positioning, the vibration after each angle change also causes film thickness fluctuations. While current coarse leveling solutions can guarantee levelness in a static state, they cannot compensate for dynamic deviations during rotation. This problem significantly reduces product yield, especially when the process requires millimeter-level disk vibration. Utility Model Content

[0003] The present invention provides a leveling device for a rotating heating plate and a semiconductor device, which solves the technical problem that traditional leveling devices cannot compensate for dynamic deviations during rotation, resulting in film thickness fluctuations.

[0004] To address the aforementioned problems, according to one aspect of this application, an embodiment of the present invention provides a leveling device for a rotating heating plate. The leveling device includes a lifting unit, a rotating unit, a drive shaft unit, a driven shaft unit, a coarse adjustment unit, and a fine adjustment unit. The lifting unit drives the heating plate to move vertically. The rotating unit is connected to the lifting unit and provides rotational power. The input end of the drive shaft unit is connected to the output end of the rotating unit. The output end of the driven shaft unit is connected to the heating plate. The coarse adjustment unit is disposed between the base of the lifting unit and the cavity mounting surface and is used to adjust the horizontal reference of the lifting unit. The fine adjustment unit is disposed between the drive shaft unit and the driven shaft unit and is used to compensate for the surface runout of the heating plate by adjusting the tilt angle of the driven shaft unit relative to the drive shaft unit when the heating plate rotates.

[0005] In some embodiments, the fine-tuning unit includes at least three sets, which are evenly distributed along the flange circumference of the driven shaft unit.

[0006] In some embodiments, the fine-tuning unit includes an adjusting screw and a spherical nut. The adjusting screw has fine threads and is screwed into the flange of the drive shaft unit, with the tip of the adjusting screw abutting against the spherical nut. The spherical nut is supported on the bottom surface of the flange of the driven shaft unit. Rotating the adjusting screw changes the screwing depth of the fine threads, thereby adjusting the local support height of the driven shaft unit.

[0007] In some embodiments, a torque transmission unit is provided between the drive shaft unit and the driven shaft unit, and the torque transmission unit is a magnetic coupling or a flat key connection structure.

[0008] In some embodiments, when the torque transmission unit is a magnetic coupling, a non-contact force transmission gap is provided between the driving magnetic ring and the driven magnetic ring of the magnetic coupling.

[0009] In some embodiments, the housing of the driven shaft unit is connected to the housing of the driving shaft unit via annularly distributed columns.

[0010] In some embodiments, the driven shaft unit is provided with a bellows sealing structure, and the direction of expansion and contraction of the bellows sealing structure is collinear with the axis of the driven shaft unit.

[0011] In some embodiments, the coarse adjustment unit is provided in three groups, and the three groups of coarse adjustment units are evenly distributed around the circumference of the lifting unit base.

[0012] In some embodiments, the coarse adjustment unit includes a fixed stud, an upper spherical nut, and a lower spherical nut; the fixed stud passes through the mounting hole of the lifting unit base, and its lower end is fixedly connected to the cavity mounting surface; the lower spherical nut is screwed onto the fixed stud and is located on the bottom surface of the lifting unit base, with the spherical surface of the lower spherical nut contacting the bottom surface of the base; the upper spherical nut is screwed onto the fixed stud and is located on the top surface of the lifting unit base, locking with the top surface of the base.

[0013] According to another aspect of this application, an embodiment of the present invention provides a semiconductor device including the leveling device described above.

[0014] Compared with the prior art, the leveling device for the rotary heating plate of this utility model has at least the following beneficial effects:

[0015] The leveling device for a rotating heating plate provided by this utility model includes a lifting unit, a rotating unit, a drive shaft unit, a driven shaft unit, a coarse adjustment unit, and a fine adjustment unit. The lifting unit is used to drive the heating plate to move vertically. The rotating unit is connected to the lifting unit and is used to provide rotational power. The input end of the drive shaft unit is connected to the output end of the rotating unit, and the output end of the driven shaft unit is connected to the heating plate. The coarse adjustment unit is located at the base of the lifting unit and is used to adjust the horizontal reference of the lifting unit. The fine adjustment unit is located between the drive shaft unit and the driven shaft unit and is used to compensate for the surface runout of the heating plate by adjusting the tilt angle of the driven shaft unit relative to the drive shaft unit when the heating plate rotates.

[0016] In this invention, the coarse adjustment unit solves the problem of the initial horizontal reference of the device in a static state. The fine adjustment unit, by introducing an interface between the drive shaft unit and the driven shaft unit that allows for precise adjustment of the tilt angle, directly compensates for the deviation in perpendicularity between the rotating shaft and the heating plate surface caused by machining and assembly errors. When the heating plate rotates to a specific angle and exhibits jump, the tilt state of the plate surface at that angle can be corrected in real time by adjusting the fine adjustment unit to change the instantaneous tilt angle of the driven shaft unit, restoring it to parallelism with the upper component. In this way, whether in uniform continuous rotation or indexing rotation positioning conditions, the dynamic jump of the heating plate surface can be effectively controlled within the millimeter-level requirement, thereby improving the uniformity of the deposited film.

[0017] The semiconductor device provided by this utility model is designed based on the leveling device of the above-mentioned rotating heating plate. Its beneficial effects are the same as those of the leveling device of the above-mentioned rotating heating plate, and will not be repeated here.

[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 The image shows a front view of a leveling device for a rotating heating plate according to an embodiment of the present invention;

[0021] Figure 2A cross-sectional view of a leveling device for a rotary heating plate provided in an embodiment of the present invention is shown.

[0022] Figure 3 A cross-sectional view of the fine adjustment unit in a leveling device for a rotary heating plate provided in an embodiment of the present invention is shown.

[0023] Figure 4 This invention illustrates a cross-sectional view of the connection between the drive shaft unit and the driven shaft unit in a leveling device for a rotary heating plate provided by an embodiment of the present invention, when the torque transmission unit is a magnetic coupling.

[0024] Figure 5 This invention illustrates a cross-sectional view of the connection between the drive shaft unit and the driven shaft unit in a leveling device for a rotary heating plate provided by an embodiment of the present invention, when the torque transmission unit is a keyed connection structure.

[0025] Figure 6 This invention illustrates a cross-sectional view from another direction at the connection point between the drive shaft unit and the driven shaft unit in a leveling device for a rotary heating plate provided in an embodiment of the present invention, when the torque transmission unit has a flat key connection structure.

[0026] Figure 7 This invention provides a cross-sectional view of a leveling device for a rotary heating plate, showing the column in cooperation with the drive shaft unit and the driven shaft unit.

[0027] Figure label:

[0028] 1. Lifting unit; 2. Rotation unit; 21. Driven pulley; 3. Driven shaft unit; 4. Driven shaft unit; 41. Bellows sealing structure; 5. Coarse adjustment unit; 51. Fixing stud; 52. Upper ball nut; 53. Lower ball nut; 6. Fine adjustment unit; 61. Adjusting screw; 62. Spherical nut; 63. Fine thread; 7. Heating plate; 8. Torque transmission unit; 81. Driven magnetic ring; 82. Driven magnetic ring; 9. Column. Detailed Implementation

[0029] To further illustrate the technical means and effects adopted by this utility model to achieve its intended purpose, the specific implementation methods, structures, features, and effects according to this utility model application are described in detail below with reference to the accompanying drawings and preferred embodiments. In the following description, different "an embodiment" or "an embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0030] In the description of this utility model, it should be clarified that the terms "first," "second," etc., in the specification, claims, and drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence; the terms "vertical," "lateral," "longitudinal," "front," "back," "left," "right," "up," "down," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this utility model, and do not mean that the device or element referred to must have a specific orientation or position, and therefore should not be construed as a limitation of this utility model.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0033] Example 1

[0034] This embodiment provides a leveling device for a rotating heating plate, such as... Figures 1-7 As shown, the leveling device includes a lifting unit 1, a rotating unit 2, a drive shaft unit 3, a driven shaft unit 4, a coarse adjustment unit 5, and a fine adjustment unit 6. The lifting unit 1 drives the heating plate 7 to move vertically. The rotating unit 2 is connected to the lifting unit and provides rotational power. The input end of the drive shaft unit 3 is connected to the output end of the rotating unit 2. The output end of the driven shaft unit 4 is connected to the heating plate 7. The coarse adjustment unit 5 is located between the base of the lifting unit 1 and the cavity mounting surface and is used to adjust the horizontal reference of the lifting unit 1. The fine adjustment unit 6 is located between the drive shaft unit 3 and the driven shaft unit 4 and is used to compensate for the surface runout of the heating plate 7 by adjusting the tilt angle of the driven shaft unit 4 relative to the drive shaft unit 3 when the heating plate 7 rotates.

[0035] Lifting unit 1 is used to lift the heating plate 7. Rotating unit 2 is located below lifting unit 1 and provides it with rotational power. The input end of drive shaft unit 3 is connected to the output end of rotating unit 2 to receive power. The output end of driven shaft unit 4 is connected to the heating plate 7 to drive its rotation. Coarse adjustment unit 5 is located on top of lifting unit 1 and is used to adjust the initial horizontal reference of lifting unit 1 and its supported mechanism. Fine adjustment unit 6 is located between the output end of drive shaft unit 3 and the input end of driven shaft unit 4, forming an adjustable tilt angle power transmission interface. Lifting unit 1 drives heating plate 7 to move vertically, realizing the transfer of wafers between the process position and the transfer position. Rotating unit 2 provides the power required to drive heating plate 7 to rotate. Drive shaft unit 3 transmits the power generated by rotating unit 2. Driven shaft unit 4 receives the power from drive shaft unit 3 and ultimately drives heating plate 7 to rotate. Coarse adjustment unit 5 establishes an initial static horizontal reference for the entire device by adjusting the levelness of the top of lifting unit 1. The fine-tuning unit 6 dynamically compensates for the surface jump of the heating plate 7 during rotation by adjusting the spatial tilt angle of the driven shaft unit 4 relative to the driving shaft unit 3.

[0036] In the specific working process, firstly, the coarse adjustment unit 5 adjusts the level of the top of the lifting unit 1 to set the initial static level reference of the device. The lifting unit 1 then moves the heating plate 7 up and down according to process requirements to complete the positioning or transfer of the wafer. The rotation unit 2 is activated, driving the drive shaft unit 3 to rotate. Power is transmitted to the driven shaft unit 4 through the fine adjustment unit 6, ultimately driving the heating plate 7 to rotate. During the rotation of the heating plate 7, if any movement of its surface relative to the upper component is detected, the fine adjustment unit 6 is operated to finely adjust the tilt angle of the driven shaft unit 4, so that the surface of the heating plate 7 can dynamically maintain parallelism with the upper spray plate or cover plate during rotation.

[0037] In this embodiment, the coarse adjustment unit 5 solves the problem of the initial horizontal reference of the device in a static state. The fine adjustment unit 6 directly compensates for the deviation in perpendicularity between the rotating shaft and the heating plate 7 surface caused by machining and assembly errors by introducing an interface between the drive shaft unit 3 and the driven shaft unit 4 that allows for precise adjustment of the tilt angle. When the heating plate 7 rotates to a specific angle and exhibits jump, the tilt state of the plate surface at that angle can be corrected in real time by adjusting the fine adjustment unit 6 to change the instantaneous tilt angle of the driven shaft unit 4, restoring it to parallelism with the upper component. In this way, whether in uniform continuous rotation or indexing rotation positioning, the dynamic jump of the heating plate 7 surface can be effectively controlled within the millimeter-level requirement range, thereby improving the uniformity of the deposited film.

[0038] In a specific embodiment, at least three sets of the fine-tuning unit 6 are provided, and the at least three sets of the fine-tuning unit 6 are evenly distributed along the flange circumference of the driven shaft unit.

[0039] At least three sets of fine-tuning units 6 are provided, and these fine-tuning units 6 are distributed at equal angular intervals on the flange circumference of the driven shaft unit 4. This structure allows for precise control of the tilt attitude of the flange face of the driven shaft unit 4 in three-dimensional space by adjusting the extension and retraction of each fine-tuning unit 6 individually.

[0040] In this embodiment, at least three adjustment points evenly distributed circumferentially can independently fine-tune the local height of different positions on the flange surface, forming a stable planar reference and ensuring the multi-angle tilt compensation capability of the heating plate 7 mounting surface; in addition, the uniform layout avoids local stress concentration and maintains a reliable connection between the driven shaft unit 4 and the driving shaft unit 3 during power transmission, which not only achieves dynamic correction of tilt angle but also ensures the stability of torque transmission.

[0041] In a specific embodiment, such as Figure 3 As shown, the fine-tuning unit 6 includes an adjusting screw 61 and a spherical nut 62. The adjusting screw 61 has fine threads 63 and is screwed into the flange of the drive shaft unit 3. The top end of the adjusting screw 61 abuts against the spherical nut 62. The spherical nut 62 is supported on the bottom surface of the flange of the driven shaft unit 4. Rotating the adjusting screw 61 changes the screwing depth of the fine threads 63, thereby adjusting the local support height of the driven shaft unit 4.

[0042] The adjusting screw 61 is screwed into the flange threaded hole of the drive shaft unit 3 through the fine thread 63 on its surface, so that the axial position of the adjusting screw 61 is controlled by the screwing depth; the top surface of the adjusting screw 61 directly abuts the bottom of the spherical surface of the spherical nut 62; the top spherical surface of the spherical nut 62 is supported on the bottom surface of the flange of the driven shaft unit 4, forming a unidirectional force transmission path in which the adjusting screw 61 pushes the spherical nut 62, and then the spherical nut 62 supports the flange of the driven shaft unit 4.

[0043] The adjusting screw 61 acts as a rigid support rod, driving its own axial movement through rotation to provide height adjustment power; the fine thread 63 utilizes the characteristics of the thread pair with a small pitch to convert the rotational motion into axial displacement with millimeter-level precision, realizing the fine adjustment function; the spherical nut 62, through the adaptive deformation of the spherical surface, allows the flange of the driven shaft unit 4 to generate a micro-tilt angle while transmitting the support force, avoiding mechanical interference.

[0044] When the adjusting screw 61 is rotated, the fine-pitch thread 63 drives its axial movement, and the top pushes the spherical nut 62 to produce a vertical displacement, thereby changing the support height of the corresponding position of the flange of the driven shaft unit 4. When at least three sets of this module are adjusted in coordination, the flange tilt angle of the driven shaft unit 4 can be precisely controlled through differentiated height adjustments. This design achieves a dual effect: firstly, the micro-pitch characteristics of the fine-pitch thread 63 enable the height adjustment resolution to reach the micrometer level, directly compensating for the rotational runout of the heating plate 7; secondly, the spherical contact of the spherical nut 62 eliminates rigid constraints, ensuring continuous and stable power transmission during tilt angle adjustment and maintaining the dynamic balance of the rotating mechanism.

[0045] In a specific embodiment, such as Figures 4-6 As shown, a torque transmission unit 8 is provided between the drive shaft unit 3 and the driven shaft unit 4. The torque transmission unit 8 is a magnetic coupling or a flat key connection structure.

[0046] A torque transmission unit 8 is installed between the drive shaft unit 3 and the driven shaft unit 4. The torque transmission unit 8 employs a magnetic coupling or a keyed connection structure. The magnetic coupling transmits torque through non-contact magnetic coupling, while the keyed connection structure transmits torque through the mechanical meshing of the key and keyway. This design ensures that power transmission is unaffected by the angle adjustment when the driven shaft unit 4 is tilted by the fine-tuning unit 6: the magnetic adaptive characteristics of the magnetic coupling tolerate instantaneous angular deviations between the drive shaft unit 3 and the driven shaft unit 4, while the clearance fit of the keyed connection allows for minute displacements. The effect is to maintain stable rotational power transmission while providing the necessary degrees of freedom for dynamic runout compensation of the heating plate 7, avoiding transmission interference or additional vibration caused by leveling operations.

[0047] In a specific embodiment, such as Figure 4 As shown, when the torque transmission unit 8 is a magnetic coupling, a non-contact force transmission gap is provided between the driving magnetic ring 81 and the driven magnetic ring 82 of the magnetic coupling. The driving magnetic ring 81 is fixed to the output end of the driving shaft unit 3, and the driven magnetic ring 82 is fixed to the input end of the driven shaft unit 4. The magnetic poles of the two magnetic rings are arranged opposite each other and spaced at a preset distance to form an air gap. This design transmits torque across the physical gap through magnetic coupling, allowing the driving shaft unit 3 and the driven shaft unit 4 to have relative displacement without mechanical contact when the tilt angle is adjusted by the fine-tuning unit 6. The core effect is to eliminate the rigid constraint of traditional couplings on axial / angular deviations, avoid vibration or wear caused by mechanical interference during fine-tuning, and maintain continuous and stable transmission of rotational power in dynamic leveling state, significantly improving the reliability of the heating plate 7 jump compensation process.

[0048] In a specific embodiment, such as Figure 4 and Figure 7As shown, the outer shell of the driven shaft unit 4 is connected to the shell of the driving shaft unit 3 via annularly distributed columns 9. The outer shell of the driven shaft unit 4 is rigidly connected to the shell of the driving shaft unit 3 via the annularly distributed columns 9, forming a circumferentially distributed axial support frame. The two ends of the columns 9 are fixed to the upper end face of the shell of the driving shaft unit 3 and the lower end face of the outer shell of the driven shaft unit 4, respectively, forming a closed force transmission path. This design provides a structural locking function after the fine-tuning unit 6 completes the tilt angle adjustment of the driven shaft unit 4: the annularly distributed columns 9 evenly transmit the torque load of the driving shaft unit 3 to the shell of the driven shaft unit 4, avoiding local stress concentration; at the same time, it maintains the coaxiality reference of the two shaft unit shells, ensuring the stability of the tilt angle compensation value set by the fine-tuning unit 6 during rotation. Furthermore, the columns 9 are actually screws.

[0049] In a specific embodiment, such as Figure 1 and Figure 2 As shown, the driven shaft unit 4 is provided with a bellows sealing structure 41, and the direction of the expansion and contraction of the bellows sealing structure 41 is collinear with the axis of the driven shaft unit 4.

[0050] Driven shaft unit 4 is equipped with a bellows sealing structure 41, the axial expansion and contraction direction of which coincides with the rotation axis of driven shaft unit 4. The fixed end of the bellows sealing structure 41 is connected to the stationary housing of driven shaft unit 4, and the movable end is connected to the rotating shaft. It adapts to the lifting and lowering motion through the axial elastic deformation of the bellows. This design achieves a dual effect: firstly, the axial expansion and contraction characteristics perfectly match the vertical displacement of driven shaft unit 4 driven by lifting unit 1, ensuring that the cavity sealing is not affected by lifting and lowering; secondly, the collinear deformation direction avoids radial twisting of the bellows. When the fine adjustment unit 6 finely adjusts the tilt angle of driven shaft unit 4, the bellows sealing structure 41 adapts to the angle change through flexible deformation, maintaining dynamic sealing reliability and eliminating the risk of process gas leakage.

[0051] In a specific embodiment, the coarse adjustment unit 5 is provided in three groups, and the three groups of coarse adjustment units 5 are evenly distributed around the circumference of the base of the lifting unit 1.

[0052] Coarse adjustment units 5 are distributed at equal angular intervals along the circumference of the base of lifting unit 1. This allows for fine-tuning of the tilt of the base of lifting unit 1 in the X / Y directions. The three sets of modules are evenly distributed circumferentially to form a stable triangular support structure, allowing independent adjustment of the height of each point to calibrate the overall horizontal reference. The core effect of this design is: by eliminating the accumulated errors of the initial assembly through three sets of symmetrically distributed adjustment points, a static horizontal reference for lifting unit 1 is quickly established, providing a precise foundation platform for the dynamic compensation of fine adjustment unit 6, while avoiding the risk of structural deformation caused by over-constraint at a single point.

[0053] In a specific embodiment, the coarse adjustment unit 5 includes a fixing stud 51, an upper spherical nut 52, and a lower spherical nut 53; the fixing stud 51 passes through the mounting hole of the base of the lifting unit 1, and its lower end is fixedly connected to the cavity mounting surface; the lower spherical nut 53 is screwed onto the fixing stud 51 and is located on the bottom surface of the base of the lifting unit 1, and the spherical surface of the lower spherical nut 53 contacts the bottom surface of the base; the upper spherical nut 52 is screwed onto the fixing stud 51 and is located on the top surface of the base of the lifting unit 1, and is locked in place with the top surface of the base.

[0054] The fixing stud 51 vertically penetrates the mounting hole of the lifting unit 1 base, and its lower end is fixedly connected to the cavity mounting surface to form a support reference. The lower spherical nut 53 is screwed onto the threaded section of the fixing stud 51, located below the bottom surface of the lifting unit 1 base, and its top spherical surface contacts the bottom surface of the base to form an adaptive support. The upper spherical nut 52 is screwed onto the threaded section of the fixing stud 51, located above the top surface of the lifting unit 1 base, and is locked by tightening it to press against the top surface of the base. The fixing stud 51 provides a vertical support axis, restricting the horizontal displacement freedom of the lifting unit 1 base. The lower spherical nut 53 adjusts the vertical position of the lifting unit 1 base by adjusting the screw height, and its spherical top surface adapts to the tilt angle of the bottom surface of the base. After the height adjustment is completed, the upper spherical nut 52 presses against the top surface of the lifting unit 1 base, forming a two-way clamping and locking structure together with the lower spherical nut 53.

[0055] When the lower spherical nut 53 is rotated to change its engagement height, the top of the spherical surface pushes the base of the lifting unit 1 to move axially along the fixed stud 51, achieving a coarse adjustment of the local support height of the base. After leveling, the upper spherical nut 52 is tightened so that it and the lower spherical nut 53 together clamp the base of the lifting unit 1, eliminating thread clearance. This design compensates for the unevenness of the cavity mounting surface through spherical contact, ensuring that the three modules work together to establish a stable horizontal reference. The bidirectional locking mechanism prevents horizontal displacement under vibration conditions, providing a precise static platform for the fine adjustment unit 6.

[0056] In addition, the drive shaft unit 3 includes core components such as bearings and a first rotary seal. As the core shaft for power transmission, the drive shaft is rotatably supported at one end in the housing of the drive shaft unit 3 by the bearings and achieves dynamic sealing of the cavity by the first rotary seal; the other end is directly connected to the output end of the rotating unit 2 (i.e., the driven pulley 21) (e.g., through key connection, flange bolt connection, or interference fit, etc.) to receive rotational power.

[0057] The driven shaft unit 4 includes core components such as bearings, a second rotary seal, and a bellows sealing structure 41. The driven shaft, as the core shaft for power output, has one end rotatably supported within the housing of the driven shaft unit 4 via a bearing, and achieves basic dynamic sealing through the second rotary seal. The bellows sealing structure 41 is located inside the driven shaft unit 4 and is used to accommodate lifting and lowering movements and maintain a high vacuum or process atmosphere seal (its axial expansion and contraction characteristics have been described previously). The output end of the driven shaft is fixedly connected to the heating plate 7 via bolts, directly transmitting rotational power to the heating plate 7.

[0058] The working process of the leveling device provided in this embodiment is as follows:

[0059] The lower ends of the three sets of fixing studs 51 of the coarse adjustment unit 5 are fixed to the cavity mounting surface. Rotating each lower spherical nut 53 pushes the base of the lifting unit 1 to move axially along the fixing studs 51. The top of its spherical surface adapts to the tilt angle of the base bottom surface. After adjustment, tighten the upper spherical nut 52 to lock the initial horizontal reference of the lifting unit 1. The lifting unit 1 drives the rotating unit 2 and the drive shaft unit 3 to lift as a whole, driving the heating plate 7 to complete the wafer transport and positioning. After the rotating unit 2 starts, the power is input to the torque transmission unit 8 through the drive shaft unit 3: if a magnetic coupling is used, the driving magnetic ring 81 drives the driven magnetic ring 82 through a non-contact air gap; if a flat key is used... The structure transmits torque to the driven shaft unit 4 via mechanical meshing. The bellows sealing structure 41 of the driven shaft unit 4 extends and retracts along the axis as the shaft rises and falls, maintaining dynamic sealing of the cavity. When the heating plate 7 rotates, if surface runout is detected, the three sets of adjusting screws 61 of the fine adjustment unit 6 are operated. The fine thread 63 drives the adjusting screws 61 to move axially, and the top pushes the spherical nut 62 to change the local support height of the flange of the driven shaft unit 4. The coordinated adjustment causes the driven shaft unit 4 to generate a compensating tilt angle. After horizontal locking, the outer shell of the driven shaft unit 4 is fixedly connected to the outer shell of the drive shaft unit 3 through the annularly distributed columns 9, forming a stable torque transmission frame. The coarse adjustment unit 5 eliminates static assembly errors throughout the process, the fine adjustment unit 6 dynamically suppresses rotational runout, and the bellows sealing structure 41 ensures process sealing, achieving millimeter-level runout control of the heating plate 7 and improving film uniformity.

[0060] Example 2

[0061] This embodiment provides a semiconductor device, which includes the leveling device described in Embodiment 1.

[0062] The semiconductor equipment provided in this embodiment directly utilizes the coarse adjustment unit 5 to establish an initial horizontal reference and the fine adjustment unit 6 to dynamically compensate for the rotational runout of the heating plate 7, thereby achieving millimeter-level runout control between the heating plate 7 and the spray plate and the top cover plate in the semiconductor process, significantly improving the uniformity of the deposited thin film and the product yield.

[0063] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A leveling device for a rotating heating plate, characterized in that, The leveling device includes a lifting unit, a rotating unit, a drive shaft unit, a driven shaft unit, a coarse adjustment unit, and a fine adjustment unit. The lifting unit drives the heating plate to move vertically. The rotating unit is connected to the lifting unit and provides rotational power. The input end of the drive shaft unit is connected to the output end of the rotating unit, and the output end of the driven shaft unit is connected to the heating plate. The coarse adjustment unit is located between the base of the lifting unit and the cavity mounting surface and is used to adjust the horizontal reference of the lifting unit. The fine adjustment unit is located between the drive shaft unit and the driven shaft unit and is used to compensate for the surface runout of the heating plate by adjusting the tilt angle of the driven shaft unit relative to the drive shaft unit when the heating plate rotates.

2. The leveling device for the rotary heating plate according to claim 1, characterized in that, At least three sets of fine-tuning units are provided, and the at least three sets of fine-tuning units are evenly distributed along the flange circumference of the driven shaft unit.

3. The leveling device for the rotating heating plate according to claim 2, characterized in that, The fine-tuning unit includes an adjusting screw and a spherical nut. The adjusting screw has fine threads and is screwed into the flange of the drive shaft unit. The top of the adjusting screw abuts against the spherical nut. The spherical nut is supported on the bottom surface of the flange of the driven shaft unit. Rotating the adjusting screw changes the screwing depth of the fine threads, thereby adjusting the local support height of the driven shaft unit.

4. The leveling device for the rotary heating plate according to claim 1, characterized in that, A torque transmission unit is provided between the drive shaft unit and the driven shaft unit. The torque transmission unit is a magnetic coupling or a flat key connection structure.

5. The leveling device for the rotary heating plate according to claim 4, characterized in that, When the torque transmission unit is a magnetic coupling, a non-contact force transmission gap is provided between the driving magnetic ring and the driven magnetic ring of the magnetic coupling.

6. The leveling device for the rotary heating plate according to claim 1, characterized in that, The housing of the driven shaft unit is connected to the housing of the driving shaft unit through annularly distributed columns.

7. The leveling device for the rotary heating plate according to claim 1, characterized in that, The driven shaft unit is provided with a bellows sealing structure, and the direction of expansion and contraction of the bellows sealing structure is collinear with the axis of the driven shaft unit.

8. The leveling device for the rotary heating plate according to claim 1, characterized in that, The coarse adjustment unit is provided in three groups, and the three groups of coarse adjustment units are evenly distributed around the circumference of the lifting unit base.

9. The leveling device for the rotary heating plate according to claim 8, characterized in that, The coarse adjustment unit includes a fixed stud, an upper spherical nut, and a lower spherical nut. The fixed stud passes through the mounting hole of the lifting unit base, and its lower end is fixedly connected to the cavity mounting surface. The lower spherical nut is screwed onto the fixed stud and is located on the bottom surface of the lifting unit base, with the spherical surface of the lower spherical nut in contact with the bottom surface of the base. The upper spherical nut is screwed onto the fixed stud and is located on the top surface of the lifting unit base, locking with the top surface of the base.

10. A semiconductor device, characterized in that, The semiconductor device includes the leveling apparatus according to any one of claims 1-9.

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