A cooling device and a cooling system

Abstract

The utility model relates to the technical field of heat dissipation, especially to a cooling device and a cooling system, the cooling device includes cooling mainboard, and the cooling mainboard top surface has the sinking groove, is equipped with cooling area on the sinking groove, and the cooling area includes a plurality of cooling bosses that set up mutually interval, still include cooling water channel, and the cooling water channel is located sinking groove below and is equipped with in the cooling mainboard inside. The graphite tray that places the metal frame is placed on the cooling boss, and the heat conduction is carried out through the cooling boss, thereby cooling the graphite tray, and compared with the conventional graphite tray directly placed on the cooling plate, because a plurality of cooling bosses are mutually separated, the heat conduction area of the graphite tray is effectively reduced, the graphite tray is cooled slowly, the cooling rate of the graphite tray is prolonged, and then the heat emission of the metal frame is slowed down, the probability that the chip is damaged due to the rapid cooling of the metal frame is effectively avoided, and the product quality of the semiconductor is protected.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a cooling device and a cooling system. Background Technology

[0002] A sintering furnace is a specialized piece of equipment that uses sintering to achieve the desired physical, mechanical properties and microstructure of powder compacts. It can process metallic materials as well as various non-metallic materials such as silicon. In semiconductor assembly production, frames containing mounted chips and jumpers are placed in the sintering furnace for sintering. A sintering furnace is generally divided into a heating zone, a high-temperature zone, and a cooling zone, and the setting of each temperature zone affects product quality. Among these, the cooling rate of the sintering furnace is one of the key process parameters affecting product reliability, mechanical properties, and electrical properties. An inappropriate cooling rate can lead to problems such as interface delamination, residual stress concentration, and material property degradation. The cooling plates in the cooling zone primarily function to control the cooling rate, ensure uniform heat dissipation, and maintain process stability.

[0003] Currently, the metal frame with the chip mounted is usually placed on a graphite disk, and then the graphite disk is placed on a cooling plate for cooling. However, during the cooling process, due to the large contact area between the graphite disk and the cooling plate, the graphite disk cools down quickly, which in turn makes the metal frame cool down quickly. However, if the metal frame cools down too quickly, a certain percentage of the chips may crack, which seriously affects the product quality. Utility Model Content

[0004] The purpose of this utility model is to address the problem in the background art where excessively rapid cooling of metal frames can easily lead to cracks in a certain proportion of chips, seriously affecting product quality, by providing a cooling device and a cooling system.

[0005] In a first aspect, the present invention provides a cooling device, including a cooling main board, the top surface of which has a recessed groove, and a cooling area is provided on the recessed groove, the cooling area including a plurality of cooling protrusions arranged at intervals between each other;

[0006] It also includes a cooling water channel, which is located inside the cooling motherboard and below the sinkhole.

[0007] A recessed groove is provided on the cooling motherboard, and a cooling zone is set within the recessed groove. The cooling zone includes multiple cooling bosses, and a cooling water channel is located inside the cooling motherboard, below the recessed groove. The cooling water channel cools the cooling bosses. In actual production, a graphite disk with a metal frame is placed on the cooling bosses in the cooling zone. Heat conduction is carried out through the cooling bosses, thereby cooling the graphite disk. Compared with conventional graphite disks placed directly on a cooling plate, the multiple cooling bosses are separated from each other, effectively reducing the heat conduction area of ​​the graphite disk, making the graphite disk cool down more slowly, prolonging the cooling rate of the graphite disk, and thus slowing down the heat dissipation of the metal frame. This effectively avoids the probability of chip breakage due to excessively rapid cooling of the metal frame, protecting the quality of semiconductor products.

[0008] Preferably, the plurality of cooling bosses are arranged in a matrix.

[0009] Preferably, the top surface of the cooling boss is flush with the top surface of the cooling motherboard.

[0010] Preferably, it further includes guide plates disposed on the sinking trough, the guide plates being located on both sides of the cooling zone;

[0011] The guide plate has a sloping surface at the end away from the cooling zone.

[0012] Preferably, the plurality of guide plates are spaced apart along the width direction of the sinking trough.

[0013] Preferably, the cooling water channels are spaced apart along the length of the sinkhole.

[0014] Preferably, the cooling motherboard has cooling cylinders arranged alternately on the left and right sides, and the cooling cylinders have connecting channels inside, which are connected to the two adjacent cooling water channels.

[0015] Preferably, the cooling cylinder is detachably connected to both ends with sealing heads, which are used to seal the connection channel.

[0016] In a second aspect, the present invention provides a cooling system, including a graphite plate and the cooling device described in this application. The graphite plate is placed on the cooling protrusion, and the top surface of the graphite plate has a plurality of sequentially spaced protrusions. A placement area is formed between adjacent protrusions, and the placement area is used to accommodate a metal frame on which a chip is mounted.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] The cooling device of this application has a recessed groove on the cooling motherboard, and a cooling zone is provided in the recessed groove. The cooling zone includes multiple cooling protrusions, and a cooling water channel is provided inside the cooling motherboard. The cooling water channel is located below the recessed groove and cools the cooling protrusions through the cooling water channel. In actual production, a graphite disk with a metal frame is placed on the cooling protrusion in the cooling zone. Heat conduction is carried out through the cooling protrusion, thereby cooling the graphite disk. Compared with the conventional graphite disk being placed directly on the cooling plate, the heat conduction area of ​​the graphite disk is effectively reduced because the multiple cooling protrusions are separated from each other, so that the graphite disk cools down more slowly and prolongs the cooling rate of the graphite disk. This slows down the heat dissipation of the metal frame and effectively avoids the probability of chip breakage due to excessive cooling of the metal frame, thus protecting the product quality of semiconductors. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the cooling device described in this application. Figure 1 .

[0020] Figure 2 This is a schematic diagram of the cooling device described in this application. Figure 2 .

[0021] Figure 3 yes Figure 2 A magnified view of part A.

[0022] Figure 4 This is a diagram showing the layout of the cooling water channels inside the motherboard.

[0023] Figure 5 This is a schematic diagram of a graphite disk placed on a cooling device.

[0024] Figure 6 Figure 5 A magnified view of section B.

[0025] Marked in the image:

[0026] 1-Cooling the motherboard,

[0027] 2-Sinking trough,

[0028] 3-Cooling boss,

[0029] 4-Cooling water passage,

[0030] 5-Guide plate,

[0031] 51-Slope surface,

[0032] 6-Cooling cylinder,

[0033] 61-Connecting channel, 62-Sealing head,

[0034] 7-Graphite plate,

[0035] 8-convex strips,

[0036] 9-Placement area

[0037] 10-Cooling Zone

[0038] 20-chip,

[0039] 30 - Metal frame. Detailed Implementation

[0040] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0041] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.

[0042] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," "parallel," and "coaxial" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, parallel, or coaxial. Slight tilt or deviation is permissible, as long as it does not affect the normal function of the relevant component. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," not that the structure must be perfectly horizontal; a slight tilt is acceptable. "Coaxial" means that two components are arranged as coaxially as possible, allowing them to move coaxially or approximately coaxially when their relative positions change. Alternatively, it can be simplified to mean that the corresponding device / component / element, when arranged in "horizontal," "vertical," "suspended," "parallel," or "coaxial" directions, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. For example, the deviation in the "coaxial" direction is controlled within 0.2-1mm, preferably within 0.2-0.5mm. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0043] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing descriptions of identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.

[0044] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.

[0045] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0046] Example 1

[0047] like Figures 1-4 As shown, this embodiment discloses a cooling device, including a cooling main board 1, a recessed groove 2 on the top surface of the cooling main board 1, a cooling area 10 on the recessed groove 2, and a plurality of cooling protrusions 3 arranged at intervals between each other.

[0048] It also includes a cooling water channel 4, which is located inside the cooling motherboard 1 and below the sink 2.

[0049] The cooling device of this embodiment has a recessed groove 2 on the cooling main board 1, and a cooling zone 10 is provided in the recessed groove 2. The cooling zone 10 includes multiple cooling protrusions 3, and a cooling water channel 4 is provided inside the cooling main board 1. The cooling water channel 4 is located below the recessed groove 2. The cooling protrusions 3 are cooled through the cooling water channel 4. In actual production, the graphite disk with the metal frame is placed on the cooling protrusions 3 in the cooling zone 10. Heat conduction is carried out through the cooling protrusions 3 to cool the graphite disk. Compared with the conventional graphite disk being placed directly on the cooling plate, the heat conduction area of ​​the graphite disk is effectively reduced because the multiple cooling protrusions 3 are separated from each other, so that the graphite disk cools down more slowly and the cooling rate of the graphite disk is extended. This slows down the heat dissipation of the metal frame and effectively avoids the probability of chip breakage due to the metal frame cooling too quickly, thus protecting the product quality of semiconductors.

[0050] Specifically, when a conventional cooling plate comes into contact with a graphite disk, the heat conduction area of ​​the graphite disk is equal to the area of ​​the graphite disk.

[0051] This application provides a recessed groove 2 on the cooling motherboard 1, and sets multiple mutually spaced cooling protrusions 3 in the recessed groove 2. After the graphite disk comes into contact with the cooling protrusions 3, the heat conduction area of ​​the graphite disk is equal to the area of ​​the cooling protrusions 3 in contact with it. Compared with the conventional method, this greatly reduces the heat conduction area of ​​the graphite disk.

[0052] In optional implementations, such as Figure 2 As shown, multiple cooling bosses 3 are arranged in a matrix.

[0053] In an optional embodiment, the top surface of the cooling boss 3 is flush with the top surface of the cooling motherboard 1.

[0054] In one or more implementations, such as Figure 2 , Figure 3 As shown, it also includes guide plates 5 disposed on the sink trough 2, and the guide plates 5 are located on both sides of the cooling zone 10;

[0055] The guide plate 5 has a ramp 51 at the end away from the cooling zone 10.

[0056] Guide plates 5 are provided on both sides of the cooling zone 10, and a ramp 51 is provided at the end of the guide plate 5 away from the cooling zone 10. When the graphite disk moves toward the cooling main plate 1, the graphite disk contacts the ramp 51 of the guide plate 5 and gradually moves onto the cooling boss 3, thus avoiding the situation where the graphite disk collides directly with the cooling boss 3 and cannot move onto the cooling boss 3.

[0057] In an optional embodiment, multiple guide plates 5 are spaced apart along the width direction of the sinking trough 2.

[0058] Multiple guide plates 5 are spaced apart along the width of the sink trough 2 to facilitate the movement of the graphite disk onto the cooling boss 3 via the guide plates 5.

[0059] In one or more implementations, such as Figure 1 , Figure 4 As shown, cooling water channels 4 are spaced apart along the length of the sink trough 2.

[0060] Among them, multiple cooling water channels 4 are interconnected.

[0061] Furthermore, cooling cylinders 6 are staggered on the left and right sides of the cooling main board 1, and a connecting channel 61 is provided inside the cooling cylinder 6, which is connected to two adjacent cooling water channels 4.

[0062] Cooling cylinders 6 are installed on the left and right sides of the cooling motherboard 1, and the two adjacent cooling water channels 4 are connected by the connecting channels 61 of the cooling cylinders 6.

[0063] Furthermore, the cooling cylinders 6 are staggered on the left and right sides of the cooling mainboard 1;

[0064] Specifically, a cooling cylinder 6 is set on the left side of the cooling motherboard 1, and the first cooling water channel 4 and the second cooling water channel 4 are connected on the left side of the cooling motherboard 1.

[0065] Another cooling cylinder 6 is set on the right side of the cooling motherboard 1, and the second cooling water channel 4 and the third cooling water channel 4 are connected on the right side of the cooling motherboard 1, and so on, so that multiple cooling water channels 4 are formed into a connected path, which facilitates the subsequent injection and discharge of cooling liquid.

[0066] In optional implementations, such as Figure 4 As shown, the cooling cylinder 6 is detachably connected to two sides with sealing heads 62, which are used to seal both ends of the connecting channel 61.

[0067] The two ends of the connecting channel 61 are sealed by a detachable plug head 62. When it is necessary to quickly drain the coolant, the plug head 62 can be opened to allow the coolant to flow. Alternatively, depending on the actual needs, the plug head 62 can be opened to inject new coolant into the connecting channel 61.

[0068] In an optional embodiment, the top edge of the cooling boss 3 has a rounded chamfer, which can not only further reduce the contact area between the cooling boss 3 and the graphite disk, but also reduce the risk of the cooling boss 3 scratching the graphite disk.

[0069] In an optional implementation, the cooling motherboard 1 is an aluminum plate.

[0070] This embodiment also discloses a method for manufacturing a cooling device, specifically as follows:

[0071] First, make a board, then cut multiple grooves on the board. The grooves are divided into horizontal grooves and vertical grooves. The length × width × thickness of the board is 400mm × 264mm × 50mm. Leave 16mm at the distance from the baffle on both sides of the board. Cut 15 horizontal grooves and 20 vertical grooves in the middle part of the board. The grooves are all 8mm wide and 4mm deep, thus forming a groove structure with alternating horizontal and vertical grooves of 15 × 20.

[0072] Multiple grooves divide the plate into contact and non-contact areas. The contact area is the cooling boss 3, and the non-contact area is the groove.

[0073] The graphite disk has a length × width × thickness of 240mm × 140mm × 5mm. Due to its small size, two graphite disks are typically placed side-by-side in the furnace to improve sintering efficiency. Therefore, the contact area between the graphite disk and the cooling main plate 1 of this application is: 238 × 8 × 8 + 4 × 280 × 2 = 17472mm². 2 ;

[0074] Compared to the cooling plate without cooling boss 3, the contact area is the same as the graphite disk area, which is 240×140×2=67200mm². 2 ,

[0075] The contact area is reduced by (67200-17472) / 67200 = 74%.

[0076] This application utilizes the groove area between the cooling bosses 3 to avoid direct heat transfer, thereby reducing the contact area between the graphite scale and the cooling mainboard 1 by 74% and effectively extending the cooling rate.

[0077] Example 2

[0078] like Figure 5 , Figure 6 As shown, based on Embodiment 1, this embodiment discloses a cooling system, including a graphite plate 7 and the cooling device described in Embodiment 1, wherein the graphite plate 7 is placed on the cooling boss 3;

[0079] The top surface of the graphite plate 7 has several raised strips 8 arranged at intervals in sequence, and a placement area 9 is formed between adjacent raised strips 8. The placement area 9 is used to accommodate the metal frame 30 on which the chip 20 is installed, and the chip 20 is located in the placement area 9.

[0080] The cooling device system of this embodiment includes a graphite plate 7 and the cooling device of embodiment 1. The graphite plate 7 is provided with mutually spaced protrusions 8, and a placement area 9 is formed between adjacent protrusions 8. The placement area 9 is used to accommodate the metal frame 30 mounted on the chip 20, thereby ensuring the stability of the metal frame 30 and preventing the metal frame 30 from shaking during the movement of the graphite plate 7. Furthermore, the graphite plate 7 is placed in the cooling area 10, so that the bottom surface of the cooling area 10 contacts multiple cooling protrusions 3. Heat conduction is carried out through the cooling protrusions 3. Since the multiple cooling protrusions 3 are separated from each other, the heat conduction area of ​​the graphite plate is effectively reduced, the cooling rate of the graphite plate is extended, and the heat dissipation of the metal frame is slowed down. This effectively avoids the probability of chip breakage due to excessive cooling of the metal frame and protects the product quality of the semiconductor.

[0081] In this implementation, such as Figure 6 As shown, the metal frame 30 includes a recessed area, and the chip 20 is placed on the top surface of the recessed area. The recessed area of ​​the metal frame 30 is located within the placement area 9 of the graphite plate 7.

[0082] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cooling device, characterized in that, It includes a cooling motherboard (1), the top surface of which has a recessed groove (2), and a cooling area (10) is provided on the recessed groove (2), the cooling area (10) including a plurality of cooling protrusions (3) arranged at intervals between each other; It also includes a cooling water channel (4), which is located inside the cooling main board (1) and below the sinkhole (2).

2. The cooling device according to claim 1, characterized in that, The multiple cooling bosses (3) are arranged in a matrix.

3. A cooling device according to claim 2, characterized in that, The top surface of the cooling boss (3) is flush with the top surface of the cooling motherboard (1).

4. A cooling device according to claim 1, characterized in that, It also includes guide plates (5) disposed on the sinking trough (2), the guide plates (5) being located on both sides of the cooling zone (10); The guide plate (5) has a ramp (51) at one end away from the cooling zone (10).

5. A cooling device according to claim 4, characterized in that, Multiple guide plates (5) are spaced apart along the width direction of the sinking trough (2).

6. A cooling device according to any one of claims 1-5, characterized in that, The cooling water channels (4) are spaced apart along the length of the sinkhole (2).

7. A cooling device according to claim 6, characterized in that, The cooling main board (1) has cooling cylinders (6) arranged alternately on the left and right sides. The cooling cylinder (6) has a connecting channel (61) inside, which is connected to the two adjacent cooling water channels (4).

8. A cooling device according to claim 7, characterized in that, The cooling cylinder (6) is detachably connected to two ends with sealing heads (62), which are used to block the connecting channel (61).

9. A cooling system, characterized in that, Includes a graphite plate (7) and a cooling device as described in any one of claims 1-8, wherein the graphite plate (7) is placed on the cooling boss (3), and the top surface of the graphite plate (7) has a plurality of sequentially spaced protrusions (8), and a placement area (9) is formed between adjacent protrusions (8), the placement area (9) being used to accommodate a metal frame (30) on which the chip (20) is mounted.

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