Sound production device and electronic device
By setting a conductive layer on the surface of the diaphragm assembly and electrically connecting it to the voice coil, the rigidity nonlinearity problem caused by the centering support is solved, the acoustic performance and magnetic flux of the sound-generating device are improved, and a thin and light design is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MERRY ELECTRONICS (SUZHOU) CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-07
AI Technical Summary
In existing sound-generating devices, the connection between the centering support and the voice coil leads to a rigid nonlinearity problem in the vibration system, which affects the acoustic performance.
A conductive layer is provided on the surface of the diaphragm assembly facing the voice coil. The conductive layer is electrically connected to the voice coil and the conductive structure. The conductive structure is installed by setting mounting holes in the magnetic circuit system, thereby realizing the electrical connection between the conductive layer and the voice coil, increasing the magnetic flux and improving the connection strength and reliability.
It reduces the rigidity nonlinearity problem caused by the asynchrony between the conductive layer and the diaphragm assembly, improves acoustic performance, and allows the sound-generating device to occupy less space in the thickness direction, which is beneficial for thinner and lighter designs and increased magnetic flux.
Smart Images

Figure CN224473410U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electroacoustic transduction technology, and in particular to a sound-generating device and electronic equipment. Background Technology
[0002] Sound-generating devices are important electroacoustic transducers in electronic devices, and they are widely used as loudspeakers, earpieces, headphones, etc.
[0003] In related technologies, the sound-generating device includes a vibration system and a magnetic circuit system. The vibration system includes a diaphragm assembly and a voice coil. The magnetic circuit system has a magnetic gap. One end of the voice coil is connected to the diaphragm assembly, and the other end is located in the magnetic gap. The voice coil is electrically connected to a conductive structure (e.g., a solder pad) of the generating device via a centering support. The conductive structure is electrically connected to an external power source to provide electrical energy to the voice coil. The connection between the centering support and the conductive structure is spot welding. The centering support is electrically connected to the lead wire of the voice coil. Apart from this, the centering support is not fixedly connected to other components, which leads to a rigidity nonlinearity problem in the vibration system caused by the centering support, affecting the acoustic performance of the sound-generating device. Utility Model Content
[0004] The purpose of this invention is to provide a sound-generating device and electronic device to solve the technical problem of poor acoustic performance in the prior art.
[0005] Based on the above concept, the technical solution adopted by this utility model is as follows:
[0006] The sound-generating device includes:
[0007] case;
[0008] A magnetic circuit system is connected to the housing. The magnetic circuit system includes a magnetic yoke and a magnetic circuit assembly disposed on the magnetic yoke. The magnetic circuit assembly has a magnetic gap. The magnetic circuit system is provided with a mounting hole that passes through the magnetic yoke and the magnetic circuit assembly.
[0009] A conductive structure is disposed in the mounting hole;
[0010] A vibration system, comprising a diaphragm assembly and a voice coil, one end of which is connected to the diaphragm assembly and the other end of which is located within the magnetic gap. A conductive layer is disposed on the surface of the diaphragm assembly facing the voice coil, and the conductive layer is electrically connected to the voice coil and the conductive structure.
[0011] In one embodiment, the diaphragm assembly includes a first diaphragm, a second diaphragm, and a diaphragm plate; the first diaphragm is connected to the outer periphery of the diaphragm plate, the second diaphragm is connected to the middle region of the diaphragm plate; the voice coil is connected to the diaphragm plate, and the conductive layer is disposed on the second diaphragm.
[0012] In one embodiment, the middle region of the diaphragm has a central hole; the second diaphragm includes a central portion, an edge portion, and a convex portion connecting the central portion and the edge portion, the central portion being located in the central hole, the convex portion protruding in a direction away from the voice coil, and the edge portion being connected to the surface of the diaphragm facing the voice coil;
[0013] The conductive layer includes a first conductive portion, a second conductive portion, and a third conductive portion connected in sequence. The first conductive portion is disposed at the center portion, the second conductive portion is disposed at the convex portion, and the third conductive portion is disposed at the edge portion. The first conductive portion is electrically connected to the conductive structure, and the third conductive portion is electrically connected to the voice coil.
[0014] In one embodiment, the surface of the diaphragm facing the voice coil is provided with a first receiving groove, and the edge portion is located in the first receiving groove;
[0015] And / or, the conductive layer is provided with a first notch, and the lead of the voice coil extends to the first notch and is electrically connected to the conductive layer.
[0016] In one embodiment, the surface of the diaphragm facing the voice coil is provided with a second receiving groove, and one end of the conductive layer is located in the second receiving groove and electrically connected to the voice coil.
[0017] In one embodiment, the second receiving groove is provided with conductive adhesive, and the conductive layer is electrically connected to the voice coil through the conductive adhesive.
[0018] In one embodiment, the magnetic circuit assembly includes a first main magnet and a second main magnet, the first main magnet being disposed on the magnetic yoke, and the second main magnet being disposed on the side of the first main magnet facing away from the magnetic yoke; the mounting hole includes a first sub-hole disposed on the magnetic yoke, a second sub-hole disposed on the first main magnet, and a third sub-hole disposed on the second main magnet.
[0019] In one embodiment, along a first direction, the orthographic projection of the second main magnet does not exceed the orthographic projection of the center portion, and the first direction is the vibration direction of the vibration system.
[0020] In one embodiment, the magnetic circuit assembly further includes a pole piece disposed between the first main magnet and the second main magnet, and the mounting hole further includes a fourth sub-hole disposed on the pole piece.
[0021] Electronic devices, including the sound-generating devices described above.
[0022] The beneficial effects of this utility model are:
[0023] One end of the voice coil in the vibration system is connected to the diaphragm assembly, and the other end is located within the magnetic gap of the magnetic circuit assembly. When the voice coil is energized, it converts electrical energy into mechanical energy within the magnetic gap, driving the diaphragm assembly to vibrate, thus producing sound. The magnetic circuit system has mounting holes that connect the yoke and the magnetic circuit assembly. A conductive structure is installed in the mounting holes, allowing the conductive layer to be electrically connected to one end of the conductive structure. This enables the conductive structure to be electrically connected to the voice coil through the conductive layer, thus achieving conductivity between the voice coil and the external circuit. Since the conductive layer is located on the surface of the diaphragm assembly facing the voice coil, and the conductive layer... The conductive layer is arranged in layers on the diaphragm assembly, which does not require additional space in the magnetic circuit system, increases the magnetic flux of the magnetic circuit system, and at the same time makes the connection between the conductive layer and the diaphragm assembly have high strength and reliability. When the diaphragm assembly vibrates, the conductive layer can vibrate synchronously and at the same frequency as the diaphragm assembly, and the vibration amplitude of the conductive layer and the diaphragm assembly is also the same. The conductive layer and the diaphragm assembly have a high rigidity connection, which reduces the problem of rigidity nonlinearity caused by the asynchronous connection between the conductive layer and the diaphragm assembly, thereby improving the acoustic performance of the diaphragm assembly and the sound-generating device.
[0024] Furthermore, by installing the conductive structure through mounting holes in the magnetic circuit system, the conductive structure occupies less space in the thickness direction of the sound-generating device. This eliminates the need for a large space to be reserved for the conductive structure in the thickness direction, facilitating a thinner and lighter design and expanding the device's application scenarios. While maintaining the same device size, more space can be allocated to install the magnetic circuit system, effectively increasing the magnetic flux. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0026] Figure 1 This is a first structural schematic diagram of a sound-generating device provided in an embodiment of the present invention;
[0027] Figure 2 This is a second structural schematic diagram of a sound-generating device provided in one embodiment of the present invention;
[0028] Figure 3 This is an exploded view of a sound-generating device provided in an embodiment of this utility model;
[0029] Figure 4 This is a top view of a sound-generating device provided in an embodiment of this utility model;
[0030] Figure 5This is a utility model Figure 4 The AA section view shown;
[0031] Figure 6 This is a utility model Figure 4 The BB section view shown;
[0032] Figure 7 This is a utility model Figure 6 The enlarged view at point C is shown below;
[0033] Figure 8 This is a schematic diagram of the structure of a vibration plate provided in one embodiment of the present invention;
[0034] Figure 9 This is a schematic diagram of the structure of the conductive layer provided in one embodiment of the present invention;
[0035] Figure 10 This is an assembly diagram of the vibrating plate, conductive layer and second diaphragm provided in one embodiment of the present invention;
[0036] Figure 11 This is a schematic diagram of a sound-generating device provided in an embodiment of the present invention, excluding the vibrating plate and the second diaphragm.
[0037] In the picture:
[0038] 1. Housing; 11. Assembly holes;
[0039] 2. Magnetic circuit system; 21. Magnetic yoke; 22. Magnetic circuit assembly; 221. Magnetic gap; 222. First main magnet; 223. Second main magnet; 224. Pole plate; 225. Side magnet; 23. Mounting hole; 231. First sub-hole; 232. Second sub-hole; 233. Third sub-hole; 234. Fourth sub-hole;
[0040] 3. Conductive structure; 31. Support; 311. Boss; 32. Pad;
[0041] 4. Vibration system; 41. Diaphragm assembly; 411. First diaphragm; 412. Second diaphragm; 4121. Center portion; 4122. Edge portion; 4123. Protrusion portion; 4124. Second notch; 413. Vibrating plate; 4131. Central hole; 4132. First receiving groove; 4133. Second receiving groove; 42. Voice coil; 421. Lead wire; 43. Conductive layer; 431. First conductive part; 432. Second conductive part; 433. Third conductive part; 434. First notch; 435. Folded edge;
[0042] Z, First direction. Detailed Implementation
[0043] To make the technical problem solved by this utility model, the technical solution adopted, and the technical effect achieved clearer, the technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining this utility model and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this utility model are shown in the accompanying drawings, not all of them.
[0044] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.
[0045] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0046] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0047] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. In the description of this embodiment, unless otherwise specified, "multiple" specifically refers to two or more.
[0048] In the description of this embodiment, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., are based on the orientation or positional relationships shown in the accompanying drawings and are only for ease of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are merely used for distinction in description and have no special meaning.
[0049] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or it can be located in between the component.
[0050] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0051] This embodiment provides a sound-generating device that can reduce the risk of rigid nonlinearity and improve the acoustic performance of the sound-generating device.
[0052] The sound-generating devices used in this embodiment include, but are not limited to, speakers, earpieces, and headphones. These sound-generating devices are applied to electronic devices, including, but not limited to, smartwatches, mobile phones, speakers, computers, headphones, or televisions.
[0053] For example, such as Figures 1 to 11 As shown, the sound-generating device includes a housing 1, a magnetic circuit system 2, a conductive structure 3, and a vibration system 4. The housing 1 serves as the main supporting structure of the sound-generating device, and both the magnetic circuit system 2 and the vibration system 4 are connected to the housing 1 to form an integral structure. In some optional embodiments, such as... Figure 3 As shown, the housing 1 can specifically be a frame structure. The housing 1 has mounting holes 11 for mounting the vibration system 4 and the magnetic circuit system 2. The housing 1 can be made of metal or non-metal, and this embodiment does not limit this.
[0054] For example, such as Figure 1 As shown, the magnetic circuit system 2 is connected to the housing 1, and the magnetic circuit system 2 includes a magnetic yoke 21 and a magnetic circuit assembly 22 disposed on the magnetic yoke 21. The magnetic yoke 21 and / or the magnetic circuit assembly 22 are connected to the housing 1. The magnetic circuit assembly 22 is disposed on one side of the magnetic yoke 21, for example, the magnetic circuit assembly 22 is located on one side of the magnetic yoke 21 in the thickness direction of the sound-generating device. The magnetic circuit assembly 22 has a magnetic gap 221, and, as... Figure 2As shown, the magnetic circuit system 2 has a mounting hole 23 that passes through the magnetic yoke 21 and the magnetic circuit assembly 22. That is, the hole on the magnetic yoke 21 and the hole on the magnetic circuit assembly 22 cooperate to form the mounting hole 23. In some optional embodiments, the axial direction of the mounting hole 23 is the thickness direction of the sound-generating device. In this embodiment, the thickness direction of the sound-generating device is the same as the vibration direction of the vibration system 4.
[0055] like Figure 2 As shown, the conductive structure 3 is disposed in the mounting hole 23. For example, the conductive structure 3 passes through the mounting hole 23, that is, at least one end of the conductive structure 3 may be located outside the mounting hole 23. In this embodiment, one end of the conductive structure 3 is flush with the opening of the mounting hole 23, and the other end extends outside the mounting hole 23. At least a portion of the conductive structure 3 is a conductor for conducting electricity.
[0056] In at least one possible implementation, such as Figure 3 As shown, the conductive structure 3 may include a bracket 31 and a pad 32 fixedly mounted on the bracket 31. The bracket 31 supports the pad 32 and is disposed in the mounting hole 23. The bracket 31 may be made of a non-conductive material. One end of the pad 32 is located on one end face of the bracket 31 for electrical connection to an external power source, and the other end is located on the other end face of the bracket 31 for electrical connection to the vibration system 4, thereby providing power to the entire sound-generating device. It should be noted that there are two pads 32 to form a circuit.
[0057] For example, such as Figure 3 As shown, the vibration system 4 includes a diaphragm assembly 41 and a voice coil 42. One end of the voice coil 42 is connected to the diaphragm assembly 41, and the other end of the voice coil 42 is located within the magnetic gap 221. A conductive layer 43 is disposed on the surface of the diaphragm assembly 41 facing the voice coil 42. The conductive layer 43 is electrically connected to the voice coil 42 and the conductive structure 3, so that the conductive structure 3, the conductive layer 43, and the voice coil 42 form a circuit. When the voice coil 42 is energized, it interacts with the magnetic circuit system 2 to generate a driving force that drives the vibration system 4 to vibrate, causing the vibration system 4 to vibrate and produce sound.
[0058] In at least one embodiment, the conductive layer 43 is formed on the diaphragm assembly 41 by spraying. In other embodiments, the conductive layer 43 may also be formed on the diaphragm assembly 41 by other methods such as bonding or vapor deposition, which is not limited in this embodiment.
[0059] The conductive layer 43 is made of a conductive material. For example, the conductive layer 43 is formed by nano-conductive silver wires, or it can be composed of other conductive materials or composite conductive materials. This embodiment does not limit this.
[0060] In the sound-generating device provided in this embodiment, one end of the voice coil 42 of the vibration system 4 is connected to the diaphragm assembly 41, and the other end is located in the magnetic gap 221 of the magnetic circuit assembly 22. When the voice coil 42 is energized, it converts electrical energy into mechanical energy within the magnetic gap 221 to drive the voice coil 42 to vibrate the diaphragm assembly 41, thereby generating sound. The magnetic circuit system 2 is provided with a mounting hole 23 that passes through the magnetic yoke 21 and the magnetic circuit assembly 22. The conductive structure 3 is installed in the mounting hole 23, so that the conductive layer 43 can be electrically connected to one end of the conductive structure 3. This allows the conductive structure 3 to be electrically connected to the voice coil 42 through the conductive layer 43, realizing the conduction of the voice coil 42 with the external circuit. Since the conductive layer 43 is located on the surface of the diaphragm assembly 41 facing the voice coil 42, the conductive layer 43 is used to achieve the conduction of the voice coil 42 with the external circuit. Furthermore, the conductive layer 43 is layered on the diaphragm assembly 41. Compared with the existing technology of conducting through FPC-pads, it does not require additional space for the magnetic circuit system 2, which can increase the magnetic flux of the magnetic circuit system 2. It also makes the conductive layer 43 and the diaphragm assembly 41 have higher connection strength and reliability. When the diaphragm assembly 41 vibrates, the conductive layer 43 can vibrate synchronously and at the same frequency as the diaphragm assembly 41, and the vibration amplitude of the conductive layer 43 and the diaphragm assembly 41 is also the same. The conductive layer 43 and the diaphragm assembly 41 have a high rigid connection, which reduces the problem of rigid nonlinearity of the diaphragm assembly 41 caused by the asynchronous connection between the conductive layer 43 and the diaphragm assembly 41, thereby improving the acoustic performance of the diaphragm assembly 41.
[0061] Furthermore, by installing the conductive structure 3 through mounting holes 23 in the magnetic circuit system 2, the conductive structure 3 occupies a smaller space in the thickness direction of the sound-generating device. This eliminates the need for a large space to be reserved for the conductive structure 3 in the thickness direction, facilitating a thinner and lighter design and expanding the device's application scenarios. With the size of the sound-generating device remaining constant, more space can be allocated to install the magnetic circuit system 2, effectively increasing the magnetic flux.
[0062] It should be noted that, as Figure 3 As shown, in this embodiment, there are two conductive layers 43. The two conductive layers 43 are respectively connected to the two leads 421 of the voice coil 42, and the two conductive layers 43 are also electrically connected to the two pads 32.
[0063] In some alternative embodiments, the diaphragm assembly 41, the magnetic circuit assembly 22, and the magnetic yoke 21 are arranged sequentially in the thickness direction of the sound-generating device.
[0064] In one embodiment, such as Figure 3As shown, the diaphragm assembly 41 includes a first diaphragm 411, a second diaphragm 412, and a diaphragm plate 413. The first diaphragm 411 is connected to the outer periphery of the diaphragm plate 413, and the second diaphragm 412 is connected to the middle region of the diaphragm plate 413. In this embodiment, the diaphragm assembly 41 is a dual-diaphragm structure, which can effectively improve sound quality and effects. The voice coil 42 is connected to the diaphragm plate 413. When the voice coil 42 vibrates, it drives the diaphragm plate 413 to vibrate, and the diaphragm plate 413 drives the first diaphragm 411 and the second diaphragm 412 to vibrate and produce sound.
[0065] In one embodiment, the first diaphragm 411 and the second diaphragm 412 can be made of composite material or silicone material. The vibrating plate 413 can be made of metal such as aluminum alloy, foam material, fiber material, or composite material.
[0066] For example, such as Figure 6 or Figure 7 As shown, in this embodiment, the conductive layer 43 is disposed on the second diaphragm 412. In this embodiment, the conductive layer 43 is disposed on the surface of the second diaphragm 412 facing the voice coil 42. By disposing of the conductive layer 43 on the second diaphragm 412, since the second diaphragm 412 is located in the central region of the vibrating plate 413, the distribution of the conductive layer 43 can be controlled, thereby reducing the influence of the conductive layer 43 on the vibration of the second diaphragm 412. For example, two conductive layers 43 can be symmetrically arranged with the center of the second diaphragm 412 as the axis of symmetry. In this way, the structural symmetry and center of gravity of the second diaphragm 412 will not be affected by the placement of the conductive layer 43, thereby reducing the risk of polarization and other problems and ensuring the sound quality and sound effect of the sound-generating device.
[0067] It is understandable that, without affecting the acoustic performance of the sound-generating device, the conductive layer 43 can also be disposed on the vibrating plate 413 or the first diaphragm 411. This embodiment does not limit this.
[0068] In at least one implementation, such as Figure 8 As shown, the vibrating plate 413 has a central hole 4131 in its central region. Figure 6 As shown, the second diaphragm 412 includes a central portion 4121, an edge portion 4122, and a convex portion 4123 connecting the central portion 4121 and the edge portion 4122. The central portion 4121 is located in the central hole 4231, the convex portion 4123 protrudes in the direction away from the voice coil 42, and the edge portion 4122 is connected to the surface of the diaphragm 413 facing the voice coil 42.
[0069] By providing a central hole 4131 in the diaphragm 413, the second diaphragm 412 can have a larger vibration amplitude. Furthermore, the second diaphragm 412 can have a portion inside the diaphragm 413 and a portion outside the diaphragm 413, which improves the connection strength between the second diaphragm 412 and the diaphragm 413. In addition, the portion inside the diaphragm 413 can be used to provide a conductive layer 43, allowing the conductive layer 43 to extend smoothly to the lead wire 421 of the voice coil 42. The conductive layer 43 only needs to be supported on the second diaphragm 412 and does not need to be supported on the diaphragm 413, which reduces the performance difficulty of setting the conductive layer 43.
[0070] In this embodiment, the shape of the conductive layer 43 matches the shape of the second diaphragm 412 to further improve the rigidity between the conductive layer 43 and the second diaphragm 412. In at least one embodiment, such as Figure 9 As shown, the conductive layer 43 includes a first conductive portion 431, a second conductive portion 432, and a third conductive portion 433 that are sequentially connected and electrically connected. The first conductive portion 431 is disposed at the center portion 4121, the second conductive portion 432 is disposed at the protrusion portion 4123, and the third conductive portion 433 is disposed at the edge portion 4122. The first conductive portion 431 is electrically connected to the conductive structure 3, and the third conductive portion 433 is electrically connected to the voice coil 42.
[0071] It should be noted that the surface of the first conductive part 431 on the central portion 4121 is flat, and the surface of the third conductive part 433 on the edge portion 4122 is flat. Therefore, both the first conductive part 431 and the third conductive part 433 can be flat. The surface of the second conductive part 432 on the convex portion 4123 is curved, thus the second conductive part 432 is curved. The shape of the second conductive part 432 matches the convex portion 4123, so that when the convex portion 4123 vibrates and deforms, the second conductive part 432 can also vibrate and deform with the convex portion 4123, so that the second conductive part 432 can still conduct the circuit and prevent the problem of open circuit.
[0072] In some alternative embodiments, the first diaphragm 411 has a convex hull structure that protrudes toward the interior of the sound-generating device, such that the first diaphragm 411 and the second diaphragm 412 cooperate with each other to further improve the acoustic performance of the sound-generating device.
[0073] Optionally, a rounded transition is used between the first conductive part 431 and the second conductive part 432, and between the third conductive part 433 and the second conductive part 432, to reduce the risk of the conductive layer 43 breaking and causing an open circuit, and to improve the reliability of the conductive layer 43.
[0074] In this embodiment, the first conductive part 431 is electrically connected to the conductive structure 3. The first conductive part 431 is disposed in the center part 4121 of the second diaphragm 412, so that the conductive structure 3 is disposed close to the center part 4121 of the second diaphragm 412.
[0075] In at least one implementation, such as Figure 8 As shown, the surface of the diaphragm 413 facing the voice coil 42 is provided with a first receiving groove 4132, and the edge portion 4122 is located in the first receiving groove 4132. This arrangement ensures that even if the edge portion 4122 is located on the side of the diaphragm 413 facing the voice coil 42, it will not excessively occupy the space on that side of the diaphragm 413 facing the voice coil 42, allowing the sound-generating device more space to install the magnetic circuit system 2, thereby increasing the magnetic flux. For example, the thickness of the edge portion 4122 can be the same as the depth of the first receiving groove 4132.
[0076] In one embodiment, such as Figure 9 As shown, the conductive layer 43 has a first notch 434, which is located at one end of the conductive layer 43 away from the center portion 4121. Figure 11 As shown, the lead 421 of the voice coil 42 extends to the first notch 434 and is electrically connected to the conductive layer 43. By setting the first notch 434, the lead 421 of the voice coil 42 does not need to be located on one side of the conductive layer 43 in the thickness direction, but can be located in the first notch 434. On the one hand, this ensures the reliability and strength of the electrical connection between the conductive layer 43 and the lead 421 of the voice coil 42; on the other hand, the overall thickness of the lead 421 of the voice coil 42 after being electrically connected to the conductive layer 43 is the thickness of either the lead 421 or the conductive layer 43, rather than the sum of the thicknesses of the lead 421 and the conductive layer 43, reducing the space required after the lead 421 is connected to the conductive layer 43, which is beneficial for the miniaturization and thinning of the sound-generating device.
[0077] It is understandable that, such as Figure 3 As shown, the edge portion 4122 of the second diaphragm 412 is provided with a second notch 4124 that mates with the first notch 434, such as... Figure 10 As shown, the first notch 434 and the second notch 4124 are opposite each other in the thickness direction of the conductive layer 43, so that the edge portion 4122 will not affect the connection between the conductive layer 43 and the lead 421 of the voice coil 42, and can better support the conductive layer 43.
[0078] In at least one implementation, such as Figure 9 and Figure 10As shown, one end of the conductive layer 43 is provided with a folded edge 435 that bends toward the second diaphragm 412, and the folded edge 435 is connected to the end face of the second diaphragm 412. By providing the folded edge 435, the conductive portion of the conductive layer 43 can extend to the side of the second diaphragm 412, and the lead 421 of the voice coil 42 does not need to be located on one side in the thickness direction of the conductive layer 43, but can be located on the folded edge 435.
[0079] For example, the conductive layer 43 has a folded edge 435 at one end away from the center portion 4121, and the folded edge 435 is connected to the end of the edge portion 4122 of the second diaphragm 412.
[0080] Optionally, the lead 421 of the voice coil 42 is electrically connected to the folded edge 435. Since the folded edge 435 has a certain height, the contact area between the lead 421 and the folded edge 435 can be increased, thereby ensuring the reliability of the electrical connection between the lead 421 and the conductive layer 43 and further reducing the risk of short circuit.
[0081] In at least one implementation, such as Figure 11 As shown, a boss 311 is provided on the end face of the bracket 31 near the conductive layer 43. The end of the conductive layer 43 connected to the pad 32 abuts against the side of the boss 311. In this way, the boss 311 can restrict the position of the conductive layer 43, reduce the risk of the end of the conductive layer 43 moving relative to the bracket 31 in the extension direction of the conductive layer 43, and further improve the strength of the connection between the conductive layer 43 and the second diaphragm 412.
[0082] It is understandable that when there are two conductive layers 43, the two conductive layers 43 are disposed opposite to each other on both sides of the boss 311 and both abut against the boss 311.
[0083] In one embodiment, such as Figure 8 and Figure 10 As shown, the surface of the diaphragm 413 facing the voice coil 42 is provided with a second receiving groove 4133. One end of the conductive layer 43 is located in the second receiving groove 4133 and is electrically connected to the voice coil 42. By providing the second receiving groove 4133, the diaphragm 413 reserves space for the connection of the lead wire 421 of the voice coil 42 and one end of the conductive layer 43. The lead wire 421 of the voice coil 42 and the conductive layer 43 can be connected in the second receiving groove 4133 without sacrificing the thickness of the magnetic circuit system 2 to provide space for the electrical connection of the lead wire 421 and the conductive layer 43. This allows the magnetic circuit assembly 22 to be set larger, or the sound-generating device to be thinner.
[0084] In at least one embodiment, the second receiving groove 4133 may be provided with conductive adhesive, and the conductive layer 43 and the lead 421 of the voice coil 42 are electrically connected through the conductive adhesive. The conductive adhesive is located in the second receiving groove 4133 and does not occupy a large amount of additional space, thus having little impact on the space utilization of the sound-generating device.
[0085] It should be noted that conductive adhesive is an adhesive that becomes conductive after curing or drying. Conductive adhesive can connect various conductive materials together, creating an electrical path between the connected structures.
[0086] It is understandable that the conductive layer 43 and the lead 421 of the voice coil 42 can also be electrically connected by means of welding or other methods, but this embodiment does not limit this.
[0087] In one embodiment, such as Figure 8 As shown, the first receiving groove 4132 and the second receiving groove 4133 are connected, and the edge portion 4122 of the second diaphragm 412 extends from the first receiving groove 4132 to the second receiving groove 4133 to support the portion of the conductive layer 43 used for connecting the lead 421.
[0088] The magnetic circuit assembly 22 can have various specific structures. This embodiment provides a magnetic circuit assembly 22, such as... Figure 5 or Figure 6 As shown, the magnetic circuit assembly 22 includes a first main magnet 222 and a second main magnet 223. The first main magnet 222 is disposed on the yoke 21, and the second main magnet 223 is disposed on the side of the first main magnet 222 facing away from the yoke 21. The first main magnet 222 is connected to the yoke 21, and the second main magnet 223 is connected to the first main magnet 222. The yoke 21 is connected to the housing 1. In this embodiment, the first main magnet 222 and the second main magnet 223 are arranged in the thickness direction of the sound-generating device, which can increase the magnetic flux of the magnetic circuit assembly 22, thereby effectively improving the acoustic performance of the sound-generating device.
[0089] like Figure 3 and Figure 5 As shown, the mounting hole 23 includes a first sub-hole 231 located on the yoke 21, a second sub-hole 232 located on the first main magnet 222, and a third sub-hole 233 located on the second main magnet 223. Since magnetic leakage typically occurs at the central positions of the first main magnet 222 and the second main magnet 223, by configuring the mounting hole 23 to pass through both the first and second main magnets 222 and 223, the second sub-hole 232 needs to be formed by removing at least a portion of the central magnet of the first main magnet, and the third sub-hole 233 needs to be formed by removing at least a portion of the central magnet of the second main magnet. This reduces the magnetic leakage of the first and second main magnets 222 and 223. When the sound-generating device is assembled into an electronic device, the impact of magnetic leakage in the magnetic circuit assembly 22 on the performance of the electronic device can be reduced, thus meeting the electronic device's requirements for magnetic leakage.
[0090] Please continue reading Figure 5 and Figure 6The magnetic circuit assembly 22 also includes a side magnet 225, which is disposed around the first main magnet 222 and spaced apart from the first main magnet 222, such that the gap between the side magnet 225 and the first main magnet 222 forms a magnetic gap 221.
[0091] In one embodiment, multiple side magnets 225 are provided, and the multiple side magnets 225 are arranged circumferentially around the outer periphery of the first main magnet 222. With this arrangement, the cost of the magnetic circuit assembly 22 can be reduced, resulting in a higher cost-performance ratio.
[0092] In other embodiments, a side magnet 225 may also be provided, and the side magnet 225 is arranged around the outer periphery of the first main magnet 222. This embodiment does not limit this.
[0093] In this embodiment, the conductive structure 3 is installed at the first main magnet 222 and the second main magnet 223 located in the center. By setting the mounting hole 23 at the center of the first main magnet 222 and the second main magnet 223 of the magnetic circuit assembly 22 where the magnetic field utilization is not high, both weight reduction and installation and fixation of the conductive structure 3 can be achieved. Moreover, since the conductive structure 3 is set on the second diaphragm 412 located in the center of the diaphragm assembly 41 and connected to the conductive structure 3 set in the mounting hole 23 between the first main magnet 222 and the second main magnet 223, the conductive layer 43 does not occupy the setting space of the side magnet 225, thereby increasing the volume of the side magnet part.
[0094] In at least one embodiment, such as Figure 6 As shown, the magnetic circuit assembly 22 also includes a pole piece 224. The pole piece 224 is disposed between the first main magnet 222 and the second main magnet 223. In this embodiment, the second main magnet 223 is disposed on the side of the pole piece 224 facing the second diaphragm 412, fully utilizing the space between the pole piece 224 and the second diaphragm 412, effectively increasing the magnetic flux without reducing the acoustic performance of the sound-generating device. It should be noted that, as... Figure 5 As shown, the second main magnet 223 is located in the hollow region of the voice coil 42.
[0095] Optionally, such as Figure 3 As shown, the mounting hole 23 also includes a fourth sub-hole 234 disposed on the electrode 224, and the conductive structure 3 is disposed through the first sub-hole 231, the second sub-hole 232, the third sub-hole 233 and the fourth sub-hole 234.
[0096] In some alternative embodiments, such as Figure 5As shown, the second main magnet 223 is sleeved on the conductive structure 3, and along the first direction Z, the orthographic projection of the second main magnet 223 is located within the orthographic projection of the center portion 4121 of the second diaphragm 412. This arrangement increases the magnetic flux without affecting the vibration of the diaphragm 413, avoiding noise caused by collisions between the second main magnet 223 and the diaphragm 413, thus ensuring the sound-generating performance of the device. Optionally, the surface of the second main magnet 223 facing away from the first main magnet 222 can be flush with the end face of the bracket 31, allowing for a larger volume of the second main magnet 223 and further increasing the magnetic flux. It should be noted that the virtual plane is not a real plane, but an imaginary plane designed to describe the size relationship between the second main magnet 223 and the second diaphragm 412.
[0097] The sound-generating device provided in this embodiment has a large space ratio for the magnetic circuit component 22, which enables the sound-generating device to have a large magnetic flux. The use of the conductive layer 43 to realize the electrical connection between the conductive structure 3 and the voice coil 42 increases the installation space of the magnetic circuit system 2, thereby increasing the magnetic flux value of the sound-generating device. At the same time, it can also eliminate the rigid nonlinearity problem of the vibration system 4, thereby improving the product performance of the sound-generating device.
[0098] This embodiment also provides an electronic device that has high acoustic performance.
[0099] The electronic device in this embodiment includes the aforementioned sound-generating device. The electronic device may also include external circuitry, which is electrically connected to the conductive structure via exposed pads on the magnetic yoke, to power the entire sound-generating device.
[0100] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.
Claims
1. A sound-generating device, characterized in that, include: case; A magnetic circuit system is connected to the housing. The magnetic circuit system includes a magnetic yoke and a magnetic circuit assembly disposed on the magnetic yoke. The magnetic circuit assembly has a magnetic gap. The magnetic circuit system is provided with a mounting hole that passes through the magnetic yoke and the magnetic circuit assembly. A conductive structure is disposed in the mounting hole; A vibration system, comprising a diaphragm assembly and a voice coil, one end of which is connected to the diaphragm assembly and the other end of which is located within the magnetic gap. A conductive layer is disposed on the surface of the diaphragm assembly facing the voice coil, and the conductive layer is electrically connected to the voice coil and the conductive structure.
2. The sound-generating device according to claim 1, characterized in that, The diaphragm assembly includes a first diaphragm, a second diaphragm, and a diaphragm plate; the first diaphragm is connected to the outer periphery of the diaphragm plate, and the second diaphragm is connected to the middle region of the diaphragm plate; the voice coil is connected to the diaphragm plate, and the conductive layer is disposed on the second diaphragm.
3. The sound-generating device according to claim 2, characterized in that, The diaphragm has a central hole in the middle region; the second diaphragm includes a central portion, an edge portion, and a convex portion connecting the central portion and the edge portion. The central portion is located in the central hole, the convex portion protrudes in a direction away from the voice coil, and the edge portion is connected to the surface of the diaphragm facing the voice coil. The conductive layer includes a first conductive portion, a second conductive portion, and a third conductive portion connected in sequence. The first conductive portion is disposed at the center portion, the second conductive portion is disposed at the convex portion, and the third conductive portion is disposed at the edge portion. The first conductive portion is electrically connected to the conductive structure, and the third conductive portion is electrically connected to the voice coil.
4. The sound-generating device according to claim 3, characterized in that, The surface of the diaphragm facing the voice coil is provided with a first receiving groove, and the edge portion is located in the first receiving groove; And / or, the conductive layer is provided with a first notch, and the lead of the voice coil extends to the first notch and is electrically connected to the conductive layer.
5. The sound-generating device according to claim 3, characterized in that, The surface of the diaphragm facing the voice coil has a second receiving groove, and one end of the conductive layer is located in the second receiving groove and electrically connected to the voice coil.
6. The sound-generating device according to claim 5, characterized in that, The second receiving groove is provided with conductive adhesive, and the conductive layer and the voice coil are electrically connected through the conductive adhesive.
7. The sound-generating device according to any one of claims 3-6, characterized in that, The magnetic circuit assembly includes a first main magnet and a second main magnet. The first main magnet is disposed on the magnetic yoke, and the second main magnet is disposed on the side of the first main magnet away from the magnetic yoke. The mounting hole includes a first sub-hole disposed on the magnetic yoke, a second sub-hole disposed on the first main magnet, and a third sub-hole disposed on the second main magnet.
8. The sound-generating device according to claim 7, characterized in that, Along the first direction, the orthographic projection of the second main magnet does not exceed the orthographic projection of the center portion, and the first direction is the vibration direction of the vibration system.
9. The sound-generating device according to claim 7, characterized in that, The magnetic circuit assembly further includes a pole piece disposed between the first main magnet and the second main magnet, and the mounting hole further includes a fourth sub-hole disposed on the pole piece.
10. An electronic device, characterized in that, Includes the sound-generating device as described in any one of claims 1-9.