PCB layout structure of transport monitor

Abstract

The utility model provides a kind of PCB board layout wiring structure of transfer monitor, belong to PCB board design technical field, comprising: PCB board is the multilayer structure including surface layer, intermediate signal layer and ground plane layer;Processing module, processor power module, storage module, high-speed communication module, radio frequency module and display screen socket are all set in the surface layer of PCB board, and all are connected with processing module by signal line;The signal line that storage module, display screen socket and processor power module are connected with processing module is evenly arranged in intermediate signal layer;The signal line that high-speed communication module and radio frequency module are connected with processing module is evenly arranged in surface layer;Ground plane layer is used to provide continuous reference ground plane for the signal line of surface layer and intermediate signal layer and constitute the shielding structure between surface layer and intermediate signal layer.The utility model realizes to promote signal transmission stability and transmission quality by multilayer PCB structure and modular layered wiring scheme.

Description

Technical Field

[0001] This utility model relates to the field of PCB board design technology, and in particular to a PCB board layout and wiring structure for a transport monitor. Background Technology

[0002] As portable medical devices become increasingly integrated, transport monitors, as a typical example, need to integrate multiple functional modules such as processors, power management, data storage, display drivers, high-speed communication, and wireless radio frequency within a limited space. To achieve interconnection between these modules, existing transport monitors often use a four-layer PCB stack-up structure with top and bottom layer wiring. This results in slightly higher-speed signals and clock signal lines being exposed on the top and bottom surfaces of the PCB, making them more susceptible to external factors affecting signal transmission and leading to lower signal transmission stability and quality.

[0003] Therefore, improving the signal transmission stability and quality of transport monitoring devices has become an urgent technical problem to be solved. Utility Model Content

[0004] This utility model provides a PCB layout and wiring structure for a transport monitor, which solves the defects of low signal transmission stability and transmission quality in the existing transport monitor, thereby improving signal transmission stability and transmission quality.

[0005] This utility model provides a PCB layout and wiring structure for a transport monitor, including: a PCB board, a processing module, a processor power module, a storage module, a high-speed communication module, an RF module, and a display screen socket; the PCB board has a multi-layer structure including a surface layer, an intermediate signal layer, and a ground plane layer.

[0006] The processing module, the processor power module, the storage module, the high-speed communication module, the radio frequency module, and the display screen socket are all disposed on the surface layer of the PCB board, and the processor power module, the storage module, the high-speed communication module, the radio frequency module, and the display screen socket are all connected to the processing module through signal lines;

[0007] The storage module, the display socket, and the signal lines connecting the processor power module and the processing module are all located in the intermediate signal layer.

[0008] The signal lines connecting the high-speed communication module and the radio frequency module to the processing module are all laid on the surface layer.

[0009] The ground plane layer is disposed between the surface layer and the intermediate signal layer, and is used to provide a continuous reference ground plane for the signal lines of the surface layer and the intermediate signal layer and to form a shielding structure between the surface layer and the intermediate signal layer.

[0010] According to the PCB layout and wiring structure of the transport monitor provided by this utility model, the signal lines connecting the storage module and the display socket to the processing module are high-speed signal lines; when the high-speed signal lines are laid on the intermediate signal layer, grounding copper foil electrically connected to the ground plane layer is provided on both sides of the high-speed signal lines, and multiple grounding vias electrically connected to the ground plane layer are provided on the outside of the grounding copper foil along the transmission direction of the high-speed signal lines.

[0011] According to the PCB layout and wiring structure of the transport monitor provided by this utility model, the signal lines connected to the high-speed communication module, the radio frequency module and the processing module are differential signal lines; when the differential signal lines are laid on the surface layer, grounding copper foil electrically connected to the ground plane layer is provided on both sides of the differential signal lines, and multiple grounding vias electrically connected to the ground plane layer are provided on the outside of the grounding copper foil along the transmission direction of the differential signal lines.

[0012] According to the PCB layout and wiring structure of the transport monitor provided by this utility model, the trace impedance of the high-speed signal line is a first preset value; and the spacing between the high-speed signal line and the ground copper foil is a first preset multiple of the width of the high-speed signal line.

[0013] According to the PCB layout and wiring structure of the transport monitor provided by this utility model, the trace impedance of the differential signal line is a second preset value; and the spacing between the differential signal line and the ground copper foil is a second preset multiple of the width of the differential signal line.

[0014] According to the PCB layout and wiring structure of the transport monitor provided by this utility model, the surface layer includes an upper surface and a lower surface;

[0015] The display screen socket is disposed on the upper surface of the PCB board;

[0016] The processing module, the processor power module, the storage module, the high-speed communication module, and the radio frequency module are all disposed on the lower surface of the PCB board.

[0017] According to the PCB layout and wiring structure of the transport monitor provided by this utility model, the processing module is disposed in the central area of ​​the lower surface of the PCB board, and with the processing module as the center of symmetry, the processor power module and the storage module are respectively arranged on opposite sides of the processing module, and the high-speed communication module and the radio frequency module are respectively arranged in the opposite edge areas of the lower surface of the PCB board.

[0018] According to the PCB layout and wiring structure of the transport monitor provided by this utility model, it also includes: a power socket, a power conversion module, a display power module, a touch socket, a multi-parameter board connection socket, and multiple indicator lights.

[0019] The power socket, the power conversion module, the display power module, and the multi-parameter board connection socket are all located on the lower surface of the PCB board.

[0020] The touch socket and the plurality of indicator lights are all located on the upper surface of the PCB board.

[0021] In summary, one or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0022] By employing a multi-layered PCB structure including a surface layer, intermediate signal layers, and a ground plane, comprehensive optimization of signal transmission paths, power integrity, and electromagnetic compatibility (EMC) performance is achieved. By placing the signal lines between the processor power module, storage module, and display socket to the processing module in the intermediate signal layer, these critical high-speed or high-stability signal paths are embedded in the inner layer, helping to reduce external EMC. Simultaneously, the ground plane between the upper and lower layers forms a three-dimensional grounding structure, improving signal transmission integrity and anti-interference capabilities. Placing the signal lines between the high-speed communication module and RF module to the processing module on the PCB surface layer provides the shortest path for differential signals or RF transmission and simplifies the design of external connection interfaces. Combined with the reference function of the ground plane, it maintains a stable characteristic impedance during high-frequency transmission. By placing the ground plane between the surface layer and the intermediate signal layers, providing a continuous reference ground plane for the upper and lower signal layers and forming a shielding structure, a closed electromagnetic shielding channel is effectively constructed, providing a stable reference potential for high-speed signals while significantly shortening the signal return path. In summary, the multi-layer PCB structure and modular layered wiring scheme described above can effectively improve the signal transmission stability and quality of the transport monitor. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the layout of the lower surface of the PCB board of the transport monitor provided by this utility model.

[0025] Figure 2 This is a schematic diagram of the layout of the upper surface of the PCB board of the transport monitor provided by this utility model.

[0026] Figure 3 This is a schematic diagram of the surface wiring of the PCB board provided by this utility model.

[0027] Figure 4 This is a schematic diagram of the wiring of the middle signal layer of the PCB board provided by this utility model.

[0028] Figure 5 This is a schematic diagram of the ground plane layer wiring of the PCB board provided by this utility model.

[0029] Explanation of reference numerals in the attached diagram: 100, lower surface of PCB board; 101, processing module; 102, processor power module; 103, storage module; 104, high-speed communication module; 105, radio frequency module; 106, power socket; 107, power conversion module; 108, display power module; 109, multi-parameter board connection socket; 200, upper surface of PCB board; 201, display socket; 202, touch socket; 203, indicator light. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0031] It should be noted that in the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. The terms "comprising," "including," "having," and their variations all mean "including but not limited to," unless otherwise specifically emphasized.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "electrical connection," "electrical connection," or "communication electrical connection" should be interpreted broadly. For example, "electrical connection," "electrical connection," or "communication electrical connection" can refer not only to a physical electrical connection, but also to an electrical connection or a signal electrical connection. For instance, it can be a direct electrical connection, i.e., a physical electrical connection, or an indirect electrical connection through at least one intermediate component, as long as the circuit is connected. It can also refer to the internal connection between two components. A signal electrical connection can refer not only to a signal electrical connection through a circuit, but also to a signal electrical connection through a medium, such as radio waves. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] The following is combined Figures 1-5 This invention describes the PCB layout and wiring structure of the transport monitor provided by this utility model.

[0034] The PCB layout and wiring structure of the transport monitor provided by this utility model aims to solve the problems of severe high-speed signal interference, poor electromagnetic compatibility (EMC), and complex wiring caused by scattered component layout in existing transport monitoring equipment. To this end, this embodiment achieves stable high-speed signal transmission and overall system electromagnetic interference suppression through a multi-layer PCB structure combined with optimized module distribution and signal layer separation design, thereby improving the signal integrity and system reliability of the monitor.

[0035] Specifically, the PCB layout and wiring structure of the transport monitor provided by this utility model includes: a PCB board, a processing module 101, a processor power module 102, a storage module 103, a high-speed communication module 104, a radio frequency module 105, and a display screen socket 201; the PCB board is a multi-layer structure including a surface layer, an intermediate signal layer, and a ground plane layer.

[0036] The processing module 101, processor power module 102, storage module 103, high-speed communication module 104, radio frequency module 105 and display socket 201 are all disposed on the surface layer of the PCB board, and the processor power module 102, storage module 103, high-speed communication module 104, radio frequency module 105 and display socket 201 are all connected to the processing module 101 through signal lines.

[0037] Among them, the signal lines connecting the storage module 103, the display socket 201, and the processor power module 102 to the processing module 101 are all laid in the intermediate signal layer.

[0038] The signal lines connecting the high-speed communication module 104 and the radio frequency module 105 to the processing module 101 are all laid on the surface.

[0039] The ground plane layer is located between the surface layer and the intermediate signal layer to provide a continuous reference ground plane for the signal lines of the surface layer and the intermediate signal layer and to form a shielding structure between the surface layer and the intermediate signal layer.

[0040] Specifically, the PCB board adopts a multi-layer structure, which includes a surface layer, an intermediate signal layer, and a ground plane layer. The surface layer is the main layer for mounting components, including the top and bottom surfaces of the PCB board. The intermediate signal layer (ART02 layer) is used for routing high-speed signal lines. The ground plane layer (GND03 layer) is located between the surface layer and the intermediate signal layer, serving as a reference ground for various signal transmissions and structurally providing electromagnetic shielding for the upper and lower signal layers, thereby significantly suppressing crosstalk and leakage radiation caused by high-frequency signal coupling.

[0041] The functional modules in this embodiment include a processing module 101, a processor power module 102, a storage module 103, a high-speed communication module 104, a radio frequency module 105, and a display socket 201. The processing module 101 is a central control unit (CPU), which can use a chip such as the RK3308. The processor power module 102 supplies power to the processing module 101. The storage module 103 can use a FLASH memory chip for data storage. The high-speed communication module 104 (i.e., a USB module) and the radio frequency module 105 (Wi-Fi module) are used for high-speed external data transmission and wireless communication, respectively. The display socket 201 is used to connect the front-end display components. All of the above modules are located on the surface of the PCB board, preferably on the lower surface, to facilitate unified wiring and thermal management.

[0042] In terms of signal routing, the signal lines between the processor power module 102, storage module 103, and display socket 201 and the processing module 101 are high-speed signal lines, all of which are routed in the intermediate signal layer. This intermediate signal layer effectively isolates high-speed signals between component layers and constructs a complete signal return path through the stacked ground plane layers, minimizing the signal loop area and thus enhancing signal stability and reducing radiated interference. Simultaneously, the ground plane layer serves as a reference ground plane for high-speed signals, providing a low-impedance return path and preventing irregular radiation caused by return path offset.

[0043] In addition, the signal lines between the high-speed communication module 104 and the radio frequency module 105 and the processing module 101 are differential signal lines. In order to minimize common-mode interference and external coupling in differential mode, such signal lines are preferably laid on the surface of the PCB board and are combined with the edge grounding copper and the GND guard structure constructed by the equidistant vias to ensure impedance stability and signal integrity.

[0044] In summary, this embodiment, through the unified placement of modules on the surface layer and the coordinated design of the intermediate signal layer and ground plane layer, achieves high-speed connectivity between functional modules, electromagnetic shielding of signal paths, and optimized layout of the overall PCB board structure. This effectively improves the overall performance of the transport monitor in terms of miniaturization, low radiation, and high reliability. This structure is not only suitable for the transport monitoring scenario described in this solution but also possesses good scalability and adaptability, making it suitable for other portable medical electronic devices requiring high-density wiring and high-speed signal transmission.

[0045] Subsequent embodiments will detail the PCB layout and wiring structure of the transport monitor.

[0046] The following embodiments will detail the PCB board layout structure of the transport monitor. In one possible implementation, the PCB board surface includes an upper surface and a lower surface. (Refer to...) Figure 1 , Figure 1 This is a schematic diagram of the layout of the lower surface of the PCB board of the transport monitor provided by this utility model, as shown below. Figure 1 As shown, it includes: a processing module 101, a processor power module 102, a storage module 103, a high-speed communication module 104, a radio frequency module 105, a power socket 106, a power conversion module 107, a display power module 108, and a multi-parameter board connection socket 109.

[0047] The processing module 101, processor power module 102, storage module 103, high-speed communication module 104, radio frequency module 105, power socket 106, power conversion module 107, display power module 108, and multi-parameter board connection socket 109 are all located on the lower surface of the PCB board.

[0048] In this embodiment, the lower surface serves as the main device mounting area, integrating multiple functional modules, including: a processing module 101, a processor power module 102, a storage module 103, a high-speed communication module 104, a radio frequency module 105, a power socket 106, a power conversion module 107, a display power module 108, and a multi-parameter board connection socket 109. The processing module 101, as the core control unit, undertakes key functions such as monitoring data acquisition, processing, analysis, and system communication scheduling; the processor power module 102 is dedicated to powering the processing module 101, ensuring its stable operation; the storage module 103 is used for local caching or log recording of monitoring data; the high-speed communication module 104 and the radio frequency module 105 support wired and wireless data transmission, respectively; the power socket 106 and the power conversion module 107 form an external power supply and voltage adaptation path; the display power module 108 powers the front-end display unit; and the multi-parameter board connection socket 109 enables signal interface with external acquisition channels. The aforementioned functional components are centrally located on the lower surface 100 of the PCB board, which facilitates spatial isolation from the display and touch components on the upper surface, avoids signal interference, and also helps to optimize the welding manufacturing process and improve assembly efficiency.

[0049] To further improve the regularity of board-level routing and the electrical performance of inter-module interconnection, in a preferred embodiment, the processing module 101 is disposed in the central area of ​​the lower surface of the PCB board, and with the processing module 101 as the center of symmetry, the processor power module 102 and the storage module 103 are respectively arranged on opposite sides of the processing module 101, and the high-speed communication module 104 and the radio frequency module 105 are respectively arranged in the opposite edge areas of the lower surface of the PCB board.

[0050] Specifically, the processing module 101 is positioned in the central area of ​​the lower surface of the PCB board. This placement helps shorten the signal path from the core processing unit to other modules, reduces the loop area, and lowers the risk of signal reflection and crosstalk. Around this central structure, the modules are configured in a "symmetrical distribution" manner: the processor power module 102 and the storage module 103 are respectively arranged on the left and right sides of the processing module 101, achieving logical adjacency and minimizing the power path; simultaneously, the high-speed communication module 104 and the RF module 105 are arranged on the edge areas of the lower surface of the PCB board, avoiding radiated interference to the central high-speed core area and facilitating their connection to the board edge interfaces or antenna modules via traces, thereby improving signal radiation efficiency and enhancing the overall EMC compatibility.

[0051] Furthermore, the power socket 106 and the power conversion module 107 are respectively located in the upper left and upper areas of the processing module 101. This layout has a clear rationale: firstly, keeping power-related components away from the main high-speed signal path effectively reduces coupling interference between high-frequency signals and the power supply path, preventing power noise injection from affecting the processor's core logic operations and high-speed interface data transmission; secondly, this layout also achieves a "nearby power supply" structure between the processing module 101 and the power module, minimizing the current path, thereby reducing voltage drop and improving power response speed and overall load stability. In addition, placing the power socket 106 at the board edge facilitates direct connection to external power connectors, simplifying cable routing and overall assembly.

[0052] Meanwhile, to meet the power supply requirements of the display circuit, the display power module 108 is positioned directly below the display socket 201, forming a typical "direct-connected power supply structure". This layout achieves the shortest path power supply, effectively reducing voltage drop and EMI issues caused by excessively long power wiring. Furthermore, placing the display power module 108 on the lower surface of the PCB board avoids interference issues caused by component height on the upper surface, ensuring that the LCD screen on the upper surface can be smoothly mounted without being affected by component thickness or local protrusions, thus improving the overall structural compactness and aesthetics.

[0053] Reference Figure 2 , Figure 2 This is a schematic diagram of the upper surface layout of the PCB board of the transport monitor provided by this utility model, as shown below. Figure 2 As shown, it includes: a display socket 201, a touch socket 202, and multiple indicator lights 203;

[0054] The display socket 201, touch socket 202, and multiple indicator lights 203 are located on the upper surface of the PCB board.

[0055] Specifically, the display socket 201 is used for electrical connection with the LCD module and is the core path for image and data information output; the touch socket 202 is used to connect to the front touch panel to realize user input function; and multiple indicator lights 203 are used to provide optical feedback of real-time operating status, alarm information or system indication signals, improving visibility and intuitive interactive experience of the device.

[0056] The reason for implementing this layout is that, as an embedded device designed for portable medical environments, the transport monitor's front-end display and input components must be flush with the front panel area of ​​the device housing. By centrally mounting the aforementioned interfaces and indicator lights 203 on the upper surface 200 of the PCB board, it facilitates direct structural connection with the front cover of the housing, avoiding signal attenuation and connector loosening issues caused by excessively long cables or jumpers, thereby improving the connection stability of the front-end display and input system. Simultaneously, this arrangement also allows the display socket 201 and the corresponding display power module 108 on the lower surface to form a short-path power supply structure in the vertical direction, reducing power voltage drop and improving drive efficiency.

[0057] To avoid tall components hindering the bonding of the LCD module or causing structural interference, this embodiment places only thinner connectors and LED surface-mount components on the upper surface, while concentrating all large-volume components (such as the processing module 101, power module, and storage module 103) on the lower surface. This partitioning strategy not only optimizes the height distribution of components and ensures the flatness of the upper surface, but also facilitates the bonding of the LCD screen.

[0058] The following embodiments will describe in detail the PCB board wiring structure of the transport monitor. A detailed PCB board wiring diagram can be found in [reference needed]. Figures 3 to 5 ,in, Figure 3 This is a schematic diagram of the surface wiring of the PCB board provided by this utility model; Figure 4 This is a schematic diagram of the signal layer wiring in the middle of the PCB board provided by this utility model; Figure 5 This is a schematic diagram of the PCB ground plane layer wiring provided by this utility model. In the PCB layout and wiring structure of the transport monitor provided by this utility model, in order to ensure the integrity and electromagnetic compatibility of high-speed signal transmission, a structured wiring design is carried out for the signal connection between the processing module 101, the storage module 103, and the display socket 201. In particular, specific implementation schemes are proposed for the layout position, impedance control, and shielding structure of high-speed signal lines to effectively reduce the adverse effects of crosstalk, reflection, and radiation interference during signal transmission.

[0059] In one possible implementation, the signal line connecting the storage module 103 and the display socket 201 to the processing module 101 is a high-speed signal line; when the high-speed signal line is laid in the intermediate signal layer, grounding copper foil electrically connected to the ground plane layer is provided on both sides of the high-speed signal line, and multiple grounding vias electrically connected to the ground plane layer are provided on the outside of the grounding copper foil along the transmission direction of the high-speed signal line.

[0060] In a preferred embodiment, the trace impedance of the high-speed signal line is a first preset value; and the spacing between the high-speed signal line and the ground copper foil is a first preset multiple of the width of the high-speed signal line.

[0061] Specifically, the signal lines connecting the storage module 103 and the display socket 201 to the processing module 101 are high-speed signal lines. These signal lines have high transmission frequencies and fast edge transition speeds, placing high demands on the consistency of trace impedance and the stability of the electromagnetic environment. To reduce the loss and interference of these high-speed signals in the lines, this embodiment uniformly routes the high-speed signal lines on the middle signal layer of the PCB board. Placing the high-speed lines on the middle layer helps to enclose them between multiple GND planes, thereby constructing a good three-dimensional shielding structure, suppressing the impact of external interference on the signal link, providing a stable ground reference plane, reducing the signal return path, and avoiding radiation problems caused by an excessively large return loop area.

[0062] In the specific wiring structure, the signal lines of the storage module 103 and the display socket 201 are led out from the processing module 101 and preferably routed through an intermediate signal layer. Therefore, the processing module 101, storage module 103, and display socket 201 are respectively connected via vias (VIAs) for signal fan-out, with corresponding traces completed in the intermediate signal layer. This routing method, on the one hand, encloses high-speed signals in an inner layer, reducing external interference coupling; on the other hand, it facilitates the construction of a complete shielding envelope structure between the signals and the upper and lower ground planes, further suppressing common-mode noise and crosstalk.

[0063] To ensure impedance consistency in signal transmission, the routing impedance of the high-speed signal lines in this embodiment is set to a first preset value, preferably 50Ω, to meet the impedance matching requirements of the processor and memory interface. In terms of the physical wiring structure, the signal line width in the intermediate signal layer is preferably 5.5mil, and the air gap between the entire group of signal lines is controlled to be more than twice the line width to avoid inter-line coupling interference; the air gap between other non-group signal lines is preferably more than three times the line width, thereby minimizing crosstalk.

[0064] Regarding overall routing consistency, the number of VIAs for the entire group of signal lines is kept consistent to ensure that the electrical length and capacitance characteristics of all signal paths are aligned during layer switching, reducing the risk of timing offsets. Simultaneously, in terms of physical layer layout, grounding copper foil is laid on both sides and the top surface (TOP plane) of the signal lines, and all copper foil is electrically connected to the ground plane layer (GND03 layer), thus forming a multi-directional three-dimensional grounding structure. This structure completely encloses the high-speed signal lines within the ground reference system, effectively reducing electromagnetic emissions caused by abrupt changes in the return path.

[0065] To further stabilize signal impedance and construct a closed shielded loop, the spacing between the grounding copper foil on both sides of the signal line and the signal line is limited to a first preset multiple of its line width, preferably 2 times. This parameter is determined based on impedance control calculations and can effectively suppress the risk of impedance changes caused by the copper foil being too close. Furthermore, multiple grounding vias electrically connected to the ground plane are evenly spaced on the outer side of the grounding copper foil. The spacing between these vias is preferably 300 mil, forming a periodic GND barrier that effectively isolates external interference from the signal loop.

[0066] To maintain the consistency and timing synchronization of signal transmission, this embodiment also strictly controls the signal length, requiring the length error of the entire group of signal lines in the storage module 103 to be controlled within 25mil as much as possible. This length tolerance meets the clock alignment requirements of high-speed parallel transmission, which helps to maintain the bit synchronization relationship during data acquisition and writing, and avoids system logic errors caused by signal phase offset.

[0067] It should be noted that the CLK signal line is grounded separately, and the sides and top and bottom surfaces are also covered with ground network copper foil to avoid radiation interference.

[0068] In one possible implementation, the signal lines connecting the high-speed communication module 104 and the radio frequency module 105 to the processing module 101 are differential signal lines; when the differential signal lines are laid on the surface layer, grounding copper sheets electrically connected to the ground plane layer are provided on both sides of the differential signal lines, and multiple grounding vias electrically connected to the ground plane layer are provided on the outside of the grounding copper sheets along the transmission direction of the differential signal lines.

[0069] In a preferred embodiment, the trace impedance of the differential signal line is a second preset value; and the spacing between the differential signal line and the ground copper trace is a second preset multiple of the width of the differential signal line.

[0070] The signal lines connecting the high-speed communication module 104 and the radio frequency module 105 to the processing module 101 are configured as differential signal lines. Differential signal lines consist of a pair of logically opposite signal paths, offering advantages such as strong immunity to common-mode noise and high transmission stability. Differential signal lines are particularly suitable for transmitting high-speed digital signals with high frequencies and small level swings, helping to improve the overall communication rate and data integrity of the device. To fully utilize the anti-interference performance of the differential structure, in this embodiment, the differential signal lines are preferably laid on the surface layer of the PCB board, and complete shielding measures for the differential signals are implemented in the wiring structure.

[0071] In terms of specific wiring structure, the signal lines of the high-speed communication module 104 are led out from the processing module 101 and preferably routed through the surface layer (i.e., the upper and lower surfaces). This wiring method ensures the shortest connection path while leveraging the structural advantages of open surface routing, facilitating ground symmetry and EMC optimization through reasonable layout. Regarding signal electrical performance control, the routing impedance of the differential signal lines is set to a second preset value, preferably 90Ω, to meet the impedance matching requirements of high-speed communication interfaces such as USB, high-speed serial ports, and Wi-Fi, reducing eye diagram convergence problems caused by transmission reflections and impedance abrupt changes.

[0072] To reduce crosstalk between differential channels and interference to other signal channels, this embodiment controls the air gap between the differential line pair and other non-differential signal lines to be at least five times the line width, effectively isolating the signal spatial domain and improving the independence of interconnected signal paths. Simultaneously, to construct a complete and symmetrical electromagnetic reference structure, traces connected to the ground network are laid on both sides of the differential line pair, and the minimum distance between the ground line and the signal line is controlled to a second preset multiple of the width of the differential signal line, preferably three times. This wiring constraint prevents characteristic impedance fluctuations caused by ground traces being close to signal lines, while maintaining the uniformity of the differential pair impedance environment.

[0073] In addition to the planar structure of the wiring layer, to further stabilize the continuity of the ground reference and form a shielded redundancy structure in the vertical direction, multiple grounding vias electrically connected to the ground plane are arranged around the differential signal line group. These grounding vias are arranged at equal intervals, preferably 300 mils apart, forming a periodic GND via fence structure. This structure can significantly reduce the sensitivity of the signal path to external electromagnetic interference, while improving the common-mode rejection ratio (CMRR) and the symmetry of the transmission line ends, ultimately achieving the goal of low-radiation and low-noise transmission of differential signals.

[0074] Furthermore, to further improve power supply stability, reduce electromagnetic interference, and optimize the overall electromagnetic compatibility performance of the board, based on the completion of signal routing, specific routing and grounding optimizations were carried out on the main chip power supply, power ground design, key component layout, and overall board copper pouring structure.

[0075] In a specific implementation, the power supply of the main chip corresponding to the processing module 101 is processed with copper plating on the entire surface of the intermediate signal layer (ART02 layer). This copper plating structure not only improves the current carrying capacity of the power layer and reduces the impedance and voltage drop of the power path, but also effectively constructs a stable power-ground loop by forming a vertical dual structure between the power copper plating and the adjacent ground plane layer (GND03 layer), further improving the power integrity of the main chip power supply network.

[0076] To improve electrostatic coupling and interference immunity during electromagnetic compatibility testing (especially electrostatic discharge immunity testing), this embodiment features a large grounding network pad located below the display socket 201. This pad is directly connected to the ground plane and serves as an electrostatic discharge path, rapidly dispersing static charge across the entire board's GND network, preventing localized static accumulation that could interfere with or damage the display interface or control logic. This design not only enhances the structure's electrostatic protection but also acts as a GND reinforcement point to further reduce the shielding loop impedance.

[0077] Regarding the placement of crystal devices, considering their sensitivity to signal integrity due to their oscillation characteristics, crystal devices are preferably placed on the lower surface of the PCB board, on the same layer as the processing module 101, and as close as possible to reduce the path length of the oscillation signal and improve the consistency and stability of the clock signal. To avoid signal interference and oscillation noise coupling to other signal paths, the area around the crystal is fully enclosed by ground plane, and it is explicitly stipulated that no high-speed or sensitive signal lines should be placed on the layers below the crystal. This avoids cross-layer coupling from adversely affecting clock accuracy or other modules, thereby ensuring the independence and anti-interference capability of the clock system.

[0078] After the entire board routing is completed, in order to further reduce electromagnetic radiation and strengthen the ground reference plane, this embodiment performs uniform copper pouring on the unrouted areas of the entire board, and all the copper pours are connected to the GND network. This copper pouring not only increases the effective area of ​​the PCB ground plane, forming multiple high-coverage reference planes, but also significantly shortens the return path of each high-speed signal, reduces the parasitic inductance and impedance of the return loop, thereby effectively reducing common-mode interference and signal leakage, and improving the electromagnetic compatibility (EMC) performance of the entire device.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A PCB layout and wiring structure for a transport monitor, characterized in that, include: PCB board, processing module, processor power module, storage module, high-speed communication module, radio frequency module, and display socket; The PCB board has a multi-layer structure including a surface layer, an intermediate signal layer, and a ground plane layer. The processing module, the processor power module, the storage module, the high-speed communication module, the radio frequency module, and the display screen socket are all disposed on the surface layer of the PCB board, and the processor power module, the storage module, the high-speed communication module, the radio frequency module, and the display screen socket are all connected to the processing module through signal lines; The storage module, the display socket, and the signal lines connecting the processor power module and the processing module are all located in the intermediate signal layer. The signal lines connecting the high-speed communication module and the radio frequency module to the processing module are all laid on the surface layer. The ground plane layer is disposed between the surface layer and the intermediate signal layer, and is used to provide a continuous reference ground plane for the signal lines of the surface layer and the intermediate signal layer and to form a shielding structure between the surface layer and the intermediate signal layer.

2. The PCB layout and wiring structure of the transport monitor according to claim 1, characterized in that, The signal lines connecting the storage module and the display socket to the processing module are high-speed signal lines. When the high-speed signal lines are laid in the intermediate signal layer, grounding copper foil electrically connected to the ground plane layer is provided on both sides of the high-speed signal lines, and multiple grounding vias electrically connected to the ground plane layer are provided on the outside of the grounding copper foil along the transmission direction of the high-speed signal lines.

3. The PCB layout and wiring structure of the transport monitor according to claim 1, characterized in that, The signal lines connecting the high-speed communication module and the radio frequency module to the processing module are differential signal lines. When the differential signal lines are laid on the surface layer, grounding copper foil electrically connected to the ground plane layer is provided on both sides of the differential signal lines, and multiple grounding vias electrically connected to the ground plane layer are provided on the outside of the grounding copper foil along the transmission direction of the differential signal lines.

4. The PCB layout and wiring structure of the transport monitor according to claim 2, characterized in that, The trace impedance of the high-speed signal line is a first preset value; and the distance between the high-speed signal line and the ground copper foil is a first preset multiple of the width of the high-speed signal line.

5. The PCB layout and wiring structure of the transport monitor according to claim 3, characterized in that, The trace impedance of the differential signal line is a second preset value; and the spacing between the differential signal line and the ground copper foil is a second preset multiple of the width of the differential signal line.

6. The PCB layout and wiring structure of the transport monitor according to claim 1, characterized in that, The surface layer includes an upper surface and a lower surface; The display screen socket is disposed on the upper surface of the PCB board; The processing module, the processor power module, the storage module, the high-speed communication module, and the radio frequency module are all disposed on the lower surface of the PCB board.

7. The PCB layout and wiring structure of the transport monitor according to claim 6, characterized in that, The processing module is located in the center area of ​​the lower surface of the PCB board, and with the processing module as the center of symmetry, the processor power module and the storage module are respectively arranged on opposite sides of the processing module, and the high-speed communication module and the radio frequency module are respectively arranged on opposite edge areas of the lower surface of the PCB board.

8. The PCB layout and wiring structure of the transport monitor according to claim 6, characterized in that, Also includes: Power socket, power conversion module, display power module, touch socket, multi-parameter board connection socket, and multiple indicator lights; The power socket, the power conversion module, the display power module, and the multi-parameter board connection socket are all located on the lower surface of the PCB board. The touch socket and the plurality of indicator lights are all located on the upper surface of the PCB board.

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