Middle frame assembly and electronic device
By designing the mid-frame assembly, combining the fixation of the second mid-plate to the frame with the phase change cooling medium of the heat spreader, the problem of insufficient structural strength and heat dissipation performance of electronic devices during drops is solved, achieving more efficient heat conduction and heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HENAN YUZHAN PRECISION TECH CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-07-07
AI Technical Summary
Electronic devices are structurally weak when dropped, and their components have insufficient heat dissipation capabilities.
The design employs a mid-frame assembly, including a mid-frame, a second mid-plate, and a heat spreader. The second mid-plate is fixed to the frame to enhance structural strength, and the phase change cooling medium of the heat spreader enables efficient heat conduction and dissipation.
It improves the structural strength and heat dissipation performance of electronic devices, and enhances the stability and heat dissipation efficiency of components.
Smart Images
Figure CN224473532U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic device technology, and in particular to a mid-frame assembly and an electronic device. Background Technology
[0002] Electronic devices typically consist of a frame and components, with the components mounted on the frame. In current technologies, when an electronic device is dropped, only the frame bears the bending force, resulting in relatively weak structural strength. Furthermore, heat generated by the components can only be dissipated through the frame, indicating that the heat dissipation performance of electronic devices needs further improvement. Utility Model Content
[0003] In view of the above situation, this application provides a mid-frame component to solve the above problems.
[0004] Embodiments of this application provide a mid-frame assembly, which includes a mid-frame, a second mid-plate, and a heat spreader. The mid-frame includes a first mid-plate and a frame surrounding the outer edge of the first mid-plate. The second mid-plate is spaced apart from the first mid-plate along a first direction. The side of the second mid-plate away from the first mid-plate is configured to support a first component, and the space between the second mid-plate and the first mid-plate is configured to accommodate a second component. The two sides of the second mid-plate along a second direction are respectively fixed to the frame, and the second direction is perpendicular to the first direction. The second mid-plate has a first mounting opening extending along the first direction, and the heat spreader is fixed to the first mounting opening. The heat spreader includes a first surface and a second surface disposed opposite each other along the first direction. The first surface is away from the first mid-plate, and the second surface faces the first mid-plate. The first surface is configured to contact the first component, and the second surface is configured to contact the second component.
[0005] In the aforementioned mid-frame assembly, the second middle plate is fixed to the frame on both sides along a second direction, which is perpendicular to the first direction. The second middle plate enhances the frame's resistance to deformation, thereby improving the overall structural strength of the mid-frame assembly. During use, heat from the second components in contact with the first middle plate is conducted to the frame through the first middle plate and dissipated through the frame. Similarly, heat from the first and / or second components in contact with the second middle plate is conducted to the frame through the second middle plate and dissipated through the frame. Heat from the first and second components in contact with the heat spreader is conducted to the frame through the second middle plate and dissipated through the frame. Heat from the second components in contact with the second surface is conducted to the first component in contact with the first surface through the heat spreader and dissipated through that component. Compared to traditional mid-frames, the mid-frame assembly has more heat dissipation paths and higher thermal efficiency, which is beneficial for improving the heat dissipation performance of the mid-frame assembly.
[0006] In some embodiments of this application, the end face of the frame away from the first middle plate along a first direction is provided with a first stepped surface. The first stepped surface includes two first sub-stepped surfaces spaced apart along a second direction, each first sub-stepped surface corresponding to one side supporting the second middle plate, to improve the stability of the frame supporting the second middle plate, and thus improve the stability of the second middle plate bearing the first component. The first sub-stepped surfaces and the second middle plate are fixed by first fasteners to further improve the stability of the second middle plate fixed to the frame, thereby improving the overall structural strength of the middle frame assembly.
[0007] In some embodiments of this application, the surface of the second middle plate facing the first middle plate is provided with two first protrusions, and each first sub-step surface is provided with a first concave portion. Each first protrusion is correspondingly engaged with a first concave portion to improve the stability of the second middle plate and the frame, thereby improving the overall structural strength of the middle frame assembly.
[0008] In some embodiments of this application, the first fastener passes through the first protrusion. The thickening effect of the first protrusion can improve the stability of the first fastener and the second middle plate, thereby improving the overall structural strength of the middle frame assembly.
[0009] In some embodiments of this application, a second protrusion is provided on the surface of the first middle plate facing the second middle plate. The second protrusion supports the portion of the second middle plate that is separated from the first step surface, thereby improving the stability of the frame supporting the second middle plate and thus improving the stability of the second middle plate carrying the first component.
[0010] In some embodiments of this application, a first groove is provided on the surface of the second intermediate plate away from the first intermediate plate. The first groove includes a first bottom wall, a first mounting opening penetrates the middle region of the first bottom wall, and a second stepped surface is formed in the region of the first bottom wall surrounding the first mounting opening. The heat spreader includes a protrusion and a connecting portion surrounding the edge of the protrusion. The second stepped surface supports the connecting portion, and the protrusion passes through the first mounting opening. The connecting portion improves the stability of the heat spreader and the second intermediate plate. The protrusion forms a first surface and a second surface on both sides along a first direction. The protrusion is used to improve the heat conduction efficiency of the first and second components in contact with the heat spreader and to achieve a uniform temperature distribution. The heat from the protrusion is conducted to the second intermediate plate through the connecting portion.
[0011] In some embodiments of this application, the protrusion includes a first cover plate, a second cover plate, and a capillary structure. The first cover plate and the second cover plate are spaced apart along a first direction. The first surface is the surface of the first cover plate away from the second cover plate, and the second surface is the surface of the second cover plate away from the first cover plate. A connecting portion surrounds the periphery of the first cover plate. The first cover plate and the second cover plate are sealed together to form a sealed cavity. The interior of the sealed cavity is a negative pressure environment and contains a cooling medium. The capillary structure is disposed within the sealed cavity. When heat is conducted from the heat source to the evaporation zone of the protrusion, the cooling medium in the sealed cavity begins to vaporize after being heated in a low vacuum environment. At this time, the absorbed heat energy rapidly expands in volume, and the gaseous cooling medium quickly fills the entire sealed cavity. When the gaseous cooling medium enters the cooling zone, condensation occurs. The heat accumulated during evaporation is released through condensation. The condensed cooling medium returns to the evaporation heat source through the capillary structure. This operation repeats continuously within the sealed cavity.
[0012] In some embodiments of this application, the second step surface and the connecting portion are fixed by bonding or welding to improve the stability of the heat spreader plate and the second middle plate.
[0013] In some embodiments of this application, a second groove is provided on the surface of the second middle plate facing the first middle plate. The second groove is configured to accommodate components. The second groove includes a second bottom wall, and a first mounting opening penetrates a portion of the second bottom wall to facilitate contact between the second component located in the second groove and the heat spreader.
[0014] Embodiments of this application also provide an electronic device, including a first component, a second component, a back cover, and a mid-frame assembly as described in any of the above embodiments. The first component is supported on the side of the second mid-plate away from the first mid-plate, and the second component is accommodated between the second mid-plate and the first mid-plate. A first surface contacts the first component, and a second surface contacts the second component. The back cover is fixed to the mid-frame and located on the side of the first mid-plate away from the second mid-plate along a first direction. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of the middle frame component in one embodiment of this application.
[0016] Figure 2 This is a first-view split structure diagram of the middle frame component in one embodiment of this application.
[0017] Figure 3 This is a schematic diagram of the structure of the second middle plate of the middle frame assembly in one embodiment of this application.
[0018] Figure 4 This is a schematic diagram of the second-view split structure of the middle frame component in one embodiment of this application.
[0019] Figure 5This is a schematic diagram of the first internal structure of the heat spreader of the middle frame assembly in one embodiment of this application.
[0020] Figure 6 This is a schematic diagram of the second internal structure of the heat spreader of the middle frame assembly in one embodiment of this application.
[0021] Figure 7 This is a schematic diagram of the structure of an electronic device in one embodiment of this application.
[0022] Figure 8 yes Figure 7 A cross-sectional view along section line PP.
[0023] Explanation of main component symbols
[0024] Mid-frame component 100
[0025] Electronic equipment 200
[0026] Mid-frame 10
[0027] First Middle Plate 11
[0028] Second convex portion 111
[0029] Second groove 112
[0030] Stud 113
[0031] Positioning post 114
[0032] 115
[0033] Border 12
[0034] First step surface 121
[0035] First sub-step surface 121A
[0036] First screw hole 121A1
[0037] First recess 121A2
[0038] Second Middle Plate 20
[0039] First mounting port 20A
[0040] Gap 20B
[0041] First connecting hole 21
[0042] Second connecting hole 22
[0043] first convex portion 23
[0044] Third connecting hole 24
[0045] Third convex part 25
[0046] First groove 26
[0047] First bottom wall 261
[0048] Second step surface 2611
[0049] Second groove 27
[0050] Second bottom wall 271
[0051] Fourth convex part 28
[0052] 30 heat spreader
[0053] Page 1, 30A
[0054] Second page 30B
[0055] Protrusion 31
[0056] Sealed cavity 31A
[0057] First cover plate 311
[0058] Second cover plate 312
[0059] Capillary structure 313
[0060] Support structure 314
[0061] Connecting part 32
[0062] First fastener 40
[0063] Screw 41
[0064] Positioning pin 42
[0065] Second fastener 50
[0066] Screw 51
[0067] First Component 91
[0068] Back cover 92
[0069] Second component 93
[0070] First direction Z
[0071] Second direction X
[0072] Third direction Y
[0073] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0074] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0075] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be components positioned in between. When a component is considered to be "set" on another component, it can be directly set on the other component or there may be components positioned in between. It should be understood that, considering the factors of actual machining tolerances, in the technical solution of this application, when two components are set parallel / perpendicularly, they are set in the same direction, and there may be a certain angle between the two components. The angle between the two components is allowed to have a tolerance of 0-±10%. When a value is considered to be "equal" to another value, it means that the two are equal within a set deviation range, which is within 10%. That is to say, when at least one of the two values fluctuates within the set deviation range, even if their values are not equal, they are still judged to be approximately equal.
[0076] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0077] The embodiments of this application will be further described below with reference to the accompanying drawings.
[0078] Please refer to the following: Figure 1 and Figure 2 One embodiment of this application provides a mid-frame assembly 100, which is applied in an electronic device. Taking the electronic device 200 as a mobile phone as an example, the mid-frame assembly 100 is configured on both sides in the first direction Z to fix the first component 91 and the back cover 92 of the electronic device, respectively. The first component 91 may be, but is not limited to, a display screen, and the first direction Z is the thickness direction of the mid-frame assembly 100.
[0079] The mid-frame assembly 100 includes a mid-frame 10, a second mid-plate 20, and a heat spreader 30. The mid-frame 10 includes a first mid-plate 11 and a frame 12 surrounding the outer edge of the first mid-plate 11. The second mid-plate 20 is spaced apart from the first mid-plate 11 along a first direction Z. The side of the second mid-plate 20 away from the first mid-plate 11 is configured to carry a first component 91, and the space between the second mid-plate 20 and the first mid-plate 11 is configured to accommodate a second component 93.
[0080] Optionally, the first component 91 is a display screen.
[0081] Optionally, the second component 93 can be a chip, camera, microphone, earpiece, battery, etc., and the chip can be a central processing unit (CPU), graphics processing unit (GPU), memory, etc.
[0082] The second middle plate 20 is fixed to the frame 12 on both sides along the second direction X, which is perpendicular to the first direction Z. The second middle plate 20 can improve the deformation resistance of the frame 12, thereby improving the overall structural strength of the middle frame assembly 100. Furthermore, when the frame 12 is subjected to external impact (such as when it falls), the impact force is distributed to the second middle plate 20 and the first middle plate 11 to reduce the risk of excessive local stress.
[0083] The second intermediate plate 20 has a first mounting opening 20A extending along the first direction Z. A heat spreader 30 is fixed to the first mounting opening 20A. The heat spreader 30 includes a first surface 30A and a second surface 30B arranged opposite each other along the first direction Z. The first surface 30A is away from the first intermediate plate 11, and the second surface 30B faces the first intermediate plate 11. The first surface 30A is configured to contact the first component 91, and the second surface 30B is configured to contact the second component 93. The heat spreader 30 utilizes the boiling phase change of the cooling medium within the sealed cavity into a gas phase (absorbing heat) and condensation into a liquid phase (releasing heat). Capillary force and gravity are used as the transport forces for the liquid working fluid, completing the phase change cycle of the gas and liquid phases in the hot and cold regions. This achieves efficient heat exchange through latent heat of phase change, heat conduction, and convection. The heat spreader 30 is used to improve heat conduction efficiency and achieve a uniform temperature distribution.
[0084] When in use, the heat from the second component 93 in contact with the first middle plate 11 is conducted through the first middle plate 11 to the frame 12 and dissipated through the frame 12. Similarly, the heat from the first component 91 and / or the second component 93 in contact with the second middle plate 20 is conducted through the second middle plate 20 to the frame 12 and dissipated through the frame 12. The heat from the first component 91 and the second component 93 in contact with the heat spreader 30 is conducted through the second middle plate 20 to the frame 12 and dissipated through the frame 12. The heat from the second component 93 in contact with the second surface 30B is conducted through the heat spreader 30 to the first component 91 in contact with the first surface 30A and dissipated through the first component 91. Compared to a traditional middle frame, the middle frame assembly 100 has more heat dissipation pathways and higher heat dissipation efficiency, which is beneficial for improving the heat dissipation performance of the middle frame assembly 100.
[0085] Please refer to the following: Figure 1 and Figure 2 In some embodiments, the second direction X is the width direction of the middle frame component 100.
[0086] In some embodiments, the second middle plate 20 forms a gap 20B with the frame 12 on both sides along the third direction Y, so as to facilitate the placement of other thicker components on both sides of the middle frame assembly 100 along the third direction Y.
[0087] In some embodiments, the end face of the frame 12 away from the first middle plate 11 along the first direction Z is provided with a first stepped surface 121. The first stepped surface 121 refers to a stepped plane formed by cutting, casting or forging. The first stepped surface 121 is used to support the first middle plate 11 and the first component 91 to improve the stability of the first component 91 fixed to the middle frame assembly 100.
[0088] In some embodiments, the end face of the frame 12 away from the first middle plate 11 along the first direction Z has a height difference with the first middle plate 11. The rear cover 92 is fixed to the middle frame 10 and located on the side of the first middle plate 11 away from the first middle plate 11 along the first direction Z, so as to improve the stability of the fixation between the rear cover 92 and the middle frame assembly 100. Specifically, the rear cover 92 is attached to the first middle plate 11, and the portion of the frame 12 protruding from the first middle plate 11 is held in place by the periphery of the rear cover 92.
[0089] Please refer to the following: Figure 1 and Figure 2 In some embodiments, the first step surface 121 includes two first sub-step surfaces 121A spaced apart along the second direction X. Each first sub-step surface 121A corresponds to one side supporting the second middle plate 20, so as to improve the stability of the frame 12 supporting the second middle plate 20, thereby improving the stability of the second middle plate 20 carrying the first component 91.
[0090] In some embodiments, the first sub-step surface 121A and the second middle plate 20 are fixed by the first fastener 40 to further improve the stability of the second middle plate 20 fixed to the frame 12, thereby improving the overall structural strength of the middle frame assembly 100.
[0091] In some embodiments, the first fastener 40 includes a screw 41, the first sub-step surface 121A is provided with a first screw hole 121A1, the second middle plate 20 is provided with a first connecting hole 21, each first screw hole 121A1 and a first connecting hole 21 are connected along the first direction Z, and the screw 41 passes through and locks the corresponding first screw hole 121A1 and first connecting hole 21.
[0092] In some embodiments, the first fastener 40 includes a positioning pin 42, which is fixed to the first sub-step surface 121A and extends along the first direction Z. The second middle plate 20 is provided with a second connecting hole 22, and each positioning pin 42 passes through a second connecting hole 22.
[0093] In some embodiments, the first fastener 40 includes adhesive that is bonded between the first sub-step surface 121A and the second middle plate 20.
[0094] Please refer to the following: Figure 2 and Figure 3 In some embodiments, the surface of the second middle plate 20 facing the first middle plate 11 is provided with two first protrusions 23, and each first sub-step surface 121A is provided with a first recess 121A2. Each first protrusion 23 is correspondingly engaged with a first recess 121A2 to improve the stability of the second middle plate 20 and the frame 12, thereby improving the overall structural strength of the middle frame assembly 100. Furthermore, the engagement of the first protrusion 23 with the first recess 121A2 also ensures that the surfaces of the second middle plate 20 and the first sub-step surface 121A that are away from the first middle plate 11 are substantially on the same plane, so that the surfaces of the second middle plate 20 and the first sub-step surface 121A that are away from the first middle plate 11 are both in contact with the first component 91.
[0095] In some embodiments, the first fastener 40 passes through the first protrusion 23. The thickening effect of the first protrusion 23 can improve the stability of the first fastener 40 and the second middle plate 20, thereby improving the overall structural strength of the middle frame assembly 100.
[0096] Please refer to the following: Figure 3 and Figure 4 In some embodiments, the surface of the first middle plate 11 facing the second middle plate 20 is provided with a second protrusion 111. The second protrusion 111 supports the part of the second middle plate 20 that is separated from the first step surface 121, so as to improve the stability of the frame 12 supporting the second middle plate 20, thereby improving the stability of the second middle plate 20 in carrying the first component 91.
[0097] In some embodiments, the second protrusion 111 and the second middle plate 20 are fixed by the second fastener 50 to improve the stability of the fixation between the second middle plate 20 and the first middle plate 11, thereby improving the overall structural strength of the middle frame assembly 100.
[0098] In some embodiments, the second fastener 50 includes a screw 51, the second protrusion 111 is a stud, and the second middle plate 20 is provided with a third connecting hole 24, through which the screw 51 passes and locks the third connecting hole 24 and the stud.
[0099] In some embodiments, the surface of the second middle plate 20 facing the first middle plate 11 is provided with a third protrusion 25, the third protrusion 25 is provided with a third connecting hole 24, and the third protrusion 25 abuts against the second protrusion 111 so that the second protrusion 111 supports the second middle plate 20.
[0100] In some embodiments, the second fastener 50 includes adhesive that is bonded between the second protrusion 111 and the second middle plate 20.
[0101] Please refer to the following: Figure 2 and Figure 3 In some embodiments, the surface of the second middle plate 20 away from the first middle plate 11 is provided with a first groove 26. The first groove 26 includes a first bottom wall 261. The first mounting port 20A penetrates the middle area of the first bottom wall 261. The area of the first bottom wall 261 located around the first mounting port 20A forms a second stepped surface 2611.
[0102] Please see Figure 4 The heat spreader 30 includes a protrusion 31 and a connecting portion 32 surrounding the edge of the protrusion 31. The thickness of the protrusion 31 is greater than that of the connecting portion 32. A second stepped surface 2611 supports the connecting portion 32, and the protrusion 31 passes through a first mounting opening 20A. The connecting portion 32 improves the stability of the heat spreader 30 fixed to the second intermediate plate 20. The protrusion 31 forms a first surface 30A and a second surface 30B on both sides along the first direction Z. The protrusion 31 is used to improve the heat conduction efficiency of the first component 91 and the second component 93 in contact with the heat spreader 30 and to achieve a uniform temperature distribution. The heat from the protrusion 31 is conducted to the second intermediate plate 20 through the connecting portion 32.
[0103] Please see Figure 5 In some embodiments, the protrusion 31 includes a first cover plate 311, a second cover plate 312, and a capillary structure 313. The first cover plate 311 and the second cover plate 312 are spaced apart along a first direction Z. A first surface 30A is the surface of the first cover plate 311 away from the second cover plate 312, and a second surface 30B is the surface of the second cover plate 312 away from the first cover plate 311. A connecting portion 32 surrounds the periphery of the first cover plate 311. The first cover plate 311 and the second cover plate 312 are sealed together to form a sealed cavity 31A. The interior of the sealed cavity 31A is a negative pressure environment and is provided with a cooling medium. The capillary structure 313 is disposed within the sealed cavity 31A.
[0104] The protrusion 31 includes an evaporation zone and a cooling zone. These two zones are determined according to the specific working conditions and can be the entire first cover plate 311 or the entire second cover plate 312, or a portion of either the first cover plate 311 or the second cover plate 312. When heat is conducted from the heat source to the evaporation zone of the protrusion 31, the cooling medium in the sealed cavity 31A begins to vaporize after being heated in a low-vacuum environment. At this time, the absorbed heat energy causes the volume to expand rapidly, and the gaseous cooling medium quickly fills the entire sealed cavity 31A. When the gaseous cooling medium enters the cooling zone, condensation occurs. The heat accumulated during evaporation is released through condensation. The condensed cooling medium returns to the evaporation heat source via the capillary structure 313. This process repeats continuously within the sealed cavity 31A.
[0105] Optionally, the cooling medium may be deionized water, methanol, acetone, etc.
[0106] In some embodiments, the second cover plate 312 forms an evaporation zone, and the first cover plate 311 forms a cooling zone.
[0107] In some embodiments, the capillary structure 313 may or may not be connected to the inner surface of the protrusion 31. The capillary structure 313 is a porous medium made of metal. Specifically, the capillary structure 313 is made of copper or a copper alloy, and may be one or more of the following: copper mesh, copper fiber, copper powder, or copper foam. The copper mesh can be bonded to the opposing surfaces of the first cover plate 311 and the second cover plate 312 by means of sintering, hot welding, or cold pressing. By using sintering, hot welding, or cold pressing, the copper mesh is fixed to the inner surface of the protrusion 31, preventing changes in the position of the copper mesh during use and ensuring the stability of the product operation. Alternatively, the copper mesh can be placed inside the sealed cavity 31A without any connection processing, avoiding the impact of processing such as sintering, hot welding, or cold pressing on the protrusion 31 and ensuring the structural stability of the protrusion 31.
[0108] Please see Figure 6 In some embodiments, the protrusion 31 includes a support structure 314 disposed within the sealing cavity 31A of the protrusion 31. The support structure 314 abuts against the first cover plate 311 and the second cover plate 312. The support structure 314 provides a supporting and protective function within the sealing cavity 31A to prevent the sealing cavity 31A of the protrusion 31 from deforming due to compression.
[0109] In some embodiments, the support structure 314 is distributed in an array, which is beneficial for the lightweight design of the heat spreader 30 and for the uniform distribution of the mass of the protrusion 31.
[0110] In some embodiments, the second stepped surface 2611 and the connecting portion 32 are fixed by adhesive bonding or welding to improve the stability of the fixation between the heat spreader 30 and the second middle plate 20. Optionally, the adhesive is a thermally conductive adhesive.
[0111] In some embodiments, the surface of the second intermediate plate 20 facing the first intermediate plate 11 is provided with a second groove 27. The second groove 27 is configured to accommodate a second component 93 to improve the stability of the second intermediate plate 20 and the second component 93. The second groove 27 includes a second bottom wall 271, and a first mounting opening 20A penetrates a portion of the second bottom wall 271 to facilitate contact between the second component 93 located in the second groove 27 and the heat spreader 30.
[0112] In some embodiments, the surface of the second middle plate 20 facing the first middle plate 11 is provided with a fourth protrusion 28, the fourth protrusion 28 being spaced apart from the second groove 27, and the fourth protrusion 28 being configured to fix the second component 93 to reduce the risk of interference between different second components 93.
[0113] Please see Figure 4 In some embodiments, the surface of the first middle plate 11 facing the second middle plate 20 is provided with a second groove 112, and the second groove 112 is configured to fix the second component 93 to improve the stability of fixing the first middle plate 11 and the second component 93.
[0114] In some embodiments, a stud 113 is provided on the surface of the first middle plate 11 facing the second middle plate 20. The stud 113 is configured to fix the second component 93 to improve the stability of fixing the first middle plate 11 and the second component 93.
[0115] In some embodiments, the surface of the first middle plate 11 facing the second middle plate 20 is provided with a positioning post 114, which is configured to fix the second component 93 to improve the stability of fixing the first middle plate 11 and the second component 93.
[0116] In some embodiments, the surface of the first middle plate 11 facing the second middle plate 20 is provided with a hook 115, which is configured to fix the second component 93 to improve the stability of fixing the first middle plate 11 and the second component 93.
[0117] Please refer to the following: Figure 7 and Figure 8 The embodiments of this application also provide an electronic device 200, which includes a first component 91, a second component 93, a back cover 92, and a mid-frame assembly 100 in any of the above embodiments.
[0118] The second middle plate 20 carries the first component 91 on the side away from the first middle plate 11, and the second component 93 is accommodated between the second middle plate 20 and the first middle plate 11. The first surface 30A contacts the first component 91, and the second surface 30B contacts the second component 93. The rear cover 92 is fixed to the middle frame 10 and is located on the side of the first middle plate 11 away from the first middle plate 11 along the first direction Z.
[0119] Optionally, the first component 91 is a display screen, and the second component 93 is a battery.
[0120] Electronic device 200 may include, but is not limited to, mobile or fixed terminals such as tablet computers (PADs), laptops, personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, and wireless terminals in smart homes.
[0121] In the aforementioned electronic device 200, the second middle plate 20 is fixed to the frame 12 on both sides along the second direction X, which is perpendicular to the first direction Z. The second middle plate 20 can improve the deformation resistance of the frame 12, thereby improving the overall structural strength of the middle frame assembly 100. Furthermore, when the frame 12 is subjected to an external impact (e.g., when it falls), the impact force is distributed to the second middle plate 20 and the first middle plate 11 to reduce the risk of excessive local stress. When the electronic device 200 is in use, the heat from the second component 93 in contact with the first middle plate 11 is conducted through the first middle plate 11 to the frame 12 and dissipated through the frame 12. The heat from the first component 91 and / or the second component 93 in contact with the second middle plate 20 is conducted through the second middle plate 20 to the frame 12 and dissipated through the frame 12. The heat from the first component 91 and the second component 93 in contact with the heat spreader 30 is conducted through the second middle plate 20 to the frame 12 and dissipated through the frame 12. The heat from the second component 93 in contact with the second surface 30B is conducted through the heat spreader 30 to the first component 91 in contact with the first surface 30A and dissipated through the first component 91. Compared with a traditional middle frame, the middle frame assembly 100 has more heat dissipation paths and higher heat dissipation efficiency, which is beneficial to improving the heat dissipation performance of the middle frame assembly 100.
[0122] In addition, those skilled in the art may make other changes within the spirit of this application. Of course, all such changes made in accordance with the spirit of this application should be included within the scope disclosed in this application.
Claims
1. A mid-frame component, characterized in that, The mid-frame component includes: The middle frame includes a first middle plate and a frame surrounding the outer edge of the first middle plate; The second middle plate is spaced apart from the first middle plate along a first direction. The side of the second middle plate away from the first middle plate is configured to support the first component. The space between the second middle plate and the first middle plate is configured to accommodate the second component. The two sides of the second middle plate along a second direction are respectively fixed to the frame. The second direction is perpendicular to the first direction. The second middle plate is provided with a first mounting opening that passes through the first direction. A heat spreader plate is fixed to the first mounting port. The heat spreader plate includes a first surface and a second surface that are disposed opposite to each other along the first direction. The first surface is away from the first middle plate, and the second surface faces the first middle plate. The first surface is configured to contact the first component, and the second surface is configured to contact the second component.
2. The mid-frame assembly as described in claim 1, characterized in that, The frame has a first stepped surface on the end face away from the first middle plate along the first direction. The first stepped surface includes two first sub-steps spaced apart along the second direction. Each first sub-step corresponds to one side supporting the second middle plate. The first sub-step and the second middle plate are fixed by a first fastener.
3. The mid-frame assembly as described in claim 2, characterized in that, The second middle plate has two first protrusions on its surface facing the first middle plate, and each of the first sub-step surfaces has a first recess, with each first protrusion corresponding to a first recess.
4. The mid-frame assembly as described in claim 3, characterized in that, The first fastener passes through the first protrusion.
5. The mid-frame assembly as described in claim 2, characterized in that, The surface of the first middle plate facing the second middle plate has a second protrusion, which supports the portion of the second middle plate that is separated from the first step surface.
6. The mid-frame assembly as described in claim 1, characterized in that, The second middle plate has a first groove on its surface away from the first middle plate. The first groove includes a first bottom wall. The first mounting opening penetrates the middle area of the first bottom wall. The area of the first bottom wall located around the first mounting opening forms a second stepped surface. The heat spreader includes a protrusion and a connecting portion around the edge of the protrusion, the second stepped surface supports the connecting portion, and the protrusion passes through the first mounting port.
7. The mid-frame assembly as described in claim 6, characterized in that, The protrusion includes a first cover plate, a second cover plate, and a capillary structure. The first cover plate and the second cover plate are spaced apart along the first direction. The first surface is the surface of the first cover plate away from the second cover plate, and the second surface is the surface of the second cover plate away from the first cover plate. The connecting portion surrounds the periphery of the first cover plate. The first cover plate and the second cover plate are sealed together to form a sealed cavity. The interior of the sealed cavity is a negative pressure environment and is provided with a cooling medium. The capillary structure is disposed within the sealed cavity.
8. The mid-frame assembly as described in claim 6, characterized in that, The second step surface is fixed to the connecting part by adhesive or welding.
9. The mid-frame assembly as claimed in claim 1, characterized in that, The second middle plate has a second groove on its surface facing the first middle plate. The second groove is configured to accommodate the second component. The second groove includes a second bottom wall, and the first mounting opening penetrates a portion of the second bottom wall.
10. An electronic device, characterized in that, The device includes a first component, a second component, a back cover, and a mid-frame assembly as described in any one of claims 1 to 9. The second mid-plate carries the first component on a side away from the first mid-plate, and the second component is accommodated between the second mid-plate and the first mid-plate. The first surface contacts the first component, and the second surface contacts the second component. The back cover is fixed to the mid-frame and is located on the side of the first mid-plate away from the second mid-plate along the first direction.