An automated high-speed die bonder

Abstract

The utility model relates to an automatic high -speed fixed crystal machine, including fixed crystal mechanism, glue spraying mechanism and base plate conveying mechanism, fixed crystal mechanism includes wafer feeding mechanism, IC wafer taking and placing mechanism and wafer workstation, IC wafer taking and placing mechanism sets up at the top of wafer workstation, wafer feeding mechanism includes feeding mechanism and turnover feeding mechanism, turnover feeding mechanism includes swing cylinder and clamping mechanism, clamping mechanism and swing cylinder's pivot fixed connection, feeding mechanism installs in the side away from wafer workstation of turnover feeding mechanism, and feeding mechanism and turnover feeding mechanism structure are same, and the bottom of feeding mechanism is provided with translation cylinder, and feeding mechanism and the slider fixed connection of translation cylinder. After adopting such scheme, the automation level of fixed crystal machine whole has been improved significantly, realizes the automatic feeding of wafer, avoids the damage and electrostatic problem that the manual installation wafer possibly causes, thereby is favorable for the pickup of subsequent IC wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging equipment technology, and in particular to an automated high-speed die bonder. Background Technology

[0002] Die bonding, a core step in semiconductor packaging and optoelectronic device manufacturing, mainly encompasses substrate coating, IC chip picking, and IC chip positioning and fixation. The die bonder, a key piece of equipment in this process, is responsible for picking up individual IC chips from the IC chip carrier, accurately placing them onto the substrate, and firmly bonding the IC chip to the substrate using adhesive. This ensures stable fixation of the IC chip, providing a solid foundation for subsequent packaging and testing processes.

[0003] Currently, the most commonly used chip carriers are wafers. A wafer is a thin, circular sheet and serves as the "mother" of IC chips. All IC chips are arranged in an array on its surface and are ultimately separated into individual IC chips through dicing. During the die bonding process, the wafer must be precisely placed on a wafer stage, after which a robotic arm removes the IC chip from the wafer and mounts it onto a substrate. However, in current equipment, wafer mounting usually requires manual operation, a process that easily generates static electricity, adversely affecting subsequent IC chip pick-up operations. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide an automated high-speed die bonding machine, which further improves the automation level of the equipment, enables automatic wafer feeding, avoids damage and static electricity problems that may be caused by manual wafer installation, and thus facilitates the subsequent picking of IC chips.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0006] An automated high-speed die bonder includes a die bonder mechanism, a glue spraying mechanism, and a substrate conveying mechanism. The die bonder mechanism and the glue spraying mechanism are located on one side of the substrate conveying mechanism, with the glue spraying mechanism near the starting end of the substrate conveying mechanism. The die bonder mechanism includes a wafer loading mechanism, an IC wafer pick-and-place mechanism, and a wafer stage. The IC wafer pick-and-place mechanism is located above the wafer stage, and the wafer loading mechanism is located on the side of the wafer stage away from the glue spraying mechanism. The wafer loading mechanism includes a feeding mechanism and a flipping loading mechanism. The flipping loading mechanism includes a swing cylinder and a clamping mechanism. The clamping mechanism is fixedly connected to the rotating shaft of the swing cylinder. The feeding mechanism is installed on the side of the flipping loading mechanism away from the wafer stage. The feeding mechanism and the flipping loading mechanism have the same structure. A translation cylinder is provided at the bottom of the feeding mechanism, and the feeding mechanism is fixedly connected to the slider of the translation cylinder.

[0007] This design further enhances the automation level of the die bonder. Specifically, the solution integrates the substrate transport mechanism, adhesive spraying mechanism, and die bonder into a single unit. The substrate is transported to the adhesive spraying mechanism via the substrate transport mechanism for adhesive spraying, and then transported to the die bonder to complete the die bonding operation. Inside the die bonder, the wafer stage and IC chip pick-and-place mechanism work together to complete the die bonding operation. This series of measures effectively improves the overall automation level of the die bonder, significantly shortens the production cycle, and improves overall efficiency. The wafer loading mechanism achieves automatic wafer loading and mounting through a feeding mechanism and a flipping loading mechanism. This not only further enhances the automation level of the die bonder but also avoids damage and static electricity problems that may be caused by manual wafer mounting, thus facilitating subsequent IC chip picking. The feeding mechanism, driven by a translation cylinder, can move the wafer horizontally to the loading point. The flipping loading mechanism, with its swing cylinder and gripping mechanism, can grip the wafer and flip it to the wafer stage. The two work together to ensure that the wafer is accurately transported, improving the stability and reliability of loading.

[0008] Furthermore, the gripping mechanism includes a driver and a chuck. The chuck is fixedly connected to the driver, which controls the chuck to open and close vertically. By controlling the chuck's vertical movement through the driver, the gripping mechanism enables precise gripping and release of the wafer. The driver's precise control ensures the consistency and stability of the chuck's movements, preventing material damage or inaccurate positioning due to improper gripping force or movement deviations, thereby improving the accuracy and reliability of material handling during the die bonding process.

[0009] Furthermore, the IC wafer pick-and-place mechanism includes a pick-and-place rocker arm and a rocker arm drive device. One end of the pick-and-place rocker arm is fixedly connected to the rocker arm drive device, and the other end is equipped with a suction nozzle. The rocker arm drive device controls the movement of the pick-and-place rocker arm. In the IC wafer pick-and-place mechanism, the rocker arm drive device drives the pick-and-place rocker arm to move quickly and flexibly to the designated position, completing the pick-up and placement operation of the IC wafer. This greatly shortens the time required for picking up and placing IC wafers, speeds up the die bonding process, effectively improves the efficiency of the die bonding stage, and meets the speed requirements of large-scale production. A negative pressure device is connected to the suction nozzle. The negative pressure suction generated by the negative pressure device ensures that the suction nozzle is in close contact with the IC wafer. Even if the IC wafer is small in size and lightweight, it can be firmly adsorbed, preventing the IC wafer from falling during the pick-and-place process and improving the success rate and stability of the pick-and-place operation.

[0010] Furthermore, the glue spraying mechanism includes a drive assembly, a glue storage assembly, a glue spraying head, and a vision assembly. The drive assembly is located on one side of the substrate conveying mechanism, the glue spraying head is fixedly mounted on the drive assembly, the glue storage assembly is connected to the glue spraying head, and the vision assembly is fixed on the drive assembly and located on one side of the glue spraying head. In the glue spraying mechanism, the rapid response and precise movement capability of the drive assembly enable the glue spraying head to move from one glue spraying position to the next in a short time, reducing glue spraying auxiliary time and improving overall production efficiency. The glue storage assembly, connected to the glue spraying head, ensures the stability of glue supply, providing a basis for precise control of glue dispensing. The presence of the vision assembly enables real-time monitoring of the glue spraying process and effect, detecting whether the glue spraying position is accurate, whether the glue amount is uniform, and whether there is glue leakage, thus promptly identifying defects in the production process.

[0011] Furthermore, the wafer stage includes a position adjustment mechanism and a wafer clamping mechanism. The wafer clamping mechanism is mounted above the position adjustment mechanism and includes two clamping components symmetrically arranged. Each clamping component includes a clamping block and a push cylinder. The piston rod of the push cylinder pushes the clamping block to move horizontally. A flipping and loading mechanism is located on one side of the clamping component. The position adjustment mechanism can precisely adjust the position of the wafer clamping mechanism to ensure that the wafer is in the optimal position during the die bonding process. The symmetrically arranged clamping components can stably clamp the wafer from both sides. The push cylinder pushes the clamping block to move horizontally through the piston rod, achieving precise positioning of wafers of different sizes. This symmetrical clamping method can apply clamping force evenly, preventing the wafer from shifting or deforming during clamping, thereby ensuring the accuracy of die bonding.

[0012] Furthermore, an electrostatic precipitator fan is fixedly installed on one side of the wafer worktable. During wafer processing, static electricity is easily generated due to friction between the wafer and equipment, air, etc. Static electricity not only attracts dust particles but can also damage the tiny electronic components on the wafer, or even trigger discharge phenomena, damaging IC chips or other precision components. The electrostatic precipitator fan can eliminate static electricity, preventing its adverse effects on the wafer and related equipment, and protecting the safe operation of the wafer and die bonding equipment.

[0013] In summary, this automated high-speed die bonder significantly improves the overall automation level of the die bonder, realizes automatic wafer feeding, and avoids damage and static electricity problems that may be caused by manual wafer installation, thus facilitating the subsequent picking of IC chips. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0015] Figure 1 This is a schematic diagram of the overall assembly structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the wafer worktable and the flipping and loading mechanism of this utility model;

[0017] Figure 3 This is a schematic diagram of the chip picking and placing mechanism of this utility model;

[0018] Figure 4 This is a schematic diagram of the adhesive spraying mechanism of this utility model;

[0019] The components include: die bonding mechanism-1, wafer loading mechanism-11, IC chip pick-and-place mechanism-12, pick-and-place rocker arm-121, rocker arm drive device-122, suction nozzle-123, wafer worktable-13, position adjustment mechanism-131, wafer clamping mechanism-132, clamping component-133, clamping block-1331, push cylinder-1332, feeding mechanism-14, translation cylinder-141, flip loading mechanism-15, swing cylinder-151, gripping mechanism-152, driver-1521, chuck-1522, glue spraying mechanism-2, drive assembly-21, glue storage assembly-22, glue spraying head-23, vision assembly-24, substrate transfer mechanism-3, and electrostatic dust removal fan-4. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] In the description of this utility model, it should be understood that the orientation and positional relationship indicated by terms such as "up", "down", "left", "right", "front", "back", "vertical", "bottom", "inner", and "outer" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0022] like Figure 1An automated high-speed die bonder is shown, comprising a die bonder mechanism 1, a glue spraying mechanism 2, and a substrate conveying mechanism 3. The die bonder mechanism 1 and the glue spraying mechanism 2 are disposed on one side of the substrate conveying mechanism 3, with the glue spraying mechanism 2 located near the starting end of the substrate conveying mechanism 3. The die bonder mechanism 1 includes a wafer loading mechanism 11, an IC wafer pick-and-place mechanism 12, and a wafer stage 13. The IC wafer pick-and-place mechanism 12 is disposed above the wafer stage 13, and the wafer loading mechanism 11 is disposed on the side of the wafer stage 13 away from the glue spraying mechanism 2. The wafer loading mechanism 11 includes a feeding mechanism 14 and a flipping loading mechanism 15. The flipping loading mechanism 15 includes a swing cylinder 151 and a clamping mechanism 152. The clamping mechanism 152 is fixedly connected to the rotating shaft of the swing cylinder 151. The feeding mechanism 14 is installed on the side of the flipping loading mechanism 15 away from the wafer worktable 13. The feeding mechanism 14 and the flipping loading mechanism 15 have the same structure. A translation cylinder 141 is provided at the bottom of the feeding mechanism 14. The slider of the feeding mechanism 14 is fixedly connected to the translation cylinder 141.

[0023] This design further enhances the automation level of the die bonder. Specifically, the solution integrates the substrate transfer mechanism 3, the adhesive spraying mechanism 2, and the die bonder 1 into a single unit. The substrate is transported to the adhesive spraying mechanism 2 via the substrate transfer mechanism 3 for adhesive spraying, and then transported to the die bonder 1 to complete the die bonding operation. Inside the die bonder 1, the wafer stage 13 and the IC wafer pick-and-place mechanism 12 work together to complete the die bonding operation. This series of measures effectively improves the overall automation level of the die bonder, significantly shortens the production cycle, and improves overall efficiency. The wafer loading mechanism 11 achieves automatic wafer loading and mounting through the feeding mechanism 14 and the flipping loading mechanism 15. This not only further enhances the automation level of the die bonder but also avoids damage and static electricity problems that may be caused by manual wafer mounting, thus facilitating the subsequent IC wafer picking. Driven by the translation cylinder 141, the feeding mechanism 14 can move the wafer horizontally to the loading point. The swing cylinder 151 and the clamping mechanism 152 of the flipping loading mechanism 15 can clamp the wafer and flip it to the wafer worktable 13. The two work together to ensure that the wafer can be accurately transported, improving the stability and reliability of the loading.

[0024] As a preferred option, such as Figure 2As shown, the clamping mechanism 152 includes a driver 1521 and a chuck 1522. The chuck 1522 is fixedly connected to the driver 1521, and the driver 1521 controls the chuck 1522 to perform up-and-down opening and closing movements. The clamping mechanism 152, through the driver 1521 controlling the chuck 1522 to perform up-and-down opening and closing movements, can achieve precise clamping and releasing of the wafer. The precise control of the driver 1521 ensures the consistency and stability of the chuck 1522's movements, avoiding material damage or inaccurate positioning due to improper clamping force or movement deviation, thereby improving the accuracy and reliability of material handling during the die bonding process.

[0025] As a preferred option, such as Figure 3 As shown, the IC wafer pick-and-place mechanism 12 includes a pick-and-place rocker arm 121 and a rocker arm drive device 122. One end of the pick-and-place rocker arm 121 is fixedly connected to the rocker arm drive device 122, and the other end is provided with a suction nozzle 123. The rocker arm drive device 122 controls the movement of the pick-and-place rocker arm 121. In the IC wafer pick-and-place mechanism 12, the rocker arm drive device 122 drives the pick-and-place rocker arm 121 to move, which can quickly and flexibly move the suction nozzle 123 to the designated position to complete the pick-up and placement operation of the IC wafer. This greatly shortens the time required for picking up and placing the IC wafer, speeds up the die bonding rhythm of the equipment, effectively improves the working efficiency of the die bonding process, and meets the speed requirements of large-scale production. A negative pressure device is connected to the suction nozzle 123. The negative pressure suction generated by the negative pressure device can ensure that the suction nozzle 123 is in close contact with the IC wafer. Even if the IC wafer is small in size and light in texture, it can be firmly adsorbed, preventing the IC wafer from falling during the pick-and-place process, and improving the success rate and stability of pick-up.

[0026] As a preferred option, such as Figure 4 As shown, the glue spraying mechanism 2 includes a drive assembly 21, a glue storage assembly 22, a glue spraying head 23, and a vision assembly 24. The drive assembly 21 is located on one side of the substrate conveying mechanism 3. The glue spraying head 23 is fixedly mounted on the drive assembly 21. The glue storage assembly 22 is connected to the glue spraying head 23. The vision assembly 24 is fixed on the drive assembly 21 and located on one side of the glue spraying head 23. In the glue spraying mechanism 2, the rapid response and precise movement capability of the drive assembly 21 enable the glue spraying head 23 to move from one glue spraying position to the next in a short time, reducing auxiliary time for glue spraying and improving overall production efficiency. The glue storage assembly 22, connected to the glue spraying head 23, ensures the stability of glue supply and provides a basis for precise control of glue dispensing. The presence of the vision assembly 24 enables real-time monitoring of the glue spraying process and effect, detecting whether the glue spraying position is accurate, whether the glue amount is uniform, and whether there is glue leakage, thus promptly identifying defects in the production process.

[0027] As a preferred option, such as Figure 2As shown, the wafer stage 13 includes a position adjustment mechanism 131 and a wafer clamping mechanism 132. The wafer clamping mechanism 132 is mounted above the position adjustment mechanism 131 and includes two clamping components 133 symmetrically arranged. Each clamping component 133 includes a clamping block 1331 and a push cylinder 1332. The piston rod of the push cylinder 1332 pushes the clamping block 1331 to move horizontally. A flipping loading mechanism 15 is located on one side of the clamping component 133. The position adjustment mechanism 131 can precisely adjust the position of the wafer clamping mechanism 132 to ensure that the wafer is in the optimal position during the die bonding process. The symmetrically arranged clamping components 133 can stably clamp the wafer from both sides. The push cylinder 1332 pushes the clamping block 1331 to move horizontally through the piston rod, achieving precise positioning of wafers of different sizes. This symmetrical clamping method can apply clamping force evenly, avoiding wafer displacement or deformation during clamping, thereby ensuring the accuracy of die bonding.

[0028] As a preferred option, such as Figure 1 As shown, an electrostatic precipitator fan 4 is fixedly installed on one side of the wafer stage 13. During wafer processing, static electricity is easily generated due to friction between the wafer and equipment, air, etc. Static electricity not only attracts dust particles but may also damage the tiny electronic components on the wafer, or even trigger discharge phenomena, damaging IC chips or other precision components. The electrostatic precipitator fan 4 can eliminate static electricity, avoid the adverse effects of static electricity on the wafer and related equipment, and protect the safe operation of the wafer and die bonding equipment.

[0029] In summary, this automated high-speed die bonder significantly improves the overall automation level of the die bonder, realizes automatic wafer feeding, and avoids damage and static electricity problems that may be caused by manual wafer installation, thus facilitating the subsequent picking of IC chips.

[0030] In summary, the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An automated high-speed die bonder, comprising a die bonder mechanism, a glue spraying mechanism, and a substrate conveying mechanism, wherein the die bonder mechanism and the glue spraying mechanism are disposed on one side of the substrate conveying mechanism, and the glue spraying mechanism is located near the starting end of the substrate conveying mechanism, characterized in that: The die bonding mechanism includes a wafer loading mechanism, an IC wafer pick-and-place mechanism, and a wafer stage. The IC wafer pick-and-place mechanism is located above the wafer stage. The wafer loading mechanism is located on the side of the wafer stage away from the adhesive spraying mechanism. The wafer loading mechanism includes a feeding mechanism and a flipping loading mechanism. The flipping loading mechanism includes a swing cylinder and a clamping mechanism. The feeding mechanism is installed on the side of the flipping loading mechanism away from the wafer stage. The feeding mechanism and the flipping loading mechanism have the same structure. A translation cylinder is provided at the bottom of the feeding mechanism, and the feeding mechanism is fixedly connected to the slider of the translation cylinder.

2. The automated high-speed die bonder according to claim 1, characterized in that: The clamping mechanism includes a driver and a chuck. The chuck is fixedly connected to the driver, and the driver controls the chuck to perform up-and-down opening and closing movements.

3. The automated high-speed die bonder according to claim 2, characterized in that: The IC wafer picking and placing mechanism includes a wafer picking rocker arm and a rocker arm driving device. One end of the wafer picking rocker arm is fixedly connected to the rocker arm driving device, and the other end is provided with a suction nozzle. The rocker arm driving device controls the movement of the wafer picking rocker arm.

4. The automated high-speed die bonder according to claim 2, characterized in that: The glue spraying mechanism includes a driving component, a glue storage component, a glue spraying head, and a vision component. The driving component is disposed on one side of the substrate conveying mechanism, the glue spraying head is fixedly mounted on the driving component, the glue storage component is connected to the glue spraying head, and the vision component is fixed on the driving component and located on one side of the glue spraying head.

5. The automated high-speed die bonder according to claim 2, characterized in that: The wafer stage includes a position adjustment mechanism and a wafer clamping mechanism. The wafer clamping mechanism is installed above the position adjustment mechanism and includes two clamping components arranged symmetrically. Each clamping component includes a clamping block and a pushing cylinder. The piston rod of the pushing cylinder pushes the clamping block to move horizontally. The flipping loading mechanism is located on one side of the clamping components.

6. The automated high-speed die bonder according to claim 5, characterized in that: An electrostatic dust removal fan is fixedly installed on one side of the wafer worktable.

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