Heating element and atomizing device

Abstract

The application provides a heating body and an atomization device, and belongs to the atomization device field. The heating body comprises a metal substrate layer, an insulating layer, a common electrode pad and a plurality of heating lines; the insulating layer is located on the surface of the metal substrate layer, the insulating layer has a first through hole and a plurality of second through holes which expose the metal substrate layer, the second through holes are arranged one by one corresponding to the heating lines; the common electrode pad is located in the first through hole and is electrically connected with the metal substrate layer; the heating lines are located on the side of the insulating layer away from the metal substrate layer, and the first end of the heating line is electrically connected with the metal substrate layer at the corresponding second through hole. The current in the plurality of heating lines can flow through the metal substrate layer and flow into the common electrode pad through the metal substrate layer. The metal substrate layer can bear a large current, which can greatly reduce the possibility of circuit breakage and is beneficial to prolong the service life of the heating body.

Description

Technical Field

[0001] This application relates to the field of atomizing devices, and particularly to a heating element and an atomizing device. Background Technology

[0002] The heating element is the core component that heats the device during operation, and it is usually made using a thick-film process.

[0003] A heating element typically includes a substrate layer, a common circuit, a common electrode pad, and multiple heating circuits formed on the surface of the substrate layer. One end of each heating circuit is connected to the common circuit, which in turn is connected to the common electrode pad. Kirchhoff's Current Law states that at any node in a circuit, the sum of the currents flowing into the node equals the sum of the currents flowing out of the node. Therefore, during the operation of the heating element, the current in the common circuit is the sum of the currents in all the heating circuits.

[0004] Currently, it has been found that in related technologies, the current in the common circuit is relatively large, which can easily burn out the common circuit and result in a short lifespan of the heating element. Utility Model Content

[0005] This application provides a heating element and an atomizing device, which can extend the service life of the heating element. The technical solution is as follows:

[0006] In a first aspect, embodiments of this application provide a heating element, which includes a metal substrate layer, an insulating layer, a common electrode pad, and multiple heating circuits;

[0007] The insulating layer is located on the surface of the metal substrate layer. The insulating layer has a first through hole and a plurality of second through holes that expose the metal substrate layer. The second through holes are arranged one-to-one with the heating circuit.

[0008] The common electrode pad is located in the first through hole and is electrically connected to the metal substrate layer;

[0009] The heating circuit is located on the side of the insulating layer away from the metal substrate layer, and the first end of the heating circuit is electrically connected to the metal substrate layer at the corresponding second through hole.

[0010] In some examples, the heating circuit includes a heating resistor layer, which is partially located in the second via and forms an electrical connection with the metal substrate layer.

[0011] In some examples, the heating circuit includes a heating resistor layer and an interconnecting metal layer, the heating resistor layer being located on the side of the insulating layer away from the metal substrate layer; a portion of the interconnecting metal layer being located in the second via and contacting the metal substrate layer to form an electrical connection; and another portion of the interconnecting metal layer contacting the heating resistor layer to form an electrical connection.

[0012] In some examples, the heating resistance layer is partially located on the surface of the interconnect metal layer away from the metal substrate layer;

[0013] or,

[0014] The other portion of the interconnecting metal layer is located on the surface of the heating resistance layer away from the metal substrate layer.

[0015] In some examples, the interconnect metal layer is made of the same material as the common electrode pad.

[0016] In some examples, the heating element further includes multiple non-common electrode pads, which are connected one-to-one with the second end of the heating circuit.

[0017] In some examples, the heating element includes two heating circuits, the distance between the first ends of the two heating circuits being less than the distance between the second ends of the two heating circuits.

[0018] In some examples, the heating element further includes a protective layer located on the side of the heating circuit away from the metal substrate layer.

[0019] In some examples, the heating element further includes a common electrode lead that is soldered to the common electrode pad.

[0020] In some examples, the material of the common electrode lead is the same as the material of the metal substrate layer.

[0021] Secondly, embodiments of this application also provide an atomizing device, the atomizing device including a power supply component and a heating element as described in the first aspect, the power supply component being used to supply power to the heating element.

[0022] The beneficial effects of the technical solutions provided in this application include at least the following:

[0023] By setting a metal substrate layer and an insulating layer on its surface, multiple heating circuits are arranged on the surface of the insulating layer away from the metal substrate layer. The common electrode pad is electrically connected to the metal substrate layer through a first through-hole in the insulating layer, and the first end of each heating circuit is electrically connected to the metal substrate layer through a second through-hole in the insulating layer. This allows current from the multiple heating circuits to flow through the metal substrate layer and into the common electrode pad. The metal substrate layer can withstand a large current, significantly reducing the possibility of open circuits and extending the lifespan of the heating element. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a heating element provided in an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of the structure of a heating element provided in an embodiment of this application;

[0027] Figure 3 yes Figure 2 Section I-I in the diagram;

[0028] Figure 4 yes Figure 2 Section II-II in the diagram;

[0029] Figure 5 This is a cross-sectional view of another heating element provided in an embodiment of this application;

[0030] Figure 6 This is a cross-sectional view of another heating element provided in an embodiment of this application;

[0031] Figure 7 This is a cross-sectional view of another heating element provided in an embodiment of this application;

[0032] Figure 8 This is a cross-sectional view of another heating element provided in an embodiment of this application.

[0033] Icon labels:

[0034] 10-Substrate layer, 21-Common line, 22-Common electrode pad, 221-Common electrode lead, 23-Heating line, 231-Heating resistor layer, 232-Interconnect metal layer, 233-Conductor line, 24-Non-common electrode pad, 241-Non-common electrode lead, 30-Metal substrate layer, 31-Insulating layer, 31a-First via, 31b-Second via, 32-Protective layer. Detailed Implementation

[0035] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0036] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0037] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0038] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0039] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" means two or more.

[0041] During the use of an atomizing device, the medium is inserted into the device and heated by a heating element inside. This low-temperature heating method, without combustion, causes the medium to release an aerosol. The heating element is typically electrically heated. Figure 1 This is a schematic diagram of the structure of a heating element provided in an embodiment of this application. The heating element is typically rolled into a cylindrical shape. Figure 1 The diagram shown is a unfolded representation of the heating element. Figure 1 As shown, the heating element includes a substrate layer 10, a common circuit 21, a common electrode pad 22, and multiple heating circuits 23. The common circuit 21 is connected to one end of each of the multiple heating circuits 23, and is also electrically connected to the common electrode pad 22. The other end of each heating circuit 23 is connected to a non-common electrode pad 24. The common electrode pad 22 and the non-common electrode pad 24 are used for soldering leads. The leads are used to supply power to the heating element. During operation, current flows through the multiple heating circuits 23, causing them to heat up and thus heating the medium. Since the current in all the heating circuits 23 flows through the common circuit 21, according to Kirchhoff's current law, the current in the common circuit 21 is the sum of the currents in all the heating circuits 23. A large current can easily cause the common circuit 21 to burn out, leading to an open circuit in the heating element and affecting its service life.

[0042] In order to extend the service life of the heating element, this application provides a heating element. Figure 2 This is a schematic diagram of the structure of a heating element provided in an embodiment of this application. Figure 2 The diagram shown is a unfolded representation of the heating element. Figure 2 As shown, the heating element includes a metal substrate layer 30, an insulating layer 31, a common electrode pad 22, and multiple heating lines 23.

[0043] As an example, the heating element may include two heating lines 23. In other possible implementations, the number of heating lines 23 may be three, four, or more.

[0044] The heating circuit 23 may have at least two ends, namely a first end and a second end. The heating circuit 23 may have a curved structure.

[0045] Figure 3 yes Figure 2 Section I-I in the diagram, Figure 4 yes Figure 2 Section II-II in the diagram, as shown Figure 3 and Figure 4 As shown, the insulating layer 31 is located on the surface of the metal substrate layer 30. The insulating layer 31 has a first through hole 31a and a plurality of second through holes 31b that expose the metal substrate layer 30. The second through holes 31b are arranged in a one-to-one correspondence with the heating circuit 23.

[0046] The common electrode pad 22 is located in the first through hole 31a and is electrically connected to the metal substrate layer 30.

[0047] The heating line 23 is located on the side of the insulating layer 31 away from the metal substrate layer 30, and the first end of the heating line 23 is electrically connected to the metal substrate layer 30 at the corresponding second through hole 31b.

[0048] like Figure 2 As shown, the heating element may also include multiple non-common electrode pads 24, which are connected one-to-one with the second end of the heating circuit 23.

[0049] Setting a non-common electrode pad 24 at the second end of the heating circuit 23 can facilitate the wiring of the heating circuit 23.

[0050] By setting a metal substrate layer 30 and an insulating layer 31 on its surface, multiple heating lines 23 are arranged on the surface of the insulating layer 31 away from the metal substrate layer 30. The common electrode pad 22 is electrically connected to the metal substrate layer 30 through a first through-hole 31a in the insulating layer 31, and the first end of the heating line 23 is electrically connected to the metal substrate layer 30 through a second through-hole 31b in the insulating layer 31. This allows the current in the multiple heating lines 23 to flow through the metal substrate layer 30 and into the common electrode pad 22. The metal substrate layer 30 can withstand a large current, which greatly reduces the possibility of open circuits and helps extend the service life of the heating element.

[0051] In some examples, the metal substrate layer 30 can be a metal sheet. For example, it can be made of stainless steel, such as 430 stainless steel, 444 stainless steel, or 304 stainless steel. Stainless steel not only has good electrical conductivity but can also withstand large currents without burning out, and it is also relatively inexpensive.

[0052] In other examples, the metal substrate layer 30 may also be made of other metallic materials, such as copper or copper alloys.

[0053] The insulating layer 31 can be formed by coating with an insulating coating and then sintering, for example, by using an insulating varnish.

[0054] like Figure 4 As shown, the heating circuit 23 includes a heating resistor layer 231 and an interconnecting metal layer 232. The heating resistor layer 231 is located on the side of the insulating layer 31 away from the metal substrate layer 30. A portion of the interconnecting metal layer 232 is located in the second via 31b and contacts the metal substrate layer 30 to form an electrical connection; another portion of the interconnecting metal layer 232 contacts the heating resistor layer 231 to form an electrical connection.

[0055] The heating resistor layer 231 is the part used to heat the medium during the energization of the heating circuit 23. The thickness of the heating resistor layer 231 affects the resistance, and thus the amount of heat generated. A heating resistor layer 231 with uniform thickness results in a uniform temperature during heating, with small temperature differences between different areas.

[0056] By connecting the heating resistor layer 231 and the metal substrate layer 30 with an interconnecting metal layer 232 in the first through hole 31a, instead of directly extending the heating resistor layer 231 into the second through hole 31b, the thickness of the heating resistor layer 231 can be prevented from changing at the hole wall of the second through hole 31b, thus affecting the temperature uniformity during heating and improving the heating effect.

[0057] As an example, a portion of the interconnect metal layer 232 is located in the second via 31b, and another portion of the interconnect metal layer 232 is located on the surface of the heating resistor layer 231 away from the metal substrate layer 30.

[0058] During the fabrication process, a heating resistor layer 231 can be formed on the surface of the insulating layer 31 first, and then an interconnecting metal layer 232 can be fabricated, so that a portion of the interconnecting metal layer 232 covers the surface of the heating resistor layer 231 and forms an electrical connection with the heating resistor layer 231. The thickness of the heating resistor layer 231 at various points will not be affected by the interconnecting metal layer 232, thus avoiding any impact on the temperature uniformity of the heating resistor layer 231 when it is heated.

[0059] Figure 5 This is a cross-sectional view of another heating element provided in an embodiment of this application, the cross-section corresponding to Figure 4 At the second through hole 31b. For example... Figure 5 As shown, different from Figure 4 The heating element shown is in Figure 5 In the heating element shown, the heating resistor layer 231 is partially located on the surface of the interconnect metal layer 232 away from the metal substrate layer 30. That is, in this example, the heating resistor layer 231 is fabricated first, and then the interconnect metal layer 232 is fabricated.

[0060] In some examples, the interconnect metal layer 232 is made of the same material as the common electrode pad 22.

[0061] Because they are made of the same materials, the interconnect metal layer 232 and the common electrode pad 22 can be formed in the same process during the fabrication of the heating element. For example, the interconnect metal layer 232 and the common electrode pad 22 can be fabricated using a coating printing and sintering process.

[0062] for Figure 4 The heating element shown, after the heating resistor layer 231 is fabricated, forms an electrode coating at the first through-hole 31a and the second through-hole 31b by printing. The electrode coating is then sintered to form a common electrode pad 22 and an interconnect metal layer 232. For Figure 5 The heating element shown can be formed by printing an electrode coating before fabricating the heating resistor layer 231, and then sintering the electrode coating to form a common electrode pad 22 and an interconnect metal layer 232.

[0063] The material of the non-common electrode pad 24 can also be the same as that of the common electrode pad 22. In this way, the non-common electrode pad 24 can be manufactured at the same time as the common electrode pad 22, so as to save steps and reduce process costs.

[0064] Figure 6 This is a cross-sectional view of another heating element provided in an embodiment of this application, which also corresponds to... Figure 4 At the second through hole 31b. For example... Figure 6 As shown, different from Figure 4 The heating element shown is in Figure 6 In the heating element shown, the heating circuit 23 includes a heating resistor layer 231. Part of the heating resistor layer 231 is located on the surface of the insulating layer 31, and another part is located in the second through hole 31b, which is in contact with the metal substrate layer 30 to form an electrical connection.

[0065] In this example, instead of setting an interconnecting metal layer 232, a portion of the heating resistor layer 231 is directly fabricated in the second via 31b to form an electrical connection with the metal substrate layer 30, which simplifies the process.

[0066] For example, the heating resistor layer 231 can be formed using a resistor paste. After an insulating layer 31 is formed on the surface of the metal substrate layer 30, a resistor paste is formed on the metal substrate layer 30 using a process such as printing, and then the resistor paste is sintered to form the heating resistor layer 231.

[0067] like Figure 2As shown, among the multiple heating circuits 23, some or all of the heating circuits 23 may also include conductor circuits 233. A heating circuit 23 may include one conductor circuit 233 or two conductor circuits 233. As an example, Figure 2 One of the heating circuits 23 includes two conductor circuits 233.

[0068] Conductor line 233 is connected to the end of heating resistor layer 231. Conductor line 233 connects heating resistor layer 231 and interconnect metal layer 232, or connects heating resistor layer 231 and non-common electrode pad 24. The resistance of conductor line 233 is less than that of heating resistor layer 231. Conductor line 233 is not used for heating. During the operation of the heating element, the heat generated by conductor line 233 is much less than that generated by heating resistor layer 231. Conductor line 233 mainly serves a connecting function. When arranging heating resistor layer 231, first via 31a, second via 31b and non-common electrode pad 24, the relative position is less restricted. Even if the end of heating resistor layer 231 is far from the second via 31b and non-common electrode pad 24, they can still be connected through conductor line 233.

[0069] For example, the conductor line 233 can be made of metallic silver. Metallic silver has low resistance, resulting in low heat generation when connected in series with the heating resistor layer 231. The conductor line 233 can be formed by sintering conductive silver paste.

[0070] In some examples, the heating element includes two heating lines 23, the distance between the first ends of the two heating lines 23 being smaller than the distance between the second ends of the two heating lines 23.

[0071] By arranging the first ends of the two heating lines 23 closer together, the two second through holes 31b are also closer together. This way, when the first through hole 31a is arranged near the second through hole 31b, the distance from the first through hole 31a to the two second through holes 31b is also closer, which makes the current flow from the second through hole 31b to the first through hole 31a shorter, which helps to reduce voltage loss in the metal substrate layer 30.

[0072] like Figure 3 As shown, the heating element also includes a protective layer 32, which is located on the side of the heating circuit 23 away from the metal substrate layer 30.

[0073] By covering the surface of the heating circuit 23 with a protective layer 32, a protective effect can be achieved, thereby extending the service life of the heating element. For example, it can reduce the risk of the heating circuit 23 being scratched by foreign objects; or, for example, it can delay the oxidation of the heating circuit 23.

[0074] For example, the protective layer 32 can be formed by printing a paste followed by sintering. The protective layer 32 is made of an insulating material.

[0075] Figure 7 and Figure 8 This is a cross-sectional view of another heating element provided in an embodiment of this application, wherein, Figure 7 The cross section shown corresponds to Figure 2 The location of section I-I in the middle, Figure 8 The cross section shown corresponds to Figure 2 The location of section II-II in the diagram. Figure 7 and Figure 8 As shown, the heating element may also include a common electrode lead 221 and a non-common electrode lead 241. The common electrode lead 221 is soldered to the common electrode pad 22, and the non-common electrode lead 241 is soldered to the non-common electrode pad 24.

[0076] In some examples, the common electrode lead 221 can be soldered to the common electrode pad 22. Common metal soldering processes can be used, such as laser soldering, friction soldering, cold soldering, and resistance welding.

[0077] According to Kirchhoff's current law, the current is relatively large at the connection between the common electrode lead 221 and the common electrode pad 22, and the resistance at the solder joint is usually slightly higher than in other areas, making it prone to overheating. In this example, the common electrode lead 221 is not soldered to the common electrode pad 22 using a weaker brazing method, but rather using a more robust conventional metal soldering process. This ensures a stronger connection between the common electrode lead 221 and the common electrode pad 22, and even if more heat is generated at the solder joint, the risk of the common electrode lead 221 and the common electrode pad 22 becoming loose is extremely low, thereby further extending the lifespan of the heating element.

[0078] In some examples, the material of the common electrode lead 221 is the same as the material of the metal substrate layer 30.

[0079] For example, the common electrode lead 221 can be a stainless steel wire or a nickel wire, or it can be a composite material wire, such as a nickel-clad copper wire or a silver-clad stainless steel wire.

[0080] The current in the common electrode lead 221 is the sum of the currents flowing through multiple heating circuits 23. The current is relatively large. Stainless steel wire, nickel wire, nickel-clad copper wire or silver-clad stainless steel wire can withstand a large current and are not easily damaged by excessive current, which helps to extend the service life.

[0081] In other examples, the material of the common electrode lead 221 may also be different from the material of the metal substrate layer 30; for example, the common electrode lead 221 may be a silver wire.

[0082] The material of the common electrode lead 221 and the non-common electrode lead 241 can be the same; for example, the non-common electrode lead 241 can also be made of silver wire. In this way, when manufacturing the heating element, only one type of wire material is needed to manufacture the common electrode lead 221 and the non-common electrode lead 241, which facilitates the manufacturing of the heating element.

[0083] The non-common electrode lead 241 can be soldered to the non-common electrode pad 24, for example, by brazing. Although the connection strength of brazing is weaker, the current in the heating circuit 23 only flows through the non-common electrode lead 241 and the non-common electrode pad 24, and the heat generated at the solder joint is small, which is sufficient to meet the strength requirements, and the solder joint is not easy to loosen.

[0084] Non-common electrode lead 241 can be soldered before or after common electrode lead 221. After both common electrode lead 221 and non-common electrode lead 241 are soldered, a protective layer 32 can be formed, so that the connection between non-common electrode lead 241 and non-common electrode pad 24, and the connection between common electrode lead 221 and common electrode pad 22 are also covered by the protective layer 32.

[0085] This application also provides an atomizing device, which includes a power supply component and the aforementioned heating element. The power supply component is used to supply power to the heating element.

[0086] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heating element, characterized in that, It includes a metal substrate layer (30), an insulating layer (31), a common electrode pad (22), and multiple heating lines (23). The insulating layer (31) is located on the surface of the metal substrate layer (30). The insulating layer (31) has a first through hole (31a) and a plurality of second through holes (31b) that expose the metal substrate layer (30). The second through holes (31b) are provided one-to-one with the heating circuit (23). The common electrode pad (22) is located in the first through hole (31a) and is electrically connected to the metal substrate layer (30); The heating line (23) is located on the side of the insulating layer (31) away from the metal substrate layer (30), and the first end of the heating line (23) is electrically connected to the metal substrate layer (30) at the corresponding second through hole (31b).

2. The heating element according to claim 1, characterized in that, The heating circuit (23) includes a heating resistor layer (231), which is partially located in the second through hole (31b) and forms an electrical connection with the metal substrate layer (30).

3. The heating element according to claim 1, characterized in that, The heating circuit (23) includes a heating resistor layer (231) and an interconnecting metal layer (232). The heating resistor layer (231) is located on the side of the insulating layer (31) away from the metal substrate layer (30). A portion of the interconnecting metal layer (232) is located in the second through hole (31b) and forms an electrical connection with the metal substrate layer (30). Another portion of the interconnecting metal layer (232) forms an electrical connection with the heating resistor layer (231).

4. The heating element according to claim 3, characterized in that, The other portion of the interconnect metal layer (232) is located on the surface of the heating resistor layer (231) away from the metal substrate layer (30); or, The heating resistance layer (231) is partially located on the surface of the interconnect metal layer (232) away from the metal substrate layer (30).

5. The heating element according to claim 3, characterized in that, The interconnect metal layer (232) is made of the same material as the common electrode pad (22).

6. The heating element according to any one of claims 1 to 5, characterized in that, The heating element also includes multiple non-common electrode pads (24), which are connected one-to-one with the second end of the heating circuit (23).

7. The heating element according to any one of claims 1 to 5, characterized in that, The heating element includes two heating circuits (23), and the distance between the first ends of the two heating circuits (23) is smaller than the distance between the second ends of the two heating circuits (23).

8. The heating element according to any one of claims 1 to 5, characterized in that, The heating element also includes a protective layer (32), which is located on the side of the heating circuit (23) away from the metal substrate layer (30).

9. The heating element according to any one of claims 1 to 5, characterized in that, The heating element also includes a common electrode lead (221), which is soldered to the common electrode pad (22).

10. The heating element according to claim 9, characterized in that, The common electrode lead (221) is a stainless steel wire, a nickel wire, a nickel-plated copper wire, or a silver-plated stainless steel wire.

11. An atomizing device, characterized in that, It includes a power supply component and a heating element as described in any one of claims 1 to 10, wherein the power supply component is used to supply power to the heating element.

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