Photocatalytic purification module and refrigeration device

Abstract

The application relates to a photocatalytic purification module and a refrigeration device. The photocatalytic purification module comprises: a conductive adsorption base material configured as a porous structure, a plurality of pores being distributed on the conductive adsorption base material; a plurality of light-emitting semiconductor particles and a plurality of photocatalytic semiconductor particles, the plurality of light-emitting semiconductor particles and the plurality of photocatalytic semiconductor particles being attached to surfaces of the pores, and / or the plurality of light-emitting semiconductor particles and the plurality of photocatalytic semiconductor particles being attached between the conductive adsorption base material and the pores. The photocatalytic purification module of the application directly absorbs light energy of the light-emitting semiconductor particles by the photocatalytic semiconductor particles, improves the efficiency of converting electric energy into electronic energy, does not need to additionally arrange a light emitter, and does not need to consider the position matching design of the light emitter and the photocatalytic material. Instead, active sites for reacting pollutants are directly integrated on the pores of the conductive adsorption base material, the distance between the pollutants and the active sites is shortened, and the pollutants are efficiently removed.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, and in particular to a photocatalytic purification module and a refrigeration device. Background Technology

[0002] In related technologies, the light source in photocatalytic purification devices is generally a mercury lamp or an ultraviolet LED lamp. When a mercury lamp is used as the light source, it is difficult to miniaturize the mercury lamp and mercury is very harmful to the environment. When an ultraviolet LED lamp is used as the light source, the photoelectric conversion efficiency is low, the reactants are far from the active sites, the reaction rate is slow, and the purification efficiency is poor. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application provides a photocatalytic purification module and a refrigeration device, which can effectively improve the efficiency of pollutant purification.

[0004] In a first aspect, this application provides a photocatalytic purification module, comprising:

[0005] A conductive adsorption substrate is constructed as a porous structure, wherein multiple pores are distributed on the conductive adsorption substrate.

[0006] Multiple light-emitting semiconductor particles and multiple photocatalytic semiconductor particles are attached to the surface of the pores, and / or, multiple light-emitting semiconductor particles and multiple photocatalytic semiconductor particles are attached between the conductive adsorption substrate and the pores.

[0007] The photocatalytic purification module according to the first aspect of this application has at least the following beneficial effects:

[0008] The photocatalytic purification module of this application attaches multiple light-emitting semiconductor particles and multiple photocatalytic semiconductor particles to the porous surface of a conductive adsorption substrate and / or between the conductive adsorption substrate and the pores. After the pores of the conductive adsorption substrate adsorb pollutants, the conductive adsorption substrate is energized, which enhances the adsorption capacity of the conductive adsorption substrate for pollutants. At the same time, it excites the light-emitting semiconductor particles to emit light, and the photocatalytic semiconductor particles directly absorb the light energy of the light-emitting semiconductor particles, improving the efficiency of converting electrical energy into electronic energy. Moreover, it does not require an additional light emitter, nor does it require consideration of the positional design of the light emitter and the photocatalytic material. Instead, it directly integrates the active sites of pollutant reaction on the pores of the conductive adsorption substrate, shortening the distance between pollutants and active sites, shortening the diffusion time and path of pollutant molecules, and increasing the rate of pollutant oxidation and decomposition, thereby improving the purification efficiency of pollutants and efficiently removing pollutants.

[0009] In some embodiments, a plurality of light-emitting semiconductor particles and a plurality of photocatalytic semiconductor particles are alternately distributed along the surface of the pores.

[0010] This configuration allows multiple locations on the surface of the photocatalytic semiconductor particles to absorb sufficient light energy, resulting in higher catalytic activity of the particles, improved oxidation and degradation efficiency of pollutants, and ultimately enhanced pollutant purification efficiency.

[0011] In some embodiments, the pore size is 1 nm to 1000 nm; the particle size of the light-emitting semiconductor particles is 2 nm to 20 nm; and the particle size of the photocatalytic semiconductor particles is 2 nm to 20 nm.

[0012] This setup, based on the structural properties of the actual pollutants, allows for the rational design of the pore size, the particle size of the photocatalytic semiconductor particles, and the particle size of the luminescent semiconductor particles, thereby improving the photocatalytic degradation efficiency of pollutants.

[0013] In some embodiments, the ratio of the sum of the masses of the light-emitting semiconductor particles and the photocatalytic semiconductor particles to the mass of the conductive adsorption substrate is 0.2 to 0.4.

[0014] By setting the ratio of the sum of the masses of the luminescent semiconductor particles and the photocatalytic semiconductor particles to the mass of the conductive adsorption substrate to a range of 0.2 to 0.4, the surface area occupied by the two types of particles, the luminescent semiconductor particles and the photocatalytic semiconductor particles, is within a suitable range. This allows for the integration of more active sites on the pores while ensuring good pore permeability.

[0015] In some embodiments, on the same pore surface, the ratio of the mass of the photocatalytic semiconductor particle to the mass of the luminescent semiconductor particle is 1.5 to 2.

[0016] This configuration, by controlling the ratio of the mass of the photocatalytic semiconductor particles to the mass of the light-emitting semiconductor particles in the same pore within the range of 1.5 to 2, ensures that there are more photocatalytic semiconductor particles than light-emitting semiconductor particles in the pore. This guarantees that the photocatalytic semiconductor particles can be further excited by the light energy generated by the light-emitting semiconductor particles, while ensuring that there are sufficient photocatalytic semiconductor particles, thereby improving the oxidative degradation efficiency of pollutants by the photocatalytic semiconductor particles.

[0017] In some embodiments, the photocatalytic purification module further includes a first electrode and a second electrode, which are respectively disposed on opposite sides of the conductive adsorption substrate.

[0018] With this configuration, by setting the first electrode and the second electrode on opposite sides of the conductive adsorption substrate, a stable and uniform electric field can be applied to the conductive adsorption substrate, so that the light-emitting semiconductor particles attached to the conductive adsorption substrate can be stably excited.

[0019] In some embodiments, a first conductive line is connected to the first electrode, and a second conductive line is connected to the second electrode.

[0020] With this configuration, the first and second conductive lines connect the electrode terminals of the conductive adsorption substrate to an external power source or load, forming a closed loop. This allows the conductive adsorption substrate to be stably energized, enabling the light-emitting semiconductor particles attached to the conductive adsorption substrate to be stably excited.

[0021] In some embodiments, the photocatalytic purification module further includes a conductive housing, the conductive adsorption substrate is disposed inside the conductive housing, and a plurality of pores are evenly distributed on opposite sides of the conductive housing, the pores being in communication with the pores.

[0022] In this configuration, airborne pollutants enter the conductive shell through the pores, then flow into the pores of the conductive adsorption substrate and are adsorbed. When the conductive shell is energized, the conductive adsorption substrate and the light-emitting semiconductor particles attached to it become charged, exciting the semiconductor particles to emit light. This, in turn, drives a photocatalytic reaction in the photocatalytic semiconductor particles within the pores, thereby degrading and removing the pollutants. The purified air then flows out through the pores on the other side of the conductive shell. The conductive shell provides mechanical support to the conductive adsorption substrate, maintaining its stable structural shape, while also allowing for smooth energization of the substrate.

[0023] In some embodiments, the conductive adsorption substrate is configured as an activated carbon honeycomb structure or a graphene honeycomb structure; the luminescent semiconductor particles are configured as ultraviolet luminescent semiconductor particles.

[0024] With this configuration, the conductive adsorption substrate has good conductivity and adsorption properties, and the light-emitting semiconductor particles can generate high-intensity ultraviolet light when energized, which can quickly excite the photocatalytic semiconductor particles.

[0025] Secondly, this application provides a refrigeration device, which includes the photocatalytic purification module described above.

[0026] The refrigeration device according to the second aspect of this application has at least the following beneficial effects:

[0027] The refrigeration device of this application, being equipped with the aforementioned photocatalytic purification module, also possesses the same technical effects brought about by the photocatalytic purification module, and has a better purification effect on the air.

[0028] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0029] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0030] Figure 1 This is a partial structural cross-sectional view of the photocatalytic purification module according to an embodiment of this application.

[0031] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle.

[0032] Figure 3 This is a cross-sectional view of another part of the photocatalytic purification module in an embodiment of this application.

[0033] Figure 4 for Figure 3 A magnified view of a section at point B.

[0034] Figure 5 This is a schematic diagram of the photocatalytic purification module according to an embodiment of this application.

[0035] Figure 6 This is an exploded view of the photocatalytic purification module according to an embodiment of this application.

[0036] Figure 7 This is a schematic diagram of the structure of a refrigeration device according to an embodiment of this application.

[0037] Explanation of reference numerals in the attached drawings: conductive adsorption substrate 100; pores 110; light-emitting semiconductor particles 200; photocatalytic semiconductor particles 300; first electrode 400; second electrode 500; first conductive wire 410; second conductive wire 510; conductive shell 600; pores 610; refrigerator body 700. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0044] Photocatalysis is a technology that uses light energy (usually ultraviolet or visible light) to excite a photocatalyst (such as titanium dioxide) to generate free radicals with strong oxidizing power, thereby decomposing organic pollutants and sterilizing. Photocatalysis is environmentally friendly and highly efficient, and is commonly used in air purification, water treatment, and self-cleaning surfaces.

[0045] In photocatalysis, active sites refer to the key locations on the surface of a photocatalyst that participate in the photocatalytic reaction. They are typically responsible for the separation of photogenerated carriers (electrons and holes), the adsorption / activation of reactants, and the conduct of the catalytic reaction. The nature, number, and distribution of active sites directly affect the efficiency, selectivity, and stability of the photocatalyst.

[0046] In related technologies, the light source in photocatalytic purification devices is generally a mercury lamp or an ultraviolet LED lamp. When a mercury lamp is used as the light source, it is difficult to miniaturize the mercury lamp and mercury is very harmful to the environment. When an ultraviolet LED lamp is used as the light source, the photoelectric conversion efficiency is low, the reactants are far from the active sites, the reaction rate is slow, and the purification efficiency is poor.

[0047] Based on this, one or more embodiments of this application provide a photocatalytic purification module. By attaching luminescent semiconductor particles and photocatalytic semiconductor particles to the porous surface of a conductive adsorption substrate, the pores of the conductive adsorption substrate adsorb pollutants. After the conductive adsorption substrate is energized, its adsorption capacity for pollutants is enhanced. Simultaneously, the luminescent semiconductor particles are excited to emit light. The photocatalytic semiconductor particles on the pore surface directly absorb the light energy of the luminescent semiconductor particles, improving the efficiency of converting electrical energy into electronic energy. Moreover, there is no need to set up an additional light emitter or consider the positional design of the light emitter and the photocatalytic material. Instead, the active sites of pollutant reaction are directly integrated on the pores of the conductive adsorption substrate, shortening the distance between pollutants and active sites, shortening the diffusion time and path of pollutant molecules, and increasing the rate of pollutant oxidation and decomposition, thereby improving the purification efficiency of pollutants and efficiently removing pollutants.

[0048] See Figure 1 and Figure 2 , Figure 3 and Figure 4This application provides a photocatalytic purification module, which includes a conductive adsorption substrate 100, a plurality of light-emitting semiconductor particles 200 and a plurality of photocatalytic semiconductor particles 300.

[0049] The conductive adsorption substrate 100 is constructed as a porous structure, with a plurality of pores 110 distributed on the conductive adsorption substrate 100. A plurality of light-emitting semiconductor particles 200 and a plurality of photocatalytic semiconductor particles 300 are attached to the surface of the pores 110, and / or, a plurality of light-emitting semiconductor particles 200 and a plurality of photocatalytic semiconductor particles 300 are attached between the conductive adsorption substrate 100 and the pores 110.

[0050] It should be noted that, in the embodiments of this application, the conductive adsorption substrate 100 may be, but is not limited to, a conductive porous structure such as an activated carbon honeycomb structure or a graphene honeycomb structure. The shape of the conductive adsorption substrate 100 is not limited and may be a cuboid, a cylinder, a sphere, etc.

[0051] It is understood that the conductive adsorption substrate 100 has good conductivity, and multiple pores 110 are distributed both inside and on its surface. These pores 110 can be independent or interconnected. All pores 110 on the conductive adsorption substrate 100 can include macropores, mesopores, and micropores. Macropores have a diameter greater than 50 nm (nanometers) and their shapes can be, but are not limited to, cylindrical, slit-like, or irregular shapes. Mesopores have a diameter of 2 nm to 50 nm and their shapes can also be, but are not limited to, cylindrical, slit-like, or irregular shapes. Micropores have a diameter less than 2 nm and their shapes can be, but are not limited to, slit-like or ink bottle-like shapes. Macropores and mesopores primarily serve as "transport channels" to rapidly introduce pollutant molecules, such as VOCs (volatile organic compounds), into the conductive adsorption substrate 100. Micropores, with the highest proportion of micropores, have a larger specific surface area and are the main adsorption sites, efficiently adsorbing pollutants such as VOCs molecules, formaldehyde, and benzene compounds through van der Waals forces.

[0052] The distribution and proportion of macropores, mesopores, and micropores on the conductive adsorption substrate 100 can be adaptively designed according to the actual pollutant molecule size and pollutant concentration.

[0053] It is understood that the conductive adsorption substrate 100 is separated from the external air by pores 110, that is, pores 110 are the interface between the conductive adsorption substrate 100 and the external air, and pores 110 can be understood as a thin film. The surface of pores 110 is in direct contact with the external air, while the conductive adsorption substrate 100 and pores 110 are not in direct contact with the external air.

[0054] In this embodiment, the attachment of multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 to the surface of the pores 110 means that multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 are attached to the surface of each pore 110 of the conductive adsorption substrate 100. The particle size of the light-emitting semiconductor particles 200 is smaller than the pore size of the pores 110, and similarly, the particle size of the photocatalytic semiconductor particles 300 is smaller than the pore size of the pores 110.

[0055] The fact that multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 are attached between the conductive adsorption substrate 100 and the pores 110 means that multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 are attached to the side of each pore 110 near the conductive adsorption substrate 100.

[0056] In some embodiments, see Figure 1 and Figure 2 A plurality of light-emitting semiconductor particles 200 and a plurality of photocatalytic semiconductor particles 300 are attached to the surface of the pores 110 on the conductive adsorption substrate 100. In other embodiments, see [reference needed]. Figure 3 and Figure 4 A plurality of light-emitting semiconductor particles 200 and a plurality of photocatalytic semiconductor particles 300 are attached between the conductive adsorption substrate 100 and the pores 110. In other embodiments, a plurality of light-emitting semiconductor particles 200 and a plurality of photocatalytic semiconductor particles 300 are attached to the surface of the pores 110 on the conductive adsorption substrate 100 and between the conductive adsorption substrate 100 and the pores 110.

[0057] When the light-emitting semiconductor particles 200 are attached to the surface of the pores 110, the light-emitting semiconductor particles 200 are exposed relative to the pores 110, forming an air passage between them and the pores 110 for the passage of pollutant molecules. That is, the light-emitting semiconductor particles 200 do not block the pores 110, allowing pollutant molecules to be smoothly introduced into the conductive adsorption substrate 100 and adsorbed by the corresponding pores 110. The same applies to the photocatalytic semiconductor particles 300, which will not be described in detail here.

[0058] When the light-emitting semiconductor particle 200 is attached between the pore 110 and the conductive adsorption substrate 100, the light-emitting semiconductor particle 200 does not occupy the space of the pore 110. The same applies to the photocatalytic semiconductor particle 300, which will not be described in detail here.

[0059] The light-emitting semiconductor particle 200 is a particle structure made of a light-emitting semiconductor material, which can be an ultraviolet light-emitting semiconductor material, such as gallium nitride semiconductor, zinc sulfide semiconductor, etc. The light-emitting semiconductor particle 200 can emit light under an applied electric field or photoexcitation. For example, the light-emitting semiconductor particle 200 is an ultraviolet light-emitting semiconductor particle structure, which can emit ultraviolet light under an applied electric field or photoexcitation.

[0060] The photocatalytic semiconductor particles 300 can be particle structures made of photocatalytic semiconductor materials. The photocatalytic semiconductor particles 300 can be titanium dioxide (TiO2) semiconductor particles or zinc oxide semiconductor particles. Under light irradiation, the photocatalytic semiconductor particles 300 excite electrons to generate active substances such as electron-hole pairs and free radicals. The active substances such as electron-hole pairs and free radicals degrade organic pollutants into carbon dioxide and water, thereby purifying and removing pollutants.

[0061] Taking the purification of air pollutants by a photocatalytic purification module as an example, the working principle of the photocatalytic purification module is explained as follows: When air flows through the conductive adsorption substrate 100 of the photocatalytic purification module, the pollutants in the air are adsorbed by the conductive adsorption substrate 100 and enter the pores 110 of the conductive adsorption substrate 100. When the conductive adsorption substrate 100 is energized, the light-emitting semiconductor particles 200 attached to the surface of the pores 110 and / or attached between the conductive adsorption substrate 100 and the pores 110 are excited under the action of charge carriers. The light-emitting semiconductor particles 200 generate electrons and holes, which migrate to the photocatalytic semiconductor particles 300 on the surface of the pores 110 and / or between the conductive adsorption substrate 100 and the pores 110. At the same time, some electrons and holes recombine near the PN junction to generate light. The light is directly absorbed by the photocatalytic semiconductor particles 300, which excites the photocatalytic semiconductor particles 300 to generate electrons and holes. The electrons and holes generated by the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 drive the oxidation-reduction reaction, oxidizing and decomposing the air pollutants into carbon dioxide and water, thereby removing the pollutants from the air.

[0062] It should be noted that the photocatalytic purification module of this application attaches the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 to the surface of the pores 110 of the conductive adsorption substrate 100 and / or between the conductive adsorption substrate 100 and the pores 110. After the pores 110 of the conductive adsorption substrate 100 adsorb pollutants, the conductive adsorption substrate 100 is energized to enhance its adsorption capacity for pollutants. At the same time, the light-emitting semiconductor particles 200 are excited to emit light, and the photocatalytic semiconductor particles 300 directly absorb the light energy of the light-emitting semiconductor particles 200, improving the efficiency of converting electrical energy into electronic energy. Moreover, there is no need to set up an additional light emitter, nor is it necessary to consider the positional design of the light emitter and the photocatalytic material. Instead, the active sites of pollutant reaction are directly integrated on the pores 110 of the conductive adsorption substrate 100, shortening the distance between the pollutants and the active sites, shortening the diffusion time and path of pollutant molecules, and increasing the rate of pollutant oxidation and decomposition, thereby improving the purification efficiency of pollutants and efficiently removing pollutants.

[0063] In some embodiments of this application, see Figure 1 and Figure 2 ,or Figure 3 and Figure 4 Multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 are alternately distributed along the surface of the pores 110.

[0064] It should be noted that the pores 110 of the conductive adsorption substrate 100 can be understood as channels with a certain axial length. The alternating distribution of multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 along the surface of the pores 110 means that: along the circumferential direction of the inner surface of the pores 110, the light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 are alternately distributed; along the axial direction of the inner surface of the pores 110, the light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 are alternately distributed, so that multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 are staggered and attached to the inner surface of the pores 110.

[0065] With this configuration, when the conductive adsorption substrate 100 is energized, the light-emitting semiconductor particles 200 are excited by conductivity and emit light. The light emitted by the light-emitting semiconductor particles 200, after rectilinear propagation, reflection, and refraction, irradiates the photocatalytic semiconductor particles 300. The alternating distribution of multiple light-emitting semiconductor particles 200 and multiple photocatalytic semiconductor particles 300 along the surface of the pores 110 allows multiple locations on the surface of the photocatalytic semiconductor particles 300 to absorb sufficient light energy, thereby increasing the catalytic activity of the photocatalytic semiconductor particles 300, improving the efficiency of oxidative degradation of pollutants, and thus improving the efficiency of pollutant purification.

[0066] In some embodiments of this application, the pore size of the pore 110 is 1 nm to 1000 nm; the particle size of the light-emitting semiconductor particle 200 is 2 nm to 20 nm; and the particle size of the photocatalytic semiconductor particle 300 is 2 nm to 20 nm.

[0067] It should be noted that the shape of the pores 110 of the conductive adsorption substrate 100 includes regular cylindrical, spherical and irregular shapes. When the pores 110 are irregular shapes, the pore diameter of the pores 110 refers to the equivalent diameter, that is, the pore diameter of the pores 110 is equivalent to the diameter of a regular geometric shape (such as a cylinder or a sphere) with the same physical properties.

[0068] Specifically, the pore size of the pore 110 is at least 2 to 3 times the particle size of the photocatalytic semiconductor particle 300 and also 2 to 3 times the particle size of the light-emitting semiconductor particle 200. The particle size of the photocatalytic semiconductor particle 300 and the particle size of the light-emitting semiconductor particle 200 are approximately the same, so that the photocatalytic semiconductor particle 300 and the light-emitting semiconductor particle 200 can smoothly enter the pore 110 and be loaded relatively uniformly on the surface of the pore 110, thereby enhancing the adhesion stability of the photocatalytic semiconductor particle 300 and the light-emitting semiconductor particle 200 on the surface of the pore 110 and reducing the probability of the photocatalytic semiconductor particle 300 and the light-emitting semiconductor particle 200 detaching from the surface of the pore 110.

[0069] By rationally designing the pore size of pore 110, the particle size of photocatalytic semiconductor particles 300, and the particle size of light-emitting semiconductor particles 200 based on the structural properties of actual pollutants, the photocatalytic degradation efficiency of pollutants can be improved.

[0070] In some embodiments of this application, the ratio of the sum of the masses of the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 to the mass of the conductive adsorption substrate 100 is 0.2 to 0.4.

[0071] It should be noted that the ratio of the sum of the masses of the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 to the mass of the conductive adsorption substrate 100 refers to the ratio of the sum of the masses of all the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 attached to the conductive adsorption substrate 100 to the mass of the conductive adsorption substrate 100.

[0072] The ratio of the sum of the masses of the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 to the mass of the conductive adsorption substrate 100 indirectly reflects the proportion of the surface area of ​​the pores 110 of the conductive adsorption substrate 100 occupied by the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300. If the proportion of the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 is too high, it increases the risk of pore blockage, reduces the exposed area of ​​active sites, hinders the contact between pollutants and the photocatalytic semiconductor particles 300, and weakens the adsorption capacity of the pores 110 for pollutants. If the proportion of the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 is too low, there are insufficient active sites, and the degradation efficiency of pollutants decreases.

[0073] Based on this, by setting the ratio of the sum of the masses of the light-emitting semiconductor particles 200 and the photocatalytic semiconductor particles 300 to the mass of the conductive adsorption substrate 100 in the range of 0.2 to 0.4, the two types of particles, light-emitting semiconductor particles 200 and photocatalytic semiconductor particles 300, occupy the surface area of ​​the pores 110 within a suitable range. This allows for the integration of more active sites on the pores 110 while ensuring good permeability of the pores 110.

[0074] In some embodiments of this application, on the same surface of the pore 110, the mass ratio of the photocatalytic semiconductor particle 300 to the mass of the light-emitting semiconductor particle 200 is 1.5 to 2.

[0075] On the surface of the pore 110, it is necessary to ensure that the light energy generated by the light-emitting semiconductor particle 200 after being energized is sufficient to excite the photocatalytic semiconductor particle 300. At the same time, it is also necessary to ensure that the photocatalytic semiconductor particle 300 has good catalytic activity. Excessive light-emitting semiconductor particles 200 will increase the probability of light scattering by the light-emitting semiconductor particles 200, while insufficient light-emitting semiconductor particles 200 will make it difficult to generate sufficient light energy.

[0076] Based on this, by controlling the ratio of the mass of the photocatalytic semiconductor particle 300 to the mass of the light-emitting semiconductor particle 200 on the same pore 110 within the range of 1.5 to 2, the number of photocatalytic semiconductor particles 300 on the pore 110 is greater than that of the light-emitting semiconductor particles 200. This ensures that the photocatalytic semiconductor particles 300 can be further excited by the light energy generated by the light-emitting semiconductor particles 200, while also ensuring that there are sufficient photocatalytic semiconductor particles 300, thereby improving the oxidative degradation efficiency of pollutants by the photocatalytic semiconductor particles 300.

[0077] In some embodiments of this application, see Figure 5 and Figure 6 The photocatalytic purification module also includes a first electrode 400 and a second electrode 500, which are respectively disposed on opposite sides of the conductive adsorption substrate 100.

[0078] Specifically, in one embodiment, the conductive adsorption substrate 100 is rectangular, and the first electrode 400 and the second electrode 500 are respectively attached to two opposite surfaces of the conductive adsorption substrate 100. In another embodiment, the conductive adsorption substrate 100 is cylindrical, and the first electrode 400 and the second electrode 500 are respectively attached to two opposite circular end faces of the conductive adsorption substrate 100.

[0079] The first electrode 400 and the second electrode 500 can be understood as the positive and negative terminals of the conductive adsorption substrate 100. The first electrode 400 can be made of high-quality graphene material and activated carbon nanotubes. The specific fabrication process of the first electrode 400 is as follows: a graphene film is prepared by chemical vapor deposition, and the graphene film is transferred onto a conductive substrate, which can be copper foil or stainless steel mesh, forming the first electrode 400 with high mechanical strength, ensuring efficient electron transport and structural stability. Alternatively, the first electrode 400 can also be fabricated by depositing a thin and uniform metal layer on a stainless steel mesh using electroplating. The stainless steel mesh can be silver-plated or gold-plated to improve the corrosion resistance of the first electrode 400. The fabrication method of the second electrode 500 is similar and will not be described further.

[0080] By applying a stable voltage to the first electrode 400 and the second electrode 500, the conductive adsorption substrate 100 is charged, thereby conducting charge carriers to the light-emitting semiconductor particles 200 on the surface of the pores 110 of the conductive adsorption substrate 100. This excites and drives the light-emitting semiconductor particles 200 to emit light, causing the photocatalytic semiconductor particles 300 on the pores 110 to drive a photocatalytic reaction, oxidizing and decomposing the pollutants adsorbed in the pores 110. Moreover, after the conductive adsorption substrate 100 is charged, it can adsorb salts, heavy metals, and other pollutants, improving the removal efficiency of pollutants.

[0081] It is easy to understand that by providing a first electrode 400 and a second electrode 500 on opposite sides of the conductive adsorption substrate 100, a stable and uniform electric field can be applied to the conductive adsorption substrate 100, so that the light-emitting semiconductor particles 200 attached to the conductive adsorption substrate 100 can be stably excited.

[0082] Further, see Figure 5 and Figure 6 The first electrode 400 is connected to a first conductive line 410, and the second electrode 500 is connected to a second conductive line 510.

[0083] The first conductive line 310 and the second conductive line 410 connect the electrode terminals of the conductive adsorption substrate 100 to an external power source or load to form a closed circuit, thereby enabling the conductive adsorption substrate 100 to be stably energized and allowing the light-emitting semiconductor particles 200 attached to the conductive adsorption substrate 100 to be stably excited.

[0084] In some embodiments of this application, see Figure 5 and Figure 6 The photocatalytic purification module also includes a conductive housing 600, a conductive adsorption substrate 100 disposed inside the conductive housing 600, and a plurality of pores 610 evenly distributed on opposite sides of the conductive housing 600, the pores 610 being connected to the pores 110.

[0085] Specifically, both the conductive housing 600 and the conductive adsorption substrate 100 are rectangular. The conductive adsorption substrate 100 fills the internal cavity of the conductive housing 600. The left and right walls of the conductive housing 600 form two electrodes of the conductive adsorption substrate 100. Multiple pores 610 are evenly distributed on the front and rear walls of the conductive housing 600. The pores 610 communicate with the internal cavity of the conductive housing 600, thereby communicating with the pores 110 on the conductive adsorption substrate 100. The upper and lower walls of the conductive housing 600 are sealed.

[0086] Air pollutants enter the conductive housing 600 through the pores 610, then flow into the pores 110 of the conductive adsorption substrate 100 and are adsorbed. When the conductive housing 600 is energized, the conductive adsorption substrate 100 and the light-emitting semiconductor particles 200 attached to it become charged, exciting the light-emitting semiconductor particles 200 to emit light. This causes the photocatalytic semiconductor particles 300 on the pores 110 to drive a photocatalytic reaction, thereby degrading and removing the pollutants. The purified air then flows out through the pores 610 on the other side of the conductive housing 600.

[0087] The conductive housing 600 provides mechanical support for the conductive adsorption substrate 100, enabling the conductive adsorption substrate 100 to maintain a stable structural shape, while also allowing the conductive adsorption substrate 100 to conduct electricity smoothly.

[0088] In addition, this application also provides a refrigeration device, which includes the photocatalytic purification module of any of the above embodiments.

[0089] Specifically, see Figure 7 The refrigeration device includes a refrigeration box 700, and a photocatalytic purification module is installed in the cavity of the refrigeration box 700 to purify the air inside the refrigeration box 700 and remove odors from the refrigeration box 700.

[0090] It is easy to understand that the refrigeration unit is equipped with the aforementioned photocatalytic purification module, and therefore has the same technical effect as the photocatalytic purification module, resulting in a better purification effect on the air.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A photocatalytic purification module, characterized in that, include: A conductive adsorption substrate is constructed as a porous structure, wherein multiple pores are distributed on the conductive adsorption substrate. Multiple light-emitting semiconductor particles and multiple photocatalytic semiconductor particles are attached to the surface of the pores, and / or, multiple light-emitting semiconductor particles and multiple photocatalytic semiconductor particles are attached between the conductive adsorption substrate and the pores.

2. The photocatalytic purification module according to claim 1, characterized in that, The plurality of light-emitting semiconductor particles and the plurality of photocatalytic semiconductor particles are alternately distributed along the surface of the pores.

3. The photocatalytic purification module according to claim 1, characterized in that, The pore size is 1 nm to 1000 nm; the particle size of the light-emitting semiconductor particles is 2 nm to 20 nm; and the particle size of the photocatalytic semiconductor particles is 2 nm to 20 nm.

4. The photocatalytic purification module according to claim 1, characterized in that, The ratio of the sum of the masses of the light-emitting semiconductor particles and the photocatalytic semiconductor particles to the mass of the conductive adsorption substrate is 0.2 to 0.

4.

5. The photocatalytic purification module according to claim 1, characterized in that, On the same porous surface, the ratio of the mass of the photocatalytic semiconductor particle to the mass of the luminescent semiconductor particle is 1.5 to 2.

6. The photocatalytic purification module according to claim 1, characterized in that, The photocatalytic purification module further includes a first electrode and a second electrode, which are respectively disposed on opposite sides of the conductive adsorption substrate.

7. The photocatalytic purification module according to claim 6, characterized in that, The first electrode is connected to a first conductive line, and the second electrode is connected to a second conductive line.

8. The photocatalytic purification module according to claim 1, characterized in that, The photocatalytic purification module also includes a conductive housing, the conductive adsorption substrate is disposed inside the conductive housing, and a plurality of pores are evenly distributed on opposite sides of the conductive housing, the pores being in communication with the pores.

9. The photocatalytic purification module according to claim 1, characterized in that, The conductive adsorption substrate is configured as an activated carbon honeycomb structure or a graphene honeycomb structure; the light-emitting semiconductor particles are configured as ultraviolet light-emitting semiconductor particles.

10. A refrigeration device, characterized in that, Includes the photocatalytic purification module as described in any one of claims 1 to 9.

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