Polysilicon crushing system

Abstract

The utility model discloses a kind of polysilicon crushing systems, including conveying device, handling manipulator and crushing device, conveying device includes machine table, first carrier and first drive module, first drive module is set to machine table, for driving first carrier to shift to set position;Wherein, first carrier is provided with multiple first bearing parts side by side, each first bearing part is equipped with multiple first bearing grooves along its sliding direction;Handling manipulator includes the mechanical arm and clamping component connected, and mechanical arm controls clamping component movement;Clamping component is equipped with at least two relative motion clamping pieces, and at least part clamping piece can extend into the gap between adjacent first bearing part to hold silicon column;Crushing device is used to receive the silicon column that handling manipulator is input, and silicon column is broken down. The first bearing part of first carrier and the clamping piece of clamping jaw component can be matched, and clamping jaw component can conveniently grab silicon column from first bearing part, to input crushing device.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a polycrystalline silicon crushing system. Background Technology

[0002] Polycrystalline silicon needs to be pulverized before use. This requires high-temperature and cooling treatment to facilitate subsequent pulverization.

[0003] In related technologies, during the cooling process of polycrystalline silicon, a support mechanism is typically used to immerse the heated polycrystalline silicon in liquid cooling water. After the polycrystalline silicon has cooled sufficiently, it is removed from the liquid cooling water. Then, a handling robot grabs the cooled silicon column from the support and puts it into a crushing device. Typically, the polycrystalline silicon is heated to 450℃-500℃ and then rapidly cooled by immersing it in high-purity water at room temperature. Due to the physical property of thermal expansion and contraction, the polycrystalline silicon experiences drastic changes in internal stress, resulting in numerous cracks. This allows for better subsequent crushing of the silicon column.

[0004] However, the handling robot cannot easily grab the silicon pillar from the carrier mechanism, resulting in a slow crushing efficiency of the silicon pillar. Utility Model Content

[0005] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a polycrystalline silicon crushing system, in which a handling robot can conveniently grab silicon pillars from a material transfer device and feed them into the crushing device.

[0006] In a first aspect, embodiments of this application provide a polycrystalline silicon crushing system, comprising:

[0007] The material transfer device includes a machine base, a first carrier, and a first drive module. The first drive module is disposed on the machine base and is used to drive the first carrier to slide to a set position. The first carrier has a plurality of first bearing parts arranged in parallel, and each first bearing part has a plurality of first bearing grooves along its sliding direction for bearing silicon pillars.

[0008] Polycrystalline silicon crushing system for crushing silicon pillars;

[0009] A handling robot includes a connected robotic arm and a gripping assembly, wherein the robotic arm controls the movement of the gripping assembly; wherein the gripping assembly has at least two relatively movable gripping members, and at least a portion of the gripping members can extend into the gap between adjacent first bearing portions to grip the silicon pillar.

[0010] According to some embodiments of the present invention, the material transfer device further includes a second carrier and a second drive module, the second drive module being used to drive the second carrier to move up and down; wherein, the second carrier has a plurality of second bearing parts arranged in parallel, each of the first bearing parts having a plurality of second bearing grooves along its extension direction, and the first bearing parts and the second bearing parts being staggered.

[0011] The first carrier includes a feeding section and a discharging section, which are equidistant from each other. When the feeding section extends relative to the second carrier, it receives the incoming silicon pillars, and the discharging section is aligned with the second carrier to support the silicon pillars on the second carrier. When the discharging section extends relative to the second carrier, the clamping member can clamp the silicon pillars from the discharging section, and the feeding section is aligned with the second carrier to transfer the silicon pillars into the second carrier.

[0012] According to some embodiments of the present invention, the clamping member is provided with a plurality of clamping grooves in the extension direction, and the number of such grooves is the same as the number of the first bearing grooves provided in the discharge section.

[0013] According to some embodiments of the present invention, the clamping groove is provided with relatively unfolded guide slopes.

[0014] According to some embodiments of the present invention, the side wall of the clamping groove is provided with a first support pad.

[0015] According to some embodiments of the present invention, the first carrier further includes an intermediate section, which is connected between the feeding section and the discharging section; wherein, the length of the intermediate section is X1, and the lengths of the feeding section and the discharging section are X2, X1 = nX2, and n is greater than or equal to 1.

[0016] According to some embodiments of the present invention, the first bearing groove is provided with a first unfolding inclined surface that unfolds relatively; the second bearing groove is provided with a second unfolding inclined surface that unfolds relatively.

[0017] According to some embodiments of the present invention, the first unfolding inclined surface and the second unfolding inclined surface are provided with a second support pad.

[0018] According to some embodiments of the present invention, the polycrystalline silicon crushing system further includes a heating device and a cooling device. The heating device is used to heat the silicon column to be crushed at a high temperature and then transfer it to the cooling device. The cooling device cools the silicon column and then transfers it to the material transfer device.

[0019] According to some embodiments of the present invention, the cooling device includes:

[0020] A water tank, used to hold liquid cooling water;

[0021] A handling mechanism includes a mounting frame, a first power module, a second power module, and a support base. The mounting frame is disposed on one side of the water tank. The first power module is disposed on the mounting frame, and the second power module is disposed on the first power module. The support base is connected to the second power module and located within the water tank. The first power module drives the support base to move up and down, and the second power module drives the support base to move horizontally along a predetermined direction. The first power module also drives the support base to sink downwards into the liquid-cooled water, causing the silicon pillars on the support base to sink downwards into the liquid-cooled water. The second power module drives the support base to move along the predetermined direction in the liquid-cooled water.

[0022] The support base has multiple third support parts arranged in parallel, and each third support part has multiple third support grooves along its extension direction. Under the action of the first drive module, the first support part can extend into the space between adjacent third support parts to support the silicon pillar on the third support part.

[0023] As can be seen from the above technical solution, the embodiments of this application have the following advantages: The silicon pillar to be crushed is placed on the first bearing groove of the first bearing part, and the first drive module drives the first carrier to move towards the direction of the handling robot until the silicon pillar is transported to the required position. The robot arm controls the clamping assembly to move towards the material transfer device, and part of the clamping member extends between the adjacent first bearing parts, thereby lifting the silicon pillar on the bearing member, and cooperating with another clamping member, the clamping member firmly clamps the silicon pillar. Then, the robot arm controls the clamping assembly to detach from the first carrier and move to directly above the crushing device. Then, the clamping assembly releases the clamping force on the silicon pillar, thereby putting the silicon pillar into the crushing device, and the crushing device crushes the polycrystalline silicon. It can be understood that the first bearing part of the first carrier and the clamping member of the gripper assembly can cooperate, and the gripper assembly can easily grab the silicon pillar from the first bearing part to transport it directly above the crushing device. With this setting, the handling robot can quickly supply the silicon pillar to be crushed to the crushing device, thereby ensuring the crushing efficiency of the silicon pillar. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the polycrystalline silicon crushing system according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the polycrystalline silicon crushing system according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the polycrystalline silicon crushing system according to an embodiment of the present invention;

[0027] Figure 4This is a schematic diagram of the polycrystalline silicon crushing system according to an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the polycrystalline silicon crushing system according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the polycrystalline silicon crushing system according to an embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of the polycrystalline silicon crushing system according to an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of the structure of the polycrystalline silicon crushing system according to an embodiment of the present invention.

[0032] The meanings of the reference numerals in the attached figures are as follows:

[0033] 100. Material conveying device; 110. Machine platform; 120. First carrier; 121. First bearing section; 122. First bearing trough; 1221. First unfolding ramp; 123. Feeding section; 124. Discharge section; 125. Intermediate section; 130. First drive module; 140. Second carrier; 141. Second bearing section; 142. Second bearing trough; 1421. Second unfolding ramp; 150. Second drive module; 200. Crushing device; 300. Transfer device 310. Robotic arm; 320. Clamping assembly; 321. Clamping component; 322. Clamping groove; 3221. Guide slope; 400. Cooling device; 410. Water tank; 420. Handling mechanism; 421. Mounting frame; 422. First power module; 423. Second power module; 424. Bearing seat; 4241. Third bearing part; 4242. Third bearing groove; 425. First support pad; 500. Heating device; 600. Silicon pillar. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, up, down, etc., indicating the directional or positional relationship, are based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0037] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0038] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] The present invention will now be described in further detail with reference to the accompanying drawings.

[0040] Please see Figures 1 to 4 This utility model provides a polycrystalline silicon crushing system, including a material transfer device 100, a crushing device 200, and a handling robot 300. The material transfer device 100 includes a machine base 110, a first carrier 120, and a first drive module 130. The first drive module 130 is disposed on the machine base 110 and is used to drive the first carrier 120 to slide to a set position. The first carrier 120 has multiple first bearing portions 121 arranged side-by-side, and each first bearing portion 121 has multiple first bearings along its sliding direction. The carrier groove 122 is used to carry the silicon pillar 600; the handling robot 300 includes a connected robotic arm 310 and a clamping assembly 320, wherein the robotic arm 310 controls the movement of the clamping assembly 320; wherein the clamping assembly 320 is provided with at least two relatively movable clamping members 321, and at least a portion of the clamping members 321 can extend into the gap between adjacent first carrier portions 121 to clamp the silicon pillar 600; the crushing device 200 is used to receive the silicon pillar 600 fed by the handling robot 300 and crush the silicon pillar 600.

[0041] Specifically, the silicon ingot 600 to be crushed is placed in the first support groove 122 of the first support part 121. The first drive module 130 drives the first carrier 120 to move towards the transport robot 300 until the silicon ingot 600 is transported to the required position. The robot arm 310 controls the clamping assembly 320 to move towards the material transfer device 100. Part of the clamping member 321 extends between adjacent first support parts 121, thereby lifting the silicon ingot 600 on the carrier and cooperating with another clamping member 321 to firmly clamp the silicon ingot 600. Then, the robot arm 310 controls the clamping assembly 320 to detach from the first carrier 120 and move to directly above the crushing device 200. Then, the clamping assembly 320 releases the clamping force on the silicon ingot 600, thereby putting the silicon ingot 600 into the crushing device 200, where the crushing device 200 crushes the polycrystalline silicon. Understandably, the first bearing portion 121 of the first carrier 120 can cooperate with the gripping member 321 of the gripper assembly, allowing the gripper assembly to easily pick up the silicon pillar 600 from the first bearing portion 121 and transport it directly above the crushing device 200. Thus, the handling robot 300 can quickly supply the crushing device 200 with the silicon pillar 600 to be crushed, thereby ensuring the crushing efficiency of the silicon pillar 600.

[0042] In some embodiments, please refer to Figures 2 to 4 The material transfer device 100 further includes a second carrier 140 and a second drive module 150. The second drive module 150 is used to drive the second carrier 140 to move up and down. The second carrier 140 has a plurality of second support parts 141 arranged in parallel. Each first support part 121 has a plurality of second support grooves 142 along its extension direction. The first support parts 121 and the second support parts 141 are staggered. Thus, the second support parts 141 can move up and down through the gaps between the first support parts 121 to lift the silicon pillars 600 on the first support parts 121 or place the lifted silicon pillars 600 on the first support parts 121.

[0043] The first carrier 120 includes a feeding section 123 and a discharging section 124, which are equidistant from each other. When the feeding section 123 extends relative to the second carrier 140, it receives the incoming silicon pillar 600, and the discharging section 124 is aligned with the second carrier 140 to support the silicon pillar 600 on the second carrier 140. When the discharging section 124 extends relative to the second carrier 140, the clamping member 321 can clamp the silicon pillar 600 from the discharging section 124, and the feeding section 123 is aligned with the second carrier 140 to transfer the silicon pillar 600 into the second carrier 140.

[0044] For specific applications, please also refer to Figure 5During the feeding stage, the first drive module 130 drives the first carrier 120 to slide towards the cooling device 400, and the feeding section 123 is extended relative to the second carrier 140, thereby placing the cooled silicon pillar 600 into the first bearing groove 122 of the feeding section 123. At the same time, the discharging section 124 is aligned with the second carrier 140, and the first bearing groove 122 is aligned with the second bearing groove 142. Therefore, the second drive module 150 drives the second carrier 140 to move downward, and the second carrier 140 places the silicon pillar 600 it carries onto the first carrier 120. That is, the discharging section 124 of the first carrier 120 is loaded with a silicon pillar.

[0045] During the unloading phase, the first drive module 130 drives the first carrier 120 to move toward the handling robot 300. The feeding section 123 of the first carrier 120 overlaps with the second carrier 140. At this time, the silicon pillar 600 on the first carrier 120 is directly above the second carrier 140. Then, the second drive module 150 drives the second carrier 140 to move upward. The second carrier 140 lifts the silicon pillar 600 on the first carrier 120. That is, the second carrier 140 lifts the silicon pillar 600 on the feeding section 123, except for the silicon pillar 600 on the discharge section 124. At the same time, the discharge section 124 of the first carrier 120 is in an extended state relative to the second carrier 140. The gripper 321 of the gripper assembly extends into the gap of the first bearing part 121 of the discharge section 124, thereby gripping the workpiece on the discharge section 124. In the cycle of the above loading and unloading stages, with the assistance of the second carrier 140, the first carrier 120 continuously receives the cooled silicon pillars 600 through the feeding section 123, and transfers them to the discharge section 124 of the first carrier 120 through the second carrier 140, thereby continuously supplying silicon pillars 600 to the handling robot 300.

[0046] In some embodiments, please refer to Figures 3 to 4 To ensure the clamping member 321 can securely hold the silicon pillars 600, the clamping member 321 is provided with multiple clamping grooves 322 along its extension direction, enabling it to simultaneously clamp multiple silicon pillars 600. The number of clamping grooves 322 on the clamping member 321 is the same as the number of first bearing grooves 122 on the discharge section 124. For example, each first bearing part 121 of the discharge section 124 has three first bearing grooves 122, and correspondingly, three clamping grooves 322 are provided sequentially along the extension direction of the clamping member 321. When the clamping member 321 extends between adjacent first bearing parts 121, each clamping groove 322 corresponds to one silicon pillar 600. Thus, the clamping assembly 320 can simultaneously clamp all the silicon pillars 600 on the discharge section 124. Therefore, the handling robot 300 can quickly grasp multiple silicon pillars 600 for input into the crushing device 200, thereby ensuring the crushing efficiency of the crushing device 200.

[0047] In some embodiments, please refer to Figures 2 to 4 The clamping groove 322 is provided with a relatively unfolded guide slope 3221, or in other words, the clamping groove 322 is roughly V-shaped. It can be understood that by adopting the above-described structural form, the clamping groove 322 can flexibly accommodate silicon pillars 600 of various diameters; moreover, the placement opening of the clamping groove 322 is relatively large, and the clamping member 321 can conveniently clamp the silicon pillar 600 through the clamping groove 322.

[0048] Furthermore, the sidewall of the clamping groove 322 is provided with a first support pad 425. It can be understood that the first support pad 425 increases the friction between the clamping groove 322 and the silicon pillar 600, thereby ensuring that the clamping member 321 can firmly clamp the silicon pillar 600 for placement into the crushing device 200. Additionally, the first support pad 425 effectively prevents the first carrier 120 from contaminating the silicon pillar 600, thus ensuring the future use of the silicon pillar 600.

[0049] In some embodiments, please refer to Figures 2 to 4 The first carrier 120 further includes an intermediate section 125, which is connected between the feeding section 123 and the discharging section 124; wherein the length of the intermediate section 125 is X1, and the lengths of the feeding section 123 and the discharging section 124 are X2, X1 = nX2, and n is greater than or equal to 1.

[0050] For example, the length of the intermediate section 125 is the same as the distance between the feeding section 123 and the discharging section 124. The feeding section 123 and the discharging section 124 carry three silicon pillars 600 at a time, and correspondingly, the intermediate section 125 carries three silicon pillars 600 at a time. At the same time, the length of the second carrier 140 is twice the length of the second carrier 140, so the second carrier 140 carries six silicon pillars 600 at a time.

[0051] Therefore, during the aforementioned feeding and discharging stages, after the feeding section places the silicon pillars 600 at the first three positions of the second carrier 140, the intermediate section 125 supports the silicon pillars 600 as the second carrier 140 moves downward when the feeding section is in the extended state. When the discharging section 124 is in the extended state, the intermediate section 125 moves to the last three positions of the second carrier 140, thereby transporting the silicon pillars 600 from the first three positions of the second carrier 140 to the last three positions, and the discharging section 124 supports the aforementioned three silicon pillars 600 from these positions. As can be seen from the above, through the arrangement of the intermediate section 125, the intermediate section 125 realizes the conveying of the silicon pillars 600 along the extension direction of the second carrier 140, so that the silicon pillars 600 fed by the feeding section 123 can be transported to the discharging section 124, thereby realizing the material conveying.

[0052] In some embodiments, the first carrier groove 122 is provided with a relatively unfolded first unfolding slope 1221, or in other words, the first carrier groove 122 is generally V-shaped. It is understood that by adopting the above-described structural form, the first carrier groove 122 can flexibly accommodate silicon pillars 600 of various diameters; moreover, the placement opening of the first carrier groove 122 is relatively large, thereby allowing the silicon pillars 600 to be conveniently placed in or removed from the first carrier groove 122. Similarly, the second carrier groove 142 is provided with a relatively unfolded second unfolding slope 1421, or in other words, the second carrier groove 142 is generally V-shaped. It is understandable that the second carrier groove 142 adopts the above-described structural form, and the second carrier groove 142 can be flexibly used to place silicon pillars 600 of various diameters; moreover, the placement opening of the second carrier groove 142 is set to be relatively large, so that the silicon pillars 600 can be placed in the second carrier groove 142 more conveniently, or can be taken out of the second carrier groove 142 more conveniently.

[0053] Furthermore, both the first unfolding inclined surface 1221 and the second unfolding inclined surface 1421 are provided with second support pads (not shown in the figure). It can be understood that the sidewalls of the first bearing groove 122 and the second bearing groove 142, through the provision of the second support pads, increase the friction between the first bearing groove 122 and the silicon pillar 600, thereby ensuring that the silicon pillar 600 can be stably placed in the first bearing groove 122 and the second bearing groove 142. In addition, the second support pads effectively prevent the first carrier 120 or the second carrier 140 from contaminating the silicon pillar 600, thereby ensuring the quality of the silicon pillar 600 after breakage.

[0054] In some embodiments, please refer to Figure 1 The crushing device 200 further includes a heating device 500 and a cooling device 400. The heating device 500 is used to heat the silicon column 600 to be crushed at a high temperature and then transfer it to the cooling device 400. The cooling device 400 cools the silicon column 600 and then transfers it to the material transfer device 100.

[0055] In practical applications, the silicon pillar 600 to be heated is placed in the heating device 500, which heats the silicon pillar 600. The heated silicon pillar 600 is then transferred to the cooling device 400, which cools the silicon pillar 600. The cooled silicon pillar 600 is then transferred to the material transfer device 100, where the handling robot 300 picks up the silicon pillar 600 to be crushed from the material transfer device 100 and puts it into the crushing device 200.

[0056] Further, please refer to Figures 5 to 8 The cooling device 400 includes a water tank 410 and a conveying mechanism 420. The water tank 410 is used to hold liquid cooling water. The conveying mechanism 420 includes a mounting frame 421, a first power module 422, a second power module 423, and a support 424. The mounting frame 421 is disposed on one side of the water tank 410. The first power module 422 is disposed on the mounting frame 421. The second power module 423 is disposed on the first power module 422. The support 424 is connected to the second power module 423 and is located inside the water tank 410. The first power module 422 is used to drive the support 424 to move up and down. The second power module 423 is used to drive the support 424 to move horizontally in a set direction. The first power module 422 is used to drive the support 424 to sink into the liquid-cooled water, so that the silicon pillar 600 on the support 424 sinks into the liquid-cooled water. The second power module 423 is used to drive the support 424 to move in the liquid-cooled water along the set direction.

[0057] Also see Figure 4 The support base 424 is provided with a plurality of third support parts 4241 arranged in parallel. Each of the third support parts 4241 is provided with a plurality of third support grooves 4242 along its extension direction. Under the action of the first power module 422, the first support part 121 can extend into the space between adjacent third support parts 4241 to support the silicon pillar 600 on the third support part 4241.

[0058] During the loading stage, the first power module 422 drives the support seat 424 to move upward via the second power module 423, and the silicon pillar 600 emitted by the heating device 500 is placed in the third support groove 4242 of the third support part 4241. During the cooling stage, the first power module 422 drives the support seat 424 to move downward via the second power module 423, and the silicon pillar 600 on the support seat 424 is submerged in liquid cooling water. Then, the second power module 423 drives the support seat 424 to move in the liquid cooling water, and when it moves to a set position, the first power module 422 drives the support seat 424 to move upward to a set height. At this time, the height of the support seat 424 is approximately the same as the height of the first carrier 120.

[0059] At this time, the first drive module 130 drives the first carrier 120 to move toward the carrier 424, and the third carrier portion 4241 of the carrier 424 coincides with the first carrier portion 121 of the feeding section 123. The first power module 422 drives the carrier 424 to move downward, and the carrier 424 places the silicon pillar 600 on the first carrier groove 122 of the feeding section 123, thereby completing the feeding of the material transfer device 100.

[0060] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A polycrystalline silicon crushing system, characterized in that, include: The material transfer device includes a machine base, a first carrier, and a first drive module. The first drive module is disposed on the machine base and is used to drive the first carrier to slide to a set position. The first carrier has a plurality of first bearing parts arranged in parallel, and each first bearing part has a plurality of first bearing grooves along its sliding direction for bearing silicon pillars. A handling robot includes a connected robotic arm and a gripping assembly, wherein the robotic arm controls the movement of the gripping assembly; wherein the gripping assembly has at least two relatively movable gripping members, and at least a portion of the gripping members can extend into the gap between adjacent first bearing portions to grip the silicon pillar; A crushing device is used to receive the silicon pillars fed in by the handling robot and crush the silicon pillars.

2. The polycrystalline silicon crushing system according to claim 1, characterized in that, The material transfer device further includes a second carrier and a second drive module. The second drive module is used to drive the second carrier to move up and down. The second carrier has a plurality of second bearing parts arranged in parallel. Each first bearing part has a plurality of second bearing grooves along its extension direction. The first bearing parts and the second bearing parts are staggered. The first carrier includes a feeding section and a discharging section, which are equidistant from each other. When the feeding section extends relative to the second carrier, it receives the incoming silicon pillar, and the discharging section is aligned with the second carrier to support the silicon pillar on the second carrier. When the discharging section extends relative to the second carrier, the clamping member can clamp the silicon pillar from the discharging section, and the feeding section is aligned with the second carrier to transfer the silicon pillar into the second carrier.

3. The polycrystalline silicon crushing system according to claim 2, characterized in that, The clamping member has multiple clamping grooves in the extension direction, and the number of these grooves is the same as the number of the first bearing grooves provided in the discharge section.

4. The polycrystalline silicon crushing system according to claim 3, characterized in that, The clamping groove is provided with relatively unfolded guide slopes.

5. The polycrystalline silicon crushing system according to claim 3, characterized in that, The side wall of the clamping groove is provided with a first support pad.

6. The polycrystalline silicon crushing system according to claim 2, characterized in that, The first carrier further includes an intermediate section, which is connected between the feeding section and the discharging section; wherein the length of the intermediate section is X1, and the lengths of the feeding section and the discharging section are X2, X1 = nX2, and n is greater than or equal to 1.

7. The polycrystalline silicon crushing system according to claim 2, characterized in that, The first bearing groove is provided with a first unfolding inclined surface that unfolds relatively; the second bearing groove is provided with a second unfolding inclined surface that unfolds relatively.

8. The polycrystalline silicon crushing system according to claim 7, characterized in that, The first and second unfolding inclined surfaces are provided with second support pads.

9. The polycrystalline silicon crushing system according to claim 1, characterized in that, The polycrystalline silicon crushing system also includes a heating device and a cooling device. The heating device is used to heat the silicon column to be crushed at a high temperature and then transfer it to the cooling device. The cooling device cools the silicon column and then transfers it to the material transfer device.

10. The polycrystalline silicon crushing system according to claim 9, characterized in that, The cooling device includes: A water tank, used to hold liquid cooling water; A handling mechanism includes a mounting frame, a first power module, a second power module, and a support base. The mounting frame is disposed on one side of the water tank. The first power module is disposed on the mounting frame, and the second power module is disposed on the first power module. The support base is connected to the second power module and located within the water tank. The first power module drives the support base to move up and down, and the second power module drives the support base to move horizontally along a predetermined direction. The first power module also drives the support base to sink downwards into the liquid-cooled water, causing the silicon pillars on the support base to sink downwards into the liquid-cooled water. The second power module drives the support base to move along the predetermined direction in the liquid-cooled water. The support base has multiple third support parts arranged in parallel, and each third support part has multiple third support grooves along its extension direction. Under the action of the first drive module, the first support part can penetrate into the space between adjacent third support parts to support the silicon pillars on the third support parts.

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