A semi-automatic tin dipping device

Abstract

The utility model relates to a kind of semi-automatic tin dipping device, belong to the technical field of wire / plate card production equipment.A kind of semi-automatic tin dipping device, including tin melting pool, tin dipping jig being set at the tin melting pool top, for controlling the lifting assembly of tin dipping jig height position;The lifting assembly includes the cylinder assembly for executing first lifting program to control the tin dipping jig to lift and the screw rod component for executing second lifting program to control the tin dipping jig to lift.The utility model adopts the double lifting design of cylinder assembly and screw rod component, and they are through the collaborative mode of "cylinder coarse adjustment+screw rod fine adjustment", both shorten the lifting time of single tin dipping, also guarantee the consistency of tin dipping height, effectively solve the problem of uneven tin dipping thickness caused by human force, speed difference in manual operation, significantly improve the uniformity and reliability of core wire tin dipping.

Description

Technical Field

[0001] This utility model relates to a semi-automatic soldering device, belonging to the technical field of ribbon cable / board production equipment. Background Technology

[0002] In the fields of electronic components and electrical connection devices, the processing and production of components typically involves the collaborative operation of multiple processes. Processing efficiency, product yield, and energy consumption directly impact production costs and market competitiveness. Taking the production of ribbon cable components as an example, its core process chain requires key steps such as outer sheath removal, shielding treatment, core wire tinning, and soldering. The connection and execution of each process play a decisive role in the final product quality and production efficiency. Currently, the processing and production of traditional ribbon cable components generally adopts a combination of manual and semi-automatic equipment. A typical process flow is as follows: ribbon cable → outer sheath removal → outer sheath stripping → semi-automatic stripping → manual tinning → laser cutting → manual shielding stripping → laser cutting → manual insulation stripping → core wire tinning → semi-automatic soldering. In this process, the manual tinning, manual shielding stripping, and manual insulation stripping steps still heavily rely on manual operation, presenting the following significant problems:

[0003] First, production efficiency is limited. Manual operation depends on the operator's skill level, and each operation takes a long time and is not stable. Especially in mass production scenarios, the intermittent and repetitive nature of manual operation leads to redundancy in the overall processing time, making it difficult to meet the efficiency requirements of large-scale production.

[0004] Secondly, the product yield fluctuates greatly. During the manual soldering process, the thickness and uniformity of the solder layer are easily affected by human factors (such as operating force and angle deviation), which may lead to defects such as poor soldering and short circuits. When manually peeling off the shielding layer and the insulating layer, improper operation may damage the core wire or leave impurities, further reducing product reliability and requiring additional quality inspection and rework costs.

[0005] Third, energy consumption is relatively high. Manual operation requires a lot of auxiliary equipment (such as heating devices for independent soldering stations and frequent start-stop of stripping tools), and the waiting time between processes (such as waiting for material transfer during manual operation) leads to low equipment utilization and significant energy waste.

[0006] With the accelerating trend towards miniaturization and high performance in electronic devices, the market has placed higher demands on the precision, consistency, and production cost control of ribbon cable components. Traditional processing methods that rely on manual operation are no longer sufficient to meet the industry's needs for high efficiency, low consumption, and high yield. There is an urgent need to upgrade key processes through equipment innovation and process optimization to achieve automation, thereby improving production efficiency, stabilizing product quality, and reducing overall energy consumption. Utility Model Content

[0007] This invention aims to solve the aforementioned problems by providing a semi-automatic soldering device. This invention employs a dual lifting design using a cylinder assembly and a lead screw assembly. Through a collaborative mode of "coarse cylinder adjustment + fine lead screw adjustment," the lifting time for a single soldering operation is shortened, while ensuring consistent soldering height. This effectively solves the problem of uneven soldering thickness caused by differences in human force and speed during manual operation, significantly improving the uniformity and reliability of core wire soldering.

[0008] The technical solution of this utility model to solve the above problems is as follows:

[0009] A semi-automatic soldering device includes a molten solder bath, a soldering fixture disposed above the molten solder bath, and a lifting assembly for controlling the height of the soldering fixture; the lifting assembly includes a cylinder assembly for executing a first lifting procedure to control the lifting of the soldering fixture and a lead screw assembly for executing a second lifting procedure to control the lifting of the soldering fixture.

[0010] As a preferred embodiment of the above technical solution, the cylinder assembly includes a first fixed part and a first lifting part, and the lead screw assembly includes a second fixed part and a second lifting part; the second fixed part is fixedly connected to the first lifting part; and the soldering fixture is fixed to the second lifting part.

[0011] As a preferred embodiment of the above technical solution, the molten tin pool is a cast iron molten tin pool or a carbon steel molten tin pool, and an excitation coil and a magnetic guide panel are provided below the molten tin pool.

[0012] As a preferred embodiment of the above technical solution, the tinning device further includes a frame, which includes a base plate, a front side plate, a rear side plate, a C-shaped plate based on the rear side plate, and an L-shaped cover plate based on the C-shaped plate; the first fixing part is based on the C-shaped plate and is disposed in the area enclosed by the C-shaped plate and the L-shaped cover plate.

[0013] As a preferred embodiment of the above technical solution, the second fixing part is connected to the first lifting part through a lead screw assembly mounting seat.

[0014] As a preferred embodiment of the above technical solution, the lead screw assembly mounting base includes an L-shaped carrier plate for connecting the first lifting part and a platform plate for mounting the second fixing part; the second lifting part is configured based on the lifting block of the lead screw assembly.

[0015] As a preferred embodiment of the above technical solution, a plurality of guide columns are provided between the second lifting part and the platform plate.

[0016] As a preferred embodiment of the above technical solution, a guide rail is provided between the L-shaped carrier plate and the L-shaped cover plate.

[0017] As a preferred embodiment of the above technical solution, a limit nut is provided at the end of the lead screw assembly.

[0018] As a preferred embodiment of the above technical solution, the molten solder pool and the frame are provided with a heat insulation layer.

[0019] In summary, this utility model has the following beneficial effects:

[0020] 1. This utility model adopts a dual lifting design of cylinder assembly and lead screw assembly. The cylinder assembly performs rapid lifting action through the first lifting program (such as initial positioning or large stroke adjustment), while the lead screw assembly performs precise fine adjustment through the second lifting program (such as precise control of soldering depth). Through the coordinated mode of "cylinder coarse adjustment + lead screw fine adjustment", the lifting time of a single soldering is shortened (the efficiency is improved by about 30% compared with pure lead screw lifting) and the consistency of soldering height is guaranteed (repeat positioning accuracy ±0.1mm). This effectively solves the problem of uneven soldering thickness caused by human force and speed differences in manual operation, and significantly improves the uniformity and reliability of core wire soldering.

[0021] 2. The molten solder pool is made of cast iron / carbon steel, which has good high-temperature corrosion resistance and extends the service life of the molten solder pool. The excitation coil and magnetic panel below it can be heated by electromagnetic induction, so that the temperature distribution of the molten solder is more uniform (temperature difference ≤5℃) and the thickness of the surface oxide film is reduced (the oxide layer thickness is reduced by about 40%). This avoids problems such as cold solder joints and solder ball residue caused by local overheating or oxidation of the molten solder during manual soldering, and further improves the consistency of soldering quality.

[0022] 3. The frame is a closed frame structure consisting of a base plate, front side plate, rear side plate, C-shaped plate and L-shaped cover plate, which provides a stable support foundation for the lifting assembly and reduces vibration during equipment operation; the lead screw assembly is fixedly connected to the cylinder assembly through the lead screw assembly mounting seat, combined with the layered design of the L-shaped carrier plate and platform plate, as well as the guiding constraints of the guide column and guide rail, which effectively limits the sway in the movement of the lead screw, ensures the smoothness of the lifting action of the soldering fixture, and avoids core wire scratches or solder layer thickness deviations caused by mechanical shaking;

[0023] 4. The limiting nut at the end of the lead screw can precisely limit the maximum lifting stroke of the lead screw (stroke error ≤ 0.2mm), preventing the lead screw from overtraveling due to misoperation or program abnormality; the heat insulation layer between the molten solder pool and the frame effectively blocks the transfer of heat from the molten solder to the frame, which reduces heat loss from the molten solder pool, lowers energy consumption, and avoids deformation or aging of the frame due to long-term high temperature, thus extending the overall service life of the equipment.

[0024] 5. The device of this utility model retains the flexibility of manual operation (such as the workpiece can be manually picked up and put in the tinning fixture), while replacing the manual repeated height adjustment action with the automatic lifting of the cylinder and lead screw. The operator only needs to control the switch to complete the tinning process, which greatly reduces the labor intensity and reduces the quality fluctuation caused by fatigue or experience difference. It is especially suitable for the tinning needs of small batch and multi-variety wires, effectively balancing the cost and efficiency of automation upgrade.

[0025] 6. In summary, the semi-automatic soldering device of this utility model systematically solves the pain points of traditional manual soldering process through a dual lifting system, optimized molten solder pool, stable frame structure and safe heat insulation design, and achieves a comprehensive improvement in soldering efficiency, yield and energy consumption, providing reliable technical support for the semi-automatic upgrade of ribbon cable component processing. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the present invention in its initial state;

[0027] Figure 2 This is a schematic diagram of the present invention when the first lifting procedure is executed;

[0028] Figure 3 This is a schematic diagram of the present invention when the second lifting procedure is executed;

[0029] Figure 4 This is an assembly diagram of the fixture and the cable board of this utility model;

[0030] In the diagram, the component names represented by each number are as follows:

[0031] 1-Rack,

[0032] 2-Molten solder pool,

[0033] 3- Lifting assembly,

[0034] 4-Tin dipping fixture,

[0035] 5-Insulation layer,

[0036] 6-Circuit board,

[0037] 7-Control Panel

[0038] 11-Base plate,

[0039] 12-Front side panel,

[0040] 13-Rear side panel,

[0041] 14-C type plate,

[0042] 15-L type cover plate,

[0043] 21-Magnetic guide panel,

[0044] 22-Excitation coil,

[0045] 31-Cylinder assembly,

[0046] 32-Screw assembly,

[0047] 33-Guide rail,

[0048] 311-First fixing part,

[0049] 312 - First Lifting Unit

[0050] 321-Screw assembly mounting base,

[0051] 322-Second fixing part,

[0052] 323 - Second lifting section,

[0053] 324 guide post

[0054] 3211-Platform Board

[0055] 3212- L-shaped carrier plate,

[0056] 3231 - Limit nut. Detailed Implementation

[0057] The present invention will be further explained below with reference to the accompanying drawings.

[0058] This specific embodiment is merely an explanation of the present invention and is not intended to limit it. Any changes made by those skilled in the art after reading this specification, as long as they fall within the scope of the claims, will be protected by patent law.

[0059] like Figures 1-3 As shown, the semi-automatic soldering device in this embodiment has a vertical structure and mainly consists of a frame 1, a molten solder pool 2, a lifting assembly 3, a soldering fixture 4, and a heat insulation layer 5. Its core design lies in achieving precise positioning of the soldering fixture through a dual lifting system of "cylinder + lead screw," combined with a cast iron molten solder pool and electromagnetic heating function, to solve the problems of low efficiency and large yield fluctuations in traditional manual soldering.

[0060] Frame 1 provides stable support for the foundation. Frame 1 is a frame structure welded from metal sheets, specifically including:

[0061] Base plate 11: Provides a horizontal support surface for the entire device, and adjustable feet (not shown in the figure) can be installed at the bottom to adjust the level of the frame;

[0062] Front side plate 12 and rear side plate 13: respectively vertically fixed to the front and rear sides of the base plate 11, with a height of about 1000mm, which is consistent with the overall height of the device;

[0063] C-shaped plate 14: fixed to the top of the rear side plate 13, with the opening facing the front;

[0064] L-shaped cover plate 15: horizontally fixed to the top of C-shaped plate 14, with its front end extending downward to form a folded edge that fits against the upper edge of C-shaped plate 14. The two are fixedly connected by bolts to form a closed rectangular chamber for accommodating the main body of cylinder assembly 31.

[0065] Molten solder pool 2: Heating and storage of molten solder. Molten solder pool 2 is a cuboid structure (approximately 300mm × 200mm × 150mm in size), made of cast iron (or carbon steel; cast iron is used as an example in this embodiment), and has good resistance to high-temperature corrosion.

[0066] The components associated with the molten solder pool 2 are:

[0067] Magnetic panel: It is attached to the bottom outer surface of the pool body and is made of magnetic stainless steel (such as 430 stainless steel) with a thickness of about 3mm;

[0068] Excitation coil 22: wound around the outside of the magnetically conductive panel 21, and made of copper wire with a diameter of 1.5mm;

[0069] Circuit board 6 is used to control excitation coil 22;

[0070] Control panel 7 is used for manually inputting signals.

[0071] Working principle: The working state of the excitation coil 22 is controlled by the control panel 7 and the circuit board 6. When AC current is applied to the excitation coil 22, eddy currents are generated in the magnetic panel 21 through electromagnetic induction, which in turn heats the molten solder in the solder bath 2 (the temperature of the molten solder is controlled at 230~250℃, which is the commonly used soldering temperature); at the same time, the magnetic field generated by the eddy current can slightly stir the molten solder, reduce the thickness of the surface oxide film (the oxide layer thickness is ≤0.05mm), and improve the fluidity of the molten solder.

[0072] Lifting assembly 3, a dual-drive precision lifting mechanism. Lifting assembly 3 is mounted on frame 1 and is used to drive the soldering fixture 4 to move up and down in the vertical direction. Its core is the coordinated drive of cylinder assembly 31 and lead screw assembly 32.

[0073] Cylinder assembly 31: rapid coarse adjustment lifting. Cylinder assembly 31 includes:

[0074] First fixing part 311: that is, the fixing part of the cylinder;

[0075] First lifting part 312: that is, the extension and retraction part of the cylinder.

[0076] Lead screw assembly 32: Precision fine-tuning lifting. Lead screw assembly 32 includes:

[0077] The second fixed part 321 includes a servo motor and a threaded rod fixedly connected to the output shaft of the servo motor; the servo motor is mounted on the platform plate 3211; a limit nut 3231 is provided at the lower end of the threaded rod to prevent the lead screw from overtravel due to misoperation or program abnormality;

[0078] Second lifting part 323: includes a screw sleeve for the lead screw and a carrier plate fixedly connected to the screw sleeve;

[0079] Guide post 324: disposed on the platform plate and the carrier plate; used for guiding and constraining, limiting the sway during the movement of the lead screw.

[0080] The cylinder assembly 31 completes the "large stroke adjustment" of the soldering fixture 4 through the extension and retraction of the first lifting part 312, which takes about 0.5-1 seconds; the lead screw assembly 32 drives the lead screw 322 to rotate through the servo motor 324, so that the second lifting part 32) moves up and down along the guide post 324 to complete the "precision fine adjustment" of the soldering fixture 4 (for example, controlling the distance between the bottom of the fixture and the surface of the molten solder to 1-2mm), ensuring the consistency of the soldering depth.

[0081] Soldering fixture 4: Workpiece fixing and soldering execution components.

[0082] Tinning fixture 4 is a flat plate structure made of aluminum alloy, such as... Figure 4 As shown, its specific structure includes:

[0083] The fixture body has slots for inserting the ribbon cable board; it includes a bottom limiting structure and two side limiting structures. The bottom limiting structure supports the ribbon cable board, and the side limiting structures form the slots.

[0084] Insulation layer 5: Thermal insulation protection. Insulation layer 5 is made of aluminum silicate fiber felt (20mm thick, thermal conductivity ≤0.04W / (m·K)) and is laid between the molten solder pool 2 and the front and rear side plates and bottom plate of the frame 1. Its function is to block the heat transfer of molten solder to the frame (reducing heat loss by about 60%) and reduce the energy consumption for heating the molten solder pool.

[0085] Device Workflow Example

[0086] Taking the core wire soldering process of a certain type of ribbon cable as an example, the specific operating steps of the device are as follows:

[0087] Preparation:

[0088] Liquid tin (tin-lead alloy, 63% tin content, 240°C) is injected into the molten tin pool 2, and the excitation coil 22 is turned on to heat it and maintain the temperature of the molten tin stable.

[0089] Turn on the power to the servo motor 324 and the cylinder assembly 31, and check the operating status of each component;

[0090] Fix the ribbon cable board to be soldered into the slot of soldering fixture 4, ensuring that the core wire is vertical;

[0091] Initial positioning (coarse cylinder adjustment):

[0092] When the operator presses the "Lower 1" button, the first lifting part of the cylinder extends quickly, driving the lead screw assembly 32 to descend to the bottom of the soldering fixture 4, close to the surface of the molten solder (about 5mm away), which takes about 0.8 seconds.

[0093] The operator presses the "Descent 2" button;

[0094] Start the servo motor 324 to drive the lead screw 322 to rotate counterclockwise. The second lifting part 323 slowly descends along the guide post 324 until the bottom of the soldering fixture 4 is just not in contact with the surface of the molten solder, so that the wire ends of the ribbon cable board are soldered. At this time, the lead screw stops rotating (closed-loop control is achieved through the encoder feedback of the servo motor), and the soldering time is 3 seconds.

[0095] Reset and retrieve parts:

[0096] The servo motor 324 reverses, the lead screw 322 rotates clockwise, and the second lifting part 323 rises to the initial position;

[0097] The operator removes the soldered ribbon cable, completing a single soldering operation.

Claims

1. A semi-automatic soldering device, comprising a molten solder bath (2), a soldering fixture (4) disposed above the molten solder bath (2), and a lifting assembly (3) for controlling the height position of the soldering fixture (4); characterized in that: The lifting assembly (3) includes a cylinder assembly (31) for performing a first lifting procedure to control the tinning fixture (4) to lift and lower, and a lead screw assembly (32) for performing a second lifting procedure to control the tinning fixture (4) to lift and lower.

2. The semi-automatic tinning device according to claim 1, characterized in that: The cylinder assembly (31) includes a first fixing part (311) and a first lifting part (312), and the lead screw assembly (32) includes a second fixing part (322) and a second lifting part (323); the second fixing part (322) is fixedly connected to the first lifting part (312); the soldering fixture (4) is fixed to the second lifting part (323).

3. The semi-automatic tinning device according to claim 1, characterized in that: The molten tin pool (1) is a cast iron molten tin pool or a carbon steel molten tin pool, and an excitation coil (22) and a magnetic guide panel (21) are provided below the molten tin pool (2).

4. The semi-automatic tinning device according to claim 2, characterized in that: The tinning device further includes a frame (1), which includes a base plate (11), a front side plate (12), a rear side plate (13), a C-shaped plate (14) based on the rear side plate (13), and an L-shaped cover plate (15) based on the C-shaped plate (14); the first fixing part (311) is based on the C-shaped plate (14) and is located in the area enclosed by the C-shaped plate (14) and the L-shaped cover plate (15).

5. A semi-automatic tinning device according to claim 4, characterized in that: The second fixing part (321) is connected to the first lifting part (312) via the lead screw assembly mounting seat (321).

6. A semi-automatic tinning device according to claim 5, characterized in that: The lead screw assembly mounting base (321) includes an L-shaped carrier plate (3212) for connecting the first lifting part (312) and a platform plate (3211) for mounting the second fixing part (322); the second lifting part (323) is based on the lifting block of the lead screw assembly.

7. A semi-automatic tinning device according to claim 6, characterized in that: Multiple guide posts (324) are provided between the second lifting part (323) and the platform plate (3211).

8. A semi-automatic tinning device according to claim 6, characterized in that: A guide rail (33) is provided between the L-shaped carrier plate (3211) and the L-shaped cover plate (15).

9. A semi-automatic tinning device according to claim 6, characterized in that: The lead screw assembly is provided with a limit nut (3231) at the end of the lead screw.

10. A semi-automatic tinning device according to claim 4, characterized in that: The molten solder pool (2) and the frame (1) are provided with a heat insulation layer (5).

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