Hardware injection mold
By introducing disassembly and limiting structures into the injection molds for hardware parts, the problem of difficult disassembly of the mold core due to stress adhesion and impurity residue is solved, realizing stable disassembly and precise installation of the mold core, improving the service life of the mold and the molding quality of the hardware parts.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUANG YU PRECISION ELECTRONICS (SHENZHEN) CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-10
AI Technical Summary
When molding high-hardness materials or products with inserts, the core of the injection mold for hardware parts is easily worn by friction due to the molten plastic. Furthermore, the stress caused by high-pressure injection and the residue of impurities make it difficult to disassemble, often requiring forced disassembly and resulting in damage.
A hardware injection mold was designed, which adopts a disassembly structure and a limiting structure. The mold core can be smoothly disassembled by a combination of a bidirectional screw drive block and a support plate, and the mold core is fixed by a limiting pin, avoiding the need to use copper rods or special tools to forcibly disassemble it.
It enables stable disassembly of the mold core, avoids damage, improves installation accuracy, reduces the complexity of disassembly and assembly, and ensures the forming accuracy of hardware parts.
Smart Images

Figure CN224476485U_ABST