Hardware injection mold

By introducing disassembly and limiting structures into the injection molds for hardware parts, the problem of difficult disassembly of the mold core due to stress adhesion and impurity residue is solved, realizing stable disassembly and precise installation of the mold core, improving the service life of the mold and the molding quality of the hardware parts.

CN224476485UActive Publication Date: 2026-07-10HUANG YU PRECISION ELECTRONICS (SHENZHEN) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUANG YU PRECISION ELECTRONICS (SHENZHEN) CO LTD
Filing Date
2025-07-18
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

When molding high-hardness materials or products with inserts, the core of the injection mold for hardware parts is easily worn by friction due to the molten plastic. Furthermore, the stress caused by high-pressure injection and the residue of impurities make it difficult to disassemble, often requiring forced disassembly and resulting in damage.

Method used

A hardware injection mold was designed, which adopts a disassembly structure and a limiting structure. The mold core can be smoothly disassembled by a combination of a bidirectional screw drive block and a support plate, and the mold core is fixed by a limiting pin, avoiding the need to use copper rods or special tools to forcibly disassemble it.

Benefits of technology

It enables stable disassembly of the mold core, avoids damage, improves installation accuracy, reduces the complexity of disassembly and assembly, and ensures the forming accuracy of hardware parts.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224476485U_ABST
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Abstract

This utility model relates to the field of metal injection mold technology, and discloses a metal injection mold including a mold base A and a mold base B. Mold core A and mold core B are respectively placed on the inner walls of mold base A and mold base B. Both mold base A and mold base B have a disassembly structure on their surfaces, each disassembly structure including several grooves. Grooves are also provided on both sides of mold base A and mold base B. A bidirectional screw is rotatably connected to the inner wall of each groove. Two driving blocks are threadedly connected to the surface of the bidirectional screw. Support plates are placed on the inner walls of both mold base A and mold base B, and the support plates are attached to the surfaces of the two driving blocks. This metal injection mold, by setting up the disassembly structure, allows the mold core A and mold core B to be ejected from mold base A and mold base B using the support plates, thereby solving the problem of difficult disassembly of the mold core due to stress adhesion and impurity residue, and avoiding damage to the mold core caused by striking with a copper rod or forcibly disassembling with special tools.
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