A glue pressurization and curing device

By using an improved bonding and pressure-holding curing device, and by cooperating with the top plate and snap-fit ​​components, efficient and low-cost bonding and pressure holding of acoustic devices is achieved. This solves the problems of complex operation and high cost in the existing technology, and improves pressure consistency and bonding quality.

CN224479138UActive Publication Date: 2026-07-10BESTAR HLDG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BESTAR HLDG
Filing Date
2025-06-25
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In existing technologies, the bonding and pressure holding process has problems such as high operational requirements, low efficiency and high cost. Especially in the manufacturing of acoustic devices, it is difficult to guarantee the consistency of pressure and bonding quality.

Method used

A bonding and pressure-holding curing device is adopted, including a base plate, a pressure-holding base, an elastic component, a top plate, and a snap-fit ​​component. By cooperating with the snap-fit ​​component on the top plate, uniform pressure is maintained on the product, reducing the complexity and cost of operation.

Benefits of technology

It improves the accuracy and efficiency of bonding and pressure holding, simplifies the operation process, reduces costs, and ensures the uniformity and reliability of pressure.

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Abstract

The utility model relates to tooling technical field especially relates to a kind of gluing pressure-maintaining curing device, comprising: bottom plate;Pressure-maintaining pedestal is attached to be set on bottom plate, and pressure-maintaining pedestal has the placement slot compatible with product on it;Elastic component, one end is vertically fixed on bottom plate, the other end extends towards the direction away from pressure-maintaining pedestal;Top plate, it is parallelly arranged with bottom plate, and it is opposite to pressure-maintaining pedestal, and top plate is slidably connected on elastic component, and top plate is movable setting towards the direction close to or away from pressure-maintaining pedestal;Buckle component, it is set on bottom plate, and buckle component has the pressure buckle piece movable setting along the direction parallel to bottom plate;Wherein, top plate has telescopic probe, and pressure buckle piece is configured to be buckled by pressure buckle piece to keep position when top plate is pressed to the range of pressure buckle piece, and telescopic probe is abutted with product when top plate is kept position. By the above setting, simple structure, convenient operation, improve the precision and efficiency of product gluing pressure-maintaining curing.
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