Heating device based on integrally formed cooling coil
By combining the integrated cooling coil and insulation unit, the problem of easy cracking and leakage of thin-walled corrugated pipes is solved, achieving efficient cooling and insulation, simplifying installation and maintenance, and improving the temperature control effect of the reflow oven.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI LANGSHI ELECTRONIC EQUIP CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-10
AI Technical Summary
In the existing technology, thin-walled corrugated pipes are prone to cracking and leaking water during the cooling process of reflow ovens, and the corrosiveness of water causes equipment damage, affects the quality of welds and causes economic losses. In addition, the existing heating devices have poor heating and heat preservation effects.
It adopts an integrated molded cooling coil, combined with a spiral design and insulation unit. Heat exchange is carried out through the spiral cooling coil, and the cooling coil is connected by clamps and flanges to achieve convenient installation and maintenance. The insulation board is set to isolate the influence of external temperature.
It improves cooling efficiency, prevents cooling coils from cracking due to stress concentration, achieves good temperature control and insulation, and simplifies the installation and maintenance process.
Smart Images

Figure CN224480036U_ABST