An integrated wafer inspection device

Abstract

This invention provides an integrated wafer inspection device, including a worktable, a Y-axis moving module, a stage, a primary inspection camera, and a secondary inspection camera. The Y-axis moving module is positioned above the worktable, and the stage is located at the output end of the Y-axis moving module. The stage is used to load wafers and is equipped with a positioning mechanism that positions the wafer by pressing down on the edge ring of the wafer's top surface. The primary and secondary inspection cameras are positioned along the conveying direction of the Y-axis moving module. The primary inspection camera is used for initial wafer inspection and marking defect locations. The secondary inspection camera magnifies and re-inspects each defect location marked by the primary inspection camera, identifying the defect type and status. This invention integrates macroscopic and microscopic inspection, automatically detecting and identifying appearance defects with good inspection results and high efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an integrated wafer inspection device. Background Technology

[0002] After the wafer is fabricated, its appearance needs to be inspected to ensure its quality. Appearance inspection can help detect defects on the wafer surface, such as scratches, color differences, contamination, and damage.

[0003] Currently, the process typically involves first capturing an image of the wafer's appearance using a camera, and then having staff manually determine the location and type of defects in the image. This process is cumbersome, time-consuming, prone to errors, has poor detection results, and is inefficient. Utility Model Content

[0004] The present invention aims to provide an integrated wafer inspection device to overcome the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is: an integrated wafer inspection device, including a worktable, a Y-axis moving module, a stage, a primary inspection camera, and a secondary inspection camera. The Y-axis moving module is provided above the worktable, and the stage is provided at the output end of the Y-axis moving module. The stage is used to load wafers, and a positioning mechanism is also provided on the stage. The positioning mechanism positions the wafer by pressing the edge ring on the top surface of the wafer. The primary inspection camera and the secondary inspection camera are arranged opposite to each other on both sides of a support and along the conveying direction of the Y-axis moving module. The primary inspection camera is used to perform primary inspection of the wafer and mark the defect location. The secondary inspection camera magnifies and re-inspects each defect location marked by the primary inspection camera to identify the defect type and status. The support spans above the Y-axis moving module and is fixed on the worktable.

[0006] Furthermore, the aforementioned integrated wafer inspection device also includes an X-axis moving module and a Z-axis moving module. The X-axis moving module is fixed to one side of the upper end of the support and has a transfer plate at its output end. The Z-axis moving module is mounted on the transfer plate and has a re-inspection camera at its output end.

[0007] Furthermore, the aforementioned integrated wafer inspection device also includes an electric switcher. The re-inspection camera is equipped with a magnification turntable, which is equipped with multiple magnification lens barrels. The electric switcher is located on the transfer plate and can automatically switch magnifications.

[0008] Furthermore, in the aforementioned integrated wafer inspection device, the stage is disc-shaped, with multiple circumferentially distributed limiting blocks on its top. The limiting blocks protrude from the top surface of the stage, and the upper inner side of the limiting blocks is provided with a guiding slope. The multiple limiting blocks cooperate with the outer periphery of the wafer to center and limit the wafer.

[0009] Furthermore, in the aforementioned integrated wafer inspection device, the positioning mechanism includes two positioning components symmetrically arranged on both sides of the stage. Each positioning component includes a positioning seat, a lifting cylinder, a lifting seat, a transverse seat, and a pressure claw. The positioning seat is connected to a mounting base located below the stage. The lifting cylinder is fixed below the positioning seat, and its output end is connected to the lifting seat. A transverse seat is provided above the lifting seat and slidably connected thereto. Guide grooves are provided on both sides of the positioning seat, and guide parts are provided on both sides of the transverse seat. The guide parts are inserted into the guide grooves and can move along the guide grooves by being driven by the lifting cylinder. A pressure claw is provided at the end of the transverse seat. The pressure claw is arc-shaped and presses against the edge ring of the wafer during positioning.

[0010] Furthermore, in the aforementioned integrated wafer inspection device, the guide groove is located on both side plates of the positioning base and includes guide section one and guide section two arranged from top to bottom. Guide section one is an inclined groove and guide section two is a vertical groove. Guide section one and guide section two are connected by an arc transition.

[0011] Furthermore, in the aforementioned integrated wafer inspection device, the positioning seat is U-shaped, with vertically arranged guide rails on the inner sides of its two side plates. The lifting seat has sliders on both sides that are slidably connected to the guide rails. The top of the lifting seat also has a second guide rail, and the transverse moving seat is slidably connected to the lifting seat via the second guide rail. Preferably, the second guide rail is a cross roller guide rail.

[0012] Furthermore, in the aforementioned integrated wafer inspection device, the positioning component also includes a spring, which is located below the transverse support, with one end connected to the lifting support and the other end connected to the transverse support.

[0013] Furthermore, in the aforementioned integrated wafer inspection device, the worktable is fixed above the base frame, a protective cover is provided above the base frame, and the protective cover has opening and closing doors on the front and rear sides.

[0014] Furthermore, in the aforementioned integrated wafer inspection device, a fan is provided on the top of the protective cover, and ventilation holes are provided on the worktable.

[0015] Compared with the prior art, the beneficial effects of this utility model are: this utility model integrates macroscopic detection and microscopic detection into one, which can automatically detect and identify appearance defects, with good detection effect and high detection efficiency. Moreover, the positioning mechanism has a simple structure, accurate and stable positioning, and ensures the accuracy of detection. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the external structure of the integrated wafer inspection device of this utility model;

[0018] Figure 2 This is a partial structural schematic diagram of the wafer inspection device integrated in this utility model;

[0019] Figure 3 This is a schematic diagram of the stage structure of the integrated wafer inspection device of this utility model;

[0020] Figure 4 This is a schematic diagram of the positioning component structure of the integrated wafer inspection device of this utility model. Figure 1 ;

[0021] Figure 5 This is a schematic diagram of the positioning component structure of the integrated wafer inspection device of this utility model. Figure 2 ;

[0022] In the diagram: 1. Workbench; 2. Y-axis moving module; 3. Carrier; 31. Limit block; 4. Initial inspection camera; 5. Re-inspection camera; 51. Magnification turntable; 6. Positioning mechanism; 61. Positioning seat; 611. Guide groove; 62. Lifting cylinder; 63. Lifting seat; 64. Transverse moving seat; 641. Guide part; 65. Pressure claw; 66. Guide rail one; 67. Guide rail two; 68. Spring; 7. Bracket; 81. X-axis moving module; 82. Z-axis moving module; 83. Transplant plate; 9. Electric switcher; 10. Base frame; 11. Protective cover; 12. Fan; 100. Wafer; 101. Edge ring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1

[0025] like Figure 1-5As shown, an integrated wafer inspection device includes a worktable 1, a Y-axis moving module 2, a stage 3, a primary inspection camera 4, and a secondary inspection camera 5. The Y-axis moving module 2 is located above the worktable 1, and the stage 3 is located at the output end of the Y-axis moving module 2. The stage 3 is used to load wafers, and a positioning mechanism 6 is also provided on the stage 3. The positioning mechanism 6 positions the wafer by pressing the edge ring on the top surface of the wafer. The primary inspection camera 4 and the secondary inspection camera 5 are arranged opposite each other on both sides of a support 7 and are set along the conveying direction of the Y-axis moving module 2. The primary inspection camera 4 is a line scan camera, equipped with a line scan light source and a reflector, used for primary inspection of the wafer 100 and marking the defect location. The secondary inspection camera 5 magnifies and re-inspects each defect location marked by the primary inspection camera 4 to identify the defect type and status. The support 7 spans above the Y-axis moving module 2 and is fixed on the worktable 1. During inspection, wafer 100 is moved to below the initial inspection camera 4 via the Y-axis moving module 2 to complete the initial inspection (macroscopic inspection) of the entire wafer 100 and identify the location of defects. Then, stage 3 is moved to below the re-inspection camera 5 via the Y-axis moving module 2 for re-inspection (microscopic inspection). During re-inspection, the inspection is magnified to identify the type of defect and determine its state, whether it is within the detection accuracy range. In summary, this utility model integrates macroscopic and microscopic inspection, can automatically detect and identify appearance defects, has good detection effect and high detection efficiency, and only re-inspects the missing markings, further improving detection efficiency.

[0026] like Figure 2 As shown, the integrated wafer inspection device also includes an X-axis moving module 81 and a Z-axis moving module 82. The X-axis moving module 81 is fixed to one side of the upper end of the support 7, and its output end is provided with a transfer plate 83. The Z-axis moving module 82 is disposed on the transfer plate 83, and its output end is provided with a re-inspection camera 5. Through the cooperation of the X-axis moving module 81, the Z-axis moving module 82, and the Y-axis moving module, the re-inspection camera can be moved to any coordinate on the wafer.

[0027] like Figure 2 As shown, the integrated wafer inspection device also includes an electric switcher 9. The re-inspection camera 5 is equipped with a magnification turntable 51, which has multiple magnification lens barrels. The electric switcher 9 is mounted on the transfer plate 83 and can drive the magnification turntable to rotate, automatically switching the magnification. In this embodiment, lens barrels with magnifications of 5x, 10x, and 50x are provided, which can be automatically switched according to the defect situation.

[0028] like Figure 1 As shown, the workbench 1 is fixed above the base frame 10, and a protective cover 11 is provided above the base frame 10. The protective cover 11 has opening and closing doors on its front and rear sides. Furthermore, a fan 12 is provided on the top of the protective cover 11, and ventilation holes are provided on the workbench 1. The fan ensures a clean testing environment and improves testing quality.

[0029] Example 2

[0030] Based on the structure of Example 1, such as Figure 2 , 3 As shown, the stage 3 is disc-shaped, and its top is provided with multiple circumferentially distributed limiting blocks 31. The limiting blocks 31 protrude from the top surface of the stage 3, and the upper inner side of the limiting blocks 31 is provided with a guide slope to facilitate the placement of the wafer. The multiple limiting blocks 31 cooperate with the outer periphery of the wafer 100 to center and limit the wafer 100.

[0031] like Figure 3-5 As shown, the positioning mechanism 6 includes two positioning components symmetrically arranged on both sides of the stage 3. Each positioning component includes a positioning seat 61, a lifting cylinder 62, a lifting seat 63, a transverse seat 64, and a pressure claw 65. The positioning seat 61 is connected to a mounting base located below the stage 3. The lifting cylinder 62 is fixed below the positioning seat 61, and its output end is connected to the lifting seat 63. A transverse seat 64 is slidably connected above the lifting seat 63. Guide grooves 611 are provided on both sides of the positioning seat 61, and guide portions 641 are provided on both sides of the transverse seat 64. The guide portions 641 are inserted into the guide grooves 611 and can move along the guide grooves 611 driven by the lifting cylinder 62. In this embodiment, the guide portions 641 are rollers, resulting in smoother movement. A pressure claw 65 is provided at the end of the transverse seat 64. The pressure claw 65 is arc-shaped and presses against the edge ring 101 of the wafer 100 during positioning. When pressing, the pressure claw 65 does not extend beyond the inner side of the edge ring 101, that is, it does not cover the detection range, and the bottom of the pressure claw 65 is provided with a pad made of elastic plastic to avoid damaging the wafer during pressing.

[0032] In the above structure, such as Figure 4-5 As shown, the guide groove 611 is provided on both side plates of the positioning base 61, including guide section one and guide section two arranged from top to bottom. Guide section one is an inclined groove, and guide section two is a vertical groove. Guide section one and guide section two are connected by an arc transition. With the setting of guide groove 611, when driven by lifting cylinder 62, the movement of pressure claw 65 in two directions is guided, the structure is simpler, and the cost is saved. During pressing, pressure claw 65 first moves obliquely downward along guide section one, and then presses vertically downward along guide section two onto the edge ring of the wafer. This not only does not affect the loading and unloading of the wafer on the stage 2, but also does not cover the detection range.

[0033] Among them, such as Figure 4As shown, the positioning seat 61 is U-shaped, with vertically arranged guide rails 66 on the inner sides of its two side plates. The lifting seat 63 has sliders on both sides that are slidably connected to the guide rails 66. The top of the lifting seat 63 also has a guide rail 67, which is perpendicular to the guide rails 66. The transverse moving seat 64 is slidably connected to the lifting seat 63 via the guide rail 67. In this embodiment, the guide rail 67 is a cross roller guide rail, which offers high precision, good stability, and can evenly distribute the load, adapting to multi-directional forces and ensuring accurate and stable positioning.

[0034] In addition, such as Figure 4 As shown, the positioning assembly also includes a spring 68, which is located below the transverse sliding seat 64. One end of the spring 68 is connected to the lifting seat 63, and the other end is connected to the transverse sliding seat 64. In this embodiment, the spring is a tension spring, and the hooks at both ends of the tension spring are connected to bolts (not shown in the figure) provided on the lifting seat 63 and the transverse sliding seat 64. Since the guide groove 611 and the guide part 641 are in clearance fit, there may be errors or displacement during press-fit positioning. The spring 68 can eliminate the errors caused by this clearance, ensuring accurate and stable positioning, thereby ensuring the consistency of subsequent coordinate identification.

[0035] Since wafer appearance inspection is required, nothing can obstruct the inspection area during positioning. The positioning mechanism of this invention can not only position the wafer stably and firmly, but also avoid obstructing the inspection area, thus ensuring inspection accuracy.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0037] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An integrated wafer inspection device, characterized in that: The system includes a worktable, a Y-axis moving module, a carrier stage, a primary inspection camera, and a secondary inspection camera. The Y-axis moving module is located above the worktable, and the carrier stage is located at the output end of the Y-axis moving module. The carrier stage is used to load wafers and is also equipped with a positioning mechanism. The positioning mechanism positions the wafer by pressing the edge ring on the top surface of the wafer. The primary inspection camera and the secondary inspection camera are positioned opposite each other on both sides of a support frame and are arranged along the conveying direction of the Y-axis moving module. The primary inspection camera is used to perform primary inspection of the wafers and mark the defect locations. The secondary inspection camera magnifies and re-inspects each defect location marked by the primary inspection camera to identify the defect type and status. The support frame spans above the Y-axis moving module and is fixed to the worktable.

2. The integrated wafer inspection device according to claim 1, characterized in that: It also includes an X-axis moving module and a Z-axis moving module. The X-axis moving module is fixed to one side of the upper end of the bracket and its output end is equipped with a transplanting plate. The Z-axis moving module is set on the transplanting plate and its output end is equipped with a re-inspection camera.

3. The integrated wafer inspection device according to claim 1, characterized in that: It also includes an electric switcher. The re-examination camera is equipped with a magnification turntable, which is equipped with multiple magnification tubes. The electric switcher is located on the transfer plate and can automatically switch magnifications.

4. The integrated wafer inspection device according to claim 1, characterized in that: The stage is disc-shaped, with multiple circumferentially distributed limiting blocks on its top. The limiting blocks protrude from the top surface of the stage, and the upper inner side of the limiting blocks is provided with a guiding slope. The multiple limiting blocks cooperate with the outer periphery of the wafer to center and limit the wafer.

5. The integrated wafer inspection device according to claim 1 or 4, characterized in that: The positioning mechanism includes two positioning components symmetrically arranged on both sides of the stage. Each positioning component includes a positioning seat, a lifting cylinder, a lifting seat, a transverse seat, and a pressure claw. The positioning seat is connected to a mounting base located below the stage. The lifting cylinder is fixed below the positioning seat, and its output end is connected to the lifting seat. A transverse seat is provided above the lifting seat and slidably connected thereto. Guide grooves are provided on both sides of the positioning seat, and guide parts are provided on both sides of the transverse seat. The guide parts are inserted into the guide grooves and can move along the guide grooves by being driven by the lifting cylinder. A pressure claw is provided at the end of the transverse seat. The pressure claw is arc-shaped and presses against the edge ring of the wafer during positioning.

6. The integrated wafer inspection device according to claim 5, characterized in that: The guide groove is located on both side plates of the positioning seat and includes guide section one and guide section two arranged from top to bottom. Guide section one is an inclined groove and guide section two is a vertical groove. Guide section one and guide section two are connected by a circular arc transition.

7. The integrated wafer inspection device according to claim 5, characterized in that: The positioning seat is U-shaped, with vertically arranged guide rails on the inner sides of its two side plates. The lifting seat has sliders on both sides that are slidably connected to the guide rails. The top of the lifting seat also has a guide rail. The transverse moving seat is slidably connected to the lifting seat through the guide rail.

8. The integrated wafer inspection device according to claim 7, characterized in that: The positioning component also includes a spring, which is located below the transverse sliding seat, with one end connected to the lifting seat and the other end connected to the transverse sliding seat.

9. The integrated wafer inspection device according to claim 1, characterized in that: The workbench is fixed above the base frame, and a protective cover is provided above the base frame. The protective cover has opening and closing doors on the front and back sides.

10. The integrated wafer inspection device according to claim 9, characterized in that: The protective cover is equipped with a fan on top, and the workbench is equipped with ventilation holes.

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