A heat dissipating hot plate

Abstract

The patent discloses a heat dissipation heating plate, which comprises an upper shell, a heating component, a circuit board, a temperature sensor, a heat dissipation fan and a lower shell. The upper shell is provided with a heating plate assembly part and a circuit board assembly part which are spaced apart, and the heating component and the circuit board are assembled respectively; the temperature sensor is electrically connected with the circuit board to detect the temperature of the heating element; the heat dissipation fan is mounted on the upper shell and located between the two assembly parts, and can simultaneously dissipate heat for the two, thereby improving the heat dissipation efficiency and avoiding internal heat accumulation. The lower shell is provided with a plurality of heat dissipation air inlets at the edge and an air inlet opposite to the heat dissipation fan, so that effective air circulation is formed and the heat dissipation effect is enhanced. Meanwhile, the circuit board accurately controls the power of the heating plate according to the temperature signal detected by the temperature sensor, and automatically converts to small power constant temperature after reaching the set temperature, thereby avoiding the problems of large temperature fluctuation and inability to maintain constant temperature under the traditional simple on-off control mode, and improving the temperature control precision.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a heat dissipation heating plate. Background Technology

[0002] In the field of nano-far-infrared heating technology, nano-far-infrared heating plates are an important heating device widely used in industrial production, household appliances, healthcare, and many other fields. However, current nano-far-infrared heating plates on the market have many problems in terms of heat dissipation performance, temperature control, and structural design.

[0003] Specifically, existing nano-far-infrared heating plates generally suffer from poor heat dissipation. Due to inadequate heat dissipation design, internal heat cannot be effectively dissipated during operation, leading to excessive internal temperature rise. To alleviate this problem, manufacturers have had to increase the product height in an attempt to reduce internal temperature rise by increasing the heat dissipation area. However, this approach not only increases the product's size and weight but also raises production costs. Utility Model Content

[0004] The purpose of this invention is to disclose a heat dissipation nano-far-infrared heating plate with good heat dissipation performance, precise temperature control, and reasonable structural design.

[0005] To achieve the above objectives, this utility model discloses a heat dissipation heating plate, comprising: an upper housing, the upper housing including a heating plate assembly portion and a circuit board assembly portion spaced apart; a heating element, the heating element being assembled in the heating plate assembly portion; a circuit board, the circuit board being assembled in the circuit board assembly portion; a temperature sensor, the temperature sensor being electrically connected to the circuit board for detecting the temperature of the heating element; a cooling fan, the cooling fan being installed in the upper housing and located between the heating plate assembly portion and the circuit board assembly portion; and a lower housing, the lower housing including a plurality of heat dissipation vents arranged along its edge and an air inlet arranged directly opposite the cooling fan.

[0006] By adopting the above solution, the cooling fan is installed on the upper housing and located between the heating plate assembly and the circuit board assembly. This allows the cooling fan to simultaneously dissipate heat from both the heat-generating components and the circuit board. Compared to traditional cooling fans mounted on the bottom cover with poor airflow, this design is more conducive to heat dissipation, improves heat dissipation efficiency, and avoids the problem of excessive temperature rise due to internal heat accumulation. The lower housing forms an effective air circulation, further enhancing the heat dissipation effect. A temperature sensor monitors the temperature of the heating element in real time. The circuit board can precisely control the power of the heating plate based on the detected temperature signal. Once the set temperature is reached, it automatically switches to low power for constant temperature control, avoiding the problems of large temperature fluctuations and inability to maintain a constant temperature under traditional simple on / off control methods, thus improving the accuracy of temperature control.

[0007] Furthermore, the heating plate assembly includes: a heating plate assembly groove, which is recessed within the surface of the upper housing; and an assembly hole, which is disposed within the heating plate assembly groove.

[0008] By adopting the above solution, the heating plate mounting groove is recessed into the surface of the upper shell, providing a clear installation boundary for the heating component. This allows for quick and accurate determination of its installation position, avoiding interference between the heating component and surrounding components due to inaccurate installation position, which could affect heat dissipation or other functions.

[0009] Further, the heating assembly includes: a heating element exposed on the surface of the upper housing; a reflector disposed within the mounting hole, the reflector having a reflective groove facing the heating element; a heat insulation member disposed within the reflective groove; and an insulating heat-conducting member disposed between the heat insulation member and the heating element.

[0010] By adopting the above scheme, the heating element is directly exposed on the surface of the upper housing, reducing heat loss during the transfer process. Heat can radiate more quickly and directly to the surrounding environment or the object being heated, greatly improving heating efficiency and shortening heating time. The reflective grooves of the reflector face the heating element, reflecting the heat emitted by the heating element back, making the heat radiated more concentrated in the direction requiring heating. The heat insulation component effectively prevents heat transfer towards the reflector, avoiding heat loss at the reflector. The insulating thermally conductive component has excellent insulation properties, effectively isolating the heating element from other components, preventing leakage, and ensuring electrical safety during use.

[0011] Furthermore, the temperature sensor includes a thermocouple, one end of which is assembled to the reflector via a thermocouple plate, and the other end passes through the heat insulation component and abuts against the insulating heat-conducting component.

[0012] By adopting the above scheme, one end of the thermocouple passes through the heat insulation component and abuts against the heat-conducting insulating component, allowing it to directly contact the heat generated by the heating element, which greatly shortens the path of heat transfer from the heating element to the thermocouple.

[0013] Furthermore, at least two pressure plates are provided between the reflector and the upper housing, with one side of the pressure plate connected to the upper housing and the other side abutting against the reflector.

[0014] By adopting the above scheme, multiple pressure plates increase the connection points between the reflector and the upper housing, which can evenly distribute the various forces borne by the reflector to the upper housing.

[0015] Furthermore, the circuit board assembly is located inside the upper housing and includes a mounting post and a through hole. The mounting post is connected to the circuit board by fasteners, and an adjustment unit is provided in the through hole. The adjustment unit is electrically connected to the circuit board.

[0016] By adopting the above solution, the mounting column is connected to the circuit board through fasteners, providing a stable fixing point for the circuit board; users can directly operate and control the heating plate by rotating the knob, without the need for complicated button combinations or menu operations.

[0017] Furthermore, the perforation includes a knob perforation and a button perforation, the adjustment unit includes a temperature knob and an adjustment button, the temperature knob is disposed in the knob perforation, the adjustment button is disposed in the button perforation, and the temperature knob and the adjustment button are electrically connected to the circuit board.

[0018] By adopting the above solution, the knob perforation is specifically for installing the temperature knob, and the button perforation is for setting the adjustment button. This clear distinction allows users to quickly identify the location and purpose of different functional components.

[0019] Furthermore, the temperature knob is provided with a knob decorative cover, and / or the adjustment button is provided with a transparent cover.

[0020] By adopting the above solutions, the overall aesthetics and texture of the product can be improved, and it can also play a certain role in visual guidance, making it easier for users to notice the position of the button parameters. At the same time, it can also reduce problems such as knob jamming and button malfunction caused by dust and dirt accumulation, and extend the service life of knobs and buttons.

[0021] Furthermore, the heating element is a nano-coated microcrystalline plate.

[0022] By employing the above-described method, nano-coating technology can form a uniform thin film with unique electrical and thermal properties on the surface of the microcrystalline board. The nano-coated microcrystalline board can reach the set temperature in a shorter time, significantly reducing heating time. The nano-coated microcrystalline board also exhibits excellent wear resistance and corrosion resistance, resisting scratches, impacts, and chemical erosion during daily use.

[0023] Furthermore, the insulating and heat-conducting component is a mica sheet.

[0024] By adopting the above scheme, the mica sheet has extremely high insulation resistance, which can effectively prevent current leakage, excellent resistance to electrical breakdown, rapid and uniform heat conduction, and high strength and toughness.

[0025] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0026] 1. The unique design of the cooling fan, installed on the upper housing and located between the heating plate assembly and the circuit board assembly, breaks away from the traditional situation where the cooling fan is mounted on the bottom cover and has poor airflow. The cooling fan can simultaneously dissipate heat from both the heat-generating components and the circuit board, forming a more direct and efficient heat dissipation path. Heat can be carried away more quickly from the heat source and the circuit board, greatly shortening the time heat stays inside the device, significantly improving heat dissipation efficiency, and effectively avoiding the problem of excessive temperature rise due to internal heat accumulation.

[0027] 2. The lower housing is provided with multiple heat dissipation vents along the edges of the heating plate assembly and circuit board assembly, as well as an air inlet facing the cooling fan, forming an effective air circulation system. When the cooling fan is working, external cold air enters from the air inlet, absorbs heat through the heating components and circuit board, and is discharged from the heat dissipation vents, forming a complete heat exchange cycle.

[0028] 3. The temperature sensor is electrically connected to the circuit board, enabling real-time monitoring of the heating element's temperature. Through a precise temperature sensor, the actual temperature value of the heating element can be obtained promptly, providing reliable data support for accurate temperature control of the circuit board and avoiding control errors caused by inaccurate temperature detection.

[0029] 4. Excellent heat dissipation and precise temperature control can effectively reduce the internal operating temperature of the equipment, minimizing damage to various components caused by high temperatures. Operating heat-generating components and circuit boards within a suitable temperature environment extends their lifespan and reduces equipment failure rates and maintenance costs. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a partial exploded structural diagram of an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the internal structure of the upper shell according to an embodiment of the present utility model;

[0033] Figure 3 This is a cross-sectional structural diagram of an embodiment of the present utility model;

[0034] Figure 4 This is a schematic diagram of the lower shell structure according to an embodiment of the present utility model;

[0035] Figure 5 This is a cross-sectional structural diagram of an embodiment of the present utility model.

[0036] Key reference numerals in the attached drawings: 1. Upper housing; 11. Heating plate assembly; 111. Heating plate assembly slot; 112. Assembly hole; 12. Circuit board assembly; 121. Mounting post; 122. Through hole; 1221. Knob through hole; 1222. Button through hole; 13. Adjustment unit; 131. Temperature knob; 132. Adjustment button; 133. Knob decorative cover; 134. Transparent cover; 14. Pressure plate; 2. Heating component; 21. Heating element; 22. Reflector; 221. Reflector groove; 23. Heat insulation component; 24. Insulating and heat-conducting component; 3. Circuit board; 4. Temperature sensor; 41. Thermocouple; 42. Thermocouple pressure plate; 5. Cooling fan; 6. Lower housing; 61. Cooling vent; 62. Air inlet. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0039] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0040] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0041] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0042] The technical solution of this utility model will be further described below with reference to the embodiments and accompanying drawings.

[0043] Please refer to Embodiment 1 of this utility model. Figures 1 to 5 As shown, a heat dissipation heating plate is provided, including an upper housing 1, a heating element 2, a circuit board 3, a temperature sensor 4, a cooling fan 5, and a lower housing 6. The upper housing 1 is divided into a heating plate assembly section 11 and a circuit board assembly section 12, which are spaced apart to separate the heat source from the circuit module. The heating element 2 is assembled in the heating plate assembly section 11, and the circuit board 3 is assembled in the circuit board assembly section 12. The cooling fan 5 is installed inside the upper housing 1, located between the heating plate assembly section 11 and the circuit board assembly section 12, forming a bidirectional heat dissipation path. The cooling fan 5 is installed in the upper housing 1 and located between the heating plate assembly section 11 and the circuit board assembly section 12, so that the cooling fan can dissipate heat from both the heating element 2 and the circuit board 3 at the same time. Compared with the traditional situation where the cooling fan is installed on the bottom cover and the airflow is poor, it is more conducive to heat dissipation, improves heat dissipation efficiency, and avoids the problem of excessive temperature rise caused by internal heat accumulation. The lower housing 6 is fastened to the upper housing 1, and multiple heat dissipation vents 61 are provided on its edge. An air inlet 62 is opened at the bottom directly opposite the position of the cooling fan 5, forming an air circulation channel, which further enhances the heat dissipation effect. The temperature sensor 4 is embedded in the heating component 2 and electrically connected to the circuit board 3. It provides real-time temperature feedback. By monitoring the temperature of the heating element 21 in real time through the temperature sensor 4, the circuit board 3 can accurately control the power of the heating plate according to the detected temperature signal. After reaching the set temperature, it automatically switches to low power constant temperature, avoiding the problem of large temperature fluctuations and inability to maintain constant temperature under the traditional simple switch control method, thus improving the accuracy of temperature control.

[0044] In some embodiments, the heating assembly 2 includes a heating element 21, a reflector 22, a heat insulation component 23, and an insulating heat-conducting component 24. The heating element 21 is exposed on the surface of the upper housing 1. The reflector 22 is disposed within the mounting hole 112 and has a reflective groove 221 facing the heating element 21. The heat insulation component 23 is disposed within the reflective groove 221, and the insulating heat-conducting component 24 is disposed between the heat insulation component 23 and the heating element 21. In this embodiment 1, the heating element 21 is a nano-coated microcrystalline plate with a carbon nanotube coating on its surface. As the core heating element, it emits far-infrared rays through resistance heating. By being directly exposed to the surface of the upper housing 1, heat transfer loss is reduced. The reflector 22 is made of polished aluminum, and the reflective groove 221 faces the nano-coated microcrystalline plate, directionally reflecting scattered heat to the target area. The reflector 22 is rectangular, and at least two pressure plates 14 are provided between the reflector 22 and the upper housing 1. One side of each pressure plate 14 is fixed to the upper housing 1 by bolts, and the other side abuts against the reflector 22. Multiple pressure plates 14 increase the connection points between the reflector 22 and the upper housing 1, enabling the uniform distribution of various forces borne by the reflector 22 onto the upper housing 1. The heat insulation component 23 can be made of ceramic fiber filling the reflective groove 221 to block heat conduction into the housing, with a thickness of 3-5mm to ensure temperature resistance. The insulating and heat-conducting component 24 is made of mica sheet, covering the space between the heat insulation component 23 and the nano-coated microcrystalline plate, providing both insulation and heat conduction functions.

[0045] In some embodiments, the upper housing 1 has a recessed heating plate mounting groove 111 for positioning the heating component 2. The heating plate mounting groove has a mounting hole 112 with the same size as the reflector 22. The circuit board mounting part 12 has a mounting post 121 on its inner side for fixing the circuit board 3 with screws. The circuit board mounting part 12 also has a knob through hole 1221 and a button through hole 1222 for installing a temperature knob 131 and an adjustment button 132, respectively. The cooling fan 5 is installed in the cavity between the two mounting parts and is connected to the circuit board 3 through a wire.

[0046] In this embodiment 1, the temperature sensor 4 includes a thermocouple 41. One end of the thermocouple 41 is assembled to the reflector 22 via a thermocouple plate 42, and the other end passes through the heat insulation component 23 and abuts against the insulating heat-conducting component 24, directly detecting the temperature of the heating element 21. The circuit board 3 integrates a PID control chip, receives the signal from the thermocouple 41, and dynamically adjusts the heating power. In some embodiments, the through hole 122 includes a knob through hole 1221 and a button through hole 1222. The adjustment unit 13 includes a temperature knob 131 and an adjustment button 132. The temperature knob 131 is disposed in the knob through hole 1221, and the adjustment button 132 is disposed in the button through hole 1222. The temperature knob 131 and the adjustment button 132 are electrically connected to the circuit board 3. The circuit board 3 controls the speed of the cooling fan 5 through a PWM signal and supports functions such as inputting temperature parameter values ​​and switching timer modes via the temperature knob 131 and the adjustment button 132.

[0047] In some embodiments, the temperature knob 131 is provided with a knob decorative cover 133, the surface of which is engraved with temperature scale, which is dustproof and improves the operating feel; and / or, the adjustment button 132 is provided with a transparent cover 134, which can embed an LED indicator light to display the operating status. This can improve the overall aesthetics and texture of the product, and can also play a certain visual guiding role, making it easier for users to notice the position of the button parameters; at the same time, it can also reduce problems such as knob jamming and button malfunction caused by dust and dirt accumulation, and extend the service life of the knob and button.

[0048] The workflow is as follows:

[0049] After being powered on, the nano-coated microcrystalline plate heats up rapidly. Far-infrared rays are radiated directionally through the reflector 223. Thermocouple 41 monitors the temperature in real time, and circuit board 3 controls the heating power to the set value. When the temperature reaches the set value, circuit board 3 switches to low-power mode, and cooling fan 5 adjusts its speed according to the real-time temperature, such as 2000 rpm at 150℃ and 3000 rpm at 200℃. External cold air is drawn in through air inlet 622, flows through heating component 2 and circuit board 3 to absorb heat, and hot air is discharged through cooling vent 61, forming continuous convection and reducing the internal temperature rise by more than 40%.

[0050] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0051] 1. The unique design of the cooling fan 5, installed on the upper housing 1 and located between the heating plate assembly 11 and the circuit board assembly 12, breaks away from the traditional situation where the cooling fan is mounted on the bottom cover and has poor airflow. The cooling fan 5 can simultaneously dissipate heat from the heat-generating component 2 and the circuit board 3, forming a more direct and efficient heat dissipation path. Heat can be carried away more quickly from the heat source and the circuit board 3, greatly shortening the heat residence time inside the device, significantly improving heat dissipation efficiency, and effectively avoiding the problem of excessive temperature rise caused by internal heat accumulation.

[0052] 2. The lower housing 6 is provided with multiple heat dissipation vents 61 along the edges of the heating plate assembly 11 and the circuit board assembly 12, as well as an air inlet 62 facing the cooling fan 5, forming an effective air circulation system. When the cooling fan 5 is working, external cold air enters from the air inlet 62, absorbs heat through the heating component 2 and the circuit board 3, and is discharged from the heat dissipation vents 61, forming a complete heat exchange cycle.

[0053] 3. Temperature sensor 4 is electrically connected to circuit board 3, enabling real-time monitoring of the temperature of heating element 21. The precise temperature sensor 4 allows for timely acquisition of the actual temperature value of heating element 21, providing reliable data support for precise temperature control of circuit board 3 and avoiding control errors caused by inaccurate temperature detection.

[0054] 4. Excellent heat dissipation and precise temperature control can effectively reduce the internal operating temperature of the equipment, minimizing damage to various components caused by high temperatures. Operating the heating element 2 and circuit board 3 within a suitable temperature environment extends their service life and reduces equipment failure rates and maintenance costs.

[0055] The above provides a detailed description of a heat dissipation heating plate disclosed in the embodiments of this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the heat dissipation heating plate and its core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A heat dissipation heating plate, characterized in that, include: The upper housing (1) includes a heating plate assembly (11) and a circuit board assembly (12) spaced apart. Heating component (2), which is assembled on the heating plate assembly part (11); Circuit board (3), said circuit board (3) is assembled on said circuit board assembly part (12); Temperature sensor (4), which is electrically connected to the circuit board (3), is used to detect the temperature of the heating element (21); A cooling fan (5) is installed on the upper housing (1) and located between the heating plate assembly (11) and the circuit board assembly (12); The lower housing (6) includes a plurality of heat dissipation vents (61) arranged along its edge and an air inlet (62) arranged opposite the heat dissipation fan (5).

2. The heat dissipation heating plate according to claim 1, characterized in that, The heating plate assembly (11) includes: Heating plate assembly groove (111), the heating plate assembly groove (111) is recessed into the surface of the upper housing (1); Assembly hole (112) is provided in the heating plate assembly groove (111).

3. A heat dissipation heating plate according to claim 2, characterized in that, The heating component (2) includes: Heating element (21) is exposed on the surface of the upper housing (1); A reflector (22) is disposed in the mounting hole (112) and has a reflective groove (221) facing the heating element (21); A heat insulation component (23) is disposed within the reflective groove (221); An insulating heat-conducting component (24) is disposed between the heat insulation component (23) and the heating element (21).

4. A heat dissipation heating plate according to claim 3, characterized in that, The temperature sensor (4) includes a thermocouple (41), one end of which is assembled with the reflector (22) through a thermocouple plate (42), and the other end passes through the heat insulation member (23) and abuts against the insulating heat-conducting member (24).

5. A heat dissipation heating plate according to claim 3, characterized in that, At least two pressure plates (14) are provided between the reflector (22) and the upper housing (1). One side of the pressure plate (14) is connected to the upper housing (1), and the other side abuts against the reflector (22).

6. A heat dissipation heating plate according to claim 1, characterized in that, The circuit board assembly part (12) is located inside the upper housing (1) and includes a mounting post (121) and a through hole (122). The mounting post (121) is connected to the circuit board (3) by fasteners. An adjustment unit (13) is provided in the through hole (122) and the adjustment unit (13) is electrically connected to the circuit board (3).

7. A heat dissipation heating plate according to claim 6, characterized in that, The perforation (122) includes a knob perforation (1221) and a button perforation (1222). The adjustment unit (13) includes a temperature knob (131) and an adjustment button (132). The temperature knob (131) is located in the knob perforation (1221), and the adjustment button (132) is located in the button perforation (1222). The temperature knob (131) and the adjustment button (132) are electrically connected to the circuit board (3).

8. A heat dissipation heating plate according to claim 7, characterized in that, The temperature knob (131) is provided with a knob decorative cover (133), and / or the adjustment button (132) is provided with a transparent cover (134).

9. A heat dissipation heating plate according to claim 2, characterized in that, The heating element (21) is a nano-coated microcrystalline plate.

10. A heat dissipation heating plate according to claim 3, characterized in that, The insulating and heat-conducting component (24) is a mica sheet.

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