Auxiliary board mounting mold for production of circuit board
By setting mounting grooves and covering the surface with mesh on the substrate, and using fixing components to fix the circuit board, the problems of collapse and jamming of small-sized circuit boards during transportation are solved, achieving stable transportation and low-cost production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HESHAN SHIYUN CIRCUIT TECH CO LTD
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-10
AI Technical Summary
In the prior art, PCB boards may jam during transport due to their size being smaller than the distance between the rollers on the equipment. In the prior art, small-sized boards may collapse during transport due to a lack of effective support in the middle, resulting in jamming and preventing normal transport.
Multiple mounting slots are set on the substrate, the surface of the substrate is covered with mesh and the liquid is allowed to pass through, and the fixing components fix the circuit board to form a stable assembly structure to ensure that the circuit board does not collapse during transportation.
It enables stable transfer of small-sized circuit boards in existing equipment, avoids board jamming, improves production flexibility and equipment processing capabilities, and reduces production costs.
Smart Images
Figure CN224481864U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to auxiliary assembly molds for circuit board manufacturing. Background Technology
[0002] As electronic products rapidly evolve towards higher performance and more multifunctionality, the demand for printed circuit boards (PCBs), as the core carriers of electronic components, has significantly increased in terms of structural complexity and dimensional diversity. In actual production, PCB products exhibit significant differences in size specifications—including both standard large-size boards (such as 150mm×150mm and above) and a large number of small-size boards (such as 30mm×60mm or even smaller).
[0003] In some horizontal ion cleaning applications, the core conveying structure relies on a roller conveyor mechanism. The minimum support spacing between the rollers is fixed at 45mm. However, when the dimensions of the PCB board to be processed in any direction are smaller than this spacing, for example, a small board of 30mm × 60mm, where 30mm < 45mm, the PCB board will collapse during the conveying process due to the lack of effective support in the middle. This will cause unstable contact between the board and the rollers, leading to board jamming. In other words, the board will get stuck in the equipment and cannot be conveyed normally, ultimately forcing the production line to stop and preventing the completion of critical process steps such as cleaning.
[0004] Traditional solutions mainly rely on two approaches: one is to customize small-scale special equipment, which adapts to small-sized PCBs by reducing the spacing between rollers or adjusting the design of the conveyor mechanism. However, this solution requires additional purchase of expensive equipment, resulting in high investment costs and is only applicable to specific small-size ranges with poor versatility. The other approach is to adjust the process flow, such as using manual assistance for fixing or batch processing. However, this will significantly reduce production efficiency and increase operational complexity and quality risks.
[0005] Therefore, developing a low-cost auxiliary fixture mold based on the existing equipment architecture, and adapting small-sized PCB boards to the minimum production size range of the equipment through structural optimization, while ensuring no board jamming and no chemical residue during processing, has become an urgent need to improve the overall production capacity and market competitiveness of the equipment. Utility Model Content
[0006] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, this utility model proposes an auxiliary mounting mold for circuit board production, which effectively solves the problem of small-sized circuit boards jamming and inability to be produced, improves the minimum processing capacity of the equipment, is compatible with all horizontal cleaning lines, and is simple to operate, low in cost, reusable, leaves no chemical residue, has excellent cleaning effect, and significantly enhances production flexibility and order taking capacity.
[0007] The circuit board production auxiliary assembly mold according to an embodiment of the present utility model includes:
[0008] The substrate is provided with multiple mounting slots for placing circuit boards.
[0009] A mesh is attached to one side of the substrate, which covers the surface of the substrate and allows the liquid medicine to pass through while preventing the circuit board from falling off.
[0010] A fixing component is connected to the substrate and used to fix the circuit board.
[0011] The circuit board production auxiliary mounting mold according to the embodiments of this utility model has at least the following beneficial effects: By using a combination structure of multiple mounting slots on a substrate to place the circuit board, a mesh connected to one side of the substrate to cover the surface and allow the cleaning solution to pass through while preventing the circuit board from falling off, and a fixing component to fix the circuit board, stable processing of small-sized circuit boards is achieved in existing ion cleaning horizontal line equipment. This solves the problem of board jamming caused by the circuit board size being smaller than the minimum spacing of the equipment's rollers, ensuring that the circuit board remains flat and does not collapse during transport. The mesh structure of the mesh allows the cleaning solution to fully penetrate and make full contact with the circuit board surface to ensure the cleaning effect, while effectively preventing the circuit board from falling off the mounting slot. The fixing component... The components act directly on the circuit board, using physical constraints to ensure it does not move or shift during the cleaning process, avoiding processing defects caused by shaking. The substrate, as the main support, is compatible with the processing size range of existing equipment, ensuring that the assembled mold meets the equipment's roller spacing requirements and preventing conveying abnormalities. Furthermore, by adjusting the mounting slot size and mesh specifications, it can accommodate small circuit boards of different shapes and sizes. The flexible configuration of fixing components meets diverse production needs. The fixture mold is reusable multiple times, simple and convenient to operate, and eliminates the need for additional high-priced components, significantly reducing production costs. This effectively improves the equipment's processing capacity and production flexibility for small circuit boards, enhancing the company's competitiveness in securing orders.
[0012] According to some embodiments of the present invention, the circuit board production auxiliary mounting mold includes a fixing component, which is used to press and fix the circuit board in the mounting groove.
[0013] According to some embodiments of the present invention, the circuit board production auxiliary mounting mold includes a paperclip, which can clamp the substrate and is used to tighten and fix the rubber band.
[0014] According to some embodiments of the present invention, the circuit board production auxiliary mounting mold has two paperclips arranged opposite each other on both sides of the substrate, and the ends of the rubber bands are respectively snapped into the two paperclips.
[0015] According to some embodiments of the present invention, the paperclip is capable of sliding along the edge of the substrate in the circuit board production auxiliary mounting mold.
[0016] According to some embodiments of the present invention, the circuit board production auxiliary mounting mold includes a fixing component, which, after the rubber band is pressed and fixed to the circuit board, adheres and fixes the rubber band to the substrate.
[0017] According to some embodiments of the present invention, the auxiliary mounting mold for circuit board production is provided, wherein the tape and the rubber band are arranged perpendicular to each other.
[0018] According to some embodiments of the present invention, the circuit board production auxiliary mounting mold has the mesh glued and fixed to the substrate.
[0019] According to some embodiments of the present invention, a circuit board production auxiliary mounting mold is provided, wherein a plurality of mounting slots are arranged on the substrate.
[0020] According to some embodiments of the present invention, the circuit board production auxiliary mounting mold has a square substrate.
[0021] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0022] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0023] Figure 1 This is a schematic diagram of the overall structure of the circuit board production auxiliary assembly mold according to an embodiment of the present utility model;
[0024] Figure 2 This is a schematic diagram of the substrate of the circuit board production auxiliary assembly mold according to an embodiment of the present utility model;
[0025] Figure 3 This is a schematic diagram illustrating the application of the auxiliary assembly mold for circuit board production in an embodiment of this utility model.
[0026] Explanation of icon numbers:
[0027] Substrate 100; Mounting slot 101;
[0028] Fixing component 200; rubber band 210; paper clip 220; tape 230;
[0029] Circuit board 300;
[0030] 400 mesh. Detailed Implementation
[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0032] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0033] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0034] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0035] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0036] As electronic products rapidly evolve towards higher performance and more multifunctionality, the demand for printed circuit boards (PCBs), as the core carriers of electronic components, has significantly increased in terms of structural complexity and dimensional diversity. In actual production, PCB products exhibit significant differences in size specifications—including both standard large-size boards (such as 150mm×150mm and above) and a large number of small-size boards (such as 30mm×60mm or even smaller).
[0037] In some horizontal ion cleaning applications, the core conveying structure relies on a roller conveyor mechanism. The minimum support spacing between the rollers is fixed at 45mm. However, when the dimensions of the PCB board to be processed in any direction are smaller than this spacing, for example, a small board of 30mm × 60mm, where 30mm < 45mm, the PCB board will collapse during the conveying process due to the lack of effective support in the middle. This will cause unstable contact between the board and the rollers, leading to board jamming. In other words, the board will get stuck in the equipment and cannot be conveyed normally, ultimately forcing the production line to stop and preventing the completion of critical process steps such as cleaning.
[0038] Traditional solutions mainly rely on two approaches: one is to customize small-scale special equipment, which adapts to small-sized PCBs by reducing the spacing between rollers or adjusting the design of the conveyor mechanism. However, this solution requires additional purchase of expensive equipment, resulting in high investment costs and is only applicable to specific small-size ranges with poor versatility. The other approach is to adjust the process flow, such as using manual assistance for fixing or batch processing. However, this will significantly reduce production efficiency and increase operational complexity and quality risks.
[0039] Therefore, developing a low-cost auxiliary fixture mold based on the existing equipment architecture, and adapting small-sized PCB boards to the minimum production size range of the equipment through structural optimization, while ensuring no board jamming and no chemical residue during processing, has become an urgent need to improve the overall production capacity and market competitiveness of the equipment.
[0040] Therefore, such as Figures 1 to 3As shown, this utility model proposes an auxiliary mounting mold for circuit board production, which includes a substrate 100, a mesh 400 connected to one side of the substrate 100, and a fixing component 200 connected to the substrate 100. The substrate 100 is provided with a plurality of mounting grooves 101 for placing circuit boards 300. The fixing component 200 is used to fix the circuit boards 300. The mesh 400 can cover the surface of the substrate 100, and the mesh 400 can allow the liquid to pass through and prevent the circuit boards 300 from falling off. It should be noted that the combination of multiple mounting slots 101 on the substrate 100 to place the circuit board 300, a mesh 400 connected to one side of the substrate 100 to cover the surface and allow the cleaning solution to pass through while preventing the circuit board 300 from falling off, and a fixing component 200 to fix the circuit board 300, achieves stable processing of small-sized circuit boards 300 in existing ion cleaning horizontal line equipment. This solves the problem of board jamming caused by the circuit board 300 being smaller than the minimum spacing of the equipment's rollers, ensuring that the circuit board 300 remains flat and does not collapse during transport. The mesh structure of the mesh 400 allows the cleaning solution to fully penetrate and make full contact with the surface of the circuit board 300 to ensure cleaning effect, while effectively preventing the circuit board 300 from falling off from the mounting slots 101. The fixing component 200... The 0 directly acts on the circuit board 300, ensuring it does not move or shift during the cleaning process through physical constraints, thus avoiding processing defects caused by shaking. The substrate 100, as the main support, is adapted to the processing size range of existing equipment, ensuring that the combined mold meets the equipment's roller spacing requirements and preventing abnormal transmission. Furthermore, by adjusting the size of the mounting slot 101 and the specifications of the mesh 400, it can accommodate small-sized circuit boards 300 of different shapes and sizes. Combined with the flexible configuration of the fixing component 200, it meets diverse production needs. At the same time, the fixture mold can be reused multiple times, making operation simple and convenient, eliminating the need for additional high-priced components, significantly reducing production costs, effectively improving the equipment's processing capacity and production flexibility for small-sized circuit boards 300, and enhancing the company's competitiveness in order taking.
[0041] Refer to Figure 1In some embodiments of this utility model, the fixing component 200 includes a rubber band 210, which is used to press and fix the circuit board 300 in the mounting groove 101. By using the rubber band 210 as the fixing component 200, the circuit board 300 is firmly pressed into the mounting groove 101 of the substrate 100 by the clamping force generated by its elastic deformation. This achieves reliable positioning of the small-sized circuit board 300, preventing it from shifting or falling off during the operation of the ion cleaning horizontal line equipment due to transmission vibration or chemical impact, and also avoids damage to the board surface that may be caused by traditional mechanical clamping methods. Furthermore, the rubber band 210 is inexpensive and readily available. When combined with the substrate 100 and the mesh 400, it forms a lightweight fixing structure that does not increase the overall weight or complexity of the fixture mold. At the same time, its repeatable stretching and deformation characteristics support multiple disassembly and reassembly, significantly reducing production costs and improving operational convenience, ensuring that the circuit board 300 remains stable during the cleaning process. Furthermore, the fixing component 200 includes a paperclip 220. The paperclip 220 forms a stable anchor point by clamping the edge of the substrate 100, providing a reliable tensioning and fixing fulcrum for the rubber band 210. Its metal material ensures that the clamping force is sufficient to resist loosening caused by the impact of the cleaning solution and mechanical vibration during the cleaning process. It should be noted that through the synergistic effect of the paperclip 220 and the rubber band 210, not only is the clamping stability of the rubber band 210 on the circuit board 300 enhanced, but also the fixing component 200 can be quickly disassembled and adjusted. Operators can adjust the position of the paperclip 220 according to the actual placement of the circuit board 300 to optimize the tension of the rubber band 210, ensuring that small-sized circuit boards 300 of different sizes or thicknesses can be uniformly clamped. Similarly, the paperclip 220, as a common low-cost hardware component, together with the substrate 100 and the rubber band 210, constitutes an economical and efficient fixing system, further reducing the overall manufacturing cost of the fixture mold, while its mechanical reliability ensures the continuous stability of the cleaning process. Specifically, two paperclips 220 are arranged opposite each other on both sides of the substrate 100, forming symmetrical fixing points. By attaching the two ends of the rubber band 210 to these two paperclips 220 respectively, bidirectional balanced tension is achieved on the circuit board 300 in the horizontal or vertical direction. This ensures that the circuit board 300 is uniformly pressed and stressed in the mounting groove 101, avoiding board tilting or local stress concentration that may result from unilateral fixing. Furthermore, the symmetrical structural design simplifies the operation process—operators only need to attach the two ends of the rubber band 210 to the corresponding paperclips 220 on both sides to complete the fixing, ensuring consistent fixing effect without complex adjustments. In addition, the layout of the paperclips 220 on both sides is adapted to the edge position of the substrate 100, which does not interfere with the placement of the circuit board 300, and can make full use of the space of the substrate 100 to form a stable support. This further improves the universal adaptability of the fixture mold to small-sized circuit boards 300 of different shapes and sizes, ensuring that the circuit board 300 will not shift or fall off due to uneven force during the cleaning process.It is easy to understand that the paperclip 220 can slide along the edge of the substrate 100, giving the fixing component 200 dynamic adjustment capability. Operators can flexibly adjust the positioning point of the paperclip 220 on the edge of the substrate 100 according to the specific dimensions of the circuit board 300 being processed, such as differences in length and width, or its placement. This changes the tension direction and distribution of the elastic band 210, ensuring that the elastic band 210 always precisely fits the edge of the circuit board 300 and applies uniform pressure. It should be noted that this sliding design eliminates the risk of fixing failure caused by minor dimensional deviations of the circuit board 300, such as ±1-2mm tolerance. This significantly improves the compatibility of the fixture with various small-sized circuit boards 300, such as 30×60mm and 20×40mm. Furthermore, the ease of sliding adjustment further simplifies the operation steps, enabling production personnel to quickly respond to different order requirements and improve overall production efficiency.
[0042] Refer to Figure 1 In some embodiments of this utility model, the fixing component 200 includes adhesive tape 230. After the rubber band 210 presses and fixes the circuit board 300, the adhesive tape 230 adheres and fixes the rubber band 210 to the substrate 100, forming a secondary locking of the position of the rubber band 210. This effectively prevents the rubber band 210 from shifting or loosening during the cleaning process due to the impact of the liquid flow, mechanical vibration, or the relaxation of the elasticity of the rubber band 210 itself. The adhesive tape 230, the rubber band 210, and the paperclip 220 together constitute a multi-level fixing system, which significantly improves the reliability of fixing the circuit board 300. Its lightweight characteristics do not increase the extra burden on the fixture module, and the adhesion operation is simple, requiring no complicated tools or skills, further simplifying the production process. Furthermore, the flexible material of the tape 230 can adapt to minor unevenness on the surfaces of the substrate 100 and the elastic band 210, forming a tight fit. This ensures stable fixing while avoiding scratches or indentations on the surface of the circuit board 300, guaranteeing the integrity of the circuit board 300 after cleaning and improving the practicality and durability of the fixture mold. Optionally, the tape 230 and the elastic band 210 are arranged perpendicular to each other, optimizing the distribution direction of the fixing force—the elastic band 210 mainly provides lateral or longitudinal clamping force, while the vertically arranged tape 230 restricts the displacement of the elastic band 210 in the direction perpendicular to the tension of the elastic band 210 through adhesive force. The two form an orthogonal constraint, significantly improving the overall stability of the fixing system.
[0043] Optionally, the mesh 400 is firmly bonded to the substrate 100 with adhesive, eliminating the possibility of liquid leakage caused by gaps or looseness between the mesh 400 and the substrate 100. This also enhances the structural stability of the mesh 400—the bonded mesh 400 will not shift or detach due to liquid impact during cleaning, mechanical friction, or long-term use, ensuring the continuity of its filtration and support functions. Understandably, the bonding process is simple and efficient, requiring no additional mechanical fasteners, reducing the manufacturing cost and complexity of the fixture mold. Furthermore, the bonded structure is lightweight, not increasing the overall weight of the substrate 100 or affecting its conveying stability on the equipment rollers.
[0044] Refer to Figure 2 In some embodiments of this utility model, multiple mounting slots 101 adopt a dot matrix layout, such as a matrix arrangement, enabling the substrate 100 surface to simultaneously support multiple small-sized circuit boards 300, such as 2×3 or 3×4 arrangements. This significantly improves the processing efficiency of a single clamping operation—operators can fix multiple circuit boards 300 on the same fixture mold and complete batch cleaning with a single feeding, reducing equipment idle time and the frequency of manual operation. Furthermore, the uniform spacing design of the dot matrix arrangement ensures that the substrate 100 area around each mounting slot 101 has sufficient structural strength, avoiding local stress concentration or substrate 100 deformation due to multiple slots, and ensuring the independent stability of each circuit board 300 during the cleaning process. Moreover, this layout also enhances the universal adaptability of the fixture mold—by adjusting the dot matrix density of the mounting slots 101, such as reducing or increasing the slot spacing according to the size of the circuit board 300, different production needs can be flexibly matched. At the same time, the regularity of the dot matrix structure simplifies the positioning process for operators to place the circuit boards 300, reduces the probability of misoperation, and improves production efficiency and product quality consistency. Optionally, the substrate 100 is a square plate, which is highly compatible with the conveyor path and internal space layout of the ion cleaning horizontal line equipment. The square design avoids conveyor jamming or edge interference problems that may occur with irregularly shaped substrates 100, ensuring that the fixture mold can smoothly pass through the support points of the equipment's conveyor rollers. This solves the problem of plate jamming caused by the central collapse when small-sized circuit boards 300 are placed directly due to their small size. Furthermore, the symmetrical structure of the square substrate 100 simplifies the layout design of the mounting slots 101. Operators can flexibly plan the slot direction and density according to common small-sized circuit board 300 specifications, such as 30×60mm and 20×40mm, without needing to adjust the processing technology for irregularly shaped substrates 100. At the same time, the standardized shape of the square plate reduces the difficulty of mold making and material waste. Combined with the universal compatibility of components such as mesh 400 and elastic band 210, this further improves the economy and production applicability of the fixture mold, enhancing the company's ability to accept orders for diverse small-sized circuit boards 300.
[0045] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.
Claims
1. A circuit board manufacturing auxiliary assembly mold, characterized in that, include: The substrate is provided with multiple mounting slots for placing circuit boards. A mesh is attached to one side of the substrate, which covers the surface of the substrate and allows the liquid medicine to pass through while preventing the circuit board from falling off. A fixing component is connected to the substrate and used to fix the circuit board.
2. The circuit board production auxiliary assembly mold according to claim 1, characterized in that: The fixing component includes an elastic band for pressing and fixing the circuit board in the mounting groove.
3. The circuit board production auxiliary assembly mold according to claim 2, characterized in that: The fixing component includes a paperclip that can clamp the substrate and is used to tighten and fix the rubber band.
4. The circuit board production auxiliary assembly mold according to claim 3, characterized in that: The paperclips are two in number and arranged opposite each other on both sides of the substrate, and the ends of the rubber bands are respectively snapped into the two paperclips.
5. The circuit board production auxiliary assembly mold according to claim 3, characterized in that: The paperclip is able to slide along the edge of the substrate.
6. The circuit board production auxiliary assembly mold according to any one of claims 2 to 5, characterized in that: The fixing component includes tape, which adheres and fixes the rubber band to the substrate after the rubber band is pressed and fixed to the circuit board.
7. The circuit board production auxiliary assembly mold according to claim 6, characterized in that: The tape and the rubber band are arranged perpendicular to each other.
8. The circuit board production auxiliary assembly mold according to claim 1, characterized in that: The mesh is bonded and fixed to the substrate.
9. The circuit board production auxiliary assembly mold according to claim 1, characterized in that: Multiple mounting slots are arranged on the substrate.
10. The circuit board production auxiliary assembly mold according to claim 1, characterized in that: The substrate is a square plate.