Improved printing tool for filling holes of copper paste on a circuit board

Abstract

The utility model discloses improve the printing tool of line board copper paste hole filling, include: scrape handle, scrape glue, fixed connection in scrape handle, scrape glue is provided with first scraping surface and second scraping surface in the side surface of the side away from the connection of scrape handle, and first scraping surface and second scraping surface meet and form the included angle A, satisfy: 140 degree <= A <= 160 degree. Through the non - planar scraping surface combination design, solve the prior art problem from two dimensions of mechanics transmission and ink flow control, the structure makes scrape glue and screen contact, and the pressure changes from single plane stress into multi - angle collaborative stress, i. e. the included angle design between the first scraping surface of plane or inclined plane and the second scraping surface of inclined plane, guide ink directional into the hole to be filled along the specific path, reduce the disordered accumulation of hole ink, and simultaneously, the acute angle force point of central area at the intersection line makes the stress of screen more uniform, avoids the unbalanced distribution of hole ink caused by the local acute angle concentration of traditional plane glue scraping, and significantly improves the reliability of line board electrical connection.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a printing tool for improving copper paste filling holes in circuit boards. Background Technology

[0002] In the field of printed circuit board (PCB) manufacturing, multilayer PCBs achieve electrical conductivity between different layers of circuit pads through copper paste filling technology, which is one of the key processes to ensure the functional integrity of the circuit board.

[0003] However, existing technologies cannot apply uniform pressure to the ink during the printing process, resulting in extremely uneven ink distribution at the orifices on the ink outlet surface. Specifically, some orifices experience excessive ink accumulation due to excessive pressure, easily leading to short circuits between adjacent orifices due to ink overflow; while other orifices suffer from insufficient pressure, resulting in little or no ink, causing open circuits. This uneven ink filling directly affects the electrical reliability of the PCB board and is a long-standing technical bottleneck that the industry has failed to effectively resolve. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an improved printing tool for copper paste filling holes on circuit boards. By guiding the ink with an angle and ensuring uniform force distribution at the center acute angle, it solves the problem of uneven copper paste filling holes, avoids open circuits and short circuits, improves the reliability of circuit board circuit connections, and the process is simple and does not increase production costs.

[0005] The printing tool for improving copper paste filling holes on circuit boards according to an embodiment of the present invention includes:

[0006] Scraper handle;

[0007] A scraper is fixedly connected to the scraper handle. The scraper has a first scraping surface and a second scraping surface on the side of the scraper away from the connection with the scraper handle. The first scraping surface and the second scraping surface intersect and form an included angle A, which satisfies: 140°≤A≤160°.

[0008] The printing tool for improving copper paste filling holes on circuit boards according to the present invention has at least the following beneficial effects: the squeegee surface is provided with an intersecting first squeegee surface and a second squeegee surface, with an included angle of 140°~160°. Through the non-planar squeegee surface combination design, the existing technical problems are solved from the two dimensions of mechanical transmission and ink flow control. This structure makes the pressure when the squeegee contacts the screen change from a single plane force to a multi-angle coordinated force. That is, the included angle design between the planar or inclined first squeegee surface and the inclined second squeegee surface guides the ink to enter the hole to be filled along a specific path, reducing the disordered accumulation of ink at the hole opening. Meanwhile, the sharp angle of the central area at the intersection line makes the screen printing plate more uniformly stressed, avoiding the uneven ink distribution at the orifice caused by the concentration of sharp angles in traditional flat squeegees. In this regard, the included angle range of 140°~160° is precisely adapted to the requirements of copper paste filling process. Especially for multilayer boards with a thickness of more than 3mm, it ensures that the inclined surface can effectively guide the ink to overcome the surface tension inside the hole and enter the deep hole, while preventing ink splashing or insufficient filling inside the hole due to excessive angle. This significantly improves the reliability of the electrical connection of the circuit board, and the structure is simple, easy to manufacture and assemble, and suitable for the needs of large-scale industrial production.

[0009] The printing tool for improving copper paste filling holes on circuit boards according to some embodiments of this utility model satisfies: A=150°.

[0010] According to some embodiments of the present invention, the printing tool for improving copper paste filling holes on circuit boards has a first scraping surface that is flat and a second scraping surface that is 30° inclined.

[0011] According to some embodiments of the present invention, the printing tool for improving copper paste filling of circuit boards has an intersection line between the first scraping surface and the second scraping surface located at the center of the scraping surface.

[0012] According to some embodiments of the present invention, the printing tool for improving copper paste filling of circuit boards has an intersection line between the first scraping surface and the second scraping surface that is offset from the center of the scraping surface.

[0013] According to some embodiments of the present invention, the printing tool for improving copper paste filling of circuit boards is wherein the scraper handle and the scraper are fixed together by locking screws.

[0014] According to some embodiments of the present invention, the printing tool for improving copper paste filling holes on circuit boards has a mounting groove in the middle of the scraper handle for inserting the scraper, and the scraper handle is provided with a threaded hole communicating with the mounting groove. The locking screw is threaded into the threaded hole to press and fix the scraper.

[0015] According to some embodiments of the present invention, the printing tool for improving copper paste filling holes on circuit boards has a threaded hole that extends obliquely toward one side of the center of the mounting groove so as to fix the scraper by obliquely pushing against it with the locking screw.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure of the printing tool for improving the copper paste filling of circuit boards according to an embodiment of the present invention.

[0019] Explanation of icon numbers:

[0020] Scraper handle 100; mounting groove 101; threaded hole 102;

[0021] Glue scraping 200; First scraping surface 201; Second scraping surface 202; Intersecting line 203. Detailed Implementation

[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0023] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0025] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0026] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] In the field of printed circuit board (PCB) manufacturing, multilayer PCBs achieve electrical conductivity between different layers of circuit pads through copper paste filling technology, which is one of the key processes to ensure the functional integrity of the circuit board.

[0028] However, existing technologies cannot apply uniform pressure to the ink during the printing process, resulting in extremely uneven ink distribution at the orifices on the ink outlet surface. Specifically, some orifices experience excessive ink accumulation due to excessive pressure, easily leading to short circuits between adjacent orifices due to ink overflow; while other orifices suffer from insufficient pressure, resulting in little or no ink, causing open circuits. This uneven ink filling directly affects the electrical reliability of the PCB board and is a long-standing technical bottleneck that the industry has failed to effectively resolve.

[0029] Therefore, such as Figure 1As shown, this utility model proposes a printing tool for improving the copper paste filling of circuit boards. It includes a squeegee handle 100 and a squeegee 200 fixedly connected to the squeegee handle 100. The squeegee 200 has a first squeegee surface 201 and a second squeegee surface 202 on the side of the squeegee 200 away from the connection with the squeegee handle 100. The first squeegee surface 201 and the second squeegee surface 202 intersect and form an included angle A, which satisfies: 140°≤A≤160°. It should be noted that the squeegee 200 has intersecting first and second squeegee surfaces 201 and 202, with an included angle of 140°~160°. This non-planar squeegee surface combination design addresses existing technical problems from two dimensions: mechanical transmission and ink flow control. This structure transforms the pressure on the squeegee 200 from a single planar force to a multi-angle coordinated force when it contacts the screen. Specifically, the angle design between the planar or inclined first squeegee surface 201 and the inclined second squeegee surface 202 guides the ink along a specific path into the filling holes, reducing disordered ink accumulation at the hole openings. Simultaneously, the central area... The sharp angle at the intersection line 203 ensures more uniform force on the screen, avoiding the uneven ink distribution at the orifice caused by the concentration of sharp angles in traditional flat squeegees. The included angle range of 140°~160° precisely matches the requirements of copper paste filling process, especially for multilayer boards with a thickness of 3mm or more. It ensures that the inclined surface can effectively guide the ink to overcome the surface tension inside the hole and enter the deep hole, while preventing ink splashing or insufficient filling inside the hole due to excessive flow caused by excessive angle. This significantly improves the reliability of the electrical connection of the circuit board, and the structure is simple, easy to manufacture and assemble, and suitable for the needs of large-scale industrial production.

[0030] Optionally, the following condition must be met: A=150°. This value is at the center of the optimal range of 140°-160°. This ensures both the efficient guiding ability of the inclined structure for ink flow, effectively reducing ink accumulation at the orifice, and the uniformity of the stress on the plane and the inclined surface, avoiding local pressure concentration. This achieves optimal ink distribution control during copper paste filling, significantly reducing the risk of open circuits with insufficient ink and short circuits with excessive ink. It is suitable for the filling needs of most circuit boards with conventional hole diameters and thicknesses, balancing process universality and reliability. Specifically, refer to... Figure 1 In some embodiments of this invention, the first scraping surface 201 is a flat surface, and the second scraping surface 202 is a 30° inclined surface. The flat surface provides a stable support base, preventing scraper deformation, while the 30° inclined surface, as the main flow guiding structure, precisely guides the copper paste into the air vents in a specific direction. Furthermore, the inclined angle overcomes the surface tension of the ink, promoting directional ink flow into the vents while reducing disordered ink diffusion at the vent openings. Combined with the acute angle of force formed at the junction of the flat and inclined surfaces, the force on the screen is further balanced, ensuring uniform ink output and effectively solving the problem of abnormal ink distribution at the vent openings caused by single force application in traditional flat scrapers.

[0031] In some embodiments of this utility model, such as Figure 1 As shown, the intersection line 203 of the first squeegee surface 201 and the second squeegee surface 202 is offset from the center of the squeegee 200. The main direction of ink flow can be flexibly adjusted according to the actual hole distribution characteristics of the circuit board, such as asymmetrical holes or holes concentrated at the edges. This allows the squeegee 200 to preferentially apply uniform pressure to the holes in specific areas during printing, ensuring ink filling effect at the edges or scattered holes, avoiding short circuits between adjacent holes caused by excessive pressure in the central area, while also maintaining overall force balance. This expands the adaptability of the printing tool to different hole layouts and improves the uniformity of hole filling under complex working conditions.

[0032] In some other embodiments of this utility model, the intersection line 203 of the first squeegee surface 201 and the second squeegee surface 202 is located at the center of the squeegee 200, so that the contact pressure between the squeegee 200 and the screen during printing is concentrated in the central area, forming a uniform force distribution. This ensures that the pressure gradient is gentle when the ink diffuses from the center to the surrounding area. This is especially suitable for circuit boards with symmetrical or dense hole layouts, and can accurately control the amount of ink filling at each hole, avoiding local pressure differences caused by the offset of the intersection line 203. This further improves the consistency of copper paste filling and reduces defects such as insufficient or excessive ink caused by uneven force.

[0033] In some embodiments of this utility model, the squeegee handle 100 and the squeegee 200 are fixed together by locking screws. This structure is simple and highly reliable, ensuring that the squeegee 200 maintains a stable angle and position during printing, preventing displacement or loosening due to vibration or pressure. This maintains the accuracy of the angle between the first squeegee surface 201 and the second squeegee surface 202, as well as the accuracy of the intersection line 203, ensuring continuous and effective ink flow control. Simultaneously, it facilitates quick disassembly and replacement of the squeegee 200, adapting to the needs of different process parameters. Specifically, refer to... Figure 1In some embodiments of this utility model, a mounting groove 101 for inserting the squeegee 200 is provided in the middle of the squeegee handle 100, and a threaded hole 102 communicating with the mounting groove 101 is provided to provide a precise fixing path for the locking screw. This allows the squeegee 200 to be directly pressed and fixed by the screw in the threaded hole 102 after insertion, without the need for additional adhesives or complex clamps. This simplifies the installation process of the squeegee 200 and ensures a tight fit between the squeegee 200 and the squeegee handle 100, preventing axial slippage of the squeegee 200 during printing, maintaining the stability of the squeegee surface structure, and thus ensuring the reliability of the ink flow guiding function. Furthermore, the threaded hole 102 is designed to extend obliquely towards the center of the mounting groove 101, allowing the locking screw to push the squeegee 200 obliquely when tightened. This oblique pressure presses the squeegee 200 more tightly into the mounting groove 101, enhancing the fixation strength. For example, it can prevent the scraper 200 from loosening due to the reaction force of high-pressure ink, and by applying force obliquely, it can evenly distribute the contact pressure between the scraper 200 and the mounting groove 101, avoiding damage to the scraping surface structure caused by local extrusion deformation, ensuring the angular accuracy and surface flatness of the first scraping surface 201 and the second scraping surface 202, thereby maintaining the precision of ink flow control. In some processing applications, the relative outer walls of the scraper handle 100 are inclined surfaces, and the threaded hole 102 is vertically set on the inclined surface.

[0034] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An improved printing tool for copper paste filling holes on circuit boards, characterized in that, include: Scraper handle; A scraper is fixedly connected to the scraper handle. The scraper has a first scraping surface and a second scraping surface on the side of the scraper away from the connection with the scraper handle. The first scraping surface and the second scraping surface intersect and form an included angle A, which satisfies: 140°≤A≤160°.

2. The printing tool for improving copper paste filling holes on circuit boards according to claim 1, characterized in that: Satisfies: A=150°.

3. The printing tool for improving copper paste filling holes on circuit boards according to claim 1, characterized in that: The first scraping surface is a flat surface, and the second scraping surface is a 30° inclined surface.

4. The printing tool for improving copper paste filling of circuit boards according to any one of claims 1 to 3, characterized in that: The intersection line of the first scraping surface and the second scraping surface is located at the center of the scraping adhesive.

5. The printing tool for improving copper paste filling of circuit boards according to any one of claims 1 to 3, characterized in that: The intersection line of the first scraping surface and the second scraping surface is offset from the center of the scraping surface.

6. The printing tool for improving copper paste filling holes on circuit boards according to claim 1, characterized in that: The scraper handle and the scraper adhesive are fixed together by locking screws.

7. The printing tool for improving copper paste filling holes on circuit boards according to claim 6, characterized in that: The scraper handle has a mounting groove in the middle for inserting the scraper adhesive. The scraper handle is provided with a threaded hole that communicates with the mounting groove. The locking screw is threaded into the threaded hole to press and fix the scraper adhesive.

8. The printing tool for improving copper paste filling holes on circuit boards according to claim 7, characterized in that: The threaded hole extends obliquely toward one side of the center of the mounting groove to fix the scraper by obliquely pushing against it with the locking screw.

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