domain controller

Abstract

This utility model relates to the field of electrical equipment heat dissipation technology, and provides a domain controller. The domain controller includes: a housing; a circuit board with a chip disposed on the circuit board; a thermally conductive component, wherein the chip, the thermally conductive component, and the housing are stacked in the thickness direction of the chip and thermally connected to each other; and a clamping assembly connected between the thermally conductive component and the circuit board, used to apply a pre-tightening force along the thickness direction to the thermally conductive component and the circuit board to bring them closer together, wherein the pre-tightening force applied by the clamping assembly is adjustable. This domain controller can prevent overvoltage damage to the chip and reduce the gap between the thermally conductive component and the chip, which helps to prevent air from entering the interface material between the thermally conductive component and the chip, reducing thermal resistance and improving heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electrical equipment, and in particular to a domain controller. Background Technology

[0002] As a core component of automotive domain controllers, the SoC chip is mainly used to process vehicle information and realize intelligent control. It features high computing power, high performance, and high integration, and can integrate multiple functions into one, processing vehicle information, realizing intelligent control, and supporting advanced driver assistance functions in automobiles. With the continuous improvement of automotive intelligence and informatization, the functions integrated into SoC chips are becoming more and more numerous, resulting in a gradual increase in chip power consumption, making heat dissipation a key issue in its design.

[0003] Current automotive domain controller SoC chips primarily employ contact conduction for heat dissipation, directly contacting the SoC chip with the protrusions of the heat sink housing and filling the interface with material to conduct heat from the SoC chip to the heat sink housing. However, the fit between the heat sink protrusions formed by the dimensional chain and the SoC chip results in significant accumulated tolerances, requiring a large design clearance to prevent chip damage due to overvoltage. This clearance, in turn, makes it easy for air to enter the interface material, increasing thermal resistance and affecting heat transfer. Utility Model Content

[0004] This invention provides a domain controller to solve the problem in the prior art where the large design gap between the heat sink protrusion and the chip in the vehicle domain controller causes air to easily enter the interface material between the chip and the protrusion, resulting in increased thermal resistance.

[0005] This utility model provides a domain controller, including:

[0006] case;

[0007] A circuit board, on which chips are mounted;

[0008] A thermally conductive component, wherein the chip, the thermally conductive component, and the housing are stacked in the thickness direction of the chip and are thermally connected to each other;

[0009] A clamping assembly, connected between the heat-conducting component and the circuit board, is used to apply a pre-tightening force along the thickness direction to the heat-conducting component and the circuit board to bring them closer together. The pre-tightening force applied by the clamping assembly is adjustable.

[0010] According to the domain controller provided by this utility model, the clamping assembly includes:

[0011] A connector is provided between the heat-conducting component and the circuit board;

[0012] A locking component is sleeved on the connector and threadedly connected to the connector, and the heat-conducting component and the circuit board are clamped between the connector and the locking component.

[0013] According to the domain controller provided by this utility model, the clamping assembly further includes:

[0014] An elastic element that elastically abuts against the connector and the heat-conducting element; or, an elastic element that elastically abuts against the locking element and the circuit board.

[0015] According to the domain controller provided by this utility model, the locking member is located on the side of the circuit board away from the heat-conducting member, and the elastic member elastically abuts against the connecting member and the heat-conducting member; the clamping assembly further includes:

[0016] A stop member is fixed to the connector in the thickness direction and located on the side of the heat-conducting component near the circuit board. The stop member and the heat-conducting component are engaged in a limiting fit in the thickness direction.

[0017] According to the domain controller provided by this utility model, it further includes:

[0018] The base is located on the side of the circuit board away from the heat-conducting component. The side of the base away from the circuit board has a recessed hole. The locking component is disposed in the recessed hole and engages with the base in the circumferential upper limit of the locking component. The base is clamped between the circuit board and the locking component.

[0019] According to the domain controller provided by this utility model, it further includes:

[0020] A first insulating element is disposed between the base and the circuit board.

[0021] According to the domain controller provided by this utility model, it further includes:

[0022] A flexible insulating pad is disposed on the side of the base away from the circuit board.

[0023] According to the domain controller provided by this utility model, it further includes:

[0024] A support is provided between the heat-conducting component and the circuit board, and the connector passes through the support.

[0025] According to the present invention, a domain controller is provided, wherein there are multiple clamping components distributed around the chip, and the support is a ring structure and is arranged around the chip.

[0026] According to the domain controller provided by this utility model, it further includes:

[0027] A second insulating element is disposed between the support and the circuit board.

[0028] According to the present invention, a domain controller is provided, wherein the heat-conducting component is a heat spreader, and the area of ​​the heat spreader is larger than the area of ​​the chip.

[0029] According to the present invention, a domain controller is provided in which the thermal conductive element is in direct contact with the chip, and the gap between the thermal conductive element and the chip is filled with thermally conductive silicone grease; and / or, the thermal conductive element is bonded to the housing by thermally conductive gel.

[0030] The domain controller provided by this utility model, by setting a heat-conducting component and a clamping assembly, places the heat-conducting component between the chip and the housing, uses the clamping assembly to connect the heat-conducting component and the circuit board, and applies a pre-tightening force along the thickness direction of the chip to bring the heat-conducting component and the circuit board closer together. By adjusting the pre-tightening force, the heat-conducting component can press the chip with appropriate pressure. This can not only avoid over-pressure damage to the chip, but also reduce the gap between the heat-conducting component and the chip, which helps to prevent air from entering the interface material between the heat-conducting component and the chip, reduce thermal resistance, and improve heat dissipation efficiency. This solves the problems of low heat dissipation efficiency, difficult pressure control, and high thermal resistance of the SoC chip in traditional domain controllers. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a cross-sectional view of the domain controller provided by this utility model at the clamping assembly.

[0033] Figure 2 This is a cross-sectional view of the domain controller provided by this utility model at the chip.

[0034] Figure 3 This is an exploded view of part of the structure of the domain controller provided by this utility model.

[0035] Figure 4 yes Figure 1 A magnified view of part A shown in the middle circle.

[0036] Figure label:

[0037] 1. Housing; 2. Circuit board; 21. Chip; 3. Heat-conducting component; 4. Clamping assembly; 41. Connector; 411. Cap; 412. Shaft; 42. Locking component; 43. Elastic component; 44. Stop component; 45. Positioning nut; 46. Washer; 5. Base; 6. Support; 71. First insulating component; 72. Second insulating component; 8. Flexible insulating pad. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] In the description of the embodiments of this utility model, it should be noted that, unless otherwise expressly specified and limited, the terms "first" and "second" are numbered for the purpose of clearly identifying product components and do not represent any substantial difference. The terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model according to the specific circumstances. Furthermore, "multiple" means two or more. In the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0040] The following is combined with Figures 1-4 This invention describes the domain controller of the present invention.

[0041] like Figure 1 and Figure 2 As shown, the domain controller provided in this embodiment of the present invention includes a housing 1, a circuit board 2, a heat-conducting component 3, and a clamping assembly 4. A chip 21 is disposed on the circuit board 2. The chip 21, the heat-conducting component 3, and the housing 1 are stacked in the thickness direction of the chip 21 and thermally connected to each other. The clamping assembly 4 is connected between the heat-conducting component 3 and the circuit board 2, and is used to apply a pre-tightening force along the thickness direction of the chip 21 to the heat-conducting component 3 and the circuit board 2, bringing them closer together. The pre-tightening force applied by the clamping assembly 4 is adjustable.

[0042] It is understood that the heat-conducting component 3 has a first side and a second side opposite to each other in the thickness direction of the chip 21. The first side is thermally connected to the chip 21, and the second side is thermally connected to the housing 1. The heat generated by the battery cell can be transferred to the housing 1 through the heat-conducting component 3, and the housing 1 dissipates the heat into the environment, thereby achieving heat dissipation of the chip 21 and preventing performance degradation, shortened lifespan, or even system failure caused by overheating of the chip 21. The housing 1 can be a heat dissipation housing 1 for a domain controller, and its external cooling can be achieved through natural heat dissipation, air cooling, or liquid cooling.

[0043] The clamping assembly 4 connects the heat-conducting component 3 and the circuit board 2, and provides a certain pre-tightening force so that the heat-conducting component 3 presses the chip 21 with appropriate pressure. When installing the domain controller, first, the heat-conducting component 3 is attached to the chip 21, the clamping assembly 4 is connected to the heat-conducting component 3 and the circuit board 2, and a pre-tightening force is applied to the heat-conducting component 3 and the circuit board 2; by adjusting the pre-tightening force, the heat-conducting component 3 presses the chip 21 with appropriate pressure; then the housing 1 is attached to the heat-conducting component 3 to achieve a thermally conductive connection between the chip 21 and the housing 1.

[0044] During installation, an interface material can be applied to the side of the chip 21 or the heat-conducting component 3 that is attached to the chip 21. Then, the heat-conducting component 3 is attached to the chip 21. The clamping assembly 4 applies a suitable pre-tightening force to the heat-conducting component 3 and the circuit board 2 to reduce the distance between the heat-conducting component 3 and the chip 21, as well as the thickness of the interface material between the heat-conducting component 3 and the chip 21.

[0045] The domain controller provided in this embodiment of the utility model, by setting a heat-conducting element 3 and a clamping assembly 4, places the heat-conducting element 3 between the chip 21 and the housing 1, uses the clamping assembly 4 to connect the heat-conducting element 3 and the circuit board 2, and applies a pre-tightening force to the heat-conducting element 3 and the circuit board 2 along the thickness direction of the chip 21 to bring them closer together. By adjusting the pre-tightening force, the heat-conducting element 3 can press the chip 21 with a suitable pressure. This can not only avoid overpressure damage to the chip 21, but also reduce the gap between the heat-conducting element 3 and the chip 21, which helps to prevent air from entering the interface material between the heat-conducting element 3 and the chip 21, reduce thermal resistance, and improve heat dissipation efficiency. This solves the problems of low heat dissipation efficiency, difficult pressure control, and high thermal resistance of the SoC chip 21 in traditional domain controllers.

[0046] It should be noted that an interface material can typically be provided between the heat-conducting component 3 and the chip 21, and between the heat-conducting component 3 and the housing 1, to fill the surface unevenness between the chip 21 and the heat-conducting component 3, and between the heat-conducting component 3 and the housing 1, thereby reducing contact thermal resistance. The interface material is an adhesive with thermally conductive properties.

[0047] Optionally, the thermal conductive element 3 is in direct contact with the chip 21, and the gap between the thermal conductive element 3 and the chip 21 is filled with thermally conductive silicone grease. And / or, the thermal conductive element 3 is bonded to the housing 1 by thermally conductive gel.

[0048] The thermal grease, combined with the pre-tightening force of the clamping assembly 4, enables a zero-gap fit between the thermally conductive component 3 and the chip 21, allowing direct contact between them. The thermal grease fills the gaps between the uneven areas on the chip 21 and the thermally conductive component 3, significantly reducing the thermal resistance between them. The thermally conductive gel, with its excellent thermal conductivity, adheres to the housing 1, further improving the thermal conductivity efficiency of both components.

[0049] In this embodiment of the invention, the heat-conducting component 3 is a heat spreader, and the area of ​​the heat spreader is larger than the area of ​​the chip 21. The heat spreader has high thermal conductivity, and the heat from the chip 21 can be quickly and evenly distributed on the heat spreader. The larger area of ​​the heat spreader increases the heat dissipation area and efficiency of the chip 21. In practice, the area of ​​the heat spreader can be customized according to the heat dissipation of the chip 21 and the heat dissipation environment.

[0050] like Figure 3 and Figure 4 As shown, in some embodiments of this utility model, the clamping assembly 4 includes a connector 41 and a locking member 42. The connector 41 passes through the heat-conducting member 3 and the circuit board 2. The locking member 42 is sleeved on the connector 41 and threadedly connected to the connector 41, and the heat-conducting member 3 and the circuit board 2 are clamped between the connector 41 and the locking member 42.

[0051] Specifically, the connector 41 has a shaft portion 412 and a cap portion 411, with the cap portion 411 connected to one end of the shaft portion 412. The heat-conducting component 3 has a first through hole, and the circuit board 2 has a second through hole. The shaft portion 412 of the connector 41 passes through the first and second through holes. The shaft portion 412 has an external thread, and the locking component 42 has an internal thread. The locking component 42 is sleeved on the shaft portion 412 and threadedly connected to it. The heat-conducting component 3 and the circuit board 2 are clamped between the cap portion 411 and the locking component 42. The axial position of the locking component 42 on the shaft portion 412 can be adjusted by the number of turns or the distance by which the connector 41 is screwed into the locking component 42, which can be used to meet the pressure adjustment requirements of chips 21 with different thicknesses. Optionally, the connector 41 is a screw, and the locking component 42 is a lock nut or a structural component with a threaded groove.

[0052] In one embodiment, see Figure 4 The cap 411 of the connector 41 is located on the side of the heat-conducting component 3 away from the circuit board 2, and the locking component 42 is located on the side of the circuit board 2 away from the heat-conducting component 3. The locking component 42 is fixed relative to the circuit board 2 in its circumferential direction, and is clamped by rotating the connector 41 during installation, which facilitates clamping operations on the side of the heat-conducting component 3 away from the circuit board 2. Alternatively, the connector 41 is fixed relative to the heat-conducting component 3 in its circumferential direction, and is clamped by rotating the locking component 42 during installation, which also facilitates clamping operations on the side of the circuit board 2 away from the heat-conducting component 3.

[0053] In other embodiments, the cap 411 of the connector 41 is located on the side of the circuit board 2 away from the heat conductor 3, and the locking member 42 is located on the side of the heat conductor 3 away from the circuit board 2. Similarly, the locking member 42 can be fixed relative to the heat conductor 3 in its circumferential direction, or the connector 41 can be fixed relative to the circuit board 2 in its circumferential direction.

[0054] like Figure 3 and Figure 4 As shown, in some embodiments of this utility model, the clamping assembly 4 further includes an elastic element 43. The elastic element 43 elastically abuts against the connecting member 41 and the heat-conducting member 3; or, the elastic element 43 elastically abuts against the locking member 42 and the circuit board 2.

[0055] Among them, the elastic element 43 has the ability to deform elastically. When the pre-tightening force is applied by the connector 41, the elastic element 43 will deform and generate an elastic force opposite to the pre-tightening force. When installing the clamping assembly 4, the magnitude of the pre-tightening force applied by the connector 41 to the heat-conducting element 3 and the circuit board 2 can be determined according to the elastic deformation of the elastic element 43, so as to control the magnitude of the pre-tightening force while ensuring that the heat-conducting element 3 presses the chip 21.

[0056] This embodiment utilizes the threaded engagement of the connector 41, locking member 42, and elastic member 43 to achieve precise control of the preload force for chips 21 of different thicknesses. This prevents damage to the chip 21 due to overpressure, while simultaneously ensuring the working pressure of the interface material (such as thermal grease) between the heat-conducting member 3 and the chip 21. This prevents external air from entering the interface material, effectively improving heat dissipation efficiency and ensuring the stability of the chip 21 and the reliability of the system during high-power operation. Furthermore, the elastic member 43 can adaptively adjust the preload force, absorbing and dispersing vibration energy to reduce the impact of vibration on the chip 21.

[0057] In this embodiment of the present invention, the elastic element 43 can be a compression spring, elastic washer, elastic rubber ring, or other structural component that can provide elastic force and is sleeved on the connector 41.

[0058] See Figure 4 The cap 411 of the connector 41 is located on the side of the heat-conducting component 3 away from the circuit board 2, and the locking component 42 is located on the side of the circuit board 2 away from the heat-conducting component 3. The elastic component 43 elastically abuts between the cap 411 of the connector 41 and the heat-conducting component 3, or the elastic component 43 elastically abuts between the locking component 42 and the circuit board 2.

[0059] When the cap 411 of the connector 41 is located on the side of the circuit board 2 away from the heat conductor 3, and the locking member 42 is located on the side of the heat conductor 3 away from the circuit board 2, the elastic member 43 elastically abuts between the cap 411 of the connector 41 and the circuit board 2, or the elastic member 43 elastically abuts between the locking member 42 and the heat conductor 3.

[0060] like Figure 4 As shown, in some embodiments of this utility model, the locking member 42 is located on the side of the circuit board 2 away from the heat-conducting member 3, and the elastic member 43 elastically abuts against the connecting member 41 and the heat-conducting member 3. The clamping assembly 4 also includes a stop member 44, which is fixed to the connecting member 41 in the thickness direction of the chip 21 and is located on the side of the heat-conducting member 3 close to the circuit board 2. The stop member 44 and the heat-conducting member 3 are engaged in a limiting fit in the thickness direction of the chip 21.

[0061] When the elastic member 43 elastically abuts against the cap 411 of the connector 41 and the heat-conducting member 3, the stop member 44 is fixedly sleeved on the shaft 412 of the connector 41 and limits the cooperation with the side of the heat-conducting member 3 near the circuit board 2. This can prevent the connector 41 from being dislodged from the first through hole of the heat-conducting member 3 under the action of the elastic member 43 when the connector 41 is separated from the locking member 42.

[0062] Specifically, the shaft portion 412 of the connector 41 has a large-diameter section and a small-diameter section, and the connection between the large-diameter section and the small-diameter section forms a stepped surface. The clamping assembly 4 also includes a positioning nut 45, which is threadedly connected to the shaft portion 412 and positions the stop member 44 between the locking nut and the stepped surface, thereby axially fixing the stop member 44. At the same time, the positioning nut 45 also facilitates the disassembly of the clamping assembly 4.

[0063] Furthermore, the clamping assembly 4 also includes a gasket 46, which is sleeved on the connector 41 and located between the stop 44 and the heat-conducting component 3. The gasket 46 is used to reduce the friction between the stop 44 and the heat-conducting component 3 during rotation, so as to prevent the stop 44 from causing wear to the heat-conducting component 3.

[0064] like Figure 3 and Figure 4 As shown, the domain controller provided in this embodiment of the present invention also includes a base 5. The base 5 is located on the side of the circuit board 2 away from the heat-conducting component 3, and a recessed hole is provided on the side of the base 5 away from the circuit board 2. A locking component 42 is disposed in the recessed hole and engages with the base 5 in a circumferential upper limit engagement with the locking component 42, and the base 5 is clamped between the circuit board 2 and the locking component 42.

[0065] Specifically, the base 5 has a third through hole, and the countersunk hole on the base 5 is coaxially arranged with the third through hole. The connector 41 passes through the third through hole and the countersunk hole and is threadedly connected to the locking member 42. The wall of the countersunk hole is used to restrict the rotation of the locking member 42, so that the locking member 42 is fixed relative to the circuit board 2 in its circumferential direction. During installation, the connector 41 is rotated to achieve clamping. By setting the base 5, the base 5 is clamped between the circuit board 2 and the locking member 42, which can reduce the stress concentration on the circuit board 2 and protect the circuit board 2.

[0066] like Figure 3As shown in the present invention embodiment, there are multiple clamping components 4, which are distributed around the chip 21 to clamp the heat-conducting component 3 and the circuit board 2 from multiple points to ensure that the chip 21 is subjected to uniform force.

[0067] Furthermore, the base 5 has a ring-shaped structure and is arranged around the chip 21. Optionally, the base 5 is a ring-shaped sheet metal part. Specifically, the base 5 has multiple third through holes, and multiple connectors 41 of the multiple clamping components 4 are correspondingly inserted into the multiple third through holes. The heat-conducting component 3 and the circuit board 2 are clamped by the multiple clamping components 4 surrounding the chip 21. By setting the base 5 with a ring-shaped structure, the number of assembly parts is reduced, the installation is simplified, and the stress concentration of the circuit board 2 can be further reduced.

[0068] like Figure 3 and Figure 4 As shown, the domain controller provided in this embodiment of the present invention further includes a first insulating member 71, which is disposed between the base 5 and the circuit board 2. Optionally, the first insulating member 71 is insulating paper. When the base 5 is a conductive structure, such as a metal part, the electrical isolation between the base 5 and the circuit board 2 is achieved by setting the first insulating member 71 to prevent short circuits. The shape of the first insulating member 71 can be adapted to the shape of the base 5. For example, if the base 5 is a ring structure, then the corresponding first insulating member 71 is also a ring structure.

[0069] like Figure 3 and Figure 4 As shown, the domain controller provided in this embodiment of the present invention also includes a flexible insulating pad 8, which is disposed on the side of the base 5 away from the circuit board 2. When the base 5 is a conductive structure, such as a metal part, the flexible insulating pad 8 enables electrical isolation between the base 5 and other components, while also providing cushioning and shock absorption to protect the chip 21. The shape of the flexible insulating pad 8 can be adapted to the shape of the base 5; for example, if the base 5 is a ring structure, then the corresponding flexible insulating pad 8 is also a ring structure. The flexible insulating pad 8 can be adhesively fixed to the base 5.

[0070] like Figure 3 and Figure 4 As shown, the domain controller provided in this embodiment of the present invention also includes a support 6, which is positioned between the heat-conducting component 3 and the circuit board 2, with a connector 41 passing through the support 6. During clamping operations on the heat-conducting component 3 and the circuit board 2, the support 6 prevents excessive preload from causing overpressure damage to the chip 21 due to improper operation. The height of the support 6 in the thickness direction of the chip 21 is designed according to the thickness of the chip 21; by changing the manufacturing of different heights, it can be used to clamp chips 21 of different thicknesses.

[0071] Among them, the support 6 can be a sheet metal part. The distance between the heat conduction part 3 and the circuit board 2 can be controlled by the height design of the protrusion on the sheet metal support 6, thereby controlling the position of the first side of the heat conduction part 3 to adapt to chips 21 of different heights, improving the reusability of the heat dissipation module, eliminating the need to develop corresponding heat dissipation modules for chips 21 of different specifications, and reducing system costs.

[0072] Further, see Figure 3 The clamping components 4 are multiple, distributed around the chip 21, and the support 6 is annular and also surrounds the chip 21. Optionally, the base 5 is an annular sheet metal part. Specifically, the support 6 has multiple fourth through holes, and the multiple connectors 41 of the multiple clamping components 4 are correspondingly inserted into the multiple fourth through holes. By setting the support 6 with an annular structure, the number of assembly parts is reduced, and the installation is simplified.

[0073] like Figure 3 and Figure 4 As shown, the domain controller provided in this embodiment of the present invention further includes a second insulating member 72, which is disposed between the support 6 and the circuit board 2. Optionally, the second insulating member 72 is insulating paper. When the support 6 is a conductive structure, such as a metal part, the second insulating member 72 is used to achieve electrical isolation between the support 6 and the circuit board 2, preventing short circuits. The shape of the second insulating member 72 can be adapted to the shape of the support 6. For example, if the support 6 is a ring structure, then the corresponding second insulating member 72 is also a ring structure.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A domain controller, characterized in that, include: case; A circuit board, on which chips are mounted; A thermally conductive component, wherein the chip, the thermally conductive component, and the housing are stacked in the thickness direction of the chip and are thermally connected to each other; A clamping assembly, connected between the heat-conducting component and the circuit board, is used to apply a pre-tightening force along the thickness direction to the heat-conducting component and the circuit board to bring them closer together. The pre-tightening force applied by the clamping assembly is adjustable.

2. The domain controller according to claim 1, characterized in that, The clamping assembly includes: A connector is provided between the heat-conducting component and the circuit board; A locking element is sleeved on the connector and threadedly connected to the connector, and the heat-conducting element and the circuit board are clamped between the connector and the locking element.

3. The domain controller according to claim 2, characterized in that, The clamping assembly further includes: An elastic element is elastically abutted between the connector and the heat-conducting element; or, the elastic element elastically abuts between the locking element and the circuit board.

4. The domain controller according to claim 3, characterized in that, The locking member is located on the side of the circuit board away from the heat-conducting member, and the elastic member elastically abuts against the connector and the heat-conducting member; the clamping assembly further includes: A stop member is fixed to the connector in the thickness direction and located on the side of the heat-conducting component near the circuit board. The stop member and the heat-conducting component are engaged in a limiting fit in the thickness direction.

5. The domain controller according to claim 2, characterized in that, Also includes: The base is located on the side of the circuit board away from the heat-conducting component. The side of the base away from the circuit board has a recessed hole. The locking component is disposed in the recessed hole and engages with the base in the circumferential upper limit of the locking component. The base is clamped between the circuit board and the locking component.

6. The domain controller according to claim 5, characterized in that, Also includes: A first insulating element is disposed between the base and the circuit board.

7. The domain controller according to claim 5, characterized in that, Also includes: A flexible insulating pad is disposed on the side of the base away from the circuit board.

8. The domain controller according to claim 1, characterized in that, Also includes: A support is provided between the heat-conducting component and the circuit board, and the connector passes through the support.

9. The domain controller according to claim 8, characterized in that, The number of clamping components is multiple, and the multiple clamping components are distributed around the chip. The support is a ring structure and is arranged around the chip.

10. The domain controller according to claim 8, characterized in that, Also includes: A second insulating element is disposed between the support and the circuit board.

11. The domain controller according to claim 1, characterized in that, The heat-conducting component is a heat spreader, and the area of ​​the heat spreader is larger than the area of ​​the chip.

12. The domain controller according to claim 1, characterized in that, The thermal conductive element is in direct contact with the chip, and the gap between the thermal conductive element and the chip is filled with thermally conductive silicone grease; and / or, the thermal conductive element is bonded to the housing by thermally conductive gel.

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