Clamp type multi-slot silicon wafer deep anisotropic etching cleaning device

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, and specifically is clamp formula multi -slot silicon wafer depth anisotropic etching cleaning device, including corrosion -resistant cabinet and touch control screen, corrosion -resistant cabinet one side upper portion is equipped with operation cavity, corrosion -resistant cabinet one side is located operation cavity is and is installed with transparent sliding door in position, corrosion -resistant cabinet is close to operation cavity one side upper portion from left to right is installed with control button, touch control screen and audible -visual alarm lamp, corrosion -resistant cabinet top fixed mounting has waste gas discharge pipeline, operation cavity bottom end inner wall installs two groups of corrosion groove and QDR cleaning tank that are set up to opposite parallel, operation cavity one end inner wall still is equipped with water gas spray gun. The device adopts integrated design, integrates corrosion groove, QDR cleaning tank and relevant control system in one, can directly complete the cleaning process in the device after wafer etching ends, need not to shift to other equipment, reduces the process link time, improves the overall work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a fixture-type multi-slot silicon wafer deep anisotropic etching and cleaning device. Background Technology

[0002] In the manufacturing process of pressure sensor chips, the wet etching process for the pressure-sensing diaphragm is a critical step. Traditional processes typically use adhesive bonding, where black adhesive is attached to the front side of the wafer for sealing and protection before etching. After etching, the wafer needs to be removed by heating and the adhesive removed using solvents. This traditional process has several problems: First, the large amount of organic solvents used not only pollutes the environment but also increases production costs. Second, the black adhesive does not meet the cleanliness standards of semiconductor processes; the alkali metal impurities it contains can easily diffuse and contaminate the device, affecting its performance. Furthermore, the high coefficient of thermal expansion of the black adhesive material during thermal cycling leads to residual stress accumulation, affecting the integrity of the thin film structure and resulting in poor etching uniformity, making it difficult to guarantee the quality of the pressure sensor diaphragm.

[0003] Meanwhile, existing equipment mostly uses external circulation temperature control, which lacks sufficient temperature control accuracy and integrated fixture systems. While fixture-type single-tank etching equipment solves the problems of adhesive residue and contamination, it lacks a cleaning system, requiring wafers to be moved elsewhere for cleaning after etching, making it inconvenient to use. Therefore, existing etching and cleaning equipment has shortcomings in functional integration and process control, making it difficult to meet diverse process requirements, and its work efficiency and product quality need improvement.

[0004] To address this, we propose a fixture-type multi-slot silicon wafer deep anisotropic etching and cleaning device. Utility Model Content

[0005] The main purpose of this invention is to provide a fixture-type multi-slot silicon wafer deep anisotropic etching and cleaning device. The device adopts an integrated design, integrating the etching tank, QDR cleaning tank and related control system into one unit. After the wafer etching is completed, the cleaning process can be completed directly in this device without transferring to other equipment, reducing the process connection time and effectively solving the problems in the background technology.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A clamp-type multi-slot silicon wafer deep anisotropic etching and cleaning device includes a corrosion-resistant cabinet and a touch control screen. The corrosion-resistant cabinet is a vertically arranged rectangular structure. An operating cavity is provided on the upper part of one side of the corrosion-resistant cabinet. A front inspection door is provided on the lower part of the corrosion-resistant cabinet near the operating cavity. A transparent sliding door is slidably installed on one side of the corrosion-resistant cabinet at the location of the operating cavity. From left to right, control buttons, a touch control screen, and an audible and visual alarm light are respectively installed on the upper part of the corrosion-resistant cabinet near the operating cavity. An exhaust gas discharge pipe is fixedly installed on the top of the corrosion-resistant cabinet. A leak-proof base plate is connected to the bottom of the corrosion-resistant cabinet.

[0008] The inner wall at the bottom of the operating chamber is equipped with two sets of relatively parallel corrosion tanks and a QDR cleaning tank. A water spray gun is also provided on the inner wall at one end of the operating chamber.

[0009] The corrosion-resistant cabinet is also equipped with a PLC industrial control system, an exhaust system, an alarm system, a water supply system, a spray system, a quick drainage system, a liquid level detection module, a temperature monitoring module, a motor driver, a magnetic stirring system, a heating system, a constant temperature control system, and a drainage system. The PLC industrial control system is electrically connected to the touch control screen.

[0010] By adopting the above technical solutions, the internal circulation heating system and real-time temperature feedback mechanism, combined with the uniform stirring effect of the fluid circulation module, improve the corrosion uniformity by 30%, effectively ensuring the quality of key structures such as pressure sensor diaphragms. The device adopts an integrated design, integrating the corrosion tank, QDR cleaning tank, and related control system into one unit. After wafer etching, the cleaning process can be completed directly in this device without transferring to other equipment, reducing process connection time and supporting 24-hour continuous operation. Through multiple safety protection designs (such as air pressure sealing, liquid level and heater interlocking, etc.), the equipment failure rate is reduced by 40%, improving overall work efficiency.

[0011] Specifically, the front access door is provided in three parallel sets, and the upper part of the front access door away from the corrosion-resistant cabinet is provided with a recessed handle.

[0012] Specifically, the PLC industrial control system is electrically connected to the corrosion tank and the QDR cleaning tank, and the PLC industrial control system includes an exhaust system and an alarm system.

[0013] Specifically, the exhaust system includes an exhaust gas duct, and the alarm system includes an audible and visual alarm light.

[0014] Specifically, the liquid level detection module, temperature monitoring module, motor driver, magnetic stirring system, heating system, constant temperature control system, and drainage system are all electrically connected to the PLC industrial control system through the corrosion tank.

[0015] Specifically, the water supply system, spray system, and quick drainage system are all electrically connected to the PLC industrial control system through the QDR cleaning tank.

[0016] The beneficial effects of this utility model are as follows: The clamp-type multi-groove silicon wafer deep anisotropic etching and cleaning device of this utility model replaces black glue bonding with a positive pressure sealing method of a special clamp, which can reduce the use of organic solvents by more than 90%, greatly reducing the pollution of organic solvents to the environment. The clamp sealing method avoids impurity contamination from black glue, ensuring the stability of device performance. Through the internal circulation heating system and real-time temperature feedback mechanism, combined with the uniform stirring effect of the fluid circulation module, the etching uniformity is improved by 30%, effectively ensuring the quality of key structures such as pressure sensor diaphragms. The device adopts an integrated design, integrating the etching tank, QDR cleaning tank and related control system into one unit. After the circular corrosion is completed, the cleaning process can be completed directly within this unit without transferring to other equipment, reducing process connection time and supporting 24-hour continuous operation. Through multiple safety protection designs (such as air pressure sealing, liquid level and heater interlocking, etc.), the equipment failure rate is reduced by 40%, improving overall work efficiency. The human-machine interface of the touch control screen supports process formula switching and storage, and operators can quickly call or set parameters according to different process requirements, simplifying the operation process. The linkage of audible and visual alarm lights with various sensors can promptly remind operators and take protective measures when equipment abnormalities occur (such as low liquid level, abnormal temperature, etc.), avoiding process accidents and ensuring the safety of equipment operation and personnel operation. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a structural block diagram of the present invention;

[0020] In the diagram: 1. Corrosion-resistant cabinet; 2. Operating chamber; 3. Exhaust gas exhaust pipe; 4. Touch control panel; 5. Control buttons; 6. Water and air spray gun; 7. Corrosion tank; 8. Front inspection door; 9. Audible and visual alarm light; 10. QDR cleaning tank; 11. Transparent sliding door; 12. Leak-proof base plate; 13. Recessed handle; 14. PLC industrial control system; 15. Exhaust system; 16. Alarm system; 17. Water supply system; 18. Spray system; 19. Quick drain system; 20. Liquid level detection module; 21. Temperature monitoring module; 22. Motor driver; 2201. Magnetic stirring system; 23. Heating system; 2301. Constant temperature control system; 24. Drainage system. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] As one embodiment of this utility model, such as Figures 1-2 As shown, the clamp-type multi-slot silicon wafer deep anisotropic etching cleaning device of this utility model includes a corrosion-resistant cabinet 1 and a touch control screen 4. The corrosion-resistant cabinet 1 is a vertically arranged rectangular structure. An operating cavity 2 is provided on the upper part of one side of the corrosion-resistant cabinet 1. A front inspection door 8 is provided on the lower part of the side of the corrosion-resistant cabinet 1 near the operating cavity 2. A transparent sliding door 11 is slidably installed on one side of the corrosion-resistant cabinet 1 at the location of the operating cavity 2. From left to right, control buttons 5, a touch control screen 4, and an audible and visual alarm light 9 are respectively installed on the upper part of the side of the corrosion-resistant cabinet 1 near the operating cavity 2. An exhaust gas discharge pipe 3 is fixedly installed on the top of the corrosion-resistant cabinet 1. A leak-proof bottom plate 12 is connected to the bottom of the corrosion-resistant cabinet 1.

[0023] The inner wall at the bottom of the operating chamber 2 is equipped with two sets of relatively parallel corrosion tanks 7 and QDR cleaning tanks 10. A water spray gun 6 is also provided on the inner wall at one end of the operating chamber 2.

[0024] The corrosion-resistant cabinet 1 is also equipped with a PLC industrial control system 14, an exhaust system 15, an alarm system 16, a water supply system 17, a spray system 18, a rapid drainage system 19, a liquid level detection module 20, a temperature monitoring module 21, a motor driver 22, a magnetic stirring system 2201, a heating system 23, a constant temperature control system 2301, and a drainage system 24. The PLC industrial control system 14 is electrically connected to the touch control screen 4.

[0025] During use, the corresponding corrosion process formula is selected or set on the touch control screen 4. After the parameter settings are completed and confirmed, the corrosion program is started, and the PLC industrial control system 14 starts the relevant modules. The heating system 23 and the constant temperature control system 2301 enter the working state. The internal circulation heating module with PID closed-loop control heats the corrosion liquid in the corrosion tank 7. The temperature monitoring module 21 collects the temperature of the corrosion liquid in real time and feeds it back to the PLC industrial control system 14 to ensure that the temperature control accuracy is within ±0.5℃. The motor driver 22 drives the magnetic stirring system 2201 to operate. With the help of the fluid circulation module of the rotating reflux structure in the tank, the corrosion liquid flows evenly and the corrosion effect is improved.

[0026] This utility model also includes three sets of front inspection doors 8 arranged in parallel to each other, and a recessed handle 13 is provided on the upper part of the side of the front inspection door 8 away from the corrosion-resistant cabinet 1.

[0027] This utility model also includes that the PLC industrial control system 14 is electrically connected to the corrosion tank 7 and the QDR cleaning tank 10 respectively, and the PLC industrial control system 14 includes an exhaust system 15 and an alarm system 16.

[0028] This utility model also includes, the exhaust system 15 includes an exhaust gas discharge pipe 3, and the alarm system 16 includes an audible and visual alarm light 9.

[0029] This utility model also includes that the liquid level detection module 20, temperature monitoring module 21, motor driver 22, magnetic stirring system 2201, heating system 23, constant temperature control system 2301 and drainage system 24 are all electrically connected to the PLC industrial control system 14 through the corrosion tank 7.

[0030] This utility model also includes the fact that the water supply system 17, the spray system 18 and the quick drainage system 19 are all electrically connected to the PLC industrial control system 14 through the QDR cleaning tank 10.

[0031] When using this utility model, the operator first needs to place the silicon wafer to be processed stably in the special fixture assembly. One fixture for an etching tank can fix four wafers at the same time. During the wafer loading process, it is necessary to ensure that the wafer and the sealing surface of the fixture are in close contact. After the wafer loading is completed, the fixture is moved into the operating cavity 2 of the corrosion-resistant cabinet 1 and placed in alignment with the positioning structure of the etching tank 7.

[0032] On the touch control screen 4, select or set the corresponding corrosion process formula. After the parameter settings are completed and confirmed, start the corrosion program. The PLC industrial control system 14 starts the relevant modules. The heating system 23 and the constant temperature control system 2301 enter the working state. The internal circulation heating module with PID closed-loop control heats the corrosion liquid in the corrosion tank 7. The temperature monitoring module 21 collects the temperature of the corrosion liquid in real time and feeds it back to the PLC industrial control system 14 to ensure that the temperature control accuracy is within ±0.5℃. The motor driver 22 drives the magnetic stirring system 2201 to operate. In conjunction with the fluid circulation module of the rotating reflux structure in the tank, the corrosion liquid flows evenly and the corrosion effect is improved.

[0033] The liquid level detection module 20 performs real-time detection of the liquid level in the corrosion tank 7 at three points: low, medium, and high. When the liquid level is lower than the warning value, the alarm system 16 of the sound and light alarm light 9 is immediately triggered, and the heating system 23 is stopped at the same time to avoid safety hazards such as dry burning. Throughout the corrosion process, the exhaust system 15 continuously discharges the exhaust gas in the operating chamber 2 through the exhaust gas discharge pipe 3 to ensure the safety of the operating environment.

[0034] After the etching process is completed, the operator removes the fixture along with the wafer from the etching tank and moves it into the QDR cleaning tank 10. The PLC industrial control system 14 automatically starts the water supply system 17, which quickly injects cleaning fluid into the QDR cleaning tank 10 through the DIW injection port. After the set liquid level is reached, the top spray array tubes of the spray system 18 start working to spray and clean the wafer thoroughly, removing residual chemical liquid and contaminant particles from the wafer. After cleaning is completed, the bottom quick-drain valve of the quick-drain system 19 opens to quickly discharge the cleaning fluid, realizing rapid injection and discharge circulation of liquid and improving cleaning efficiency.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A clamp-type multi-groove silicon wafer depth anisotropic etching and cleaning device, characterized in that, The system includes a corrosion-resistant cabinet (1) and a touch control screen (4). The corrosion-resistant cabinet (1) is a vertically arranged rectangular structure. An operating cavity (2) is provided on the upper part of one side of the corrosion-resistant cabinet (1). A front inspection door (8) is provided on the lower part of the side of the corrosion-resistant cabinet (1) near the operating cavity (2). A transparent sliding door (11) is slidably installed on one side of the corrosion-resistant cabinet (1) at the location of the operating cavity (2). From left to right, control buttons (5), a touch control screen (4), and an audible and visual alarm light (9) are installed on the upper part of the side of the corrosion-resistant cabinet (1) near the operating cavity (2). An exhaust gas discharge pipe (3) is fixedly installed on the top of the corrosion-resistant cabinet (1). A leak-proof base plate (12) is connected to the bottom of the corrosion-resistant cabinet (1). The operating chamber (2) has two sets of relatively parallel corrosion tanks (7) and QDR cleaning tanks (10) installed on the inner wall at the bottom end. The operating chamber (2) also has a water spray gun (6) on one end of the inner wall. The corrosion-resistant cabinet (1) is also equipped with a PLC industrial control system (14), an exhaust system (15), an alarm system (16), a water supply system (17), a spray system (18), a quick drainage system (19), a liquid level detection module (20), a temperature monitoring module (21), a motor driver (22), a magnetic stirring system (2201), a heating system (23), a constant temperature control system (2301), and a drain system (24). The PLC industrial control system (14) is electrically connected to the touch control screen (4).

2. The clamp-type multi-groove silicon wafer depth anisotropic etching and cleaning device according to claim 1, characterized in that, The front inspection door (8) is provided in three parallel sets, and the upper part of the front inspection door (8) away from the corrosion-resistant cabinet (1) is provided with a recessed handle (13).

3. The clamp-type multi-groove silicon wafer depth anisotropic etching and cleaning device according to claim 1, characterized in that, The PLC industrial control system (14) is electrically connected to the corrosion tank (7) and the QDR cleaning tank (10) respectively. The PLC industrial control system (14) includes an exhaust system (15) and an alarm system (16).

4. The clamp-type multi-groove silicon wafer depth anisotropic etching and cleaning device according to claim 1, characterized in that, The exhaust system (15) includes an exhaust gas discharge pipe (3), and the alarm system (16) includes an audible and visual alarm light (9).

5. The clamp-type multi-groove silicon wafer depth anisotropic etching and cleaning device according to claim 1, characterized in that, The liquid level detection module (20), temperature monitoring module (21), motor driver (22), magnetic stirring system (2201), heating system (23), constant temperature control system (2301) and drainage system (24) are all electrically connected to the PLC industrial control system (14) through the corrosion tank (7).

6. The clamp-type multi-groove silicon wafer depth anisotropic etching and cleaning device according to claim 1, characterized in that, The water supply system (17), the spray system (18) and the quick drainage system (19) are all electrically connected to the PLC industrial control system (14) through the QDR cleaning tank (10).

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