A DFN no-base island chip packaging structure

Abstract

This utility model provides a DFN (Diode-Based No-Island) chip packaging structure, relating to the field of chip packaging technology. It includes a base chamber; a worktable fixedly mounted on the upper surface of the base chamber; a top chamber fixedly mounted on the upper surface of the worktable; a packaging device fixedly mounted on the lower surface of the top chamber; and a fixing device fixedly mounted on the upper surface of the worktable. The fixing device includes nine sleeves, buffer springs, buffer pillars, two fixing blocks, a threaded rod, a push plate, and a stop block. Buffer springs are fixedly installed at the bottom of the inner cavity of each sleeve, and buffer pillars are slidably connected inside the sleeves, providing cushioning during equipment use and reducing the squeezing impact on the chip during packaging. This utility model solves the problem that the lack of chip fixation during the packaging process can lead to chip displacement due to equipment vibration and impact, affecting the packaging effect.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a DFN baseless island chip packaging structure. Background Technology

[0002] DFN (Dual Flat No-lead) chip is a semiconductor packaging structure that adopts a base-island-free design. It is a variant of DFN packaging technology and achieves higher material utilization and packaging reliability by optimizing the lead frame and packaging process.

[0003] Some existing packaging equipment lacks chip fixation during the packaging process. Under special circumstances such as vibration and impact generated during equipment operation, the chip may shift, causing mechanical damage. After packaging, poor contact and short circuits may occur due to positional deviations, affecting the chip's performance. At the same time, the chip is subjected to squeezing and impact during the packaging process, which may cause damage to the chip.

[0004] For example, Chinese Patent Publication No. CN117816497A discloses a chip packaging device, including: a housing, an air system disposed in the housing, a frame disposed within the housing, and a coating machine disposed on the frame; the frame includes a partition plate that divides the space inside the housing into an upper chamber and a lower chamber, the coating machine is disposed in the upper chamber, and the partition plate is provided with a plurality of through holes connecting the upper chamber and the lower chamber; the air system provides a positive pressure environment for the upper chamber; the chip packaging device also has an exhaust system and a buffer plate, the buffer plate is disposed in the lower chamber and divides the lower chamber into a buffer cavity and a transition cavity; the air inlet is connected to the transition cavity, and a plurality of filter holes are evenly distributed on the buffer plate.

[0005] To address these issues, we propose a DFN base-island-free chip packaging structure. Utility Model Content

[0006] This invention provides a DFN base island-less chip packaging structure that solves the problems mentioned in the background art.

[0007] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0008] An embodiment of this utility model provides a DFN base-island-free chip packaging structure, comprising:

[0009] Base inventory;

[0010] A workbench, which is fixedly installed on the upper surface of the bottom compartment;

[0011] Top compartment, which is fixedly installed on the upper surface of the workbench;

[0012] A packaging device, which is fixedly installed on the lower surface of the top compartment;

[0013] A fixing device is fixedly installed on the upper surface of the workbench. The fixing device includes nine sleeves, buffer springs and buffer pillars, as well as two fixing blocks, threaded rods, push plates and stop blocks. Buffer springs are fixedly installed at the bottom of the inner cavity of each sleeve. Buffer pillars are slidably connected inside each sleeve to provide cushioning during equipment use and reduce the squeezing impact on the chip during packaging. Threaded rods are threadedly connected inside each fixing block. Threaded rods are slidably connected to the inside of the push plate. Stop blocks are fixedly installed on the side wall of the threaded rods to fix chips of different sizes and specifications, preventing displacement during packaging.

[0014] Through the above technical solution, the fixing device can fix chips of different specifications, avoid the chip displacement caused by equipment vibration or impact during the packaging process, and reduce the risk of mechanical damage.

[0015] Furthermore, the fixing device includes a base plate, which is fixedly connected to the upper surface of the workbench. The buffer spring is located between the sleeve and the buffer column. An operating table is fixedly installed on the upper surface of the buffer column. A retaining ring is fixedly installed on the outer circumference of the threaded rod. The push plate is located between the retaining ring and the stop block.

[0016] With the above technical solution, when the equipment is needed, the base is placed on the operating table. By rotating the threaded rod on the fixed block, it moves the push plate through the retaining ring and the stop block to contact the base, fixing the position of the base and preventing displacement during the packaging process. At the same time, during packaging, the squeezing impact force on the chip is transmitted to the buffer pillar through the operating table, causing the buffer pillar to move down in the sleeve and compress the buffer spring. The reaction force of the compressed buffer spring offsets and weakens the squeezing impact, reducing the squeezing impact on the chip and avoiding damage.

[0017] Furthermore, the side wall of the push plate is provided with a sliding groove, the inner wall of the sliding groove is slidably connected with a clamping plate, and the side wall of the push plate is threadedly connected with an adjusting bolt, which penetrates the side wall of the push plate and contacts the clamping plate.

[0018] With the above technical solution, after the push plate clamps and fixes the base, the adjusting bolt on the push plate is rotated to make the clamping plate slide in the groove, so as to further clamp the base and improve the fixing effect.

[0019] Furthermore, an auxiliary block is fixedly installed on the side wall of the operating table, and an auxiliary rod is slidably connected inside the auxiliary block. The auxiliary rod passes through the auxiliary block and is connected to the push plate.

[0020] Through the above technical solutions, the auxiliary block and auxiliary rod make the push plate more stable during movement and prevent the push plate from deviating.

[0021] Furthermore, the push plate adopts a concave design.

[0022] The above technical solution avoids the threaded rod and stop protruding from the push plate, thus preventing them from affecting the clamping effect.

[0023] Furthermore, a triangular plate is fixedly installed on the outer circumference of the sleeve.

[0024] Through the above technical solution, the triangular plate makes the connection between the sleeve and the base plate more stable and provides better cushioning.

[0025] Furthermore, a damping block is fixedly installed on the lower surface of the buffer column, and the damping block is slidably connected to the inside of the sleeve.

[0026] Through the above technical solution, the damping block enables the buffer column and buffer spring to quickly return to their original position after compression.

[0027] The beneficial effects of this utility model are:

[0028] The fixing device allows the equipment to clamp and fix chips of different sizes, reducing the risk of chip misalignment caused by vibration and impact during equipment operation, which may lead to poor contact or short circuits after packaging. At the same time, it provides some buffering against the squeezing and impact on the chip, reducing the risk of chip damage. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0030] Figure 2 This is an enlarged schematic diagram of the fixing device part of this utility model;

[0031] Figure 3 This is a structurally disassembled schematic diagram of the fixing device part of this utility model;

[0032] Figure 4 This is a schematic diagram of the structural assembly of the fixing device part of this utility model;

[0033] Figure 5 This is a cross-sectional schematic diagram of the fixing device part of this utility model.

[0034] In the diagram: 1. Bottom compartment; 2. Workbench; 3. Top compartment; 4. Sealing device; 5. Fixing device; 501. Base plate; 502. Sleeve; 503. Buffer spring; 504. Buffer column; 505. Operating table; 506. Fixing block; 507. Threaded rod; 508. Push plate; 509. Stop block; 510. Slide groove; 511. Clamping plate; 512. Adjusting bolt; 513. Auxiliary block; 514. Auxiliary rod; 515. Damping block. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0036] like Figure 1 As shown, an embodiment of this utility model provides a DFN baseless island chip packaging structure, including: a bottom chamber 1; a worktable 2, the worktable 2 being fixedly installed on the upper surface of the bottom chamber 1; a top chamber 3, the top chamber 3 being fixedly installed on the upper surface of the worktable 2; a packaging device 4, the packaging device 4 being fixedly installed on the lower surface of the top chamber 3; and a fixing device 5, the fixing device 5 being fixedly installed on the upper surface of the worktable 2, the fixing device 5 including nine sleeves 502, buffer springs 503 and buffer pillars 504, as well as two fixing blocks 506 and threaded rods 506. 7. Push plate 508 and stop block 509. A buffer spring 503 is fixedly installed at the bottom of the inner cavity of sleeve 502. A buffer column 504 is slidably connected inside sleeve 502 to provide buffering during equipment use and reduce the squeezing impact on the chip during packaging. A threaded rod 507 is threadedly connected inside the fixing block 506. The threaded rod 507 is slidably connected to the inside of push plate 508. A stop block 509 is fixedly installed on the side wall of threaded rod 507 to fix chips of different sizes and specifications and prevent displacement during packaging.

[0037] like Figures 1 to 5As shown, the fixing device 5 includes a base plate 501, which is fixedly connected to the upper surface of the workbench 2. A sleeve 502 is fixedly installed on the upper surface of the base plate 501. A buffer spring 503 is fixedly installed at the bottom of the inner cavity of the sleeve 502. A buffer column 504 is slidably connected inside the sleeve 502. The buffer spring 503 is located between the sleeve 502 and the buffer column 504. An operating table 505 is fixedly installed on the upper surface of the buffer column 504. A fixing block 506 is fixedly installed on the side wall of the operating table 505. A threaded rod 507 is threadedly connected inside the fixing block 506. A retaining ring is fixedly installed on the outer circumference of the threaded rod 507. A push plate 508 is slidably connected to the threaded rod 507. A stop 509 is fixedly installed on the wall, and a push plate 508 is positioned between the stop ring and the stop 509. When the equipment is needed, the base is placed on the operating table 505, and the threaded rod 507 is rotated on the fixed block 506, causing it to move the push plate 508 through the stop ring and the stop 509 to adapt to the size of the base. The position of the base is fixed by the clamping of the two sets of push plates 508, which facilitates packaging. During the packaging process, the squeezing impact on the chip is transmitted to the buffer post 504 through the operating table 505, causing the buffer post 504 to move downward in the sleeve 502, while compressing the buffer spring 503 inside the sleeve 502. Under the reaction force of the compressed buffer spring 503, the squeezing impact is weakened or resisted. To reduce the impact on the chip and prevent damage, a sliding groove 510 is provided on the side wall of the push plate 508. A clamping plate 511 is slidably connected to the inner wall of the sliding groove 510. An adjusting bolt 512 is threadedly connected to the side wall of the push plate 508. The adjusting bolt 512 passes through the side wall of the push plate 508 and contacts the clamping plate 511. After the push plate 508 fixes the base, rotating the adjusting bolt 512 on the push plate 508 causes the clamping plate 511 to move on the sliding groove 510 and contact the base, providing further fixation. An auxiliary block 513 is fixedly installed on the side wall of the operating table 505. An auxiliary rod 514 is slidably connected inside the auxiliary block 513. The auxiliary rod 514 passes through the auxiliary block 513 and connects to the push plate 508, assisting in... Block 513 and auxiliary rod 514 make the push plate 508 more stable during movement and prevent the ends of the push plate 508 from shifting. The push plate 508 adopts a concave design to prevent the threaded rod 507 and the stop block 509 from protruding on the push plate 508 and affecting the clamping effect. A triangular plate is fixedly installed on the outer circumference of the sleeve 502. The triangular plate enhances the stability of the connection between the sleeve 502 and the base plate 501 and makes the buffering effect better. A damping block 515 is fixedly installed on the lower surface of the buffer column 504. The damping block 515 is slidably connected to the inside of the sleeve 502. The damping block 515 allows the buffer spring 503 and the buffer column 504 to quickly return to their original position after compression, which is convenient for subsequent use.

[0038] In this embodiment of the invention, when the equipment is needed, the base is placed on the operating table 505, and the threaded rod 507 is rotated on the fixing block 506, so that it drives the push plate 508 to move through the retaining ring and the stop block 509 to adapt to the size of the base. The position of the base is fixed by the clamping of the two sets of push plates 508. By rotating the adjusting bolt 512 on the push plate 508, the clamping plate 511 moves on the slide groove 510 to contact the base, providing further fixation and facilitating packaging. During the packaging process, the squeezing impact on the chip is transmitted to the buffer column 504 through the operating table 505, causing the buffer column 504 to move down in the sleeve 502, while compressing the buffer spring 503 in the sleeve 502. Under the reaction force of the compression of the buffer spring 503, the squeezing impact force is weakened or canceled, reducing the impact on the chip and avoiding damage. The damping block 515 allows the buffer spring 503 and the buffer column 504 to quickly reset after compression, which is convenient for subsequent use.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A DFN base-island-free chip packaging structure, characterized in that, include: Base warehouse (1); Workbench (2), which is fixedly installed on the upper surface of the bottom compartment (1); Top compartment (3), which is fixedly installed on the upper surface of the workbench (2); A packaging device (4) is fixedly installed on the lower surface of the top chamber (3); A fixing device (5) is fixedly installed on the upper surface of the workbench (2). The fixing device (5) includes nine sleeves (502), buffer springs (503) and buffer pillars (504), as well as two fixing blocks (506), threaded rods (507), push plates (508) and stop blocks (509). Buffer springs (503) are fixedly installed at the bottom of the inner cavity of the sleeves (502). Buffer pillars (504) are slidably connected inside the sleeves (502) to provide buffering during equipment use and reduce the squeezing impact on the chips during packaging. Threaded rods (507) are threadedly connected inside the fixing blocks (506). Threaded rods (507) are slidably connected to the inside of the push plates (508). Stop blocks (509) are fixedly installed on the side walls of the threaded rods (507) to fix chips of different sizes and specifications, preventing displacement during packaging.

2. The DFN baseless island-less chip packaging structure according to claim 1, characterized in that, The fixing device (5) includes a base plate (501), which is fixedly connected to the upper surface of the workbench (2). The buffer spring (503) is located between the sleeve (502) and the buffer column (504). An operating table (505) is fixedly installed on the upper surface of the buffer column (504). A retaining ring is fixedly installed on the outer circumference of the threaded rod (507). The push plate (508) is located between the retaining ring and the stop block (509).

3. The DFN baseless island chip packaging structure according to claim 2, characterized in that, The push plate (508) has a sliding groove (510) on its side wall. A clamping plate (511) is slidably connected to the inner wall of the sliding groove (510). An adjusting bolt (512) is threadedly connected to the side wall of the push plate (508). The adjusting bolt (512) passes through the side wall of the push plate (508) and contacts the clamping plate (511).

4. The DFN baseless island chip packaging structure according to claim 2, characterized in that, An auxiliary block (513) is fixedly installed on the side wall of the operating table (505). An auxiliary rod (514) is slidably connected inside the auxiliary block (513). The auxiliary rod (514) passes through the auxiliary block (513) and is connected to the push plate (508).

5. The DFN baseless island chip packaging structure according to claim 2, characterized in that, The push plate (508) adopts a concave design.

6. The DFN baseless island chip packaging structure according to claim 2, characterized in that, A triangular plate is fixedly installed on the outer circumference of the sleeve (502).

7. The DFN baseless island chip packaging structure according to claim 2, characterized in that, A damping block (515) is fixedly installed on the lower surface of the buffer column (504), and the damping block (515) is slidably connected to the inside of the sleeve (502).

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