Wafer loading apparatus and wafer burn-in test apparatus

Abstract

The application relates to the technical field of wafer testing, in particular to a wafer feeding equipment and a wafer aging test system; the wafer feeding equipment comprises: a loading platform comprising a placing plane for placing wafers of different sizes; a wafer edge finding mechanism comprising a wafer image acquisition device, a first driving device and a first transmission device; the wafer image acquisition device is arranged above the placing plane; the first driving device is in driving connection with the first transmission device; the transmission end of the first transmission device is fixedly connected with the wafer image acquisition device, so that the wafer image acquisition device moves to acquire a wafer image under the driving of the first driving device; through the edge finding processing suitable for wafers of different sizes, the universality of the wafer feeding equipment is improved, and the aging test cost is reduced.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, and in particular to a wafer loading device and a wafer aging test device. Background Technology

[0002] During the wafer loading process, the position and angle of the wafer need to be adjusted so that the wafer can be assembled onto the chuck. However, in the existing technology, the wafer position adjustment of a wafer loading device can only be applied to wafers of one size. Different loading devices are used for wafers of different sizes. Summary of the Invention

[0003] To address the aforementioned problems in the prior art, the purpose of this application is to provide a wafer loading device that can adapt to edge-finding processing of wafers of different sizes, improve the versatility of the wafer loading device, and reduce aging test costs.

[0004] To address the aforementioned problems, this application provides a wafer loading device, comprising:

[0005] Loading platform, including a placement plane for placing wafers of different sizes;

[0006] The wafer edge-finding mechanism includes a wafer image acquisition device, a first driving device, and a first transmission device. The wafer image acquisition device is disposed above the placement plane. The first driving device is drivenly connected to the first transmission device, and the transmission end of the first transmission device is fixedly connected to the wafer image acquisition device, so that the wafer image acquisition device moves under the drive of the first driving device to acquire wafer images.

[0007] In this embodiment of the application, the wafer loading equipment further includes:

[0008] The controller is electrically connected to both the wafer image acquisition device and the first drive device.

[0009] A receiving space is provided below the placement plane; the controller is provided within the receiving space.

[0010] In this embodiment of the application, the wafer loading equipment further includes:

[0011] The information reading mechanism includes an information image acquisition device, a second driving device, a second transmission device, and a fixed structure; the information image acquisition device is disposed above the placement plane, the second driving device is drivenly connected to the second transmission device, the transmission end of the second transmission device is fixedly connected to the fixed structure, and the fixed structure is fixedly connected to the information image acquisition device so that the information image acquisition device moves toward the edge of the wafer.

[0012] In this embodiment, the second transmission device is a lead screw, the transmission end is a transmission nut, and the fixing structure includes:

[0013] The first fixing plate is fixedly connected to the transmission nut of the transmission screw;

[0014] The second fixing plate is set at a preset angle to the first fixing plate and is fixedly connected to the information image acquisition device.

[0015] In this embodiment of the application, the information reading mechanism further includes:

[0016] A collection and fixing device is connected to a bearing at one end of the transmission lead screw;

[0017] A fixed slide rail is installed on the acquisition and fixing device;

[0018] The sliding block is slidably connected to the fixed slide rail and fixedly connected to the first fixed plate.

[0019] In this embodiment of the application, the information reading mechanism further includes:

[0020] The winding device is fixedly connected to the second fixing plate.

[0021] In this embodiment of the application, the loading platform further includes:

[0022] A rotating device includes a rotating surface for contacting the wafer; the rotating surface is located within the placement plane.

[0023] In this embodiment of the application, the loading platform further includes:

[0024] The lifting device includes a telescopic structure that moves in a planar direction toward the placement plane, the end of the telescopic structure being used to contact the wafer.

[0025] In this embodiment of the application, the end of the telescopic structure is provided with a rubber suction nozzle.

[0026] On the other hand, this application also provides a wafer aging test device, which includes the wafer loading device in the embodiments of this application.

[0027] Due to the above technical solution, the wafer loading equipment described in this application has the following beneficial effects:

[0028] By incorporating a first driving device and a first transmission device in the wafer edge-finding mechanism, the first driving device drives the first transmission device to move, and the transmission end of the first transmission device drives the wafer image acquisition device to move, thereby changing the acquisition range of the wafer image. Different acquisition ranges can adapt to wafers of different sizes; for example, a first-size wafer corresponds to a first acquisition range, and a second-size wafer corresponds to a second acquisition range. The movement of the wafer image acquisition device can switch between the first acquisition range and the second acquisition range. This adapts to edge-finding processing of wafers of different sizes, improves the versatility of wafer loading equipment, and reduces aging test costs. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0030] Figure 1 is a schematic diagram of the structure of the wafer loading equipment in an embodiment of this application;

[0031] Figure 2 is a schematic diagram of the loading platform and the wafer edge-finding mechanism in the wafer loading equipment in the embodiments of this application;

[0032] Figure 3 is a schematic diagram of the information reading mechanism in the wafer loading equipment in this application embodiment;

[0033] Figure 4 is a partial component diagram of the information reading mechanism in the wafer loading equipment of this application embodiment.

[0034] Among them, 1-loading platform, 11-placement plane, 12-accommodation space, 13-rotating device, 14-lifting device, 2-wafer edge finding mechanism, 21-wafer image acquisition device, 22-first driving device, 23-first transmission device, 24-acquisition device housing, 25-heat dissipation hole, 3-controller, 4-information reading mechanism, 41-information image acquisition device, 42-second driving device, 43-second transmission device, 431-transmission nut, 44-fixed structure, 441-first fixing plate, 442-second fixing plate, 45-acquisition fixing device, 46-fixed slide rail, 47-sliding block, 48-winding device, 5-ion fan. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0036] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0037] Combination Figure 1-2 This application describes a wafer loading device provided in an embodiment, the device comprising:

[0038] The loading platform 1 includes a placement plane 11 for placing wafers of different sizes.

[0039] The wafer edge-finding mechanism 2 includes a wafer image acquisition device 21, a first driving device 22, and a first transmission device 23. The wafer image acquisition device 21 is disposed above the placement plane 11. The first driving device 22 is drivenly connected to the first transmission device 23, and the transmission end of the first transmission device 23 is fixedly connected to the wafer image acquisition device 21 so that the wafer image acquisition device 21 moves under the drive of the first driving device 22 to acquire wafer images.

[0040] In this embodiment, the wafer image acquisition device 21 is used to acquire at least a portion of the surface image of the wafer; the first driving device 22 is used to drive the first transmission device 23 to operate, and the first transmission device 23 drives the wafer image acquisition device 21 to move under the drive of the first driving device 22; preferably, the wafer image acquisition device 21 moves toward the edge of the wafer; the direction toward the edge of the wafer includes the direction away from the edge of the wafer and the direction closer to the edge of the wafer; preferably, the wafer image acquisition device 21 can move in a straight line toward the edge of the wafer; it should be noted that in actual applications, the wafer has a missing edge, and the wafer edge finding mechanism 2 can find the missing edge position of the wafer.

[0041] In a specific embodiment of this application, the wafer image acquisition device 21 may be a camera device.

[0042] In a specific embodiment of this application, the first driving device 22 may be a drive motor or a drive servo motor.

[0043] In a specific embodiment of this application, the first transmission device 23 may be a transmission lead screw, which includes a transmission rod and a transmission end. Specifically, the transmission end is a transmission nut 431; the transmission nut 431 is fixedly connected to the wafer image acquisition device 21.

[0044] In a specific embodiment of this application, the first transmission device 23 may be a transmission structure consisting of a push rod, a transmission slider, and a transmission slide rail. Specifically, the drive motor drives the push rod to push the transmission slider to move along the transmission slide rail. The transmission end is the transmission slider, and the transmission slider is fixedly connected to the wafer image acquisition device 21.

[0045] In a specific embodiment of this application, when the first transmission device 23 is a transmission lead screw, the direction toward the wafer edge is the same as the setting direction of the transmission rod.

[0046] In a specific embodiment of this application, when the first transmission device 23 is a transmission structure consisting of a push rod, a transmission slider, and a transmission slide rail, the direction toward the wafer edge is equivalent to the setting direction of the transmission slide rail.

[0047] In this embodiment, by setting a first driving device 22 and a first transmission device 23 in the wafer edge finding mechanism 2, the first driving device 22 drives the first transmission device 23 to move, and the transmission end of the first transmission device 23 drives the wafer image acquisition device 21 to move, thereby changing the acquisition range of the wafer image. Different acquisition ranges can adapt to wafers of different sizes. For example, a first-size wafer corresponds to a first acquisition range, and a second-size wafer corresponds to a second acquisition range. The movement of the wafer image acquisition device 21 can switch between the first acquisition range and the second acquisition range. This adapts to edge finding processing of wafers of different sizes, improves the versatility of the wafer loading equipment, and reduces the cost of aging tests.

[0048] In specific embodiments of this application, in the case of large-size wafers, the wafer image acquisition device 21 is controlled to move away from the wafer edge, and the acquisition range of the wafer image acquisition device 21 is adjusted to adapt to the large size; conversely, in the case of small-size wafers, the wafer image acquisition device 21 is controlled to move closer to the wafer edge, and the acquisition range of the wafer image acquisition device 21 is adjusted to adapt to the small size.

[0049] In a specific embodiment of this application, a reflector is also provided on the loading platform. The reflector is used to cooperate with the wafer image acquisition device 21 so that the wafer image acquisition device 21 can acquire images of at least a portion of the wafer surface.

[0050] In this embodiment of the application, the wafer loading equipment further includes:

[0051] The controller 3 is electrically connected to the wafer image acquisition device 21 and the first drive device 22, respectively.

[0052] The accommodating space 12 is located below the placement plane 11; the controller 3 is located within the accommodating space 12.

[0053] In a specific embodiment of this application, the controller 3 is used to receive the image acquisition signal from the wafer image acquisition device 21, and to control the operation of the first drive device 22 based on the wafer size information.

[0054] In this embodiment of the application, by setting the controller 3, automated control is achieved, thereby improving the intelligence of wafer loading; and by setting the accommodating space 12 below the placement platform and placing the controller 3 in the accommodating space 12, most of the wiring connected to the controller 3 can be placed in the accommodating space 12, thereby improving the regularity of the loading processing equipment and reducing the size of the wafer loading equipment.

[0055] refer to Figure 3-4 In this embodiment of the application, the wafer loading equipment further includes:

[0056] The information reading mechanism 4 includes an information image acquisition device 41, a second driving device 42, a second transmission device 43, and a fixing structure 44. The information image acquisition device 41 is disposed above the placement plane 11. The second driving device 42 is drivenly connected to the second transmission device 43. The transmission end of the second transmission device 43 is fixedly connected to the fixing structure 44. The fixing structure 44 is fixedly connected to the information image acquisition device 41 so that the information image acquisition device 41 moves toward the edge of the wafer.

[0057] In this embodiment of the application, the information image acquisition device 41 is used to acquire information such as the wafer number. Specifically, the information image acquisition device 41 is a wafer ID reader.

[0058] In a specific embodiment of this application, the controller 3 is also electrically connected to the second transmission device 43 and the second drive device 42, respectively.

[0059] In a specific embodiment of this application, the second driving device 42 may be a drive motor or a drive servo motor.

[0060] In a specific embodiment of this application, the second transmission device 43 may be a transmission screw, which includes a transmission rod and a transmission end. Specifically, the transmission end is a transmission nut 431; the transmission nut 431 is fixedly connected to the fixed structure 44.

[0061] In a specific embodiment of this application, the second transmission device 43 can be a transmission structure composed of a push rod, a transmission slider, and a transmission slide rail. Specifically, the drive motor drives the push rod to push the transmission slider to move along the transmission slide rail, the transmission end is the transmission slider, and the transmission slider is fixedly connected to the fixed structure 44.

[0062] In a specific embodiment of this application, when the second transmission device 43 is a transmission lead screw, the direction toward the wafer edge is the same as the setting direction of the transmission rod.

[0063] In a specific embodiment of this application, when the second transmission device 43 is a transmission structure consisting of a push rod, a transmission slider, and a transmission slide rail, the direction toward the wafer edge is equivalent to the setting direction of the transmission slide rail.

[0064] In this embodiment of the application, by setting up an information reading mechanism 4, the identity information of the wafer is read, thereby improving the convenience of managing and tracking the wafer.

[0065] In this embodiment, the second transmission device 43 includes a transmission lead screw, the transmission end includes a transmission nut 431, and the fixing structure 44 includes:

[0066] The first fixed plate 441 is fixedly connected to the transmission nut 431 of the transmission screw.

[0067] The second fixing plate 442 is set at a preset angle to the first fixing plate 441 and is fixedly connected to the information image acquisition device 41.

[0068] In this embodiment of the application, by setting the fixing structure 44 as a first fixing plate 441 and a second fixing plate 442, with the first fixing plate 441 and the second fixing plate 442 set at a preset angle, the setting flexibility of the information image acquisition device 41 can be increased.

[0069] In a specific embodiment of this application, the second fixing plate 442 is at a 90° angle to the second fixing plate 442, forming an L-shaped plate.

[0070] In one specific embodiment of this application, the first fixing plate 441 can be connected to the second fixing plate 442 via a hinge, thereby facilitating the adjustment of the position of the information image acquisition device 41.

[0071] In this embodiment of the application, the information reading mechanism 4 further includes:

[0072] The collection and fixing device 45 is connected to a bearing at one end of the transmission lead screw.

[0073] The fixed slide rail 46 is mounted on the data acquisition device 45.

[0074] The sliding block 47 is slidably connected to the fixed slide rail 46 and fixedly connected to the first fixed plate 441.

[0075] In a specific embodiment of this application, the setting direction of the fixed slide rail 46 is consistent with the running direction of the first fixed plate 441.

[0076] In this embodiment of the application, the first fixed plate 441 moves under the drive of the transmission nut 431 of the transmission screw, and the first fixed plate 441 can also drive the sliding block 47 to move along the fixed slide rail 46.

[0077] In this embodiment of the application, by setting a sliding block 47 and a fixed slide rail 46 that matches the sliding block 47, the connection stability between the first fixed block and the acquisition fixed device 45 is strengthened, thereby improving the assembly stability of the information image acquisition device 41 and improving the accuracy of information acquisition.

[0078] In a specific embodiment of this application, the acquisition fixing device 45 includes a height adjustment plate and a horizontal adjustment plate, which are arranged crosswise. Preferably, the intersection angle between the height adjustment plate and the horizontal adjustment plate is 90° to form a cross-shaped structure; the fixed slide rail 46 is disposed on the horizontal adjustment plate.

[0079] In a specific embodiment of this application, a height adjustment plate is provided with a height slide rail. The information image acquisition device 41 can adjust its position on the height slide rail through the connection between the fixed structure 44 and the second transmission device 43, thereby adjusting the relative height between the information image acquisition device 41 and the placement platform.

[0080] In this embodiment of the application, the information reading mechanism 4 further includes:

[0081] The winding device 48 is fixedly connected to the second fixing plate 442.

[0082] In a specific embodiment of this application, the wires that are electrically connected to the controller 3 and the wafer image acquisition device 21 or the first driving device 22 can be wound around the winding device 48, thereby avoiding messy wire bundles and improving the regularity of the wafer loading equipment.

[0083] In a specific embodiment of this application, the winding device 48 is an L-shaped plate.

[0084] In this embodiment, the loading platform 1 further includes:

[0085] The rotating device 13 includes a rotating surface for contacting the wafer; the rotating surface is located within the placement plane 11.

[0086] In this embodiment, the wafer rotation can be controlled by setting the rotating device 13, and the wafer edge finding mechanism 2 can rotate the wafer with missing edge to the target position, thereby realizing edge finding and positioning before wafer loading and improving the accuracy of subsequent wafer aging test process.

[0087] In this embodiment of the application, the wafer loading equipment further includes:

[0088] Ionizing fan 5, the air outlet of ionizing fan 5 is set to correspond to the placement plane 11.

[0089] In this embodiment, the ion fan 5 can blow out ion wind, and the air outlet of the ion fan 5 is set to correspond with the placement plane 11, indicating that the wind blown out by the ion fan 5 can reach the placement plane 11.

[0090] In this embodiment of the application, by setting up an ion fan 5, and the air blown by the ion fan 5 can reach the placement plane 11, the static electricity in the wafer loading process is reduced, thereby improving the reliability of the wafer loading process.

[0091] In this embodiment of the application, the loading platform 1 further includes:

[0092] The lifting device 14 includes a telescopic structure that moves in a planar direction toward the placement plane 11, and the end of the telescopic structure is used to contact the wafer.

[0093] In this embodiment, by setting up a lifting device 14, when the wafer is transferred to the wafer loading equipment, the lifting device 14 catches the wafer and retracts it onto the placement plane 11, so that the wafer comes into contact with the rotating device 13, thereby realizing edge positioning before wafer loading and improving the accuracy of subsequent wafer aging test process.

[0094] In a specific embodiment of this application, a rubber suction nozzle is provided at the end of the telescopic structure. By providing a rubber suction nozzle at the end of the telescopic structure, the surface of the wafer is prevented from being scratched, thereby improving the reliability of the wafer loading equipment.

[0095] In a specific embodiment of this application, the telescopic structure includes at least two telescopic leads to form two support points for supporting the wafer; preferably, the telescopic structure includes four telescopic leads arranged around the periphery of the rotating device 13.

[0096] In this embodiment of the application, the wafer edge-finding mechanism 2 further includes:

[0097] The acquisition device housing 24 and the wafer image acquisition device 21 are disposed above the placement plane 11 through the acquisition device housing 24; the acquisition device housing 24 is provided with multiple heat dissipation holes 25.

[0098] In this embodiment of the application, by providing multiple heat dissipation holes 25 on the housing 24 of the acquisition device, the heat dissipation efficiency of the wafer image acquisition device 21 is improved, thereby improving the safety of the wafer loading equipment.

[0099] The working principle of the wafer loading equipment in the embodiments of this application is described below:

[0100] Before wafer processing, controller 3 receives wafer size information and sends electrical signals to the first drive device 22 and the second drive device 42 to control the wafer image acquisition device 21 and the information image acquisition device 41 to reach the positions corresponding to the size information. For example, if the wafer size is 6 inches, controller 3 sends control electrical signals to the first drive device 22 and the second drive device 42 to make the wafer image acquisition device 21 move along the wafer edge to position A corresponding to 6 inches, and the information image acquisition device 41 move along the wafer edge to position B corresponding to 6 inches. If the wafer size is 8 inches, controller 3 sends control signals to the second drive device 42 to make the wafer image acquisition device 21 move along the wafer edge to position C corresponding to 8 inches, and the information image acquisition device 41 move along the wafer edge to position D corresponding to 8 inches.

[0101] When the wafer image acquisition device 21 and the information image acquisition device 41 reach the position corresponding to the size information, the wafer begins to be transferred to the top of the loading platform 1. When the wafer is transferred to the top of the loading platform 1, the telescopic structure in the lifting device 14 supports the wafer and gradually lowers it to the rotating surface corresponding to the rotating device 13 so that the wafer is placed on the placement plane 11.

[0102] At this time, the wafer image acquisition device 21 and the information image acquisition device 41 start working. Specifically, the wafer image acquisition device 21 acquires at least a portion of the image information of the wafer and sends the electrical signals corresponding to the at least a portion of the image information to the controller 3. The controller 3 determines the orientation of the wafer on the placement plane 11 based on the at least a portion of the image information. Then, based on the orientation of the wafer, the rotating device 13 is controlled to rotate the wafer to adjust the orientation of the wafer. The information image acquisition device 41 acquires the identity information of the wafer and sends the identity information of the wafer to the controller 3. The controller 3 stores the identity information of the wafer for subsequent management and tracking of the wafer. Preferably, the controller 3 can send the identity information of the wafer to the cloud server and store it on the cloud server.

[0103] The wafer loading equipment in this embodiment of the application has the following beneficial effects:

[0104] By setting a first driving device 22 and a first transmission device 23 in the wafer edge finding mechanism 2, the first driving device 22 drives the first transmission device 23 to move, and the transmission end of the first transmission device 23 drives the wafer image acquisition device 21 to move, thereby changing the acquisition range of the wafer image. Different acquisition ranges can be adapted to wafers of different sizes. For example, a wafer of the first size corresponds to the first acquisition range, and a wafer of the second size corresponds to the second acquisition range. The movement of the wafer image acquisition device 21 can switch between the first acquisition range and the second acquisition range. This adapts to the edge finding processing of wafers of different sizes, improves the versatility of the wafer loading equipment, and reduces the cost of aging tests.

[0105] This application also provides a wafer aging test device, which includes the wafer loading device in this application embodiment. The beneficial effects of the wafer aging test device are the same as those of the wafer loading device described above, and will not be repeated here.

[0106] The foregoing description has fully disclosed the specific embodiments of this application. It should be noted that any modifications made by those skilled in the art to the specific embodiments of this application do not depart from the scope of the claims. Accordingly, the scope of the claims of this application is not limited to the foregoing specific embodiments.

Claims

1. A wafer loading device, characterized in that, include: The loading platform includes a placement plane for placing wafers of different sizes; The wafer edge-finding mechanism includes a wafer image acquisition device, a first driving device, and a first transmission device. The wafer image acquisition device is disposed above the placement plane. The first driving device is drivenly connected to the first transmission device, and the transmission end of the first transmission device is fixedly connected to the wafer image acquisition device, so that the wafer image acquisition device moves under the drive of the first driving device to acquire wafer images.

2. The wafer loading equipment according to claim 1, characterized in that, Also includes: The controller is electrically connected to both the wafer image acquisition device and the first driving device. A accommodating space is provided below the placement plane; The controller is located within the accommodating space.

3. The wafer loading equipment according to claim 1, characterized in that, Also includes: The information reading mechanism includes an information image acquisition device, a second drive device, a second transmission device, and a fixed structure; The information image acquisition device is positioned above the placement plane. The second driving device is driven and connected to the second transmission device. The transmission end of the second transmission device is fixedly connected to the fixed structure. The fixed structure is fixedly connected to the information image acquisition device so that the information image acquisition device moves toward the edge of the wafer.

4. The wafer loading equipment according to claim 3, characterized in that, The second transmission device is a lead screw, the transmission end is a transmission nut, and the fixing structure includes: The first fixing plate is fixedly connected to the transmission nut of the transmission screw; The second fixing plate is set at a preset angle to the first fixing plate and is fixedly connected to the information image acquisition device.

5. The wafer loading equipment according to claim 4, characterized in that, Information reading organizations also include: A collection and fixing device is connected to a bearing at one end of the transmission lead screw; A fixed slide rail is installed on the acquisition and fixing device; The sliding block is slidably connected to the fixed slide rail and fixedly connected to the first fixed plate.

6. The wafer loading equipment according to claim 4, characterized in that, The information reading mechanism also includes: The winding device is fixedly connected to the second fixing plate.

7. The wafer loading equipment according to claim 1, characterized in that, The loading platform also includes: A rotating device includes a rotating surface for contacting the wafer; the rotating surface is located within the placement plane.

8. The wafer loading equipment according to claim 1, characterized in that, The loading platform also includes: The lifting device includes a telescopic structure that moves in a planar direction toward the placement plane, the end of the telescopic structure being used to contact the wafer.

9. The wafer loading equipment according to claim 8, characterized in that, The telescopic structure is equipped with a rubber suction nozzle at its end.

10. A wafer aging test apparatus, characterized in that, Includes the wafer loading equipment as described in any one of claims 1-9.

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