Conveying device
By designing a combination of upper and lower layered conveyor lines and robotic arms for the transfer equipment, the silicon wafer transfer process was optimized, solving the problem of long transfer time and achieving efficient silicon wafer transfer and quality control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LAPLACE (WUXI) SEMICON TECH CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-10
AI Technical Summary
In existing technologies, silicon wafer transfer equipment is numerous, time-consuming, and has low transfer efficiency, leading to quality uncertainty.
A transfer device was designed, including a first conveying device, a cover opening device, a second conveying device, and a robot. Through the combination of upper and lower layered conveying lines, buffer mechanisms, and transfer mechanisms, the material box is efficiently transferred, and the silicon wafer is transferred between different devices by the robot, thus optimizing the transfer process.
It significantly shortens the silicon wafer turnaround time, improves turnaround efficiency, reduces quality uncertainty, and increases production efficiency.
Smart Images
Figure CN224482026U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic material processing technology, and in particular to a transfer device. Background Technology
[0002] Currently, in the production process of solar cells, laser dicing is used to split the solar cell in half. The cross-section is an unpassivated silicon wafer cross-section. Due to the increased recombination at the edge of the cross-section, the conversion efficiency of this half-cell will decrease by 0.2-0.3%. Heterojunction solar cells, due to their higher open-circuit voltage, experience an even greater decrease in efficiency after laser dicing.
[0003] The reduced efficiency of solar cells caused by the aforementioned cutting will directly lead to a reduction in the power of modules made from sliced solar cells. Therefore, it is necessary to passivate the cut parts. Passivation coating refers to the formation of a passivation film on the surface of the solar cell through deposition, which can reduce minority carrier recombination, provide field passivation effect, and reduce reflectivity.
[0004] The aforementioned cross-section passivation process requires stacking the halved silicon wafers together and then placing them into a fixture for further processing. After the stacking process, the entire stack of silicon wafers needs to be transferred from the fixture to a transfer fixture, after which other equipment will proceed to the next step of the process.
[0005] In related technologies, there are many devices that handle the transfer of halved silicon wafers, which takes a long time and results in low wafer transfer efficiency, as well as uncertainty in quality issues. Utility Model Content
[0006] In view of this, this application provides a transfer device that can improve the transfer efficiency of silicon wafers.
[0007] Embodiments of this application provide a transfer device, including a first conveying device, a lid-opening device, a second conveying device, and a robotic arm. The first conveying device is used to dock with a process machine to receive a first material box output from the process machine and / or to transport the first material box to the process machine. The first conveying device includes a first upper conveyor line and a first lower conveyor line arranged vertically, both extending along a first direction and having one end for docking with the process machine. The first conveying device also includes a first buffer mechanism and a first transfer mechanism. The first buffer mechanism is used to carry the first material box. The first transfer mechanism is configured to move along a third direction and has a first upper docking position and a first lower docking position to selectively dock with the first upper conveyor line or the first lower conveyor line, the first direction being perpendicular to the third direction; when the first transfer mechanism is in the first upper docking position or the first lower docking position, the first transfer mechanism docks with the first buffer mechanism. The lid-opening device is used to open the lid of the first material box and is disposed adjacent to the first buffer mechanism. The second conveying device is used to provide a second material box and / or output the second material box. The robotic arm is configured to transfer the first material box between the first buffer mechanism and the opening mechanism, and is also configured to transfer the silicon wafers in the first material box after the lid is opened to the second material box in the second conveying device.
[0008] In some embodiments of this application, the second conveying device includes a second upper conveyor line and a second lower conveyor line arranged in two layers, both extending along a first direction. The second conveying device also includes a second buffer mechanism and a second transfer mechanism. The second buffer mechanism is used to carry the second material box, and the second buffer mechanism and the second transfer mechanism are spaced apart. The second transfer mechanism is configured to move along a third direction and has a second upper docking position and a second lower docking position to selectively dock with either the second upper conveyor line or the second lower conveyor line; when the second transfer mechanism is in the second upper docking position or the second lower docking position, the second transfer mechanism connects to the second buffer mechanism.
[0009] In some embodiments of this application, multiple sets of second buffer mechanisms are arranged along the second direction, and the multiple sets of second buffer mechanisms are spaced apart along the second direction. The second conveying device also includes a transfer mechanism, which is configured to move along the second direction to connect the second transfer mechanism with the second material boxes carried by the multiple second buffer mechanisms one by one. The first direction, the second direction, and the third direction are perpendicular to each other.
[0010] In some embodiments of this application, the first conveying device, the opening device, and the second conveying device constitute a production line unit, and the transfer equipment includes two production line units arranged along a second direction, with the first direction, the second direction, and the third direction being perpendicular to each other.
[0011] In some embodiments of this application, a single robotic arm is provided, which transfers materials between two production line units.
[0012] In some embodiments of this application, the robotic arm includes a base, a rotating arm, and a clamping mechanism. One end of the rotating arm is fixed to the base, and the other end of the rotating arm is connected to the clamping mechanism.
[0013] In some embodiments of this application, the clamping mechanism includes a clamping mounting plate and a first clamping assembly. The clamping mounting plate is rotatably connected to a rotating arm. The first clamping assembly is mounted on the clamping mounting plate. The first clamping assembly includes a first clamping drive member and a pair of clamping arms that are close to or far apart from each other. The first clamping drive member drives the pair of clamping arms to move.
[0014] In some embodiments of this application, the clamping mechanism further includes a second clamping assembly, which is mounted on a clamping mounting plate. The second clamping assembly includes a support arm, a clamping arm, and a second clamping drive member. The support arm is fixed to the clamping mounting plate, and the second clamping drive member drives the clamping arm to move toward or away from the support arm.
[0015] In some embodiments of this application, the lid opening device includes a frame, a positioning component, a rotating component, and a lid opening component. The rotating component is disposed on the frame, and the positioning component is disposed on the rotating component. The positioning component has a loading position for carrying the first material box and a lid opening position for opening the lid. The rotating component drives the positioning component to rotate to switch from the loading position to the lid opening position, or from the lid opening position to the loading position. The lid opening component is disposed on the frame and configured to cooperate with the positioning component at the lid opening position to open the lid of the first material box.
[0016] In some embodiments of this application, the positioning component includes a first positioning platform and a second positioning platform, with a positioning space formed between the first positioning platform and the second positioning platform. The first material box has an openable surface, a bottom surface opposite to the openable surface, and a side surface perpendicular to the openable surface. The first positioning platform is used to position the bottom surface of the first material box, and the second positioning platform is used to position the side surface of the first material box.
[0017] In this application, the first upper conveyor line and the first lower conveyor line are arranged in layers, and the first transfer mechanism is located between the first buffer mechanism and the first transfer mechanism. The first transfer mechanism is configured to move along a third direction and has a first upper docking position and a first lower docking position to selectively dock with the first upper conveyor line or the first lower conveyor line. This allows the two processes of receiving the first material box output from the process machine and conveying the first material box to the process machine to be carried out simultaneously, thereby optimizing the silicon wafer transfer process, significantly shortening the transfer time, and improving the silicon wafer transfer efficiency. Attached Figure Description
[0018] Figure 1 A schematic diagram of the overall structure of the transfer device is shown in one embodiment of this application.
[0019] Figure 2 A simplified schematic diagram of the transfer device in one embodiment of this application is shown.
[0020] Figure 3 A schematic diagram of material flow is shown in one embodiment of this application.
[0021] Figure 4 A schematic diagram of the overall structure of the first conveying device in one embodiment of this application is shown.
[0022] Figure 5 A schematic diagram of the overall structure of the second conveying device in one embodiment of this application is shown.
[0023] Figure 6 A schematic diagram of the overall structure of the robotic arm in one embodiment of this application is shown.
[0024] Figure 7 A schematic diagram of the overall structure of the lid-opening device in one embodiment of this application is shown.
[0025] Figure 8 A schematic diagram of the overall structure of the first material box in one embodiment of this application is shown.
[0026] Explanation of main component symbols
[0027] 001. Transfer equipment; 100. First conveying device; 110. First upper conveyor line; 120. First lower conveyor line; 130. First buffer mechanism; 140. First transfer mechanism; 141. First upper docking position; 142. First lower docking position; 200. Lid opening device; 210. Frame; 220. Positioning component; 221. First positioning platform; 222. Second positioning platform; 223. Positioning space; 230. Rotating component; 240. Lid opening component; 300. Second conveying device; 310. Second upper conveyor line; 320. Second lower conveyor line; 330. Second buffer mechanism; 340. Second transfer mechanism; 341. Second upper docking position 342. Second lower docking position; 350. Transfer mechanism; 400. Robotic arm; 410. Base; 420. Rotating arm; 430. Clamping mechanism; 431. Clamping mounting plate; 432. First clamping assembly; 4321. First clamping drive; 4322. Clamping arm; 433. Second clamping assembly; 4331. Support arm; 4332. Pressing arm; 4333. Second clamping drive; 5. Process machine; 51. First material box; 511. Turnover pallet; 512. Turnover box; 5121. Box lid; d1. Opening surface; d2. Bottom surface; d3. Side surface; 52. Second material box; X. First direction; Y. Second direction; Z. Third direction. Detailed Implementation
[0028] To further illustrate the technical means and effects adopted by this application to achieve the intended purpose, the following description, in conjunction with the accompanying drawings and embodiments, is provided. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0030] In related technologies, there are many devices that handle the transfer of halved silicon wafers, which takes a long time and results in low wafer transfer efficiency.
[0031] Embodiments of this application provide a transfer device, including a first conveying device, a lid-opening device, a second conveying device, and a robotic arm. The first conveying device is used to dock with a process machine to receive a first material box output from the process machine and / or to transport the first material box to the process machine. The first conveying device includes a first upper conveyor line and a first lower conveyor line arranged vertically, both extending along a first direction and having one end for docking with the process machine. The first conveying device also includes a first buffer mechanism and a first transfer mechanism. The first buffer mechanism is used to carry the first material box. The first transfer mechanism is configured to move along a third direction and has a first upper docking position and a first lower docking position to selectively dock with the first upper conveyor line or the first lower conveyor line, the first direction being perpendicular to the third direction; when the first transfer mechanism is in the first upper docking position or the first lower docking position, the first transfer mechanism docks with the first buffer mechanism. The lid-opening device is used to open the lid of the first material box and is disposed adjacent to the first buffer mechanism. The second conveying device is used to provide a second material box and / or output the second material box. The robotic arm is configured to transfer the first material box between the first buffer mechanism and the opening device, and is also configured to transfer the silicon wafers in the first material box after the lid is opened to the second material box in the second conveying device.
[0032] The first transfer mechanism can move along a third direction and has a first upper docking position and a first lower docking position to selectively dock with the first upper conveyor line or the first lower conveyor line. This allows the two processes of receiving the first material box output from the process machine and conveying the first material box to the process machine to be carried out simultaneously, thereby optimizing the silicon wafer transfer process, significantly shortening the transfer time, and improving the silicon wafer transfer efficiency.
[0033] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the embodiments and features described below can be combined with each other.
[0034] Please see Figure 1 and Figure 2 One embodiment of this application provides a transfer device 001, including a first conveying device 100, a lid opening device 200, a second conveying device 300, and a robot arm 400. The first conveying device 100 is used to dock with a process machine 5, the lid opening device 200 is used to open the lid 5121 of a first material box 51, the second conveying device 300 is used to provide and / or output a second material box 52, and the robot arm 400 is used to transfer materials.
[0035] During operation, the process machine 5 needs to input a first material box 51 containing silicon wafers so that the cut portions of the silicon wafers in the first material box 51 can be passivated by the process machine 5. After the process machine 5 completes the passivation coating process on the silicon wafers, the silicon wafers in the first material box 51 that have completed the passivation coating process are output from the process machine 5.
[0036] The first conveying device 100 is used to dock with the process machine 5 to receive the first material box 51 output by the process machine 5, and also to convey the first material box 51 to the process machine 5. The process of receiving the first material box 51 output by the process machine 5 and the process of conveying the first material box 51 to the process machine 5 can be performed simultaneously, or one of the processes can be performed separately.
[0037] Please see Figure 1 and Figure 3 In some embodiments, the first conveying device 100 includes a first upper conveying line 110 and a first lower conveying line 120 arranged vertically along a third direction Z. Both the first upper conveying line 110 and the first lower conveying line 120 extend along a first direction X and one end is used to connect to the process machine 5 so as to receive the first material box 51 output by the process machine 5 through the first upper conveying line 110 and convey the first material box 51 to the process machine 5 through the first lower conveying line 120.
[0038] In other embodiments, the first upper conveyor line 110 and the first lower conveyor line 120 both extend along the first direction X and one end is used to connect to the process machine 5 so as to receive the first material box 51 output by the process machine 5 through the first lower conveyor line 120 and transport the first material box 51 to the process machine 5 through the first upper conveyor line 110.
[0039] Please see Figure 3 and Figure 4 In some embodiments, the first conveying device 100 further includes a first buffer mechanism 130 and a first transfer mechanism 140. The first buffer mechanism 130 is used to carry the first material box 51.
[0040] The first transfer mechanism 140 is configured to move along a third direction Z and has a first upper docking position 141 and a first lower docking position 142 to selectively dock with the first upper conveyor line 110 or the first lower conveyor line 120. The first direction X is perpendicular to the third direction Z.
[0041] When the first transfer mechanism 140 is in the first upper docking position 141 or the first lower docking position 142, the first transfer mechanism 140 docks with the first buffer mechanism 130.
[0042] The first upper conveyor line 110 and the first lower conveyor line 120 are arranged in layers. The first transfer mechanism 140 is configured to move along the third direction Z and has a first upper docking position 141 and a first lower docking position 142 to selectively dock with the first upper conveyor line 110 or the first lower conveyor line 120. This allows the two processes of receiving the first material box 51 output from the process machine 5 and conveying the first material box 51 to the process machine 5 to be carried out simultaneously, thereby optimizing the silicon wafer transfer process, significantly shortening the transfer time, and improving the silicon wafer transfer efficiency.
[0043] In some embodiments, the first buffer mechanism 130 and the first transfer mechanism 140 are arranged along the first direction X. The first transfer mechanism 140 is located on the side of the first upper conveyor line 110 or the first lower conveyor line 120 away from the process machine 5, so that the material can flow in the same direction and improve the flow efficiency.
[0044] In other embodiments, the first buffer mechanism 130 and the first transfer mechanism 140 are arranged along the second direction Y. The first transfer mechanism 140 is located on the side of the first upper conveyor line 110 or the first lower conveyor line 120 away from the process machine 5. The first buffer mechanism 130 is located on the side of the first transfer mechanism 140 along the second direction Y. This is beneficial to shorten the overall length of the transfer equipment 001 and improve the layout flexibility of the transfer equipment 001.
[0045] Please see Figure 3 and Figure 5 In some embodiments, the second conveying device 300 includes a second upper conveying line 310 and a second lower conveying line 320 arranged vertically along a third direction Z, both of which extend along a first direction X.
[0046] In some embodiments, the second upper conveyor line 310 provides an empty second material box 52 for loading silicon wafers that have undergone the passivation coating process. After the silicon wafers that have undergone the passivation coating process are loaded into the second material box 52, they are output from the transfer device 001 via the second lower conveyor line 320.
[0047] In another embodiment, the second lower conveyor line 320 provides an empty second material box 52 for loading silicon wafers that have undergone the passivation coating process. After the silicon wafers that have undergone the passivation coating process are loaded into the second material box 52, they are output from the transfer device 001 via the second upper conveyor line 310.
[0048] In some embodiments, the first lower conveyor line 120 and the second lower conveyor line 320 have opposite transmission directions.
[0049] In some embodiments, the first upper conveyor line 110 and the second upper conveyor line 310 are arranged along the first direction X, and the first lower conveyor line 120 and the second lower conveyor line 320 are arranged along the first direction X.
[0050] In some embodiments, the second conveying device 300 further includes a second buffer mechanism 330 and a second transfer mechanism 340. The second buffer mechanism 330 is used to carry the second material box 52, and the second buffer mechanism 330 and the second transfer mechanism 340 are spaced apart.
[0051] The second transfer mechanism 340 is configured to move along a third direction Z and has a second upper docking position 341 and a second lower docking position 342 to selectively dock with the second upper conveyor line 310 or the second lower conveyor line 320.
[0052] When the second transfer mechanism 340 is in the second upper docking position 341 or the second lower docking position 342, the second transfer mechanism 340 is connected to the second buffer mechanism 330.
[0053] In some embodiments, multiple sets of second buffer mechanisms 330 are arranged along the second direction Y, and the multiple sets of second buffer mechanisms 330 are spaced apart along the second direction Y. The second conveying device 300 also includes a transfer mechanism 350, which is configured to move along the second direction Y to dock the second transfer mechanism 340 with the multiple second buffer mechanisms 330 one by one. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other.
[0054] By setting the second buffer mechanism 330 into multiple groups, the second transfer mechanism 340 is connected one by one with the second material box 52 carried by the multiple second buffer mechanisms 330, thereby increasing the carrying capacity of the second conveying device 300 and improving the transfer efficiency of silicon wafers.
[0055] Please see Figure 3 , Figure 4 and Figure 5In some embodiments, the first upper conveyor line 110, the first lower conveyor line 120, the first transfer mechanism 140, the first buffer mechanism 130, the second upper conveyor line 310, the second lower conveyor line 320, the second transfer mechanism 340, and the multiple first buffer mechanisms 130 all include a conveyor belt structure, which is used to carry and transport the first material box 51 or the second material box 52.
[0056] In some embodiments, the conveyor belt structure described above is equipped with photoelectric sensor components to detect the presence of materials, thereby improving the automation control capability and operational safety of the transfer equipment 001.
[0057] Please see Figure 1 and Figure 2 In some embodiments, a first upper conveyor line 110, a first lower conveyor line 120, a first transfer mechanism 140, a first buffer mechanism 130, a cover opening device 200, a second upper conveyor line 310, a second lower conveyor line 320, a second transfer mechanism 340, and multiple first buffer mechanisms 130 constitute a production line unit. The transfer device 001 includes two production line units arranged along a second direction Y, with the first direction X, the second direction Y, and the third direction Z perpendicular to each other. By setting up two production line units, it is beneficial to double the operating efficiency of the silicon wafers.
[0058] Please see Figure 1 , Figure 3 and Figure 6 In some embodiments, the robotic arm 400 is configured to grasp and transfer the first material box 51 on the first buffer mechanism 130 to the lid opening device 200 and to grasp and transfer the first material box 51 on the lid opening device 200 to the first buffer mechanism 130, thereby completing the material flow between the first buffer mechanism 130 and the lid opening device 200, wherein the material is the first material box 51 loaded with a silicon wafer that has completed the passivation coating process.
[0059] In some embodiments, the robot arm 400 is further configured to transfer silicon wafers from the first material box 51 after opening to the second material box 52 in the second conveying device 300. Specifically, the robot arm 400 transfers the silicon wafers from the first material box 51 after opening to the second material box 52 on the second buffer mechanism 330. This completes the material flow between the opening device 200 and the second buffer mechanism 330, wherein the material is a silicon wafer that has undergone the passivation coating process.
[0060] Previously, the empty second material box 52, after passing through the second upper conveyor line 310, the second transfer mechanism 340, and the circulation mechanism 350, stopped at the second buffer mechanism 330, awaiting silicon wafer loading. The process of the robotic arm 400 transferring the silicon wafers can be synchronized with the process of the empty second material box 52 being transferred to the second buffer mechanism 330, or it can be performed after the process of the empty second material box 52 being transferred to the second buffer mechanism 330.
[0061] In some embodiments, the robotic arm 400 is further configured to transfer the first material box 51 after opening from the opening device 200 back to the first buffer mechanism 130, thereby completing the material flow between the first buffer mechanism 130 and the opening device 200, wherein the material is the empty first material box 51.
[0062] In some embodiments, a single robotic arm 400 is configured to transfer materials between two production line units, which helps to improve the integration of the transfer equipment 001. Simultaneously, having two production line units transfer materials via a single robotic arm 400 helps to reduce costs.
[0063] In some embodiments, the robotic arm 400 includes a base 410, a rotating arm 420, and a clamping mechanism 430. One end of the rotating arm 420 is fixed to the base 410, and the other end of the rotating arm 420 is connected to the clamping mechanism 430.
[0064] The clamping mechanism 430 includes a clamping mounting plate 431, a first clamping component 432 and a second clamping component 433. The clamping mounting plate 431 is rotatably connected to the rotating arm 420. The first clamping component 432 and the second clamping component 433 are both mounted on the clamping mounting plate 431.
[0065] The first clamping assembly 432 includes a first clamping drive 4321 and a pair of clamping arms 4322 that move closer to or further away from each other. The pair of clamping arms 4322 are slidably engaged with the clamping mounting plate 431. The first clamping drive 4321 is disposed on the clamping mounting plate 431 and drives the pair of clamping arms 4322 to move closer to or further away from each other.
[0066] The second clamping assembly 433 includes a support arm 4331, a clamping arm 4332, and a second clamping drive member 4333. The support arm 4331 is fixed to the clamping mounting plate 431, the clamping arm 4332 is slidably engaged with the clamping mounting plate 431, and the second clamping drive member 4333 is disposed on the clamping mounting plate 431 and drives the clamping arm 4332 to move toward or away from the support arm 4331.
[0067] Please see Figure 1 , Figure 3 and Figure 7In some embodiments, the lid opening device 200 is disposed adjacent to the first buffer mechanism 130. The lid opening device 200 includes a frame 210, a positioning component 220, a rotating component 230, and a lid opening component 240. The rotating component 230 is disposed on the frame 210 and has a rotation axis, which is disposed along a second direction Y.
[0068] The positioning component 220 is disposed on the rotating component 230. The positioning component 220 has a loading position for carrying the first material box 51 and an opening position for opening the lid. The rotating component 230 drives the positioning component 220 to rotate, so as to switch from the loading position to the opening position, or from the opening position to the loading position.
[0069] Specifically, the positioning component 220 includes a first positioning platform 221 and a second positioning platform 222, and a positioning space 223 is formed between the first positioning platform 221 and the second positioning platform 222. The first material box 51 has an opening surface d1, a bottom surface d2 opposite to the opening surface d1, and a side surface d3 perpendicular to the opening surface d1. The first positioning platform 221 is used to position the bottom surface d2 of the first material box 51, and the second positioning platform 222 is used to position the side surface d3 of the first material box 51.
[0070] The lid opening assembly 240 is mounted on the frame 210 and configured to cooperate with the positioning assembly 220 at the lid opening position to open the lid 5121 of the first material box 51. When the robot arm 400 picks up the first material box 51 from the first buffer mechanism 130 and transfers it to the lid opening device 200, the positioning assembly 220 is in the loading position. After the positioning assembly 220 fixes the first material box 51, the rotating assembly 230 drives the positioning assembly 220 and the first material box 51 to rotate together, thereby rotating the first material box 51 by 90°.
[0071] Please see Figure 7 and Figure 8 In some embodiments, the first material box 51 includes a turnover tray 511 and two turnover boxes 512, which are arranged side by side on the surface of the turnover tray 511. Each turnover box 512 has a lid 5121, and the lids 5121 of the two turnover boxes 512 are arranged opposite to each other. When the rotating assembly 230 drives the positioning assembly 220 and the first material box 51 to rotate 90° together, the lids 5121 of the turnover boxes 512 face the opening assembly 240, so that the opening assembly 240 can open the lids 5121 of the turnover boxes 512.
[0072] First, in the first conveying device 100, the first upper conveyor line 110 conveys the first material box 51 filled with silicon wafers output from the process machine 5 to the right end. At this time, the first transfer mechanism 140 rises and docks with the first upper conveyor line 110, and the first material box 51 is conveyed to the first transfer mechanism 140. The first transfer mechanism 140 carries the first material box 51 down and docks with the first lower conveyor line 120 and the first buffer mechanism 130, and the first material box 51 filled with silicon wafers is conveyed to the first buffer mechanism 130.
[0073] Meanwhile, in the second conveying device 300, the second upper conveyor line 310 transports the empty second material box 52 to the left end. At this time, the second transfer mechanism 340 rises and connects with the second upper conveyor line 310, and the empty second material box 52 is transported to the second transfer mechanism 340. The second transfer mechanism 340 connects with the circulation mechanism 350, and the circulation mechanism 350 connects with the second buffer mechanism 330, and the empty second material box 52 is transported to the second buffer mechanism 330.
[0074] Next, the robotic arm 400 grasps the first material box 51 on the first buffer mechanism 130 and transports it to the opening device 200. After the opening device 200 opens the lid 5121 of the first material box 51, the robotic arm 400 grasps the silicon wafers (which can be multiple silicon wafers) inside the opened first material box 51 and places them into the second material box 52 on the second buffer mechanism 330.
[0075] Next, the robotic arm 400 grabs the first material box 51 (with the silicon wafer removed) above the lid-opening device 200 and transfers it to the first buffer mechanism 130. The first transfer mechanism 140 descends and docks with the first buffer mechanism 130 and the first lower conveyor line 120, and the empty first material box 51 returns to the process machine 5 via the first lower conveyor line 120;
[0076] At the same time, the second material box 52 filled with silicon wafers moves to the right and is conveyed to the transfer mechanism 350. The second transfer mechanism 340 rises and docks with the transfer mechanism 350. After the second material box 52 is conveyed to the second transfer mechanism 340, the second transfer mechanism 340 descends and docks with the second lower layer conveyor line 320, so that it flows out from the transfer equipment 001 through the second lower layer conveyor line 320.
[0077] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.
Claims
1. A transfer device, characterized in that, Includes a first conveying device for docking with a process machine to receive a first material box output by the process machine and / or to convey the first material box to the process machine; The first conveying device includes a first upper conveying line and a first lower conveying line arranged in two layers. Both the first upper conveying line and the first lower conveying line extend along a first direction and one end is used to connect to the process machine. The first conveying device further includes a first buffer mechanism and a first transfer mechanism, wherein the first buffer mechanism is used to carry the first material box; The first transfer mechanism is configured to move along a third direction and has a first upper docking position and a first lower docking position to selectively dock with the first upper conveyor line or the first lower conveyor line, the first direction being perpendicular to the third direction; when the first transfer mechanism is located at the first upper docking position or the first lower docking position, the first transfer mechanism docks with the first buffer mechanism; The transfer equipment also includes: A lid-opening device is used to open the lid of the first material box, and the lid-opening device is disposed adjacent to the first buffer mechanism; A second conveying device is used to provide a second material box and / or output the second material box; A robotic arm is configured to transfer the first material box between the first buffer mechanism and the opening device, and the robotic arm is also configured to transfer the silicon wafers in the first material box after the lid is opened to the second material box in the second conveying device.
2. The transfer equipment as described in claim 1, characterized in that, The second conveying device includes a second upper conveying line and a second lower conveying line arranged in two layers, both of which extend along the first direction; The second conveying device further includes a second buffer mechanism and a second transfer mechanism. The second buffer mechanism is used to carry the second material box, and the second buffer mechanism and the second transfer mechanism are arranged at intervals. The second transfer mechanism is configured to move along the third direction and has a second upper docking position and a second lower docking position to selectively dock with the second upper conveyor line or the second lower conveyor line; When the second transfer mechanism is in the second upper docking position or the second lower docking position, the second transfer mechanism is connected to the second buffer mechanism.
3. The transfer equipment as described in claim 2, characterized in that, The second buffer mechanism is provided in multiple groups along the second direction, and the multiple groups of the second buffer mechanism are spaced apart along the second direction. The second conveying device also includes a transfer mechanism, which is configured to move along the second direction to connect the second transfer mechanism with the second material boxes carried by the multiple second buffer mechanisms one by one. The first direction, the second direction and the third direction are perpendicular to each other.
4. The transfer equipment as described in claim 2, characterized in that, The first conveying device, the opening device, and the second conveying device constitute a production line unit. The transfer equipment includes two production line units, which are arranged along a second direction. The first direction, the second direction, and the third direction are perpendicular to each other.
5. The transfer device as described in claim 4, characterized in that, The robotic arm is configured as one, and the robotic arm transfers materials to two production line units respectively.
6. The transfer device as described in claim 1, characterized in that, The robotic arm includes a base, a rotating arm, and a clamping mechanism. One end of the rotating arm is fixed to the base, and the other end of the rotating arm is connected to the clamping mechanism.
7. The transfer device as described in claim 6, characterized in that, The clamping mechanism includes a clamping mounting plate and a first clamping assembly. The clamping mounting plate is rotatably connected to the rotating arm. The first clamping assembly is mounted on the clamping mounting plate. The first clamping assembly includes a first clamping drive and a pair of clamping arms that are close to or far apart from each other. The first clamping drive drives the pair of clamping arms to move.
8. The transfer device as described in claim 7, characterized in that, The clamping mechanism further includes a second clamping assembly, which is mounted on the clamping mounting plate. The second clamping assembly includes a support arm, a clamping arm, and a second clamping drive member. The support arm is fixed to the clamping mounting plate, and the second clamping drive member drives the clamping arm to move toward or away from the support arm.
9. The transfer equipment as described in claim 1, characterized in that, The lid-opening device includes a frame, a positioning component, a rotating component, and a lid-opening component. The rotating component is disposed on the frame, and the positioning component is disposed on the rotating component. The positioning component has a loading position for carrying the first material box and a lid-opening position for opening the lid. The rotating component drives the positioning component to rotate to switch from the loading position to the lid-opening position, or from the lid-opening position to the loading position. The lid-opening component is disposed on the frame and configured to cooperate with the positioning component at the lid-opening position to open the lid of the first material box.
10. The transfer device as described in claim 9, characterized in that, The positioning component includes a first positioning platform and a second positioning platform, with a positioning space formed between the first positioning platform and the second positioning platform. The first material box has an opening surface, a bottom surface opposite to the opening surface, and a side surface perpendicular to the opening surface. The first positioning platform is used to position the bottom surface of the first material box, and the second positioning platform is used to position the side surface of the first material box.