Gripper for handling wafers

Abstract

The utility model relates to the technical field of semiconductor, specifically provide a bottom support and wafer carrier, aim at solving the problem that the mechanical hand of equipment will hit wafer or scratch wafer when taking or placing wafer because the open wafer box is not placed in the correct state. For this purpose, the bottom support of the utility model includes bottom support body, limit part, recess and response part, the limit part is arranged on the upper surface of bottom support body, the limit part is configured to limit the open wafer box when the open wafer box is placed on it;The recess is opened on the upper surface of bottom support body;The response part is arranged in the recess, when the open wafer box is installed in place, the lower surface of open wafer box presses the response part, so that the response part is triggered, to avoid the situation that the mechanical hand will hit wafer or scratch wafer when taking or placing wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and specifically to a base and wafer handling device. Background Technology

[0002] In the manufacturing process of integrated circuit chips, certain steps require the use of open cassettes to hold wafer products. These open cassettes are typically placed manually by operators onto the base tray of the wafer cassette (POD cassette) at the standard mechanical interface port (SMIF port) of the equipment. Occasionally, due to operational errors, the open cassette may be placed incorrectly relative to the base tray (e.g., tilted). In this case, when the robotic arm of the equipment retrieves or places a wafer (or wafer) from the incorrectly placed open cassette, it may collide with or scratch the wafer, resulting in product damage.

[0003] Accordingly, a new technical solution is needed in this field to solve the above problems. Utility Model Content

[0004] The present invention aims to solve the above-mentioned technical problem, namely, to solve the problem that when the open wafer cassette is placed in a state that is not correctly positioned relative to the base, the robotic arm of the equipment will bump into or scratch the wafer when picking up or placing the wafer.

[0005] In a first aspect, the present invention provides a base for supporting an open wafer cassette. The base includes a base body, a limiting part, a groove, and a sensing part. The limiting part is disposed on the upper surface of the base body and is configured to limit the open wafer cassette when it is placed on it. The groove is formed on the upper surface of the base body. The sensing part is disposed in the groove. When the open wafer cassette is installed in place, the lower surface of the open wafer cassette presses against the sensing part to trigger the sensing part.

[0006] When the above technical solution is adopted, the open wafer cassette is placed on the base tray and pressed against the limiting part, preventing the open wafer cassette from moving relative to the base tray body in any direction parallel to the upper surface of the base tray body. This allows the open wafer cassette to be stably placed on the base tray body. Moreover, the sensing unit can be triggered after the open wafer cassette is installed in place, and cannot be triggered if the open wafer cassette is not installed in place. This allows the sensing unit to detect whether the open wafer cassette is installed in place. For example, the sensing unit can detect whether the open wafer cassette is in a non-tilted state relative to the upper surface of the base tray body. Therefore, when the robot arm picks up or places wafers, it can avoid the problem of the robot arm bumping into or scratching the wafers due to the incorrect placement of the open wafer cassette.

[0007] In the preferred embodiment of the base described above, the limiting portion includes a stop assembly disposed on the upper surface, and the stop assembly is configured to abut against a plurality of sidewalls of the open wafer cassette.

[0008] By adopting the above technical solution, the structure of the limiting part can be simplified, the number of parts of the limiting part can be reduced, and the installation difficulty and processing procedures of the limiting part can be simplified, thereby reducing the cost of the base.

[0009] In the preferred embodiment of the base support described above, the stop assembly includes: a first stop, a second stop, and a third stop. The first stop and the second stop are spaced apart along a first direction on one side of the upper surface of the base support body. The third stop extends along the first direction between the first stop and the second stop. Compared to the first stop and the second stop, the third stop is closer to the center of the base support in a second direction. The first direction and the second direction intersect.

[0010] With the above technical solution, the third stop extends along the first direction and is disposed between the first stop and the second stop, and is closer to the center of the base than the first stop and the second stop. In this way, when the open wafer cassette is installed in place, the first stop, the second stop, and the third stop can simultaneously abut against multiple side walls of the open wafer cassette. Since the first stop, the second stop, and the third stop are not collinear, the side wall of the open wafer cassette near the base body can stably abut against the first stop, the second stop, and the third stop, thereby reducing the risk that the open wafer cassette will move relative to the base body in any direction parallel to the upper surface after abutting against the first stop, the second stop, and the third stop.

[0011] In the preferred embodiment of the base support described above, the stop assembly further includes a fourth stop and a fifth stop. The fourth stop and the fifth stop are spaced apart on one side of the upper surface of the base support body along the first direction. One side of the upper surface of the base support body and the other side of the upper surface of the base support body are opposite to each other in the second direction. Compared with the fourth stop and the fifth stop, the third stop is closer to the middle of the base support body in the second direction.

[0012] With the above-mentioned technical features, after the open wafer cassette is placed on the base and abuts against the first, second and third blocks, the fourth and fifth blocks can also abut against the side wall of the open wafer cassette, so as to further reduce the risk of the open wafer cassette moving relative to the base body in any direction parallel to the upper surface.

[0013] In the preferred embodiment of the base described above, the sensing unit includes at least one contact switch and a lead wire. The contact switch is configured to switch states when the open wafer cassette is installed in place. The lead wire is disposed on the base body and connected to the contact switch. The lead wire is configured to connect the contact switch to an external circuit so that when at least one of the contact switches switches states, the electrical signal of the external circuit changes.

[0014] When the above technical solution is adopted, the sensing unit is configured to include a contact switch, so that when the open wafer cassette is picked up or put down, the external circuit can be switched between the on and off states by physical action to determine whether the open wafer cassette is installed in place. This is more direct and has a lower false alarm rate than the method of determining whether the open wafer cassette is installed in place by emitting an induction electrical signal through a sensor.

[0015] In the preferred embodiment of the base described above, the contact switch includes a first contact switch and a second contact switch, the first contact switch and the second contact switch are spaced apart, and the first contact switch and the second contact switch are configured to switch states when the open wafer cassette is installed in place.

[0016] When the above technical solution is adopted, the contact switch includes a first contact switch and a second contact switch disposed on the base body, so that the first contact switch and the second contact switch can be switched from the off state to the on state only when the open wafer box is installed in place. This simplifies the arrangement of the sensing part and improves the sensing accuracy of the sensing part.

[0017] In the preferred embodiment of the base described above, the first contact switch and the second contact switch are connected in series.

[0018] When the above technical solution is adopted, since the first contact switch and the second contact switch are connected in series with the circuit set on the base body, the circuit connected to the first contact switch and the second contact switch can only be turned on after the open wafer box is installed in place, so that the components connected to the circuit can perform the next action. The above setting method can simplify the operation process of the wafer pick-and-place system with the base.

[0019] In the preferred embodiment of the base mentioned above, the sensing spring of the contact switch protrudes from the upper surface of the base body.

[0020] In the preferred embodiment of the base, the base body further includes a wire groove, which is formed on the upper surface of the base body and is configured to accommodate the lead wire.

[0021] In a second aspect, the present invention also provides a wafer handling device, the wafer handling device including a standard mechanical interface port and the aforementioned base, the base being disposed on the standard mechanical interface port, and the sensing unit being configured to be electrically connected to the standard mechanical interface port. Attached Figure Description

[0022] The preferred embodiments of this utility model are described below with reference to the accompanying drawings, in which:

[0023] Figure 1 This is a schematic diagram of the structure of the base of this utility model;

[0024] Figure 2 This is a schematic diagram of the assembly of the base, open wafer box, and standard mechanical interface port of this utility model.

[0025] Figure 3 This is an exploded view of the assembly relationship between the base of this utility model, the open wafer box, and the standard mechanical interface port.

[0026] Figure 4 This is a front view of the assembly diagram of the base, open wafer box, and standard mechanical interface port of this utility model.

[0027] Figure 5 It is along Figure 4 Sectional view of line AA in the middle;

[0028] Figure 6 It is along Figure 4 A cross-sectional view of the CC line;

[0029] Figure 7 It is along Figure 4 Sectional view of the middle BB line;

[0030] Figure 8 yes Figure 7 A magnified view of a portion of region D in the middle;

[0031] Figure 9 This is a bottom view of the open wafer cassette of this utility model.

[0032] List of reference numerals in the attached diagram:

[0033] 100. Base support; 1. Base support body; 11. Groove; 12. Wire groove; 2. Limiting part; 21. Stop assembly; 211. First stop; 212. Second stop; 213. Third stop; 214. Fourth stop; 215. Fifth stop; 3. Sensing part; 31. First contact switch; 311. Sensing spring; 32. Second contact switch;

[0034] 200. Open wafer cell; 201. First sidewall; 202. Second sidewall; 203. Third sidewall; 204. Fourth sidewall; 205. Fifth sidewall; 206. Sixth sidewall; 207. Seventh sidewall; 208.

[0035] 300. Standard mechanical interface port. Detailed Implementation

[0036] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0037] It should be noted that in the description of this utility model, terms such as "inner" and "outer," indicating directional or positional relationships, are based on the directional or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, it should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium, such as a wireless network or a local area network. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0039] Figure 1 This is a schematic diagram of the structure of the base of an embodiment of the present invention. Figure 2 This is a schematic diagram of the assembly of the base, open wafer box, and standard mechanical interface port according to an embodiment of the present invention. Figure 3 This is an exploded view showing the assembly relationship between the base, the open wafer box, and the standard mechanical interface port according to an embodiment of the present invention. Figure 4 This is a front view of the assembly diagram of the base, open wafer box, and standard mechanical interface port of this utility model. Figure 5 It is along Figure 4 A cross-sectional view along line AA in the middle. Figure 6 It is along Figure 4 A cross-sectional view of the CC line. Figure 7 It is along Figure 4 A cross-sectional view along the BB line. Figure 8 yes Figure 7 A magnified view of a portion of region D. Figure 9 This is a bottom view of an open wafer cassette according to an embodiment of the present invention.

[0040] like Figure 1 As shown, see also Figures 2 to 9To address the problem of existing open wafer cassettes being bumped or scratched by robotic arms when picking up or placing wafers due to incorrect placement, this invention provides a base 100. The base 100 supports the open wafer cassette 200 and is mounted on a fixed platform of a standard mechanical interface port 300, ensuring stable placement of the open wafer cassette 200 on the platform. This facilitates subsequent processing by wafer handling equipment equipped with the standard mechanical interface port 300. The base 100 includes a base body 1, a limiting part 2, a groove 11, and a sensing part 3. The base body 1 is mounted on the fixed platform of the standard mechanical interface port 300. The limiting part 2 is located on the upper surface of the base body 1 and is configured to limit the open wafer cassette 200 when it is placed on the base 100. Specifically, the limiting part 2 is configured such that when the open wafer cassette 200 is installed in place, the side wall of the open wafer cassette 200 near the base tray body 1 can abut against the limiting part 2, and can prevent the open wafer cassette 200 from moving relative to the base tray body 1 in any direction parallel to the upper surface of the base tray body 1. More specifically, in the specific implementation of this utility model, the base tray body 1 is placed horizontally on the fixed platform of the standard mechanical interface port 300, and the upper surface of the base tray body 1 is also arranged in a horizontal direction, so that the open wafer cassette 200 can be placed horizontally on the base tray body 1, thereby enabling the open wafer cassette 200 to be accurately and stably installed on the base tray body 1.

[0041] Continue reading Figures 1 to 9 A groove 11 is formed on the upper surface of the base body 1, and a sensing part 3 is disposed in the groove 11. The sensing part 3 is configured to be triggered when the open wafer cassette 200 is installed in place, thereby enabling the sensing part 3 to detect whether the open wafer cassette 200 is installed in place. Specifically, in a specific embodiment of this utility model, the sensing part 3 is a contact sensing device, and the position of the sensing part 3 is configured such that when the open wafer cassette 200 is installed in place, the sensing part 3 can abut against the lower surface of the open wafer cassette 200, thereby triggering the sensing part 3 upon contact with the lower surface of the open wafer cassette 200, so that the sensing part 3 can sense that the open wafer cassette 200 is installed in place. For example, in this application, the sensing part 3 can be a pressure sensor (not shown) or a contact switch (not identified).

[0042] When the sensing unit 3 is a pressure sensor, there are multiple pressure sensors. "Triggered" refers to the generation of a sensing signal due to pressure being applied to the pressure sensor. More specifically, the multiple pressure sensors are positioned such that when the open wafer cassette 200 is correctly placed on the fixed platform, the lower surface of the open wafer cassette 200 can press against all of the multiple pressure sensors. At this time, all pressure sensors send pressure sensing signals to the controller. Based on this, the controller can determine that the open wafer cassette 200 is correctly positioned according to the received sensing signals from the multiple pressure sensors. Conversely, if the open wafer cassette 200 is not correctly positioned (e.g., tilted) on the fixed platform, the lower surface of the open wafer cassette 200 cannot press against all of the multiple pressure sensors. In this case, the controller can determine that the open wafer cassette 200 is not correctly positioned according to the pressure signals sent by the multiple pressure sensors. Since the setting method of the pressure sensors is not the focus of this invention, it will not be elaborated here; it is sufficient that the multiple pressure sensors and the setting method of the open wafer cassette 200 satisfy the above conditions. When the sensing unit 3 is a contact switch, the contact switch is connected to the circuit. Being triggered means that the contact switch changes its state due to being pressed, causing a change in the electrical signal in the circuit. With the above configuration, after the open wafer cassette 200 is installed in place, the sensing unit 3 can press against the lower surface of the open wafer cassette 200, thereby enabling the sensing unit 3 to detect whether the open wafer cassette 200 is installed on the base body 1 in the correct placement state. This reduces the risk of the robot arm scratching or hitting the wafers inside the open wafer cassette 200 due to the open wafer cassette 200 not being placed in the correct position during the process of picking up or placing wafers, thus reducing the risk of the robot arm colliding with or scratching the wafers.

[0043] It should be noted that although the sensing unit 3 described above is a contact sensing device, this is not limiting. In other embodiments of this utility model, the sensing unit 3 can also be a non-contact sensing device. For example, the sensing unit 3 can be a distance sensor, a position sensor, or an image sensor. In this case, when the open wafer cassette 200 is installed in place, the distance sensor, infrared sensor, or image sensor can be set in a position that does not need to contact the open wafer cassette, as long as the distance sensor, position sensor, or image sensor can sense whether the open wafer cassette 200 is installed in place.

[0044] As one possible implementation method, such as Figure 1 As shown, see also Figure 2 , Figure 3 , Figure 5 and Figure 6The limiting part 2 includes a stop assembly 21, which is disposed on the upper surface of the base body 1. The stop assembly 21 is configured to abut against multiple side walls of the open wafer cassette 200. Specifically, the stop assembly 21 is configured to abut against the side walls of the open wafer cassette 200 that extend in different directions, so that the installed open wafer cassette 200 can be stably placed on the base body 1. It also simplifies the structure of the limiting part 2, saves the number of parts of the limiting part 2, and simplifies the installation difficulty and processing steps of the limiting part 2, thereby reducing the cost of the base 100.

[0045] It should be noted that, although the above combination Figure 3 The described limiting part 2 includes a stop assembly 21, but this is not limiting. In other embodiments of this utility model, the limiting part 2 may also be a limiting groove provided on the base body 1. The limiting groove has a contour that matches the lower side wall of the open wafer cassette 200, so that the lower side wall of the installed open wafer cassette 200 can be connected with the limiting groove, thereby allowing the open wafer cassette 200 to be stably installed on the base body 1.

[0046] As one possible implementation method, such as Figure 1 As shown, see also Figure 2 , Figure 3 , Figure 5 and Figure 6 The stop assembly 21 includes a first stop 211, a second stop 212 and a third stop 213. The first stop 211 and the second stop 212 are spaced apart along a first direction on one side of the upper surface of the base body 1. Specifically, the first stop 211 is configured to simultaneously abut against the lower part of the first sidewall 201 extending along the first direction and the lower part of the second sidewall 202 extending along the second direction of the open wafer cassette 200. The second stop 212 is configured to simultaneously abut against the lower part of the third sidewall 203 extending along the first direction and the lower part of the fourth sidewall 204 extending along the second direction of the open wafer cassette 200. The first stop 211 and the second stop 212 are respectively located on the side of the second sidewall 202 and the fourth sidewall 202 away from the center of the base body 1. The first stop 211 and the second stop 212 are also respectively located on the side of the first sidewall 201 and the third sidewall 203 close to the center of the base body 1. The second sidewall 202 is located on the side of the first sidewall 201 close to the center of the base body 1, and the fourth sidewall 204 is located on the side of the third sidewall 203 close to the center of the base body 1. With the above configuration, the installed open wafer cassette 200 can only move away from the first block 211 and the second block 212 in the second direction under the action of the first block 211 and the second block 212 abutting.

[0047] It should be noted that, in specific embodiments of this utility model, both the first direction and the second direction are located within the upper surface parallel to the base body 1, and the first direction and the second direction are arranged perpendicularly. However, this is not limiting; obviously, in other embodiments of this utility model, the first direction and the second direction only need to intersect.

[0048] Furthermore, despite the above combination Figure 5 The second sidewall 202 is located on the side of the first sidewall 201 near the center of the base body 1, and the fourth sidewall 204 is located on the side of the third sidewall 203 near the center of the base body 1. However, this is not limiting. In other embodiments of the present invention, the second sidewall 202 may be located on the side of the first sidewall 201 away from the center of the base body 1, and the fourth sidewall 204 may be located on the side of the third sidewall 203 away from the center of the base body 1.

[0049] Furthermore, despite the above combination Figure 3 and Figure 5 The first stop 211 is abutted against the first sidewall 201 and the second sidewall 202 of the open wafer cassette 200, and the second stop 212 abuts against the third sidewall 203 and the fourth sidewall 204 of the open wafer cassette 200. However, this is not restrictive. Obviously, the first stop 211 and the second stop 212 can also abut against other sidewalls of the open wafer cassette 200 that extend in the first direction and the second direction, as long as the open wafer cassette 200 can move away from the first stop 211 and the second stop 212 in the second direction under the action of the abutment of the first stop 211 and the second stop 212.

[0050] See next Figure 1 , Figure 3 , Figure 5 and Figure 6The third stop 213 extends along the first direction and is disposed between the first stop 211 and the second stop 212. Compared with the first stop 211 and the second stop 212, the third stop 213 is closer to the center of the base body 1 in the second direction. Specifically, the third stop 213 abuts against the lower part of the fifth side wall 205 of the open wafer cassette 200, which extends along the first direction. The position of the third stop 213 is configured such that when the open wafer cassette 200 is installed in place, the third stop 213 is located on the side of the fifth side wall 205 away from the center of the base body 1 (and also away from the center of the crossbeams (mentioned later)). In this way, after the third stop 213 abuts against the side of the fifth sidewall 205 of the open wafer cassette 200 extending along the first direction away from the center of the base body 1, the open wafer cassette 200 can be prevented from moving away from the first stop 211 in the second direction. This prevents the open wafer cassette 200 from moving relative to the base body 1 in any direction parallel to the upper surface of the base body 1 after it is installed in place, under the action of the first stop 211, the second stop 212, and the third stop 213. This allows the open wafer cassette 200 to be positioned and connected to the base body 1. Moreover, in the embodiment where the stop assembly 21 is composed of the first stop 211, the second stop 212, and the third stop 213, the stop assembly 21 of this invention has the characteristics of simple structure, which saves the number of parts in the stop assembly 21 and reduces the production cost of the base 100.

[0051] It should be noted that, although the above combination Figure 5The first stop 211 and the second stop 212 described herein can be located on the side of the first sidewall 201 and the third sidewall 203 of the open wafer cassette 200 extending along the first direction, near the center of the base body 1, and simultaneously on the side of the second sidewall 202 and the fourth sidewall 204 of the open wafer cassette 200 extending along the second direction, away from the center of the base body 1. However, this is not limiting. In other embodiments of this utility model, if the second sidewall 202 is located on the side of the first sidewall 201 away from the center of the base body 1, and the fourth sidewall 204 is located on the side of the third sidewall 203 away from the center of the base body 1, then the first stop 211 and the second stop 212 can also be located on the side of the first sidewall 201 and the third sidewall 203 of the open wafer cassette 200 extending along the first direction, away from the center of the base body 1, and simultaneously on the side of the second sidewall 202 and the fourth sidewall 204 of the open wafer cassette 200 extending along the second direction, near the center of the base body 1. However, this is not a limitation. In other embodiments of this utility model, the first stop 211 and the second stop 212 may also abut against other side walls of the open wafer box, as long as the open wafer box 200 installed in place can be positioned and connected to the base body 1 under the action of the first stop 211, the second stop and the third stop 213.

[0052] As one possible implementation method, such as Figure 5 As shown, see also Figure 6The stop assembly 21 also includes a fourth stop 214 and a fifth stop 215. The fourth stop 214 and the fifth stop 215 are spaced apart along a first direction on the other side of the upper surface of the base body 1. This other side of the upper surface of the base body 1 is opposite to one side of the upper surface of the base body 1 (where the first stop 211 and the second stop 212 are provided) in a second direction. Compared to the fourth stop 214 and the fifth stop 215, the third stop 213 is closer to the middle of the base body 1 in the second direction. Therefore, it is easy to understand that the third stop 213 is located between the first stop 211, the second stop 212, the fourth stop 214, and the fifth stop 215 in the second direction. Specifically, the fourth stop 214 and the fifth stop 215 are configured to abut against the lower parts of the sixth sidewall 206 and the seventh sidewall 207 of the open wafer cassette 200, which extend along the second direction, respectively, and are located on the side of the sixth sidewall 206 and the seventh sidewall of the open wafer cassette 200 that extend along the second direction away from the center of the base body 1. With this configuration, after the open wafer cassette 200 is placed on the base 100 and abuts against the first stop 211, the second stop 212, and the third stop 213, the fourth stop 214 and the fifth stop 215 can abut against the lower parts of the sixth sidewall 206 and the seventh sidewall 207 of the open wafer cassette 200, which extend along the second direction, respectively. This further reduces the risk of the open wafer cassette 200 moving relative to the base body 1 in any direction parallel to the upper surface.

[0053] Furthermore, in specific embodiments of this utility model, the open wafer cassette 200 typically includes a horizontal and vertical beam located at its bottom, connecting the opposing sixth sidewall 206 and seventh sidewall 207. The fifth sidewall 205 is a sidewall extending laterally (i.e., in the first direction) from the horizontal and vertical beam, and the third stop 213 is configured to abut against the fifth sidewall. Based on this, the open wafer cassette 200 can be stably positioned on the base body 1 under the action of the first stop 211, the second stop 212, and the third stop 213. Through the above-described configuration, the structure of the limiting part 2 is simplified, making it easier for the open wafer cassette 200 to form a mating connection with the base body 1. This makes it easier for the open wafer cassette 200 to be placed on the base body, thereby improving the placement efficiency of the open wafer cassette 200 and increasing the success rate of correct placement. Moreover, it reduces the design difficulty of the limiting part, thus reducing the production cost of the base 100.

[0054] It should be noted that, although the above combination Figure 5The described stop assembly 21 includes a first stop 211, a second stop 212, a third stop 213, a fourth stop 214, and a fifth stop 215. However, this is not limiting. In other embodiments of this utility model, the stop assembly 21 may also be composed of other numbers of stops, as long as the stop assembly 21 can prevent the open wafer cassette 200 from moving relative to the base body 1 in any direction parallel to the upper surface.

[0055] As one possible implementation method, such as Figure 5 As shown, see also Figure 6 The sensing unit 3 includes at least one contact switch (not shown) and a lead (not shown). The contact switch is configured to switch states when the open wafer cassette 200 is installed in place. The lead is located on the base body 1 and connected to the contact switch. The lead is configured to connect the contact switch to an external circuit (not shown) so that the electrical signal of the external circuit changes when at least one contact switch switches states. Specifically, the lead is configured to connect to an external circuit disposed on the fixed platform when the base is mounted to the fixed platform of the standard mechanical interface port 300. When the open wafer cassette 200 is not installed in place, the contact sensing switch is in the off state. When the open wafer cassette 200 is installed in place, the contact sensing switch switches from the off state to the on state under the action of abutment against the lower surface of the open wafer cassette 200, so that the current and voltage of the external circuit disposed in the standard mechanical interface port 300 change, thereby enabling the external circuit to sense that the open wafer cassette 200 has been installed in place. More specifically, the contact switch and leads are configured to connect in series with the external circuitry in the standard mechanical interface port 300 when the open wafer cassette 200 is installed in place. This allows the contact switch to switch from an open to an on state when the open wafer cassette 200 is in place, thereby switching the external circuitry from an off state to an on state. This allows for direct confirmation that the open wafer cassette 200 is installed correctly based on the connection of the external circuitry. Furthermore, the connection of the external circuitry enables the wafer handling equipment equipped with the base tray 100 and the standard mechanical interface port 300 to perform the next step, simplifying the operation process. Moreover, this configuration is more direct and has a lower false alarm rate compared to using sensors to emit induced electrical signals to determine whether the open wafer cassette 200 is installed correctly.

[0056] It should be noted that although the contact switch described above is configured to switch from an open state to an on state when the open wafer cassette 200 is installed in place, this is not limiting. Those skilled in the art can also configure the contact switch to switch from an on state to an off state when the open wafer cassette 200 is installed in place, in which case the contact switch and leads are configured to be connected in parallel to the external circuit in the standard mechanical interface port 300 when the open wafer cassette 200 is installed in place, so that the voltage and current of the external circuit can change accordingly when the open wafer cassette 200 is installed in place, thereby sensing whether the open wafer cassette 200 is installed in place. This adjustment does not deviate from the basic principle of this utility model, and therefore will also fall within the protection scope of this utility model.

[0057] Furthermore, despite the above combination Figure 5 The described sensing unit 3 includes a contact switch and leads, but this is not limiting. In other embodiments of this invention, the sensing unit 3 may also include a pressure sensor (not shown) and leads. The pressure sensor is connected to the leads, and the position of the pressure sensor is configured such that after the open wafer cassette 200 is installed in place, the pressure sensor can abut against the lower surface of the open wafer cassette 200, so that the pressure sensor can generate a pressure signal corresponding to when the open wafer cassette 200 is installed in place. Specifically, the pressure sensor and leads are configured to connect to an external circuitry provided on the fixed platform when the base body 1 is mounted to the fixed platform of the standard mechanical interface port 300. In this case, this invention can determine whether the open wafer cassette 200 is installed in place based on the pressure signal detected by the pressure sensor when the open wafer cassette 200 is picked up or placed down. This adjustment does not deviate from the basic principle of this invention and therefore falls within the protection scope of this invention.

[0058] Furthermore, although the sensing unit 3 described above includes a pressure sensor and leads, and the leads are configured to connect to an external circuitry mounted on the mounting surface of the standard mechanical interface port 300 when the base body 1 is mounted onto the mounting surface of the standard mechanical interface port 300, this is not limiting. Those skilled in the art can also, as needed, configure the sensing unit 3 to include a contact switch and an internal circuitry (not shown) mounted on the base body 1. Specifically, the internal circuitry is located on the base body 1 and connected to the contact switch, and includes a power supply and a signal generator so that when the open wafer cassette 200 is mounted in place, the contact switch can switch its state, thereby enabling the signal generator to emit a sensing signal corresponding to the mounting of the open wafer cassette 200. This sensing signal can be received by components in the external circuitry mounted on the mounting surface of the standard mechanical interface port 300 via a wireless network, so that a device equipped with the base 100 and the standard mechanical interface port 300 can sense that the open wafer cassette 200 is mounted in place. However, this is also not limiting; those skilled in the art can also, as needed, configure the sensing unit 3 to include a pressure sensor and an internal circuitry (not shown). At this time, the pressure sensor can send a pressure signal to the components in the external circuit set on the fixed platform of the standard mechanical interface port 300, or the signal generator set in the internal circuit can send a sensing signal to the components in the external circuit set on the fixed platform of the standard mechanical interface port 300. Such adjustment does not deviate from the basic principle of this utility model, and therefore will also fall within the protection scope of this utility model.

[0059] As one possible implementation method, see below. Figure 1 , Figure 3 , Figure 5 and Figure 6The contact switch includes a first contact switch 31 and a second contact switch 32, which are spaced apart and configured to simultaneously switch states when the open wafer cassette 200 is installed. Specifically, in a specific embodiment of this invention, the first contact switch 31 and the second contact switch 32 are configured to simultaneously switch from an off state to a conducting state when the open wafer cassette 200 is installed. More specifically, the first contact switch 31 and the second contact switch 32 are connected to the base body 1 by screwing. Obviously, in other embodiments of this invention, the first contact switch 31 and the second contact switch 32 can also be welded or snapped to the base body 1. The connection method between the first contact switch 31 and the second contact switch 32 and the base body 1 is not the focus of this invention, and therefore will not be described in detail here. By adopting the above configuration, the first contact switch 31 and the second contact switch 32 can be switched from the off state to the on state simultaneously only when the open wafer box 200 is installed in place. When the open wafer box 200 is not installed in place, the first contact switch 31 and the second contact switch 32 cannot be switched from the off state to the on state simultaneously. This simplifies the configuration of the sensing unit 3 and improves the sensing accuracy of the sensing unit 3.

[0060] It should be noted that, although the above combination Figure 4 The number of contact switches described is two, but this is not limiting. In other embodiments of this invention, the number of contact switches may be three, four, or five.

[0061] As one possible implementation method, such as Figure 1 As shown, see also Figure 5 , Figure 6 and Figure 9 The first contact switch 31 and the second contact switch 32 are spaced apart along the first direction so that when the open wafer cassette 200 is installed in place, the first contact switch 31 and the second contact switch 32 can simultaneously abut against the lower surface of the eighth sidewall 208 of the open wafer cassette 200 extending along the first direction. In this way, when the open wafer cassette 200 is not placed on the base body 1 in the correct placement state (e.g., tilted state), the first contact switch 31 and / or the second contact switch 32 cannot be triggered. Moreover, the above situation is particularly obvious when the open wafer cassette 200 is tilted along the first direction. Therefore, by spaced apart the first contact switch 31 and the second contact switch 32 along the first direction, the sensing accuracy can be improved, thereby reducing the risk of the robot arm hitting or scratching the wafer when picking up or placing the wafer.

[0062] It should be noted that the eighth sidewall 208 is located in the middle of the horizontal and vertical beams and protrudes downwards. The extension direction of the eighth sidewall 208 is parallel to the extension direction of the fifth sidewall 205 and the first stop 211 and the third stop 213. In this way, when the second sidewall 202 or the fourth sidewall 204 of the open wafer box 200 is engaged with the first stop 211 or the second stop 21, causing the open wafer box 200 to tilt at a small angle in the first direction, the two ends of the eighth sidewall 208 extending along the first direction will also have a large height difference. This will enable the first contact switch 31 and the second contact switch 32, which are spaced apart along the first direction, to detect the tilt of the open wafer box 200, thereby ensuring the accuracy of the detection by the sensing unit 3.

[0063] As one possible implementation, in a specific embodiment of this utility model, the first contact switch 31 and the second contact switch 32 are connected in series so that the external circuit can be turned on when the open wafer cassette 200 is installed in place, so that the components connected to the external circuit can perform the next action. The above arrangement can simplify the operation process of the wafer pick-and-place system with the base tray 100.

[0064] It should be noted that although the first contact switch 31 and the second contact switch 32 described above are connected in series, this is not limiting. In other embodiments of this utility model, the first contact switch 31 and the second contact switch 32 can also be connected in parallel, but this is also not limiting. Those skilled in the art can also connect the first contact switch 31 and the second contact switch 32 into the circuit separately as needed.

[0065] As one possible implementation method, such as Figure 1 As shown, see also Figure 3 , Figures 5 to 8 The base body 1 also includes at least one groove 11, which is formed on the upper surface of the base body 1. The groove 11 is configured to accommodate a contact switch and cause the contact switch to protrude from the upper surface of the base body 1 so that the contact switch can be triggered when the open wafer cassette 200 is installed in place. Specifically, as Figure 1 As shown, see also Figure 3 , Figure 5 and Figure 6In a specific embodiment of this utility model, there are two grooves 11. These two grooves 11 are spaced apart along the first direction. The first contact switch 31 and the second contact switch 32 are correspondingly disposed in these two grooves 11. The size of the grooves 11 is configured such that when the first contact switch 31 and the second contact switch 32 are correspondingly disposed therein, the sensing springs 311 of the first contact switch 31 and the second contact switch 32 protrude from the upper surface of the base body 1. This is so that after the open wafer cassette 200 is installed in place, the lower surface of the open wafer cassette 200 can abut against the sensing springs 311 of the first contact switch 31 and the second contact switch 32, and the first contact switch 31 and the second contact switch 32 can detect that the open wafer cassette 200 is installed in place.

[0066] It should be noted that, although the above combination Figure 1 The number of grooves 11 described is two, but this is not limiting. Those skilled in the art can also set the number of grooves 11 to three, four or more in order to accommodate more contact switches.

[0067] As one possible implementation method, such as Figure 1 As shown, see also Figure 3 , Figure 5 and Figure 6 The base body 1 also includes a wire groove 12, which is formed on the upper surface of the base body 1 and is configured to accommodate leads or internal circuits to avoid damage to the leads when the open wafer cassette 200 is picked up or put down.

[0068] It should be noted that, although the above combination Figure 1 The described wire groove 12 is formed on the upper surface of the base body 1, but this is not limiting. In other embodiments of this utility model, the wire groove 12 can also be formed on the lower surface of the base body 1. In this case, the wire groove 12 is connected to the groove 11 through a through hole so that the lead wire in the wire groove 12 can be connected to the contact switch in the groove 11. However, this is not limiting either. Those skilled in the art may not provide the wire groove 12, but directly provide a through hole on the base body 1 so that the lead wire can pass through the through hole and connect to the contact switch.

[0069] Preferably, the dimensions of the base body 1 of this utility model are manufactured according to the 200mm wafer SMIF interface standard: SEMIE19.4 standard or the 300mm wafer device loading port standard: GB / T 44375-2024, so as to improve the versatility of the base 100 of this utility model and thereby reduce the production and use costs of the base 100.

[0070] As one possible implementation, other embodiments of the present invention also include a wafer handling device (not shown), which includes a base 100, an open wafer cassette 200 and a standard mechanical interface port 300 as described in the above embodiments. Specifically, the base 100 is disposed on the standard mechanical interface port 300, and the sensing unit 3 is configured to be able to connect to the circuitry on the standard mechanical interface port 300.

[0071] In summary, the specific implementation method and working principle of this utility model are as follows: The upper surface of the standard mechanical interface port 300 is provided with a fixed platform that can be assembled and connected with the base body 1. The fixed platform allows the base body 1 to be placed horizontally when installed. The standard mechanical interface port 300 is provided with an external circuit, which is configured to maintain connection with both ends of the lead wire when the base body 1 is installed. The specific connection structure between the lead wire and the external circuit is not the focus of this utility model, so it will not be described in detail here. Moreover, the first contact switch 31 and the second contact switch 32 are connected to the lead wire in series. They are configured such that when the open wafer cassette 200 is not installed or is not placed correctly, at least one of the first contact switch 31 and the second contact switch 32 is in an open state. At this time, the external circuit provided on the standard mechanical interface port 300 is in an open state, so the robot arm connected to the external circuit of the standard mechanical interface port 300 cannot perform the action of picking up or placing wafers. With the above configuration, only when the open wafer cassette 200 is correctly installed on the base body 1 can the lower surface of the open wafer cassette 200 simultaneously switch the first contact switch 31 and the second switch 32 from the off state to the on state. This causes the external circuit on the standard mechanical interface port 300 to switch from the off state to the on state, enabling the robotic arm to perform the actions of picking up or placing wafers. Furthermore, when the external circuit switches from the off state to the on state, it indicates that the open wafer cassette 200 is installed horizontally, ensuring that the robotic arm will not bump into or scratch the wafers when picking up or placing them from the cassette.

[0072] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A base support (100) for supporting an open wafer cassette (200), characterized in that, The base (100) includes: Bottom body(1); A limiting part (2) is provided on the upper surface of the base body (1), and the limiting part (2) is configured to limit the open wafer cassette (200) when the open wafer cassette (200) is placed on it. A groove (11) is formed on the upper surface of the base body (1); and A sensing part (3) is disposed in the groove (11); when the open wafer cassette (200) is installed in place, the lower surface of the open wafer cassette (200) presses against the sensing part (3) so that the sensing part (3) is triggered.

2. The base according to claim 1, characterized in that, The limiting part (2) includes: A stop assembly (21) is disposed on the upper surface of the base body (1), and the stop assembly (21) is configured to abut against a plurality of sidewalls of the open wafer cassette (200).

3. The base according to claim 2, characterized in that, The stop assembly (21) includes: A first stop (211) and a second stop (212) are provided at intervals along a first direction on one side of the upper surface of the base body (1); and A third stop (213) extends along the first direction and is disposed between the first stop (211) and the second stop (212). Compared with the first stop (211) and the second stop (212), the third stop (213) is closer to the middle of the base body in the second direction, wherein the first direction and the second direction are intersecting.

4. The base according to claim 3, characterized in that, The stop assembly further includes a fourth stop (214) and a fifth stop (215), the fourth stop (214) and the fifth stop (215) being spaced apart along the first direction on the other side of the upper surface of the base body (1), one side of the upper surface of the base body (1) and the other side of the upper surface of the base body (1) being opposite to each other in the second direction, and the third stop (213) being closer to the middle of the base body in the second direction than the fourth stop (214) and the fifth stop (215).

5. The base according to claim 1, characterized in that, The sensing unit (3) includes: At least one contact switch, the contact switch being configured to switch states under pressure from the lower surface of the open wafer cassette (200) when the open wafer cassette (200) is installed in place; and A lead wire is provided on the base body (1) and connected to the contact switch. The lead wire is configured to connect the contact switch to an external circuit so that when at least one of the contact switches (31) switches to a different state, the electrical signal of the external circuit changes.

6. The base according to claim 5, characterized in that, The contact switch includes a first contact switch (31) and a second contact switch (32), the first contact switch (31) and the second contact switch (32) being spaced apart, and the first contact switch (31) and the second contact switch (32) being configured to switch states when the open wafer cassette (200) is installed in place.

7. The base according to claim 6, characterized in that, The first contact switch (31) and the second contact switch (32) are connected in series.

8. The base according to claim 5, characterized in that, The sensing spring (311) of the contact switch protrudes from the upper surface of the base body (1).

9. The base according to claim 5, characterized in that, The base body (1) also includes a wire groove (12), which is formed on the upper surface of the base body (1) and is configured to accommodate the lead wire.

10. A wafer handling device, characterized in that, The wafer handling device includes a standard mechanical interface port (300) and a base (100) as described in any one of claims 1-9, the base (100) being disposed on the standard mechanical interface port (300), and the sensing unit (3) being configured to be electrically connected to the standard mechanical interface port (300).

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