Chip ball mounting device

Abstract

This invention provides a chip ball implantation device, belonging to the field of chip ball implantation technology. The device includes: a lower mold assembly with a shaking function; the top of the lower mold assembly is used to fix a chip fixture, which is used to fix the chip to be implanted; an upper mold assembly, including a vertically movable lifting seat and a clamping assembly fixed to the lifting seat; the clamping assembly is used to fix a perforated plate assembly, which has multiple drop holes corresponding to the chip implantation positions; the clamping assembly is used to release the perforated plate assembly when the upper mold assembly and the lower mold assembly are aligned; a positioning structure is provided between the lower mold assembly and the perforated plate assembly to position the perforated plate assembly at the lower mold assembly when the upper mold assembly and the lower mold assembly are aligned. This chip ball implantation device can save manpower and improve implantation efficiency.

Description

Technical Field

[0001] This application relates to the field of chip ball implantation technology, and more particularly to a chip ball implantation device. Background Technology

[0002] When placing solder balls in a chip, due to the large number of solder balls, automated equipment is usually required.

[0003] In the prior art, a perforated plate is usually set above the fixture for transporting the chip to be implanted. When the fixture moves with the chip directly under the perforated plate, solder balls are placed in batches above the perforated plate so that each solder ball falls onto the corresponding position of the chip to be implanted.

[0004] Because the fixing plate of the above-mentioned ball-planting mechanism is fixed, the solder balls cannot fall into the holes quickly after falling onto the perforated plate. It usually requires manual assistance to level the surface to speed up the falling of the solder balls into the holes, but this increases labor costs and is not efficient. Utility Model Content

[0005] One objective of this invention is to provide a chip implantation device that can save manpower and improve implantation efficiency.

[0006] Another objective of this invention is to improve the versatility of the device.

[0007] An embodiment of this utility model provides a chip ball implantation device, comprising:

[0008] The lower mold assembly has a shaking function. The top of the lower mold assembly is used to fix the chip fixture, and the chip fixture is used to fix the chip to be implanted.

[0009] The upper mold assembly includes a lifting seat that can move vertically and a clamping assembly fixed to the lifting seat. The clamping assembly is used to fix the perforated plate assembly. The perforated plate assembly is provided with a plurality of drop holes corresponding to the ball placement positions of the chip. The clamping assembly is used to release the perforated plate assembly when the upper mold assembly and the lower mold assembly are docked.

[0010] A positioning structure is provided between the lower mold assembly and the perforated plate assembly for positioning the perforated plate assembly at the lower mold assembly when the upper mold assembly and the lower mold assembly are docked.

[0011] Optionally, the positioning structure includes a quick-connect fitting assembly disposed between the lower mold assembly and the perforated plate assembly.

[0012] Optionally, the positioning structure includes a matching positioning cavity and a boss portion;

[0013] The perforated plate assembly includes a perforated plate and a fixed frame disposed on the periphery of the perforated plate. The fixed frame protrudes from the bottom surface of the perforated plate, and the bottom surface of the perforated plate together forms the positioning cavity.

[0014] The top surface of the chip fixture has the protrusion for fixing the chip.

[0015] Optionally, the fixed frame and the perforated plate are detachably connected.

[0016] Optionally, the clamping assembly includes two gripper assemblies spaced apart along a first horizontal direction. The gripper assemblies are provided with grippers that can extend and retract along the first horizontal direction. The two grippers are used to clamp the perforated plate assembly.

[0017] Optionally, the lifting seat has an opening in the middle, and the two gripper assemblies are fixed to the bottom surface of the lifting seat and located on both sides of the opening, and the size of the opening is smaller than the size of the perforated plate assembly.

[0018] Optionally, the chip ball implantation device is characterized by further including a translation mechanism for driving the lower mold assembly to move along a second horizontal direction.

[0019] Optionally, the first horizontal direction and the second horizontal direction are perpendicular.

[0020] Optionally, the chip ball implantation device further includes a lifting mechanism, which is disposed at one end of the translation mechanism and is used to drive the upper mold assembly to rise and fall.

[0021] Optionally, the chip ball placement device also includes a vision component for detecting the solder balls above the via assembly.

[0022] According to one aspect of this utility model, the chip ball placement device can fix the via plate assembly used for positioning and discharging solder balls onto the chip fixture, and then vibrate together with the chip fixture to achieve efficient solder ball placement without manual intervention, thus saving manpower and improving ball placement efficiency. Furthermore, after ball placement is completed, the via plate assembly is removed by the clamping component of the upper mold assembly, allowing the chip on the chip fixture to separate for the next process, thereby effectively improving ball placement efficiency.

[0023] Furthermore, by setting a quick-connect assembly between the lower mold assembly and the orifice plate assembly, quick-connect and quick-change between the orifice plate assembly and the lower mold assembly are realized, simplifying the connection and separation between the orifice plate assembly and the lower mold assembly.

[0024] Furthermore, by making the fixed frame of the perforated plate assembly detachably connected to the perforated plate, the appropriate perforated plate can be easily replaced according to the type of chip, thereby improving the versatility of the device. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a chip ball implantation device according to an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the upper mold assembly of a chip ball implantation device according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the perforated plate assembly of a chip ball-planting device according to an embodiment of the present invention;

[0028] Figure label:

[0029] 100-Chip ball implantation device, 10-Lower mold assembly, 20-Chip fixture, 21-Boss, 30-Upper mold assembly, 31-Lifting seat, 311-Opening, 32-Clamping assembly, 321-Gripper, 322-Cylinder, 40-Hole plate assembly, 41-Multi-hole plate, 42-Fixed frame, 401-Positioning cavity, 50-Snap-fit ​​structure, 60-Fixed buckle, 70-Translation mechanism, 80-Lifting mechanism, 90-Vision component. Detailed Implementation

[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0031] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0032] Furthermore, to better illustrate this utility model, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this utility model can be implemented without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the spirit of this disclosure.

[0033] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0034] In this embodiment of the invention, "multiple" refers to two or more. The descriptions of "first," "second," etc., appearing in this embodiment of the invention are for illustrative purposes and to distinguish the objects being described; they do not indicate any order and do not represent a specific limitation on the number of items in this embodiment of the invention, nor do they constitute any limitation on this embodiment of the invention.

[0035] Figure 1 This is a schematic diagram of the structure of a chip ball implantation device 100 according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the upper mold assembly 30 of a chip ball-planting device 100 according to an embodiment of the present invention. Figure 1 As shown, in one embodiment, the chip implantation device 100 includes a lower mold assembly 10 and an upper mold assembly 30. The lower mold assembly 10 has a shaking function, and its top is used to fix a chip fixture 20, which is used to fix the chip to be implanted. The shaking function here refers to one or more of the following movements: vibrating in the vertical direction, reciprocating in the horizontal direction (shaking), and rotating along at least one axis (swinging). This is not limited to any particular movement, and such movements can be achieved through common mechanical mechanisms, which will not be elaborated upon here. Figure 2 As shown, the upper mold assembly 30 includes a vertically movable lifting seat 31 and a clamping assembly 32 fixed to the lifting seat 31. The clamping assembly 32 is used to fix the hole plate assembly 40. The hole plate assembly 40 has multiple drop holes corresponding to the chip ball placement positions. The clamping assembly 32 is used to release the hole plate assembly 40 when the upper mold assembly 30 and the lower mold assembly 10 are docked. A positioning structure is provided between the lower mold assembly 10 and the hole plate assembly 40 to position the hole plate assembly 40 at the lower mold assembly 10 when the upper mold assembly 30 and the lower mold assembly 10 are docked. That is, when the lower mold assembly 10 is below the upper mold assembly 30, the lower mold assembly 10 is lowered to a position where the hole plate assembly 40 is aligned and fits with the chip fixture 20. At this time, the positioning structure fixes the hole plate assembly 40 at the chip fixture 20. Then, the clamping assembly is released, allowing the hole plate assembly 40 to detach from the upper mold assembly 30 and be shaken or vibrated by the lower mold assembly 10 together with the chip fixture 20.

[0036] The chip ball placement device 100 of this embodiment can fix the via plate assembly 40, used for positioning and discharging solder balls, onto the chip fixture 20, and then vibrate together with the chip fixture 20 to achieve efficient solder ball placement without manual intervention, thus saving manpower and improving ball placement efficiency. Furthermore, after ball placement is completed, the via plate assembly 40 is removed by the clamping component 32 of the upper mold assembly 30, allowing the chip on the chip fixture 20 to separate for the next process, thereby effectively improving ball placement efficiency.

[0037] Figure 3 This is a schematic diagram of the perforated plate assembly 40 of a chip ball-planting device 100 according to an embodiment of the present invention. In one embodiment, the positioning structure includes a matching positioning recess 401 and a boss portion 21. Figure 3 As shown, the perforated plate assembly 40 includes a perforated plate 41 and a fixing frame 42 disposed around the periphery of the perforated plate 41. The fixing frame 42 protrudes from the bottom surface of the perforated plate 41, and the bottom surface of the perforated plate 41 together forms a positioning cavity 401. A boss 21 is formed on the top surface of the chip fixture 20 for fixing the chip.

[0038] In this embodiment, a positioning cavity 401 is formed at the orifice plate assembly 40 and a raised boss portion 21 is formed at the chip fixture 20, so that when the orifice plate assembly 40 and the chip fixture 20 are attached, the orifice plate assembly 40 can be positioned by the positioning cavity 401 and the boss portion 21, preventing the orifice plate assembly 40 from detaching when the lower mold assembly 10 shakes.

[0039] The positioning structure formed by the positioning cavity 401 and the boss 21 can ensure that the two do not separate when the lower mold assembly 10 is subjected to small-amplitude shaking. In order to adapt to more severe shaking conditions, the positioning structure may also adopt or include the following quick-change plug-in components.

[0040] In one embodiment, the positioning structure includes a quick-connect fitting disposed between the lower mold assembly 10 and the perforated plate assembly 40. For example... Figure 1 As shown, a snap-fit ​​structure 50 is fixedly provided at the lower mold assembly 10. The snap-fit ​​structure 50 has a snap-fit ​​hole 501 with a top opening, such as... Figure 2 As shown, the perforated plate assembly 40 is provided with fixing buckles 60 on both sides. The size of the fixing buckles 60 is slightly larger than the snap-fit ​​hole 501, so that after the fixing buckles 60 snap into the snap-fit ​​hole 501, the perforated plate assembly 40 can be fixed at the lower mold assembly 10. After the ball is planted, the clamping assembly 32 can disengage the snap-fit ​​structure 50 of the perforated plate assembly 40 from the snap-fit ​​hole 501 to achieve quick insertion and quick replacement.

[0041] This embodiment achieves quick-connection and quick-change between the lower mold assembly 10 and the lower mold assembly 10 by setting a quick-change plug-in assembly between the lower mold assembly 10 and the perforated plate assembly 40, thus simplifying the connection and separation between the perforated plate assembly 40 and the lower mold assembly 10.

[0042] In one embodiment, the fixed frame 42 and the perforated plate 41 are detachably connected, for example, the fixed frame 42 is connected to the perforated plate 41 by fasteners.

[0043] Since the inner boundary of the fixed frame 42, i.e. the inner sidewall of the positioning cavity 401, matches the protrusion 21 on the top surface of the chip fixture 20, the fixed frame 42 is not easily replaced. By setting the fixed frame 42 and the perforated plate 41 to be detachably connected, the corresponding perforated plate 41 can be easily replaced according to the type of chip, thereby improving the versatility of the device.

[0044] like Figure 2 As shown, in one embodiment, the clamping assembly 32 includes two gripper assemblies spaced apart along a first horizontal direction. Each gripper assembly has a gripper 321 that is retractable along the first horizontal direction. The two grippers 321 are used to clamp the perforated plate assembly 40. The grippers 321 can be driven by a cylinder 322. An opening 311 is provided in the center of the lifting base 31. The two gripper assemblies are fixed to the bottom surface of the lifting base 31 and are located on both sides of the opening 311. The size of the opening 311 is smaller than the size of the perforated plate assembly 40.

[0045] In this embodiment, the size of the opening 311 at the lifting seat 31 is set to be smaller than the size of the orifice plate assembly 40. Therefore, after the orifice plate assembly 40 is attached to the bottom of the lifting seat 31, the solder ball conveying assembly can conveniently insert solder balls in batches from the opening 311, and use the inner wall of the opening 311 as a blocking part.

[0046] like Figure 1 As shown, in one embodiment, the chip ball-planting device 100 further includes a translation mechanism 70 and a lifting mechanism 80, used to drive the lower mold assembly 10 to move along a second horizontal direction. The first horizontal direction and the second horizontal direction are perpendicular. The lifting mechanism 80 is disposed at one end of the translation mechanism 70 and is used to drive the upper mold assembly 30 to move up and down.

[0047] In this embodiment, the chip can be transferred by the translation mechanism 70, for example, by docking with the upstream transmission line, and moved precisely to the area directly below the upper mold assembly 30.

[0048] In one embodiment, the chip ball placement device 100 further includes a vision component 90 for detecting the solder balls above the via assembly 40. The vision component 90 may be an image acquisition device such as a camera.

[0049] The vision component 90 allows for quick identification of whether each drop hole in the perforated plate contains solder balls. When insufficient solder balls are present, they can be added promptly, and when there is excess solder balls, they can be removed.

[0050] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A chip ball implantation device, characterized in that, include: The lower mold assembly has a shaking function. The top of the lower mold assembly is used to fix the chip fixture, and the chip fixture is used to fix the chip to be implanted. The upper mold assembly includes a lifting seat that can move vertically and a clamping assembly fixed to the lifting seat. The clamping assembly is used to fix the perforated plate assembly. The perforated plate assembly is provided with a plurality of drop holes corresponding to the ball placement positions of the chip. The clamping assembly is used to release the perforated plate assembly when the upper mold assembly and the lower mold assembly are docked. A positioning structure is provided between the lower mold assembly and the perforated plate assembly for positioning the perforated plate assembly at the lower mold assembly when the upper mold assembly and the lower mold assembly are docked.

2. The chip ball implantation device according to claim 1, characterized in that, The positioning structure includes a quick-connect assembly disposed between the lower mold assembly and the perforated plate assembly.

3. The chip ball implantation device according to claim 1, characterized in that, The positioning structure includes a matching positioning cavity and a boss portion; The perforated plate assembly includes a perforated plate and a fixed frame disposed on the periphery of the perforated plate. The fixed frame protrudes from the bottom surface of the perforated plate, and the bottom surface of the perforated plate together forms the positioning cavity. The top surface of the chip fixture has the protrusion for fixing the chip.

4. The chip ball implantation device according to claim 3, characterized in that, The fixed frame and the perforated plate are detachably connected.

5. The chip ball implantation device according to claim 1, characterized in that, The clamping assembly includes two gripper assemblies spaced apart along a first horizontal direction. The gripper assemblies are provided with grippers that can extend and retract along the first horizontal direction. The two grippers are used to clamp the perforated plate assembly.

6. The chip ball implantation device according to claim 5, characterized in that, The lifting seat has an opening in the middle, and the two gripper assemblies are fixed to the bottom surface of the lifting seat and located on both sides of the opening. The size of the opening is smaller than the size of the perforated plate assembly.

7. The chip ball implantation device according to claim 5 or 6, characterized in that, It also includes a translation mechanism for moving the lower mold assembly along a second horizontal direction.

8. The chip ball implantation device according to claim 7, characterized in that, The first horizontal direction is perpendicular to the second horizontal direction.

9. The chip ball implantation device according to claim 7, characterized in that, It also includes a lifting mechanism, which is located at one end of the translation mechanism and is used to drive the upper mold assembly to rise and fall.

10. The chip ball implantation device according to any one of claims 1-6, characterized in that, It also includes a vision component for detecting the condition of solder balls above the orifice plate assembly.

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