Blister tray structure

Abstract

The application belongs to the blister tray field and relates to a blister tray structure which comprises a blister tray, a plurality of product placing grooves are arranged on the blister tray, the top surface of the product placing groove is outwardly expanded and sunken to form a sunken platform. The product placing groove top surface of the blister tray is outwardly expanded and sunken, so that the interference problem of the existing blister tray when the material thickness is changed from 1.2MM to 1.5MM and the draft angle is changed from 6 DEG to 2 DEG of the electronic product is solved, the supporting effect is achieved, the original reverse buckling support of the blister tray can be cancelled, the difficulty of the blister tray mold manufacturing is reduced, the blister tray forming and demolding process is simplified, and the cost is reduced, the production efficiency and yield are improved.

Description

Technical Field

[0001] This application relates to the field of blister tray technology, and more specifically, to a blister tray structure. Background Technology

[0002] Blister trays, as a common packaging medium, are widely used in electronic components, medical devices, food cold chain, and precision parts, primarily for product securing, protection, and transportation. They are manufactured by thermoforming plastic sheets into specific shapes, offering advantages such as low cost, high production efficiency, and customizability. As the manufacturing industry moves towards lightweighting and intelligentization, the structural design of blister trays must simultaneously meet multiple requirements, including cushioning protection, space utilization, environmental protection, and compatibility with automated production.

[0003] Currently, most electronic products are packaged using blister trays. Existing blister trays can accommodate electronic products that are 1.72 inches in diameter, 1.2 mm thick, and have a draft angle of 6°. However, when the thickness of the electronic product is changed from 1.2 mm to 1.5 mm and the draft angle is changed from 6° to 2°, the upper and lower blister trays 101 interfere with each other and cannot be fastened together.

[0004] To solve the problem and meet customer requirements, this application designs a blister tray structure. Utility Model Content

[0005] The technical problem to be solved by this invention is to meet customer requirements. When the upper and lower blister trays are stacked and there is interference that prevents them from being fastened together, the problem can be solved by following the design of this invention. Moreover, it can reduce the undercut design of blister trays stacked in the same direction, reduce the difficulty of mold making and blister tray production demolding, improve production yield and efficiency, and reduce costs.

[0006] To solve the above-mentioned technical problems, this utility model provides a blister tray structure, which adopts the following technical solution:

[0007] It includes a blister tray with several product placement slots. The top surface of the product placement slots expands outward and sinks downward to form a settling platform.

[0008] Furthermore, the outer width of the settling platform is 2 mm, and the sinking depth is 1 mm.

[0009] Furthermore, the inverted support inside the product placement slot is removed.

[0010] Furthermore, the total height of the blister tray, excluding material thickness, is 12mm.

[0011] Furthermore, the bottom of the blister pack is provided with reinforcing ribs, the thickness of which is 12mm.

[0012] Furthermore, the blister tray is provided with hand positions on both sides of the product placement slot (202), and the depth of the hand positions is 11.5 mm.

[0013] Furthermore, several of the product placement slots are distributed in a rectangular array.

[0014] Compared with the prior art, the present invention has the following main advantages:

[0015] This invention solves the interference problem that occurs when placing electronic products with a material thickness changed from 1.2mm to 1.5mm and a draft angle changed from 6° to 2° by expanding and lowering the top surface of the product placement groove of the blister tray. It also provides support, eliminating the need for the original undercut support of the blister tray. This reduces the difficulty of manufacturing the blister tray mold and simplifies the forming and demolding process, thereby reducing costs and improving production efficiency and yield. Attached Figure Description

[0016] To more clearly illustrate the solution of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an existing blister pack;

[0018] Figure 2 This is a front view of an existing blister pack;

[0019] Figure 3 For along Figure 2 A cross-sectional view along the AA direction;

[0020] Figure 4 For along Figure 2 Cross-sectional view along the BB direction;

[0021] Figure 5 This is a schematic diagram of a blister tray structure according to this application;

[0022] Figure 6 This is a front view of a blister tray structure according to this application;

[0023] Figure 7 This is a right view of a blister tray structure according to this application;

[0024] Figure 8 This is a bottom view of a blister tray structure according to this application;

[0025] Figure label:

[0026] Blister trays 101 and 201;

[0027] Product placement slots 102, 202;

[0028] Reinforcing ribs 103 and 203;

[0029] Hand positions 104, 204;

[0030] Inverted support 105;

[0031] Settlement platform 205. Detailed Implementation

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] Existing technology:

[0035] Reference Figures 1-4 The existing blister tray is used to store electronic products with a hand-held size of 1.72 inches, a thickness of 1.2 mm, and a draft angle of 6°. It includes a blister tray 101, which has several product placement slots 102 on its upper part, a reinforcing rib 103 at the bottom of the blister tray 101, hand positions 104 on both sides of the blister tray 101 located in the product placement slots 102, and an inverted support 105 on the inner wall of the product placement slots 102.

[0036] When the material thickness of the electronic product was changed from 1.2mm to 1.5mm and the draft angle was changed from 6° to 2°, the upper and lower blister packs 101 interfered with each other and could not be properly fastened. Therefore, the blister packs needed to be improved.

[0037] This application:

[0038] Reference Figure 5-8This application provides a blister tray structure, including a blister tray 201, on which a plurality of product placement slots 202 are provided. The top surface of the product placement slots 202 expands outward and sinks downward to form a settling platform 205.

[0039] This invention solves the interference problem that occurs when placing electronic products with a material thickness changed from 1.2mm to 1.5mm and a draft angle changed from 6° to 2° by expanding and lowering the top surface of the product placement groove 202 of the blister tray 201. It also provides support.

[0040] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0041] Example 1

[0042] Reference Figure 5-8 This application provides a blister tray structure, including a blister tray 201, on which a plurality of product placement slots 202 are provided. The top surface of each product placement slot 202 expands outward and sinks downward to form a settling platform 205. The outward expansion width of the settling platform 205 is 2 mm, and the sinking depth is 1 mm.

[0043] The total height of the blister tray 201, excluding material thickness, is 12mm.

[0044] The bottom of the blister tray 201 is provided with a reinforcing rib 203, and the thickness of the reinforcing rib 203 is 12 mm.

[0045] The blister tray 201 is provided with hand positions 204 on both sides of the product placement slot 202, and the depth of the hand positions is 11.5 mm.

[0046] Several of the product placement slots 202 are distributed in a rectangular array.

[0047] This invention solves the interference problem that occurs when placing electronic products with a material thickness changed from 1.2mm to 1.5mm and a draft angle changed from 6° to 2° by expanding the top surface of the product placement groove 202 of the blister tray 201 outward by 2mm and sinking it by 1mm. It also provides support.

[0048] Example 2

[0049] Reference Figure 5-8 This application provides a further embodiment of a blister tray structure:

[0050] The inverted support inside the product placement slot 202 of the blister tray 201 is removed.

[0051] The original inverted support of the blister tray 201 has been eliminated, which reduces the difficulty of mold manufacturing for the blister tray 201 and simplifies the molding and demolding process. This reduces costs and improves production efficiency and yield, resulting in beneficial effects.

[0052] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

Claims

1. A blister tray structure, characterized in that, include: Includes a blister tray (201), on which a plurality of product placement slots (202) are provided. The top surface of the product placement slots (202) expands outward and sinks downward to form a settling platform (205).

2. The blister tray structure according to claim 1, characterized in that, The settling platform (205) has an outward width of 2 mm and a sinking depth of 1 mm.

3. The blister tray structure according to claim 2, characterized in that, The internal undercut support of the product placement slot (202) is removed.

4. The blister tray structure according to any one of claims 1-3, characterized in that, The total height of the blister tray (201) excluding material thickness is 12 mm.

5. The blister tray structure according to claim 4, characterized in that, The bottom of the blister tray (201) is provided with reinforcing ribs (203), and the thickness of the reinforcing ribs (203) is 12 mm.

6. The blister tray structure according to claim 5, characterized in that, The blister tray (201) has hand positions (204) on both sides of the product placement slot (202), and the depth of the hand positions is 11.5 mm.

7. The blister tray structure according to claim 1, characterized in that, Several of the product placement slots (202) are arranged in a rectangular array.

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