An optical module housing

Abstract

The utility model relates to optical module technical field, specifically disclose optical module shell, including the circuit board for signal transmission processing, the outside of circuit board is provided with the wrapping component, the wrapping component includes the shell, the inside of shell is provided with the inner chamber, the inner chamber department is provided with the slide groove that can supply circuit board suspension and set up, the slide groove is located the symmetrical setting of inner wall both sides of inner chamber, and along the horizontal midline of inner chamber is outwardly convex, the utility model discloses through the auxiliary heat dissipation assembly of the protruding portion installation of joint area, its micro - drive spare drives crossflow fan rotation, makes the air circulation flow of shell inner chamber, will be close to circuit board's hot air and re - distribution, promote heat through shell emission, avoid the heat accumulation around circuit board, reduced because high temperature leads to light emission power reduction, the probability of occurrence of performance decline problem such as the increase of error rate, guarantee optical module stable work under the suitable temperature.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to an optical module housing. Background Technology

[0002] SFP optical modules are small, pluggable optical modules widely used in data communication and telecommunications fields, and are generally used for data transmission.

[0003] During transmission, optical modules generate heat during operation. If the heat dissipation design of the casing is inadequate, the heat cannot be dissipated in time, leading to an increase in the internal temperature of the optical module. Excessive temperature will affect the performance of the optical module, such as reducing optical transmission power and increasing the bit error rate. For example, some casings adopt a closed design without heat dissipation channels or heat sinks, which will cause heat to accumulate inside the optical module.

[0004] However, when a housing with a through-hole design is used, the internal airflow efficiency is low after the device is inserted, which may also cause heat accumulation. Based on this, this application provides a housing for an optical module. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides an optical module housing that solves the problem of poor heat dissipation efficiency caused by the housing used in existing technologies.

[0006] The optical module housing of this utility model includes a circuit board for signal transmission and processing, and a wrapping component is provided on the outside of the circuit board;

[0007] The packaging component includes an outer shell, an inner cavity is provided on the inner side of the outer shell, and a sliding groove is provided in the inner cavity for suspending and mounting the circuit board. The sliding groove is symmetrically arranged on both sides of the inner wall of the inner cavity and protrudes outward along the horizontal center line of the inner cavity.

[0008] A snap-fit ​​area is provided on the inner side of the cavity near one end of the circuit board for fixing the circuit board.

[0009] A downward protrusion is provided above the snap-fit ​​area, and an auxiliary heat dissipation component is installed on the protrusion for dissipating heat from the outer casing.

[0010] As a further improvement of this utility model, three sets of spaced elastic clips are provided at one end of the outer shell, and the elastic clips are adapted to the connectors wrapped around the front end of the circuit board.

[0011] As a further improvement of this utility model, a spring tongue is provided on the other side of the outer shell, and the spring tongue is engaged with the inserted outer side.

[0012] As a further improvement of this utility model, the protrusion of the snap-fit ​​area is provided with a through hole to form a mounting cavity for installing auxiliary heat dissipation components.

[0013] As a further improvement of this utility model, a miniature driving component is provided at one end of the inner wall of the mounting cavity, and a cross-flow fan is provided at the miniature driving component. The cross-flow fan is used to drive the air circulation in the inner cavity of the outer shell.

[0014] As a further improvement of this utility model, one or more through holes are provided at the cross-section of the outer shell, and the through holes are filled with a heat-conducting medium to enhance the heat dissipation efficiency of the outer shell.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This utility model uses an auxiliary heat dissipation component installed at the protrusion of the snap-fit ​​area. Its miniature driving component drives the cross-flow fan to rotate, causing the air inside the shell to circulate. This draws in hot air near the circuit board and redistributes it, promoting heat dissipation through the shell and preventing heat from accumulating around the circuit board. This reduces the probability of performance degradation problems such as reduced optical emission power and increased bit error rate caused by high temperature, and ensures that the optical module works stably at a suitable temperature.

[0017] The through-holes in the outer casing are filled with thermally conductive media, such as thermal grease or thermal gel. These media can quickly conduct heat from inside the casing to the outer surface, and then dissipate it through heat exchange with the air, further improving the heat dissipation efficiency of the casing and ensuring that the performance of the optical module is not affected by high temperatures. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0019] Figure 1 This is a three-dimensional structural diagram of the combination of the wrapping component and the circuit board of this utility model;

[0020] Figure 2 This is a three-dimensional structural diagram of the wrapping component of this utility model;

[0021] Figure 3 This is a front view of the assembly of the wrapping component and the circuit board of this utility model;

[0022] Figure 4 This is a top view of the packaging component of this utility model;

[0023] Figure 5 This utility model Figure 4 Schematic diagram of the cross-sectional structure of the middle AA section;

[0024] Figure 6 This utility model Figure 4 Schematic diagram of the cross-sectional structure of the middle BB section;

[0025] Figure 7 This is a schematic diagram of the combined structure of the wrapping component and the auxiliary heat dissipation assembly of this utility model.

[0026] In the diagram: 1. Encasing component; 2. Circuit board; 3. Auxiliary heat dissipation component;

[0027] 11. Outer shell; 12. Spring-loaded clip; 13. Spring tongue; 14. Slide groove; 15. Through hole; 16. Inner cavity;

[0028] 31. Miniature drive component; 32. Cross-flow fan; 33. Mounting cavity. Detailed Implementation

[0029] The following illustrations will reveal several embodiments of the present invention. For clarity, many physical details will be described in the following description. However, it should be understood that these physical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these physical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and components will be shown in a simple schematic manner in the illustrations.

[0030] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] Please see Figure 1 , Figure 2 , Figure 3 as well as Figure 4 SFP optical modules are small, pluggable optical modules widely used in data communication and telecommunications fields for data transmission. When the optical module is working, it generates heat. If the heat dissipation design of the casing is not reasonable, the heat cannot be dissipated in time, resulting in an increase in internal temperature and affecting the performance of the optical module, such as reducing optical transmission power and increasing bit error rate.

[0032] A closed-off housing 11 without heat dissipation channels or heat sinks will cause heat to accumulate; after the through-hole housing 11 is inserted into the device, heat may accumulate due to the low internal air circulation efficiency. Based on this, this application provides an optical module housing 11, including a circuit board 2 for signal transmission processing, and a wrapping component 1 is provided on the outside of the circuit board 2.

[0033] The packaging component 1 includes a shell 11, and an inner cavity 16 is provided on the inner side of the shell 11. A sliding groove 14 is provided in the inner cavity 16 for the circuit board 2 to be suspended and mounted. The sliding groove 14 is symmetrically arranged on both sides of the inner wall of the inner cavity 16 and protrudes outward along the horizontal center line of the inner cavity 16.

[0034] The inner side of the inner cavity 16 is provided with a snap-fit ​​area near one end of the circuit board 2 for fixing the circuit board 2.

[0035] A downward protrusion is provided above the snap-fit ​​area, and an auxiliary heat dissipation component 3 is installed on the protrusion for dissipating heat from the outer casing 11.

[0036] The outer casing 11 can be made of a metal material with certain strength and good thermal conductivity, such as aluminum alloy. The aluminum alloy material can not only provide reliable physical protection for the internal circuit board 2, preventing it from being hit and squeezed by the outside, but also quickly conduct the heat generated by the circuit board 2 to the surface of the outer casing 11.

[0037] The outer casing 11 is rectangular in shape and has an inner cavity 16 inside. The dimensions of the inner cavity 16 are precisely designed according to the size of the circuit board 2 to ensure that the circuit board 2 can be smoothly installed in the inner cavity 16 without being too loose and causing the circuit board 2 to wobble inside.

[0038] Slide grooves 14 are symmetrically arranged on both sides of the inner wall of the inner cavity 16. The slide grooves 14 protrude outward along the horizontal center line of the inner cavity 16, so that the slide grooves 14 can provide stable support for the circuit board 2 and achieve the effect of suspension.

[0039] The slide 14 is made of high-strength plastic with a smooth surface to reduce friction with the circuit board 2, facilitating the installation and removal of the circuit board 2. The width and depth of the slide 14 match the edge dimensions of the circuit board 2, ensuring that the circuit board 2 can be tightly embedded in the slide 14.

[0040] When installing circuit board 2, the operator simply aligns the two side edges of circuit board 2 with the grooves 14 on both sides of the inner wall of the inner cavity 16, and then slowly pushes it in along the direction of the grooves 14. Due to the smooth surface and precise dimensional design of the grooves 14, circuit board 2 can easily slide in the inner cavity 16 until it reaches the appropriate position.

[0041] A snap-fit ​​area is provided on the inner side of the cavity 16 near one end of the circuit board 2. The snap-fit ​​area is formed by a specific structure on the inner wall of the outer shell 11, and its shape and size are adapted to one end of the circuit board 2.

[0042] When the circuit board 2 is pushed into the designated position along the slide 14, one end of the circuit board 2 will accurately enter the snap-fit ​​area, achieving the initial positioning of the circuit board 2.

[0043] A downward protrusion is provided above the snap-fit ​​area. This protrusion is made of metal and has a certain degree of elasticity. After the circuit board 2 enters the snap-fit ​​area, the operator can press the protrusion slightly to make it make close contact with the upper surface of the circuit board 2, thereby firmly fixing the circuit board 2 in the inner cavity 16. This fixing method not only ensures the stability of the circuit board 2, but also facilitates disassembly and maintenance when needed.

[0044] The auxiliary heat dissipation component 3 installed on the protrusion allows heat generated by the circuit board 2 during operation to be conducted first to the inner wall of the housing 11 and the protrusion in contact with it. Then, the auxiliary heat dissipation component 3 enhances the internal air circulation (suitable for open housing 11), thereby improving the heat dissipation capacity of the housing 11 and reducing the temperature of the housing 11 and the circuit board 2.

[0045] Please see Figure 4 , Figure 5 , Figure 6 as well as Figure 7 Three sets of spaced elastic clips 12 are provided at one end of the outer casing 11, and the elastic clips 12 are adapted to the connectors wrapped around the front end of the circuit board 2.

[0046] A spring tongue 13 is provided on the other side of the outer casing 11, and the spring tongue 13 is engaged with the inserted outer side.

[0047] The protrusion in the snap-fit ​​area has a through hole 15, forming a mounting cavity 33 for installing the auxiliary heat dissipation component 3.

[0048] Each of the inner walls of the mounting cavity 33 is provided with a miniature driving component 31, and a cross-flow fan 32 is provided at the miniature driving component 31. The cross-flow fan 32 is used to drive the air circulation in the inner cavity 16 of the outer shell 11.

[0049] One or more through holes 15 are provided at the cross-section of the outer casing 11. The through holes 15 are filled with a heat-conducting medium to enhance the heat dissipation efficiency of the outer casing 11.

[0050] Three sets of spaced-apart spring-loaded cards 12 are disposed at one end of the optical module housing 11. The spring-loaded cards 12 are made of a metal material with a certain degree of elasticity, such as stainless steel. This material ensures that the cards have sufficient elasticity and good corrosion resistance to adapt to different working environments.

[0051] These three sets of spring-loaded clips 12 are adapted to the connectors wrapped around the front end of the circuit board 2. When the circuit board 2 is installed into the inner cavity 16 of the housing 11, the connectors will be inserted into the corresponding positions. At this time, the spring-loaded clips 12 will use their own elasticity to tightly adhere to the surface of the connectors. This adhesion not only serves to fix the connectors and prevent them from loosening or falling off during use, but also provides a certain degree of cushioning, reducing the impact of external vibrations on the connectors and the circuit board 2, thereby ensuring the stability of the optical module signal transmission.

[0052] A spring tongue 13 is provided on the other side of the housing 11. The spring tongue 13 is also made of a flexible metal material and is designed to snap into the outer side of the connector. When the connector is inserted into the housing 11 and secured, the spring tongue 13 automatically springs up and snaps into the outer edge of the connector. This snap-in method further enhances the connection stability between the connector and the housing 11, preventing accidental loosening of the connector during insertion and removal, and ensuring that the optical module maintains good connection performance even after frequent insertion and removal operations.

[0053] A through hole 15 is provided at the protrusion of the snap-fit ​​area, thereby forming a mounting cavity 33 for installing the auxiliary heat dissipation component 3. The dimensions of the mounting cavity 33 are precisely designed according to the size of the auxiliary heat dissipation component 3 to ensure that the component can be tightly installed in it.

[0054] A miniature drive unit 31 is provided at one end of the inner wall of the mounting cavity 33. The miniature drive unit 31 can be a small electric motor, which is small in size and moderate in power, and can provide stable power to the cross-flow fan 32. The cross-flow fan 32 is mounted on the drive shaft of the miniature drive unit 31. The blades of the cross-flow fan 32 are designed with a specific shape. When the miniature drive unit 31 is started, the cross-flow fan 32 begins to rotate, which can drive the air in the inner cavity 16 of the outer casing 11 to circulate.

[0055] Specifically, the cross-flow fan 32 draws in hot air from the end of the inner cavity 16 of the housing 11 near the circuit board 2, and then blows the hot air to other parts of the housing 11 through the action of the fan, so that the hot air can be more evenly distributed in the inner cavity 16, which facilitates the dissipation of heat through the housing 11. This air circulation effectively improves the heat dissipation efficiency inside the housing 11, reduces the temperature around the circuit board 2, and ensures that the circuit board 2 operates in a suitable temperature environment.

[0056] One or more through holes 15 are provided at the cross-section of the outer casing 11. The number and location of these through holes 15 are set according to the actual heat dissipation requirements of the optical module. The diameter of the through holes 15 is generally a few millimeters to ensure that sufficient heat-conducting medium can be filled.

[0057] The through-hole 15 is filled with a thermally conductive medium, which can be thermally conductive grease or thermally conductive gel. These thermally conductive media have excellent thermal conductivity, enabling rapid heat transfer from the inside of the housing 11 to its outer surface. When the optical module is operating, the heat generated by the circuit board 2 is transferred through the inner wall of the housing 11 to the through-hole 15 filled with the thermally conductive medium. The medium then rapidly conducts the heat to the outer surface of the housing 11, where it is dissipated through heat exchange with the surrounding air. This method further enhances the heat dissipation efficiency of the housing 11, effectively solving the performance degradation problem caused by poor heat dissipation in optical modules mentioned in the background art.

[0058] In summary, the spring-loaded clip 12 and spring tongue 13 ensure a stable connection of the circuit board 2 connector, while the cross-flow fan 32 in the mounting cavity 33 and the through hole 15 filled with heat-conducting medium achieve a good heat dissipation effect, thereby ensuring that the optical module can work normally in a stable temperature environment and improving the performance and reliability of the optical module.

[0059] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. An optical module housing, comprising a circuit board (2) for signal transmission processing, wherein a wrapping component (1) is disposed on the outside of the circuit board (2); Its features are: The packaging component (1) includes a shell (11), and an inner cavity (16) is provided on the inner side of the shell (11). A slide groove (14) is provided in the inner cavity (16) for the circuit board (2) to be suspended and mounted. The slide groove (14) is symmetrically arranged on both sides of the inner wall of the inner cavity (16) and protrudes outward along the horizontal center line of the inner cavity (16). The inner side of the inner cavity (16) is provided with a snap-fit ​​area at one end near the circuit board (2) for fixing the circuit board (2); A downward protrusion is provided above the snap-fit ​​area, and an auxiliary heat dissipation component (3) is installed on the protrusion to dissipate heat from the outer shell (11).

2. The optical module housing according to claim 1, characterized in that: Three sets of spaced spring-loaded cards (12) are provided at one end of the outer casing (11), and the spring-loaded cards (12) are adapted to the connectors wrapped around the front end of the circuit board (2).

3. The optical module housing according to claim 1, characterized in that: A spring tongue (13) is provided on the other side of the outer casing (11), and the spring tongue (13) is engaged with the inserted outer side.

4. The optical module housing according to claim 1, characterized in that: The protrusion of the snap-fit ​​area has a through hole (15) to form a mounting cavity (33) for installing the auxiliary heat dissipation component (3).

5. The optical module housing according to claim 4, characterized in that: Each of the inner walls of the mounting cavity (33) is provided with a micro drive component (31), and a cross-flow fan (32) is provided at the micro drive component (31). The cross-flow fan (32) is used to drive the air circulation in the inner cavity (16) of the outer shell (11).

6. The optical module housing according to claim 1, characterized in that: The outer casing (11) has one or more through holes (15) at its cross-section, and the through holes (15) are filled with a heat-conducting medium to enhance the heat dissipation efficiency of the outer casing (11).

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