An intelligent computing component

By dividing the intelligent computing components into independent modules and dynamically adjusting the data transmission method, the problem of poor thermal stability of the intelligent computing components was solved, thereby improving thermal stability and service life.

CN224519311UActive Publication Date: 2026-07-17CHENGDU KAIDI FEIYAN TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHENGDU KAIDI FEIYAN TECH CO LTD
Filing Date
2025-07-15
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In high-density, high-concurrency operating environments, intelligent computing components accumulate heat. Existing technologies lack comprehensive temperature monitoring, resulting in poor thermal stability and affecting service life.

Method used

The intelligent computing component is divided into an independent intelligent computing processing module and a data recording module, with a status monitoring unit and a control unit set up respectively. It communicates with external components through a multi-functional connector, dynamically adjusts the data transmission mode according to the status monitoring signal, and optimizes the thermal balance in combination with the heat dissipation structure.

Benefits of technology

Modular monitoring and targeted thermal balance strategies for intelligent computing components have been implemented, improving the thermal stability and lifespan of the components under complex operating conditions.

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Abstract

The application discloses a kind of wisdom calculation components, it is related to hardware design technical field.The component includes shell, wisdom calculation processing module and data recording module are independently arranged in shell and are connected with each other and communicate;Heat dissipation structure is provided on the shell;Wisdom calculation processing module includes first control unit, first processing unit and first state monitoring unit, wherein, first control unit is connected with first processing unit, first state monitoring unit is connected with first control unit, first state monitoring unit is also connected with first processing unit;First control unit is also connected with external component by multifunctional connector, multifunctional connector includes different types of data transmission interface;First state monitoring unit is used to monitor the state information of wisdom calculation processing module, and output state monitoring signal;First control unit is used to switch the data transmission mode of multifunctional connector based on state monitoring signal.The wisdom calculation component of the application has good thermal stability.
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Claims

1. A cognitive assembly, comprising: The component includes a housing, an intelligent computing processing module and a data recording module that are independently disposed within the housing and are communicatively connected to each other; The housing is provided with a heat dissipation structure; The intelligent computing processing module includes a first control unit, a first processing unit, and a first status monitoring unit, wherein the first control unit is communicatively connected to the first processing unit, the first status monitoring unit is communicatively connected to the first control unit, and the first status monitoring unit is also communicatively connected to the first processing unit. The first control unit is also communicatively connected to external components via a multi-function connector, which includes different types of data transmission interfaces; The first status monitoring unit is used to monitor the status information of the intelligent computing processing module and output a status monitoring signal; The first control unit is used to switch the data transmission mode with the multi-functional connector based on the status monitoring signal.

2. The intelligent assembly of claim 1, wherein, The multi-functional connector includes a general data transmission interface and a dedicated data transmission interface.

3. The intelligent assembly of claim 2, wherein, The first control unit is connected to the general data transmission interface via a multimodal data transmission circuit; The first control unit is used to switch the data transmission mode with the general data transmission interface based on the status monitoring signal through the multimodal data transmission circuit. The data transmission mode includes unbalanced data transmission mode and balanced data transmission mode.

4. The intelligent assembly of claim 2, wherein, The first control unit is connected to the dedicated data transmission interface via a multi-channel data transmission circuit; The first control unit is used to turn on / off at least one data transmission channel of the multi-channel data transmission circuit based on the status monitoring signal.

5. The intelligent assembly of claim 3, wherein, The multimodal data transmission circuit includes a first differential line driver chip and a second differential line driver chip. One end of the first differential circuit driver chip is communicatively connected to the general data transmission interface, and the other end of the first differential circuit driver chip is communicatively connected to the first control unit; One end of the second differential circuit driver chip is communicatively connected to the general data transmission interface, and the other end of the second differential circuit driver chip is communicatively connected to the first control unit; The first differential circuit driver chip is used to forward the output data of the first control unit to the general data transmission interface; The second differential line driver chip is used to forward the output data of the general data transmission interface to the first control unit.

6. The intelligent assembly of claim 4, wherein, The dedicated data transmission interface includes an image data transmission interface, which is communicatively connected to the first control unit via a multi-channel serializer. The first control unit is used to output an enable control signal based on the status monitoring signal; The multi-channel serializer is used to adjust the on / off state of the output port based on the enable control signal.

7. The compute component of claim 1, wherein, The data recording module includes a second control unit, a second processing unit, and a second status monitoring unit. The second control unit is communicatively connected to the second processing unit, the second status monitoring unit is communicatively connected to the second control unit, and the second status monitoring unit is also communicatively connected to the second processing unit.

8. The compute component of claim 1, wherein, The first status monitoring unit includes an MCU microcontroller, which is communicatively connected to both the first control unit and the first processing unit. The MCU is used to collect and output temperature information of the core components of the intelligent computing processing module.

9. The intelligent computing component as described in claim 1, characterized in that, The housing includes a heat dissipation plate, a cavity, and a top cover. The upper cover plate is disposed above the cavity, and the heat dissipation plate is disposed below the cavity. The upper cover plate is provided with multiple air inlets. The intelligent computing processing module and the data recording module are disposed inside the cavity. The intelligent computing processing module and the data recording module are thermally connected to the heat dissipation plate through a thermal pad.

10. The intelligent assembly of claim 9, wherein, The heat dissipation plate is made of aluminum alloy.