Novel metal substrate

Abstract

The novel metal substrate comprises, from top to bottom, a conductive aluminum foil layer and an aluminum-iron composite plate, and a semi-cured insulating adhesive film is arranged between the conductive aluminum foil layer and the aluminum-iron composite plate, and the insulating adhesive film is located on the aluminum surface of the aluminum-iron composite plate. The utility model adopts the aluminum-iron composite plate to replace the traditional aluminum-based copper-clad plate as the heat-conducting reinforcing material, and the hardness of the aluminum-iron composite plate is higher than that of the aluminum plate, so that the flatness and durability of the substrate for the 3D printer hot bed can be improved. Moreover, the iron plate in the aluminum-iron composite plate has excellent magnetic conductivity and a lower thermal conductivity, can avoid electromagnetic radiation pollution after the 3D printing hot bed is powered on, improves the temperature uniformity of the 3D printing hot bed, reduces the heat dissipation capacity, and is more energy-saving.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to a metal substrate for a heated bed in a 3D printer. Background Technology

[0002] A heated bed is a unique accessory for 3D printers. During 3D printing, the edges of the molten material cool relatively quickly, and this shrinkage can cause the model to warp. To mitigate this, the heated bed is maintained at around 60 degrees Celsius, keeping the printed part at a relatively high temperature and preventing warping due to material cooling during printing. Currently, commonly used heated beds for 3D printers include polyimide heating plates, heating rods with aluminum plates, and aluminum-based PCB heated beds. Among these, the aluminum-based PCB heated bed does not require an external aluminum plate, has a simple structure, and is characterized by stable operation and durability, making it popular in the industry. The aluminum-based PCB heated bed utilizes the heat from the heated bed to generate resistance heating in the copper foil circuitry etched during the PCB manufacturing process when electricity is applied, thus achieving the function of heating and heat preservation.

[0003] Most existing metal-based PCBs used in heated beds for 3D printers are aluminum-based copper-clad laminates. In production practice, it has been found that aluminum-based copper-clad laminates have the following shortcomings when used in heated beds for 3D printers: 1) The aluminum surface is anodized or sulfur-free anodized, which easily attracts dust; 2) During the heating process, the copper foil circuits have electromagnetic effects under the action of pulsed or alternating current, generating electromagnetic waves that radiate to the surroundings and causing electromagnetic pollution; 3) The copper foil used for etching circuits is an electrolytic copper foil. The rough surface of the electrolytic copper foil is plated with copper nodules to obtain a rougher surface for better adhesion. However, the copper nodules plated on the rough surface lead to uneven thickness of the copper foil, resulting in uneven resistive heating effect after the copper foil circuit is energized, thus causing uneven surface temperature of the heated bed. Utility Model Content

[0004] The purpose of this invention is to provide a metal substrate for a heated bed in a 3D printer, which features uniform heat distribution and energy efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A novel metal substrate includes: a conductive aluminum foil layer and an aluminum-iron composite plate arranged sequentially from top to bottom, with a semi-cured insulating film disposed between the conductive aluminum foil layer and the aluminum-iron composite plate, the insulating film being located on the aluminum surface of the aluminum-iron composite plate.

[0007] In some embodiments, the surface of the aluminum-iron composite plate is provided with a dustproof coating.

[0008] In some embodiments, the conductive aluminum foil layer is a rolled aluminum foil.

[0009] In some embodiments, the aluminum-iron composite plate is composed of an iron plate and an aluminum plate, and the thickness of the aluminum-iron composite plate is 0.4 to 3.0 mm.

[0010] In some embodiments, the thickness of the aluminum plate is less than the thickness of the iron plate.

[0011] In some embodiments, the thickness of the aluminum plate is 0.1 to 2.8 mm.

[0012] In some embodiments, the thickness of the iron plate is 0.2 to 2.9 mm.

[0013] In some embodiments, a glass fiber reinforced prepreg is further included between the conductive aluminum foil layer and the insulating film.

[0014] In some embodiments, a PI film reinforcing film or a PET film reinforcing film is further disposed between the conductive aluminum foil layer and the insulating film.

[0015] In some embodiments, the thickness of the dustproof coating is 1–5 μm.

[0016] The dustproof coating is an epoxy resin modified polysiloxane layer, or a fluorinated, silicone-containing acrylic resin layer, or a fluorinated, silicone-containing epoxy resin modified layer.

[0017] As can be seen from the above technical solutions, for the substrate of the heated bed of a 3D printer, this utility model uses an aluminum-iron composite plate instead of the traditional aluminum-based copper-clad laminate as the thermally conductive reinforcing material. The aluminum-iron composite plate has a higher hardness than the aluminum plate, which can improve the flatness and durability of the substrate of the heated bed of the 3D printer. Moreover, the aluminum plate in the aluminum-iron composite plate is bonded with an insulating film, resulting in high bonding strength. The iron plate in the aluminum-iron composite plate has excellent magnetic permeability, which can avoid electromagnetic radiation pollution generated after the 3D printing heated bed is powered on. At the same time, iron has a lower thermal conductivity and a lower heat diffusion capacity than the traditional aluminum-based copper-clad laminate, which improves the temperature uniformity of the 3D printing heated bed, reduces heat dissipation capacity, and is more energy-efficient. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the metal substrate in Embodiment 1 of this utility model;

[0020] Figure 2This is a schematic diagram of the structure of the metal substrate in Embodiment 2 of this utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the metal substrate in Embodiment 3 of this utility model.

[0022] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Detailed Implementation

[0023] The present invention will now be described in detail with reference to the accompanying drawings. In the detailed description of the embodiments of the present invention, for ease of explanation, the drawings illustrating the device structure will be partially enlarged without adhering to the general scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. It should be noted that the drawings are in a simplified form and use non-precise scales, solely for the purpose of conveniently and clearly illustrating the embodiments of the present invention. Additionally, in the description of this application, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Terms such as "positive," "negative," "bottom," "upper," "lower," "front," "rear," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] To address the shortcomings of conventional aluminum-based copper-clad laminates used in 3D printer heated beds, such as easy dust adhesion on the aluminum surface and uneven surface temperature due to uneven thickness, this invention proposes a novel metal substrate structure for use in 3D printer heated beds. Figure 1 As shown, the metal substrate of this utility model includes: a conductive aluminum foil layer 1 and an aluminum-iron composite plate 2. The aluminum-iron composite plate 2 is composed of an aluminum plate and an iron plate. An insulating film 3 is provided on the aluminum surface of the aluminum-iron composite plate 2, and the insulating film 3 is located between the aluminum-iron composite plate 2 and the conductive aluminum foil layer 1. A dustproof coating 4 is provided on the iron surface of the aluminum-iron composite plate 2.

[0026] The conductive aluminum foil layer 1 of this invention is made of rolled aluminum foil. Rolled aluminum foil is not subjected to nodule roughening treatment, resulting in uniform thickness. This ensures a more uniform resistive heating effect when the aluminum foil circuit, as the conductive layer, is energized. Furthermore, compared to copper foil, aluminum foil has a higher resistivity (2.65 × 10⁻⁶). -8 The resistivity of the copper foil is 1.70 × 10⁻⁶ Ω·m. -8 (Ω·m), therefore, by using aluminum foil as the conductive layer, the heating rate of the hot bed after the aluminum foil circuit is energized is several times higher than that of the original aluminum substrate PCB hot bed using copper foil as the electric heat source, resulting in a higher resistance heating effect and greater environmental protection and energy saving.

[0027] Aluminum-iron composite plate 2 is a composite structure made of aluminum and iron plates. The thickness of the aluminum-iron composite plate can be 0.4–3.0 mm. Specifically, the aluminum plate thickness can be 0.1–2.8 mm, and the iron plate thickness can be 0.2–2.9 mm. The aluminum surface of the aluminum-iron composite plate 2 serves as the bonding surface, giving the plate excellent machinability similar to aluminum. The iron surface serves as the non-bonding surface, possessing magnetic conductivity similar to iron, which avoids electromagnetic radiation pollution generated after the 3D printing heated bed is powered on. Furthermore, the coefficient of thermal expansion of iron is much lower than that of aluminum. Compared to aluminum-based copper-clad laminates using aluminum as the substrate, the degree of thermal deformation during long-term use of the 3D printing heated bed is far lower than that of aluminum-based PCB heated beds, improving 3D printing accuracy and extending the service life of the heated bed. Furthermore, compared to aluminum, iron has a lower thermal conductivity (60 W / m·K for iron and 237 W / m·K for aluminum). As a result, the thermal conductivity of the iron-aluminum composite plate is lower than that of the conventional aluminum substrate. Consequently, the heat diffusion capacity of the 3D printing heated bed during long-term use is lower than that of the aluminum substrate PCB heated bed, which greatly improves the temperature uniformity of the 3D printing heated bed and reduces the heat dissipation capacity, making it more energy-efficient.

[0028] The thicknesses of the aluminum and iron plates can be set in any ratio. In some embodiments, it is preferable to set the thickness of the aluminum plate to be less than that of the iron plate to reduce the degree of thermal deformation of the plates during long-term use and improve the flatness of the plates. On the other hand, compared with aluminum, iron has a lower thermal conductivity. The fact that the aluminum plate is thinner than the iron plate can reduce heat dissipation capacity, making the plates more energy-efficient.

[0029] When preparing aluminum-iron composite plate 2, the surface of the aluminum plate is soaked in 10% NaOH solution, then cleaned with water and dried. The surface of the iron plate is soaked in 10% HCl solution, then cleaned with water and dried. The aluminum plate and the iron plate are then bonded together by cold rolling, hot rolling, explosive rolling or explosive bonding method to form aluminum-iron composite plate.

[0030] To reduce dust accumulation and facilitate cleaning, this embodiment coats the iron surface of the aluminum-iron composite plate 3 with a dustproof coating. This dustproof coating is resistant to high temperatures and acids / alkalis. The thickness of the dustproof coating can be 1–5 μm. The composition of the dustproof coating can be epoxy resin-modified polysiloxane, or fluorinated / organosilicon-containing acrylic resin or epoxy resin modifiers. In this invention, an insulating film 3 is set on the iron surface of the aluminum-iron composite plate 2. The insulating film 3 is located between the conductive aluminum foil layer 1 and the aluminum-iron composite plate 2, and is in a semi-cured state. The thickness of the insulating film 3 can be 60–250 μm. The insulating film 3 is formed by baking a resin liquid with a thermal conductivity ≤1W at high temperature. The liquid may include resin, toughening agent, curing agent, inorganic filler, etc. The resin liquid containing the above components is coated onto a release film and baked at high temperature (150–155℃) for 3–5 minutes to form a semi-cured state.

[0031] The resin can be one or more of the following: epoxy resin, alicyclic epoxy resin, bisphenol A phenolic epoxy resin, benzoxazine resin, bismaleimide resin, cyanate ester resin, PI resin, PPO resin, and phenolic resin.

[0032] The toughening agent can be one or more of the following: dimer acid modified epoxy, nitrile rubber, epoxy resin modified rubber, polyurethane resin, polyvinyl butyral resin, acrylic resin, core-shell rubber, and isocyanate modified epoxy resin.

[0033] The curing agent can be dicyandiamide, phenolic curing agents, such as phenolic resin, linear bisphenol A phenolic resin, alkyl modified phenolic resin; or it can be a high-temperature resistant aromatic amine, such as one or more of m-phenylenediamine, diaminodiphenyl sulfone, diaminodiphenyl ether, diaminodiphenylmethane, p-xyleneamine and diethyltoluenediamine.

[0034] Inorganic fillers can be one or more of the following: talc, mica, kaolin, calcium carbonate, montmorillonite, alumina, silicon dioxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, magnesium oxide, aluminum hydroxide, and silicon dioxide.

[0035] The metal substrate of this invention is formed by pressing aluminum foil, insulating film, and aluminum-iron composite plate under high temperature and high pressure (175°C / 1 hour). In some embodiments, the metal substrate further includes a glass fiber cloth reinforcement structure and / or a PI / PET film reinforcement structure.

[0036] The present invention will be further described below through specific embodiments. Unless otherwise specified, the reagents, materials and instruments used in the following description are all conventional reagents, materials and instruments, which are commercially available, and the reagents involved can also be synthesized by conventional synthesis methods.

[0037] Example 1

[0038] like Figure 1 As shown, the metal substrate of this embodiment includes a conductive aluminum foil layer 1, an insulating film 3, an aluminum-iron composite plate 2 and a dustproof coating 4 arranged sequentially from top to bottom. The dustproof coating 4 is disposed on the iron surface of the aluminum-iron composite plate 2, and the insulating film 3 is disposed on the aluminum surface of the aluminum-iron composite plate 2 and located between the aluminum-iron composite plate 2 and the conductive aluminum foil layer 1.

[0039] Example 2

[0040] like Figure 2 As shown, the difference between this embodiment and Embodiment 1 is that the metal substrate in this embodiment includes, from top to bottom, a conductive aluminum foil layer 1, a glass fiber cloth-reinforced prepreg 5, an insulating film 3, an aluminum-iron composite plate 2, and a dustproof coating 4. The glass fiber cloth-reinforced prepreg 5 is located between the conductive aluminum foil layer 1 and the insulating film 3.

[0041] The glass fiber reinforced prepreg 5 is a commonly used glass fiber reinforced prepreg in the copper clad laminate manufacturing process. It is made by immersing glass fiber cloth in a resin solution with a thermal conductivity ≤1W and then drying it to a semi-cured state. The thickness of the glass fiber reinforced prepreg 5 can be 80–200 μm.

[0042] Example 3

[0043] like Figure 3 As shown, the difference between this embodiment and Embodiment 1 is that the metal substrate in this embodiment includes, from top to bottom, a conductive aluminum foil layer 1, a PI / PET film-reinforced adhesive film 6, an insulating adhesive film 3, an aluminum-iron composite plate 2, and a dustproof coating 4. The PI / PET film-reinforced adhesive film 6 is located between the conductive aluminum foil layer 1 and the insulating adhesive film 3.

[0044] PI / PET film reinforcing film 6 is a commonly used film reinforcing film in the copper clad laminate (CCL) manufacturing process. It is made by applying a resin solution with a thermal conductivity ≤1W to the surface of a PI or PET film, followed by drying the solution to a semi-cured state. The thickness of the PI / PET film reinforcing film 6 can range from 80 to 200 μm. By reinforcing the semi-cured sheet or PI / PET film reinforcing film with glass fiber cloth, the high-voltage breakdown resistance of the board and the electrical insulation performance of the system are improved.

[0045] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A novel metal substrate, characterized in that, include: A conductive aluminum foil layer and an aluminum-iron composite plate are arranged sequentially from top to bottom. A semi-cured insulating film is provided between the conductive aluminum foil layer and the aluminum-iron composite plate. The insulating film is located on the aluminum surface of the aluminum-iron composite plate.

2. The novel metal substrate as described in claim 1, characterized in that: The aluminum-iron composite plate has a dustproof coating on its surface.

3. The novel metal substrate as described in claim 1, characterized in that: The conductive aluminum foil layer is rolled aluminum foil.

4. The novel metal substrate as described in claim 1, characterized in that: The aluminum-iron composite plate is made of iron plate and aluminum plate, and the thickness of the aluminum-iron composite plate is 0.4 to 3.0 mm.

5. The novel metal substrate as described in claim 4, characterized in that: The thickness of the aluminum plate is less than the thickness of the iron plate.

6. The novel metal substrate as described in claim 4, characterized in that: The thickness of the aluminum plate is 0.1 to 2.8 mm.

7. The novel metal substrate as described in claim 4, characterized in that: The thickness of the iron plate is 0.2 to 2.9 mm.

8. The novel metal substrate as described in claim 1, characterized in that: It also includes a glass fiber reinforced prepreg disposed between the conductive aluminum foil layer and the insulating adhesive film.

9. The novel metal substrate as described in claim 1, characterized in that: It also includes a PI film reinforcing film or a PET film reinforcing film disposed between the conductive aluminum foil layer and the insulating film.

10. The novel metal substrate as described in claim 2, characterized in that: The thickness of the dustproof coating is 1–5 μm.

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