Electronic detonator module and integrated dual firing switch electronic detonator chip lead frame package

By integrating a three-base island lead frame packaging structure with dual ignition switches, the electronic detonator module achieves efficient space utilization and reliable detonation, solving the problems of complex circuits, large space occupation, and easy premature detonation due to single-point failure in the existing technology, thus improving the safety and reliability of electronic detonators.

CN224538727UActive Publication Date: 2026-07-21SHANGHAI CORE JUMP TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI CORE JUMP TECH CO LTD
Filing Date
2025-06-19
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing electronic detonator modules suffer from problems such as complex module circuit design, large space occupation, and the single ignition switch being prone to premature detonation or mis-detonation. In particular, the ignition switch integrated in the main control chip has low withstand voltage and high conduction resistance, and single-point failure can easily lead to premature detonation.

Method used

The system adopts a three-base island lead frame package structure, integrating PMOS and NMOS ignition switch chips. The main control chip is connected to each ignition switch chip via bonding wires, forming high voltage isolation and operating potential isolation. A bus input protection circuit is designed to ensure that the dual ignition switches work in parallel, thereby improving reliability.

Benefits of technology

It solves the problems of complex modular circuits, large space occupation, and easy premature detonation due to single-point failure, improves the reliability and safety of electronic detonators, and avoids premature detonation or mis-detonation.

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Abstract

The utility model provides an integrated electronic detonator chip lead frame package of double firing switch and electronic detonator module, include: first base island, second base island, third base island, main control chip, PMOS firing switch chip and NMOS firing switch chip, first base island, second base island and third base island are located in the package body, first base island is located in the upper region of package body, second base island and third base island are side by side and located in the lower region of package body, main control chip substrate is fixed on first base island, PMOS firing switch chip drain substrate is fixed on second base island, NMOS firing switch chip drain substrate is fixed on third base island, a plurality of external pins are equipped on lead frame package, this scheme adopts the three base island lead frame package structure of special design, makes electronic detonator main control chip and high voltage low resistance's double firing switch can be integrated in the same package.
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