A mainboard processing welding jig

Abstract

The utility model provides a kind of mainboard processing welding jig, including mainboard placing structure, it includes placing frame and guide bar, the four edges of placing frame inside are provided with guide block, the inside of guide block is provided with inflatable ring, the inflatable ring is rubber material, the quantity of guide bar is provided as multiple, multiple The guide bar annular array is in the inside of placing frame.The utility model is through setting in the inside inflatable ring of mainboard placing structure, so that inflatable ring can expand and be consistent with the outer surface of mainboard, since inflatable ring has certain elasticity, can avoid inflatable ring and mainboard consistent time, hard connection causes damage to the outer wall of mainboard, improve the stability and protection of welding fixture in the welding process of mainboard, can also increase or reduce guide block between inflatable ring and placing frame according to the size of mainboard, so that inflatable ring can be fully consistent with the outer wall of mainboard, to clamp mainboard.

Description

Technical Field

[0001] This utility model belongs to the field of motherboard processing technology, and specifically relates to a motherboard processing welding fixture. Background Technology

[0002] Motherboard fabrication refers to a series of processes involving soldering electronic components onto a printed circuit board (PCB) according to design requirements. This process includes multiple stages such as raw material procurement, component mounting, soldering, and testing, ultimately forming a complete circuit system capable of normal operation. Motherboard fabrication is one of the core processes in electronic device manufacturing, directly affecting the performance and stability of electronic products. During the motherboard manufacturing process, a welding fixture is needed to fix the motherboard in place so that electronic components can be soldered to the top of the motherboard. However, the fixture can only fix the motherboard and is directly connected by a rigid connection, so there is no buffer between the motherboard and the fixture. When the fixture clamps the motherboard, it can easily cause damage to the side of the motherboard. Utility Model Content

[0003] Purpose of utility model To address the aforementioned technical problems, this utility model provides a motherboard processing and welding fixture to solve the technical problems mentioned in the background art.

[0004] Technical solution: To achieve the above objectives, the technical solution provided by this utility model is a motherboard processing and welding fixture, including a motherboard cleaning structure, wherein a motherboard placement structure is rotatably connected to the top of the motherboard cleaning structure. The motherboard placement structure includes a placement rack and guide bars. Guide blocks are provided on the four sides inside the placement rack, and an air ring is provided on the inner side of the guide block. The air ring is made of rubber. The number of guide bars is set to multiple, and the multiple guide bars are arranged in a circular array inside the placement rack.

[0005] Preferably, the motherboard cleaning structure includes a base plate, with transmission screws rotatably connected to both sides of the top of the base plate, two transmission screws being equipped with transmission devices, a lifting plate being provided between the two transmission screws, support frames being provided on both sides of the top of the base plate, and positioning holes being provided on the top of the support frames.

[0006] Preferably, the lifting plate has mating holes at both ends, which are mated with the transmission screw, and the lifting plate has mounting holes inside.

[0007] Preferably, a spring tube is rotatably connected inside the mounting hole, a meshing gear is provided at the bottom of the spring tube, a bonding disc is provided at the top of the spring tube, and a cleaning strip is provided at the top of the bonding disc.

[0008] Preferably, the placement frame is provided with positioning shafts on both sides, the positioning shafts are rotatably connected to positioning holes, the placement frame is provided with a first guide hole, the guide block is provided with a guide strip on one side, the guide strip is engaged with the first guide hole, and the other side of the guide block is provided with a second guide hole, the second guide hole is connected to the inflation ring.

[0009] Beneficial effects:

[0010] The technical solution provided by this utility model has the following advantages compared with the prior art: This invention uses an internal air ring in the motherboard placement structure to allow the air ring to expand and fit against the outer surface of the motherboard. Because the air ring has a certain degree of elasticity, it can avoid damage to the outer wall of the motherboard caused by a hard connection when the air ring fits against the motherboard, thereby improving the stability and protection of the welding fixture during the motherboard welding process. At the same time, guide blocks can be added or removed between the air ring and the placement frame according to the size of the motherboard, so that the air ring can fit fully against the outer wall of the motherboard, thereby clamping the motherboard. During the motherboard soldering process, the soldering surfaces of the motherboard need to be cleaned. A motherboard-specific cleaning fluid is sprayed from inside the spring tube, while the lifting plate moves the spring tube upwards. The spring tube then moves the cleaning strip at the top to contact the soldering surfaces of the motherboard. Afterwards, the spring tube rotates the cleaning strip, which cleans the soldering surfaces of the motherboard, keeping them clean. Attached Figure Description

[0011] Figure 1 This is a perspective view of the present utility model; Figure 2 This is a three-dimensional unfolded view of the motherboard cleaning structure of this utility model; Figure 3 This is a three-dimensional unfolded view of the motherboard placement structure of this utility model.

[0012] Figure label:

[0013] 1. Mainboard cleaning structure; 101. Base plate; 102. Transmission screw; 103. Lifting plate; 104. Mating hole; 105. Mounting hole; 106. Bourdon tube; 107. Meshing gear; 108. Adhesion plate; 109. Cleaning strip; 110. Support frame; 111. Positioning hole; 2. Mainboard placement structure; 201. Placement frame; 202. Positioning shaft; 203. First guide hole; 204. Guide block; 205. Guide strip; 206. Second guide hole; 207. Inflatable ring. Detailed Implementation

[0014] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise", "coaxial", "bottom", "one end", "top", "other end", "one side", "front", "both ends", "both sides", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0015] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0016] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," and "equipped with" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0017] Referring now to the accompanying drawings, the various figures are intended only to illustrate certain exemplary embodiments and are not intended to limit the scope of the invention. In the various figures, the same reference numerals denote the same or corresponding parts. The dimensions and scales in the various figures are also for illustrative purposes only and should not be construed as limiting the scope of the invention; these dimensions may be enlarged relative to actual products.

[0018] Reference Figure 1-3 The motherboard processing and welding fixture shown includes a motherboard cleaning structure 1, and a motherboard placement structure 2 is rotatably connected to the top of the motherboard cleaning structure 1. The motherboard placement structure 2 includes a placement rack 201 and guide bars 205. Guide blocks 204 are provided on the four sides inside the placement rack 201. An inflatable ring 207, made of rubber, is provided on the inner side of each guide block 204. Multiple guide bars 205 are arranged in a circular array inside the placement rack 201. When the motherboard needs to be fixed using a welding fixture, guide blocks 204 are added or removed between the placement rack 201 and the inflatable ring 207 according to the size of the motherboard. The motherboard is then placed inside the inflatable ring 207, and an air pump inflates the ring 207, causing it to expand and adhere to the outer wall of the motherboard for fixation. Simultaneously, a motor is provided at one end of the support frame 110, with its output connected to the positioning shaft 202. Starting the motor causes the placement rack 201 to rotate 180°, allowing the motherboard to rotate 180°, facilitating subsequent grinding of the motherboard's welding surface by the motherboard cleaning structure 1.

[0019] Furthermore, in the above technical solution, the motherboard cleaning structure 1 includes a base plate 101. Two transmission screws 102 are rotatably connected to the top sides of the base plate 101. Two transmission screws 102 are equipped with transmission devices. A lifting plate 103 is positioned between the two transmission screws 102. Support frames 110 are provided on both sides of the top of the base plate 101. Positioning holes 111 are opened at the top of the support frames 110. Matching holes 104 are opened at both ends of the lifting plate 103. The matching holes 104 are connected to the transmission screws. 102 are mutually coordinated. The lifting plate 103 has an internal mounting hole 105. A spring tube 106 is rotatably connected inside the mounting hole 105. A meshing gear 107 is provided at the bottom of the spring tube 106, and a bonding disc 108 is provided at the top of the spring tube 106. A cleaning strip 109 is provided at the top of the bonding disc 108. Positioning shafts 202 are provided on both sides of the placement frame 201. The positioning shafts 202 are rotatably connected to the positioning hole 111. A first guide hole 203 is provided inside the placement frame 201. A guide strip 205 is provided on one side of the guide block 204, and the guide strip 205 is engaged with the first guide hole 203. A second guide hole 206 is provided on the other side of the guide block 204, and the second guide hole 206 is connected to the air ring 207. After the main board is soldered, the motor drives the main board placement structure 2 to rotate 180°, and then the motor is started. The motor drives the transmission screw 102 to rotate, and the transmission screw 102 drives the lifting plate 103 to move upward. The lifting plate 103 drives the spring tube 106 to move upward. The tube 106 drives the cleaning strip 109 to move upward and fit into the motherboard inside the air ring 207. The water pump sends the motherboard-specific cleaning fluid into the inside of the spring tube 106 and sprays it out from the top of the spring tube 106. Then the motor is started, and the motor drives one meshing gear 107 to rotate. The meshing gear 107 drives the spring tube 106 to rotate, and the meshing gear 107 drives the meshing gears 107 in other positions to rotate. This causes the meshing gears 107 to drive the cleaning strip 109 to rotate through the spring tube 106. The cleaning strip 109 cleans the solder surface of the motherboard.

[0020] The above-described embodiments are merely illustrative of certain implementations of this utility model, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A motherboard processing and welding fixture, characterized in that, include A motherboard cleaning structure (1) is rotatably connected to a motherboard placement structure (2) at its top. The motherboard placement structure (2) includes a placement rack (201) and guide bars (205). The four sides inside the placement rack (201) are provided with guide blocks (204). The inner side of the guide blocks (204) is provided with an air ring (207). The air ring (207) is made of rubber. The number of guide bars (205) is set to multiple, and the multiple guide bars (205) are arranged in a ring array inside the placement rack (201).

2. The motherboard processing and welding fixture according to claim 1, characterized in that: The motherboard cleaning structure (1) includes a base plate (101), with transmission screws (102) rotatably connected to both sides of the top of the base plate (101). The two transmission screws (102) are equipped with transmission devices, and a lifting plate (103) is provided between the two transmission screws (102). Support frames (110) are provided on both sides of the top of the base plate (101), and positioning holes (111) are opened on the top of the support frames (110).

3. A motherboard processing and welding fixture according to claim 2, characterized in that: The lifting plate (103) has mating holes (104) at both ends, which are mated with the transmission screw (102). The lifting plate (103) has mounting holes (105) inside.

4. A motherboard processing and welding fixture according to claim 3, characterized in that: A spring tube (106) is rotatably connected inside the mounting hole (105). A meshing gear (107) is provided at the bottom of the spring tube (106). A bonding disc (108) is provided at the top of the spring tube (106). A cleaning strip (109) is provided at the top of the bonding disc (108).

5. A motherboard processing and welding fixture according to claim 1, characterized in that: The placement rack (201) is provided with positioning shafts (202) on both sides. The positioning shafts (202) are rotatably connected to the positioning holes (111). The placement rack (201) is provided with a first guide hole (203). The guide block (204) is provided with a guide strip (205) on one side. The guide strip (205) is engaged with the first guide hole (203). The guide block (204) is provided with a second guide hole (206) on the other side. The second guide hole (206) is connected to the inflation ring (207).

Images