Chip removal device and machining center having it

Abstract

The utility model discloses a chip removal device and processing center with it. Belong to the technical field of machining, this chip removal device includes accommodating groove, drive mechanism, waste cutting barrel and conveying mechanism, and accommodating groove is established in below ground, and drive mechanism is established in at least part in accommodating groove, and drive mechanism is used to drive waste cutting barrel and removes into and at least part removes from accommodating groove, and conveying mechanism is used for transporting the cutting chip to the waste cutting barrel in accommodating groove, and waste cutting barrel and at least part drive mechanism are established in accommodating groove, can reduce the space of chip removal device above ground, so as to be convenient for the layout compact lathe production line above ground, can shorten the logistics path of lathe production line, shortens material transport time, is favorable to the production efficiency of lathe production line.

Description

Technical Field

[0001] This utility model relates to the field of machining technology, and more specifically, to a chip removal device and a machining center having the same. Background Technology

[0002] In related technologies, cutting machine tools generate chips when machining parts. These chips are usually transported and discharged by chip conveyors. Chip conveyors occupy a large space, making it difficult to arrange them in a compact machine tool production line. To avoid chip conveyors, the distance between adjacent machine tools is increased, which leads to an increased logistics path, increased material transportation time, and reduced production efficiency of the machine tool production line. Utility Model Content

[0003] The present invention aims to at least partially solve one of the aforementioned technical problems in the prior art. To this end, the present invention proposes a chip removal device that reduces its footprint on the ground.

[0004] This utility model also proposes a machining center with the above-mentioned chip removal device.

[0005] The chip removal device according to an embodiment of the present utility model includes: a receiving groove, a driving mechanism, a waste chip bucket, and a conveying mechanism. The receiving groove is located below the ground. The driving mechanism is at least partially located in the receiving groove and is used to drive the waste chip bucket to move into and at least partially move out of the receiving groove. The conveying mechanism is used to transport chips to the waste chip bucket in the receiving groove.

[0006] According to the chip removal device of this utility model embodiment, the receiving trough is located below the ground, and the waste chip bucket and at least part of the drive mechanism are located in the receiving trough. This can reduce the space occupied by the chip removal device above the ground, so as to facilitate the compact layout of machine tool production lines above the ground. It can shorten the logistics path of the machine tool production line, shorten the material transportation time, and help improve the production efficiency of the machine tool production line.

[0007] According to some embodiments of the present invention, the driving mechanism includes a lifting assembly, the waste bin is mounted on the lifting assembly, and the lifting assembly is used to drive the waste bin to lift.

[0008] According to some embodiments of the present invention, the driving mechanism further includes: a moving component, which is disposed in the receiving groove and connected to the lifting component. The moving component is used to drive the lifting component to move closer to and away from the conveying mechanism.

[0009] According to some embodiments of the present invention, the chip removal device further includes: a conveying trough, which is located below the ground and communicates with the receiving trough, and the conveying mechanism is at least partially located in the conveying trough to transport the chips that fall into the conveying trough to the waste chip bucket.

[0010] According to some embodiments of the present invention, the chip removal device further includes: a ground cover mechanism, which covers the opening of the receiving groove.

[0011] According to some embodiments of the present invention, the ground cover mechanism includes: a cover body, a chip discharge cover, and an opening and closing assembly. The cover body is fixedly disposed in the opening of the receiving groove. The cover body has a chip discharge port, and the chip discharge port is located on the side of the cover body away from the conveying mechanism. One of the inner wall of the receiving groove and the cover body is connected to the chip discharge cover through the opening and closing assembly. The opening and closing assembly is used to drive the chip discharge cover to close and open the chip discharge port.

[0012] According to some embodiments of the present invention, the chip removal cover includes a support frame and a transparent plate, the transparent plate being installed inside the support frame, and the support frame being connected to the opening and closing assembly.

[0013] According to some embodiments of the present invention, the support frame is also hinged to the cover plate body.

[0014] According to some embodiments of the present invention, the ground cover mechanism further includes: a support column, the support column being disposed in the receiving groove, one end of the support column being connected to the inner wall of the receiving groove, and the other end of the support column being connected to the cover body.

[0015] A machining center according to another embodiment of the present invention includes: a chip removal device and a machine tool body, wherein the chip removal device is the chip removal device of the above embodiment; the machine tool body is installed above the ground, and the receiving groove is offset from the machine tool body.

[0016] According to the embodiment of the present invention, the machining center has a receiving tank located below the ground, and the waste chip bucket and at least part of the drive mechanism are located in the receiving tank. This can reduce the space occupied by the chip removal device above the ground, so as to facilitate the compact layout of the machine tool production line above the ground. This can shorten the logistics path of the machine tool production line, shorten the material transportation time, and help improve the production efficiency of the machine tool production line.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the machining center when the chip discharge cover is closed according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the machining center when the chip discharge cover is opened according to an embodiment of the present invention.

[0020] Figure label:

[0021] Drive mechanism 1; Lifting assembly 11; Base 111; Scissor arm 112; Lifting platform 113; Drive component 114; Moving assembly 12; Waste bin 2; Conveying mechanism 3; Ground cover mechanism 4; Cover body 41; Chip removal cover 42; Opening and closing assembly 43; Support column 44; Pneumatic control station 5; Receiving tank 61; Conveying tank 62; Chip removal device 10; Machine tool body 20; Machining center 100. Detailed Implementation

[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0023] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] The following is combined Figure 1 and Figure 2 Detailed description of the chip removal device 10 and the machining center 100 having the chip removal device according to an embodiment of the present invention.

[0027] Reference Figure 1 As shown, the chip removal device 10 according to an embodiment of the present utility model includes: a receiving trough 61, a driving mechanism 1, a waste chip bucket 2 and a conveying mechanism 3. The receiving trough 61 is located below the ground. The driving mechanism 1 is at least partially located in the receiving trough 61. The driving mechanism 1 is used to drive the waste chip bucket 2 to move into and at least partially move out of the receiving trough 61. The conveying mechanism 3 is used to transport the chips to the waste chip bucket 2 in the receiving trough 61.

[0028] It is understood that part or all of the drive mechanism 1 is located in the receiving groove 61, and the waste bin 2 can be used to collect chips. The waste bin 2 and at least part of the drive mechanism 1 can be accommodated in the receiving groove 61 below the ground to reduce the space occupied by the chip removal device 10 above the ground, so as to facilitate the layout of a compact machine tool production line above the ground, which is beneficial to improving the aesthetics of the site layout, and can reduce the distance between two adjacent machine tools, shorten the logistics path of the machine tool production line, shorten the material transportation time, and improve the production efficiency of the machine tool production line.

[0029] The drive mechanism 1 is used to drive the waste chip bucket 2 to move into and at least partially move out of the receiving groove 61. That is, the drive mechanism 1 can drive the waste chip bucket 2 to move into the receiving groove 61, and the drive mechanism 1 can also drive the waste chip bucket 2 to move at least partially out of the receiving groove 61. After the drive mechanism 1 drives the waste chip bucket 2 to move into the receiving groove 61, the waste chip bucket 2 can receive the chips transported by the conveying mechanism 3. After the drive mechanism 1 drives the waste chip bucket 2 to move at least partially out of the receiving groove 61, the waste chip bucket 2 can be taken out of the receiving groove 61, which is convenient for cleaning the chips in the waste chip bucket 2.

[0030] According to the chip removal device 10 of this utility model embodiment, its waste chip bucket 2 and at least part of the drive mechanism 1 are arranged in the receiving groove 61, which can reduce the space occupied by the chip removal device 10 above the ground, so as to facilitate the compact layout of machine tool production lines above the ground, shorten the logistics path of the machine tool production line, shorten the material transportation time, and help improve the production efficiency of the machine tool production line.

[0031] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 As shown, the drive mechanism 1 includes a lifting assembly 11, on which a waste bin 2 is mounted. The lifting assembly 11 is used to drive the waste bin 2 to rise and fall. That is, the lifting assembly 11 can drive the waste bin 2 to rise and also drive the waste bin 2 to fall. When the lifting assembly 11 drives the waste bin 2 to rise, at least a portion of the waste bin 2 can be moved out of the receiving groove 61, so that the waste bin 2 can be removed from the receiving groove 61 to clean the chips inside the waste bin 2. After the chips are cleaned, the waste bin 2 can be put back on the lifting assembly 11. When the lifting assembly 11 drives the waste bin 2 to fall, the waste bin 2 can be moved into the receiving groove 61, so that the waste bin 2 can continue to receive the chips conveyed by the conveying mechanism 3 in the receiving groove 61.

[0032] In some embodiments, refer to Figure 2 As shown, the lifting assembly 11 is constructed as a scissor lift, which includes a base 111, multiple X-shaped scissor arms 112, a lifting platform 113, and a drive unit 114. The base 111 is connected to the bottom wall of the receiving groove 61. In the vertical direction, the lowermost scissor arm 112 is hinged to the base 111, and the uppermost scissor arm 112 is hinged to the lifting platform 113. The lifting platform 113 can be used to support the waste bin 2. The drive unit 114 can be constructed as a cylinder, hydraulic cylinder, etc. The drive unit 114 is hinged between two adjacent scissor arms 112. When the drive unit 114 extends, it can drive the scissor arms 112 to unfold in the vertical direction, so that the lifting platform 113 rises. The lifting platform 113 can drive the waste bin 2 to rise. When the drive unit 114 retracts, it can drive the scissor arms 112 to retract in the vertical direction, so that the lifting platform 113 descends. The waste bin 2 can descend synchronously with the lifting platform 113.

[0033] In other embodiments not shown in the figures, the lifting assembly 11 includes a support, a base, and a cylinder. In the vertical direction, the two ends of the cylinder are connected to the support and the base, respectively. The base is connected to the bottom wall of the receiving groove 61. The support is used to support the waste bin 2. The extension and retraction of the cylinder can drive the support to rise and fall, so that the support can drive the waste bin 2 to rise and fall.

[0034] In some embodiments of this utility model, the drive mechanism 1 further includes a moving component 12, which is disposed in the receiving groove 61 and connected to the lifting component 11. The moving component 12 is used to drive the lifting component 11 to move closer to and away from the conveying mechanism 3.

[0035] It is understood that the moving component 12 is used to drive the lifting component 11 closer to and away from the conveying mechanism 3. That is, the moving component 12 can drive the lifting component 11 closer to the conveying mechanism 3, and the moving component 12 can also drive the lifting component 11 away from the conveying mechanism 3, as shown in the reference. Figure 1 and Figure 2 As shown, when the moving component 12 drives the lifting component 11 to move closer to the conveying mechanism 3, that is, when the moving component 12 drives the lifting component 11 to move backward, the lifting component 11 can drive the waste bin 2 to move synchronously towards the conveying mechanism 3, so that the waste bin 2 can receive the chips transported by the conveying mechanism 3. When the moving component 12 drives the lifting component 11 away from the conveying mechanism 3, that is, when the moving component 12 drives the lifting component 11 to move forward, the lifting component 11 can drive the waste bin 2 to move synchronously away from the conveying mechanism 3. During the process of the lifting component 11 driving the waste bin 2 to rise and fall, the risk of interference between the lifting component 11 and the waste bin 2 and the conveying mechanism 3 can be reduced, so that the waste bin 2 can rise and fall smoothly.

[0036] In some embodiments, the moving component 12 may include a guide rail, a slider, and a cylinder. The slider is connected to the lifting component 11. For example, in some embodiments, the slider is connected to the base 111 of the lifting component 11. The slider is slidably connected to the guide rail, which is connected to the bottom wall of the receiving groove 61. In the front-back direction, one end of the cylinder is connected to the side wall of the receiving groove 61, and the other end is connected to the lifting component 11. The cylinder can drive the lifting component 11 to move in the front-back direction. When the cylinder drives the lifting component 11 to move forward, the lifting component 11 can be moved away from the conveying mechanism 3. When the cylinder drives the lifting component 11 to move backward, the lifting component 11 can be moved closer to the conveying mechanism 3.

[0037] In other embodiments, the moving component 12 may be configured as a linear motor, which is connected to the lifting component 11 in a transmission manner. The linear motor can drive the lifting component 11 to move forward when rotating forward, so that the lifting component 11 moves away from the conveying mechanism 3. The linear motor can drive the lifting component 11 to move backward when rotating in reverse, so that the lifting component 11 moves closer to the conveying mechanism 3.

[0038] In some embodiments of this utility model, the chip removal device 10 further includes: a conveying trough 62, which is located below the ground and communicates with the receiving trough 61. The conveying mechanism 3 is at least partially located in the conveying trough 62 to transport the chips that fall into the conveying trough 62 to the waste chip bucket 2.

[0039] Specifically, the conveying trough 62 is located below the ground and communicates with the receiving trough 61. The conveying trough 62 and the receiving trough 61 can form a "T"-shaped groove located below the ground. After the cutting material falls into the conveying trough 62, it can be transported by the conveying mechanism 3 to the waste cutting bucket 2 in the receiving trough 61. All or part of the conveying mechanism 3 is located in the conveying trough 62, which can reduce the space occupied by the conveying mechanism 3 above the ground, so as to facilitate the compact layout of machine tool production lines above the ground.

[0040] Preferably, the drive mechanism 1 is located entirely within the receiving groove 61, and the conveying mechanism 3 is located entirely within the conveying groove 62. The drive mechanism 1 can drive the waste chip bucket 2 to move entirely into the receiving groove 61, thereby realizing a concealed chip removal device 10 and effectively reducing the space occupied above ground by the chip removal device 10.

[0041] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 As shown, the conveying mechanism 3 is constructed as a belt conveyor. The belt conveyor operates smoothly with low noise and has good versatility, capable of conveying chips of various shapes such as powder, granules, and blocks.

[0042] In some other embodiments of this utility model that are not shown in the figures, the conveying mechanism 3 may include a telescopic rod and a push plate. One end of the telescopic rod is connected to the inner wall of the conveying groove 62 and the other end is connected to the push plate. When the telescopic rod extends, it can drive the push plate to push the chips in the conveying groove 62 to transport the chips to the waste chip bucket 2 in the receiving groove 61. The conveying mechanism 3 has a simple structure and is easy to implement.

[0043] In some embodiments of this utility model, reference is made to Figure 1 As shown, the chip removal device 10 also includes a ground cover mechanism 4, which covers the opening of the receiving groove 61 to prevent pedestrians from falling into the receiving groove 61 and reduce the risk of accidents. In addition, machine tools can be arranged above the ground cover mechanism 4 to make full use of space, so as to facilitate the layout of a compact machine tool production line above the ground, which is conducive to improving the compactness of the machine tool production line, shortening the logistics path of the machine tool production line, shortening the material transportation time, and improving the production efficiency of the machine tool production line.

[0044] In some embodiments of this utility model, reference is made to Figure 1 As shown, the ground cover mechanism 4 includes: a cover body 41, a chip discharge cover 42, and an opening and closing assembly 43. The cover body 41 is fixed in the groove of the receiving groove 61. The cover body 41 has a chip discharge port, which is located on the side of the cover body 41 away from the conveying mechanism 3. One of the inner wall of the receiving groove 61 and the cover body 41 is connected to the chip discharge cover 42 through the opening and closing assembly 43. The opening and closing assembly 43 is used to drive the chip discharge cover 42 to close and open the chip discharge port.

[0045] It is understood that one of the inner wall of the receiving groove 61 and the cover plate body 41 is connected to the chip discharge cover 42 through the opening and closing component 43. That is, the inner wall of the receiving groove 61 is connected to the chip discharge cover 42 through the opening and closing component 43, or the cover plate body 41 is connected to the chip discharge cover 42 through the opening and closing component 43. The opening and closing component 43 is used to drive the chip discharge cover 42 to close and open the chip discharge port. That is, the opening and closing component 43 can drive the chip discharge cover 42 to close the chip discharge port, and the opening and closing component 43 can also drive the chip discharge cover 42 to open the chip discharge port.

[0046] The chip discharge port can be opened to pick up and put down the waste chip bucket 2. That is, the waste chip bucket 2 can be moved out of and into the receiving groove 61 through the chip discharge port. The chip discharge port is located on the side of the cover plate body 41 away from the conveying mechanism 3. During the process of picking up and putting down the waste chip bucket 2, the risk of interference between the waste chip bucket 2 and the conveying mechanism 3 can be reduced, so as to facilitate the smooth picking up and putting down of the waste chip bucket 2. The chip discharge port can be closed to prevent pedestrians from falling into the receiving groove 61 and reduce the risk of accidents.

[0047] In some embodiments of this utility model, the chip discharge cover 42 includes a support frame and a transparent plate, the transparent plate being installed inside the support frame, and the support frame being connected to the opening and closing assembly 43. The support frame can be constructed as a rectangular frame, and its material can be steel or aluminum alloy, which helps to ensure the structural strength of the support frame. The transparent plate can be constructed as tempered glass or acrylic sheet.

[0048] Understandably, the transparent panel provides a real-time observation window, allowing production line personnel to monitor the accumulation of chips in the waste chip bin 2 without opening the chip discharge port. When there is a large accumulation of chips in the waste chip bin 2, the waste chip bin 2 can be removed from the receiving tank 61 in a timely manner, thereby cleaning up the chips in the waste chip bin 2 in a timely manner and preventing the chips in the waste chip bin 2 from overflowing.

[0049] In some embodiments of this utility model, the support frame is also hinged to the cover plate body 41. The cover plate body 41 can support and limit the support frame. When the opening and closing component 43 drives the chip discharge cover 42 to move, the risk of the chip discharge cover 42 shaking can be reduced.

[0050] Understandably, when the opening and closing component 43 drives the chip discharge cover 42, the chip discharge cover 42 can be flipped relative to the cover plate body 41. When the opening and closing component 43 drives the chip discharge cover 42 to flip upward, the chip discharge port can be opened. When the closing component drives the chip discharge cover 42 to flip downward, the chip discharge port can be closed.

[0051] In some embodiments, refer to Figure 1 and Figure 2 As shown, the inner wall of the receiving groove 61 is connected to the chip discharge cover 42 via the opening and closing assembly 43. Specifically, the opening and closing assembly 43 can be constructed as a pneumatic rod, with one end connected to the inner wall of the receiving groove 61 and the other end connected to the support frame. (Refer to...) Figure 2As shown, the extension of the opening and closing component 43 can drive the chip discharge cover 42 to flip upward to open the chip discharge port, so as to facilitate the removal and placement of the waste chip bucket 2. (Refer to...) Figure 1 As shown, the shortening of the opening / closing assembly 43 can drive the chip discharge cover 42 to flip downwards to close the chip discharge port, preventing pedestrians from falling into the receiving groove 61 through the chip discharge port and reducing the risk of accidents. In addition, at least a portion of the opening / closing assembly 43 in this embodiment is located within the receiving groove 61, which can reduce the risk of the opening / closing assembly 43 colliding with objects or pedestrians outside the receiving groove 61, thereby reducing the risk of damage to the opening / closing assembly 43.

[0052] In other embodiments not shown in the figures, the cover body 41 is connected to the chip discharge cover 42 via an opening and closing assembly 43. Specifically, the opening and closing assembly 43 can be configured as a drive motor, which can be fixed on the cover body 41. The drive shaft of the drive motor is connected to the support frame. When the drive shaft rotates clockwise, it can drive the chip discharge cover 42 to flip upward to open the chip discharge port, so as to facilitate the removal and placement of the waste chip bucket 2. When the drive shaft rotates counterclockwise, it can drive the chip discharge cover 42 to flip downward to close the chip discharge port, preventing pedestrians from falling into the receiving groove 61 through the chip discharge port and reducing the risk of accidents.

[0053] In some embodiments of this utility model, reference is made to Figure 1 As shown, the ground cover mechanism 4 also includes a support column 44, which is located in the receiving groove 61. One end of the support column 44 is connected to the inner wall of the receiving groove 61, and the other end of the support column 44 is connected to the cover body 41.

[0054] Understandably, referring to Figure 1 As shown, in the vertical direction, the lower end of the support column 44 is connected to the bottom wall of the receiving groove 61, and the upper end of the support column 44 is connected to the cover plate body 41. The support column 44 can support the cover plate body 41, improve the load-bearing capacity of the cover plate body 41, and reduce the risk of the cover plate body 41 sinking and breaking. There are multiple support columns 44, which can support different parts of the cover plate body 41 respectively, which is beneficial for the cover plate body 41 to be evenly stressed and reduces the risk of local deformation.

[0055] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2As shown, the chip removal device 10 also includes a pneumatic control station 5, which is located in the receiving tank 61. The pneumatic control station 5 can be used to control the operation of pneumatic components such as cylinders and air rods of the chip removal device 10. The pneumatic control station 5 can communicate with the controller, which has a control program. When the waste chip bucket 2 needs to be removed from the receiving tank 61, the production line personnel can press the removal button on the controller. The control program can control the moving component 12 to drive the lifting component 11 to move forward, control the opening and closing component 43 to drive the chip discharge cover 42 to flip upward, and control the lifting component 11 to drive the waste chip bucket 2 to rise, so that the waste chip bucket 2 is at least partially moved out of the receiving tank 61 automatically. When the waste chip bucket 2 needs to be put back into the receiving tank 61, the production line personnel can press the recycling button on the controller. The control program can control the lifting component 11 to drive the waste chip bucket 2 to fall, control the moving component 12 to drive the lifting component 11 to move backward, and control the opening and closing component 43 to drive the chip discharge cover 42 to flip downward, so that the waste chip bucket 2 is moved into the receiving tank 61, realizing the automatic reset and recycling of the waste chip bucket 2. The chip discharge device 10 of this embodiment can realize one-button automatic removal and reset recycling of the waste chip bucket 2, which helps to reduce the workload of the production line personnel.

[0056] The chip removal device 10 according to the present utility model embodiment can reduce the area occupied, enable a more compact layout of the production line, reduce the logistics path, and improve the aesthetics of the production line. It has high practicality. The hidden automatic chip removal device 10 of this embodiment can be used in large gantry double spindle machining centers.

[0057] Reference Figure 1 and Figure 2 As shown, a machining center 100 according to another embodiment of the present invention includes: a chip removal device 10 and a machine tool body 20. The chip removal device 10 is the same as the chip removal device 10 described in the above embodiment. The machine tool body 20 is installed above the ground, and the receiving groove 61 is offset from the machine tool body 20.

[0058] Understandably, the machine tool body 20 is mounted above the ground, and the receiving slot 61 is offset from the machine tool body 20. This means that, in the vertical direction, the projection of the machine tool body 20 is located outside the receiving slot 61. This reduces the risk of interference between the waste bin 2 and the machine tool body 20 during the loading and unloading of the waste bin 2. The machine tool body 20 can be a CNC metal cutting machine tool, capable of high-precision and high-efficiency automated machining, and the machining center 100 can be a gantry twin-spindle machining center.

[0059] According to the embodiment of the present utility model, the machining center 100 has a receiving groove 61 located below the ground. The waste chip bucket 2 and at least part of the drive mechanism 1 are located in the receiving groove 61. This can reduce the space occupied by the chip removal device 10 above the ground, so as to facilitate the compact layout of the machine tool production line above the ground. This can shorten the logistics path of the machine tool production line, shorten the material transportation time, and help improve the production efficiency of the machine tool production line.

[0060] In some embodiments of this utility model, at least a portion of the conveying groove 62 corresponds to the machine tool body 20. That is, in the vertical direction, the projection of at least a portion of the conveying groove 62 is located inside the projection of the machine tool body 20. The chips generated by the machine tool body 20 can automatically fall into the conveying groove 62 under the action of gravity, so as to facilitate the collection and discharge of chips.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0062] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A chip removal device, characterized in that, include: A receiving groove (61) is provided below the ground; A drive mechanism (1) and a waste bin (2), wherein the drive mechanism (1) is at least partially disposed within the receiving groove (61), and the drive mechanism (1) is used to drive the waste bin (2) to move into and at least partially move out of the receiving groove (61); A conveying mechanism (3) is used to transport chips to the waste chip barrel (2) in the receiving tank (61).

2. The chip removal device according to claim 1, characterized in that, The drive mechanism (1) includes a lifting assembly (11), the waste bin (2) is mounted on the lifting assembly (11), and the lifting assembly (11) is used to drive the waste bin (2) to lift.

3. The chip removal device according to claim 2, characterized in that, The drive mechanism (1) further includes a moving component (12), which is disposed in the receiving groove (61) and connected to the lifting component (11). The moving component (12) is used to drive the lifting component (11) to move closer to and away from the conveying mechanism (3).

4. The chip removal device according to claim 1, characterized in that, The chip removal device further includes a conveying trough (62), which is located below the ground and communicates with the receiving trough (61). The conveying mechanism (3) is at least partially located in the conveying trough (62) to transport the chips that fall into the conveying trough (62) to the waste chip bucket (2).

5. The chip removal device according to any one of claims 1-4, characterized in that, The chip removal device also includes a ground cover mechanism (4), which covers the opening of the receiving groove (61).

6. The chip removal device according to claim 5, characterized in that, The ground cover mechanism (4) includes: Cover plate body (41), the cover plate body (41) is fixed in the groove of the receiving groove (61), the cover plate body (41) has a chip discharge port, and the chip discharge port is located on the side of the cover plate body (41) away from the conveying mechanism (3). A chip discharge cover (42) and an opening and closing assembly (43) are provided. One of the inner wall of the receiving groove (61) and the cover body (41) is connected to the chip discharge cover (42) through the opening and closing assembly (43). The opening and closing assembly (43) is used to drive the chip discharge cover (42) to close and open the chip discharge port.

7. The chip removal device according to claim 6, characterized in that, The chip discharge cover (42) includes a support frame and a transparent plate, the transparent plate being installed inside the support frame, and the support frame being connected to the opening and closing assembly (43).

8. The chip removal device according to claim 7, characterized in that, The support frame is also hinged to the cover plate body (41).

9. The chip removal device according to claim 6, characterized in that, The ground cover mechanism (4) further includes a support column (44), which is located in the receiving groove (61). One end of the support column (44) is connected to the inner wall of the receiving groove (61), and the other end of the support column (44) is connected to the cover body (41).

10. A machining center, characterized in that, include: The chip removal device is the chip removal device according to any one of claims 1-9; The machine tool body (20) is mounted above the ground, and the receiving groove (61) is offset from the machine tool body (20).

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