Ceramic gas nozzle inner hole polishing device

By polishing the inner hole of the ceramic gas nozzle using a pressurizing device and a connecting fixture system, the problem of inconsistent inner hole roughness is solved, achieving uniform polishing of the inner hole, preventing particle shedding, and improving the stability of gas delivery and the performance of semiconductor devices.

CN224544259UActive Publication Date: 2026-07-24SUZHOU KEY MATERIALS TECH
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Patent Information

Application Number
CN202521793460.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-22
Publication Date
2026-07-24
Estimated Expiration
2035-08-22

AI Technical Summary

Technical Problem

The inconsistent roughness of the inner hole of existing ceramic gas nozzles makes it easy for particles to fall off, affecting the stability of gas delivery and wafer cleanliness, and reducing the yield and reliability of semiconductor devices.

Method used

A pressurizing device and a connecting fixture system are used to polish the inner hole of the ceramic gas nozzle by delivering polishing fluid through pipelines. The flow rate gradient of the polishing fluid and the cutting action of the abrasive particles are used to remove the texture of the inner hole and ensure uniform roughness.

Benefits of technology

It effectively reduces the roughness of the inner hole, prevents particles from falling out, improves the stability of gas delivery and the cleanliness of the wafer, and enhances the yield and reliability of semiconductor devices.

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Abstract

The utility model discloses a ceramic gas nozzle inner hole polishing device which comprises a pressurizing device, a polishing device, a polishing device and a polishing device. The connecting jig is communicated with the pressurizing device through a pipeline and is used for mounting a to-be-polished product; the multiple sets of to-be-polished products are detachably installed at the bottom of the connecting jig, so that the grinding liquid at the liquid supply end flows through the connecting jig through the pressurizing device, and then inner holes of the to-be-polished products are polished. The nozzle is locked and installed at the bottom of the connecting jig, matched grinding liquid flows through the connecting jig through a pipeline after being input into the pressurizing device and enters an inner hole of a part needing to be polished, inner hole lines can be effectively removed by controlling the matching body of the grinding liquid and adjusting the pressure of the pressurizing device, then the roughness of the inner hole is effectively reduced, and the polishing quality of the part needing to be polished is improved. And the relative consistency of roughness is guaranteed, and the problem that particles fall off during use can be effectively solved.
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