A ceramic gas nozzle inner hole polishing device

Abstract

The utility model discloses a kind of ceramic gas nozzle inner hole polishing device, comprising: pressurizing device, communicate with liquid supply end by pipeline, for pressurized conveying grinding liquid;Connecting fixture, communicate with pressurizing device by pipeline, for installing product to be polished;Wherein, multiple groups of product to be polished are detachably installed in the bottom of connecting fixture, so that the grinding liquid of liquid supply end is polished to the inner hole of product to be polished after flowing through connecting fixture by pressurizing device.The nozzle locking is installed in the bottom of connecting fixture in the utility model, and the grinding liquid with good proportion is input into pressurizing device, and then flows through connecting fixture by pipeline and enters the inner hole of required polishing component, by controlling the ligand of grinding liquid and adjusting the pressure of pressurizing device, the inner hole grain can be effectively removed, to effectively reduce the roughness of inner hole, and ensure the relative consistency of roughness, can effectively solve the problem of particle falling during use.

Description

Technical Field

[0001] This utility model relates to the field of polishing equipment technology, specifically to a ceramic gas nozzle inner hole polishing device. Background Technology

[0002] Ceramic gas nozzles are key components used inside semiconductor equipment. They are made of high-performance ceramic materials such as alumina and aluminum nitride, and have excellent high temperature resistance, corrosion resistance, high insulation and extremely low impurity release rate. They are suitable for core processes such as etching and thin film deposition, and can achieve precise flow control and stable delivery of gas.

[0003] The existing ceramic gas nozzles have textured patterns in different areas of the inner bore, resulting in poor roughness consistency and making it easy for particles to fall off during later use.

[0004] The surface quality of the inner hole of a ceramic gas nozzle is directly related to the stability of gas delivery and the cleanliness of the wafer. However, due to factors such as uneven grinding paths and differences in stress release during material sintering, different areas of the inner hole of existing ceramic gas nozzles have micro-textures. This causes significant fluctuations in the surface roughness parameters of the inner hole in different areas. The convex edges in some high-roughness areas and the smooth surfaces in low-roughness areas form a significant difference. When high-temperature reactive gases are introduced for a long time or when subjected to plasma erosion, ceramic particles at the texture are prone to peeling off due to repeated action of airflow shear force and thermal expansion and contraction stress. This contaminates the wafer surface, interferes with the precision and stability of key processes such as etching and deposition, and reduces the yield and reliability of semiconductor devices. Utility Model Content

[0005] The purpose of this utility model is to provide a ceramic gas nozzle inner hole polishing device to solve the above problems.

[0006] To achieve the above objectives, this utility model specifically adopts the following technical solution, including:

[0007] The pressurizing device is connected to the liquid supply end through a pipeline and is used to pressurize and deliver the grinding fluid.

[0008] The connecting fixture is connected to the pressurization device via pipeline and is used to mount the product to be polished;

[0009] Multiple sets of the products to be polished are detachably installed at the bottom of the connecting fixture, so that the polishing liquid at the supply end flows through the connecting fixture via a pressurizing device to polish the inner hole of the product to be polished.

[0010] As a further description of the above technical solution, the liquid supply end is connected to the pressurization device through a liquid supply pipeline, and the liquid supply end is a liquid storage tank.

[0011] As a further description of the above technical solution, the top of the connecting fixture is provided with a pressure port, and the bottom of the connecting fixture is provided with an installation port.

[0012] As a further description of the above technical solution, the connecting fixture is provided with an infusion port, which is connected to the pressurization port and the installation port respectively.

[0013] As a further description of the above technical solution, the pressurization port is connected to the pressurization device through a pressurization pipeline, and the mounting port is detachably installed with the product to be polished.

[0014] As a further description of the above technical solution, a sealing groove is provided below the mounting port, and the sealing groove abuts against the top of the product to be polished.

[0015] As a further description of the above technical solution, a collection device is provided below the product to be polished, and the collection device is a collection tank.

[0016] As a further description of the above technical solution, the inner hole of the product to be polished is a frustum shape, and the diameter of the inner hole of the product to be polished gradually decreases.

[0017] As a further description of the above technical solution, the top diameter of the inner hole is 1.4-1.6 mm.

[0018] As a further description of the above technical solution, the bottom diameter of the inner hole is 0.3-0.4 mm.

[0019] The beneficial effects of this utility model are as follows:

[0020] In this invention, the nozzle is locked and installed at the bottom of the connecting fixture. After the prepared polishing slurry is input into the pressurizing device, it flows through the pipeline through the connecting fixture into the inner hole of the part to be polished. By controlling the ligand of the polishing slurry and adjusting the pressure of the pressurizing device, the texture of the inner hole can be effectively removed, thereby effectively reducing the roughness of the inner hole and ensuring the relative consistency of the roughness. This can effectively solve the problem of particles falling off during use.

[0021] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the ceramic gas nozzle inner hole polishing device of this utility model;

[0023] Figure 2 yes Figure 1 Enlarged diagram of point A in the middle.

[0024] Figure label:

[0025] 1. Pressurizing device; 2. Liquid supply end; 21. Liquid storage tank; 3. Connecting fixture; 31. Pressurizing port; 32. Installation port; 33. Liquid inlet; 34. Sealing groove; 4. Product to be polished; 5. Liquid supply pipeline; 6. Pressurizing pipeline; 7. Collection device; 71. Collection tank. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0027] like Figures 1-2 As shown, in one embodiment, a ceramic gas nozzle inner hole polishing device includes: a pressurizing device 1 and a connecting fixture 3;

[0028] The pressurizing device 1 is connected to the liquid supply end 2 through a pipeline and is used to pressurize and deliver the polishing slurry; while the connecting fixture 3 is connected to the pressurizing device 1 through a pipeline and is used to install the product 4 to be polished.

[0029] For example, multiple sets of products to be polished 4 can be detachably installed at the bottom of the connecting fixture 3, so that the polishing liquid from the supply end 2 flows through the connecting fixture 3 via the pressurizing device 1 to polish the inner hole of the product to be polished 4.

[0030] Please continue reading. Figures 1-2 In this embodiment, the liquid supply end 2 is connected to the pressurization device 1 through the liquid supply pipeline 5;

[0031] Specifically, the liquid supply end 2 can be a storage tank 21 with a constant temperature stirring function, used to store the grinding fluid (containing abrasive particles of a specific size and suspension medium) pre-mixed according to the process ratio, to ensure a uniform and stable supply of grinding medium; correspondingly, the pressurizing device 1 can be a plunger pump or a booster pump, etc., which continuously delivers the grinding fluid to the connecting fixture 3 at a controllable pressure through built-in precision pressure control components (such as servo pressure regulating valve, pressure sensor, etc.).

[0032] Furthermore, the top of the connecting fixture 3 is provided with a pressure port 31, which is connected to the pressure device 1 through the pressure pipe 6 to ensure that the pressure transmission is lossless; correspondingly, the bottom of the connecting fixture 3 is provided with an installation port 32 that matches the nozzle to be polished, and an annular sealing groove 34 is provided below the installation port 32. When the product to be polished 4 (ceramic gas nozzle) is locked to the installation port 32 by the bolt assembly, the leakage path of the polishing fluid can be completely blocked, ensuring the pressure stability during the polishing of the inner hole.

[0033] Specifically, the connecting fixture 3 is provided with an infusion port 33, which is connected to the pressurization port 31 and the installation port 32 respectively.

[0034] In addition, a collection device 7 is provided below the product 4 to be polished. The collection device 7 is an open collection tank 71, which can not only recover the polishing liquid flowing through the inner hole in real time (for subsequent filtration and reuse), but also indirectly judge the patency of the inner hole by observing the backflow status.

[0035] It should be noted that the inner hole of the product to be polished 4 is a frustum shape, and the diameter of the inner hole of the product to be polished 4 gradually decreases;

[0036] Specifically, the top diameter of the inner hole is 1.4-1.6 mm, while the bottom diameter of the inner hole is 0.3-0.4 mm.

[0037] Working principle: After the polishing nozzle is securely locked to the bottom of the connecting fixture 3 by the bolt assembly, the polishing slurry in the storage tank 21, prepared according to a specific concentration (e.g., abrasive ratio 15-20%) and particle size (e.g., micron-sized diamond particles), is transported to the pressurizing device 1. After the pressurizing device 1 stabilizes and adjusts the pressure to a preset pressure value (e.g., 0.3-0.5MPa), the high-pressure polishing slurry is injected at high speed into the nozzle inner hole along the inlet 33. During the flow through the inner hole, the polishing slurry generates a velocity gradient change due to the gradual narrowing of the channel. Combined with the impact and cutting action of the abrasive particles, it can specifically remove micro-textures such as strip-shaped scratches and mesh-like indentations in different areas of the inner hole. By dynamically adjusting the polishing slurry ratio and the output pressure of the pressurizing device 1, uniform polishing of the entire inner hole from the top to the outlet can be achieved.

[0038] Through the above technical solution, this application effectively reduces the roughness of the inner hole and ensures the relative consistency of the roughness, which can effectively solve the problem of particles falling off during use.

[0039] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A ceramic gas nozzle inner hole polishing device, characterized in that, include: The pressurizing device is connected to the liquid supply end through a pipeline and is used to pressurize and deliver the grinding fluid. The connecting fixture is connected to the pressurization device via pipeline and is used to mount the product to be polished; Multiple sets of the products to be polished are detachably installed at the bottom of the connecting fixture, so that the polishing liquid at the supply end flows through the connecting fixture via a pressurizing device to polish the inner hole of the product to be polished.

2. The ceramic gas nozzle inner hole polishing device according to claim 1, characterized in that, The liquid supply end is connected to the pressurization device through a liquid supply pipeline, and the liquid supply end is a liquid storage tank.

3. The ceramic gas nozzle inner hole polishing device according to claim 1, characterized in that, The connecting fixture has a pressure port at the top and an installation port at the bottom.

4. The ceramic gas nozzle inner hole polishing device according to claim 3, characterized in that, The connecting fixture has an infusion port inside, which is connected to a pressurization port and an installation port.

5. The ceramic gas nozzle inner hole polishing device according to claim 3, characterized in that, The pressurization port is connected to the pressurization device through a pressurization pipeline, and the mounting port is detachable for mounting the product to be polished.

6. The ceramic gas nozzle inner hole polishing device according to claim 3, characterized in that, A sealing groove is provided below the mounting port, and the sealing groove abuts against the top of the product to be polished.

7. The ceramic gas nozzle inner hole polishing device according to claim 6, characterized in that, A collection device, which is a collection tank, is provided below the product to be polished.

8. The ceramic gas nozzle inner hole polishing device according to claim 6, characterized in that, The inner hole of the product to be polished is truncated cone-shaped, and the diameter of the inner hole gradually decreases.

9. The ceramic gas nozzle inner hole polishing device according to claim 8, characterized in that, The top diameter of the inner hole is 1.4-1.6 mm.

10. The ceramic gas nozzle inner hole polishing device according to claim 8, characterized in that, The bottom diameter of the inner hole is 0.3-0.4 mm.

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