Spatial transcription chip clamping mold
By designing a spatial transcription chip clamping mold with a heating base, clamping components, and diaphragm components, the problem of inconsistent temperature control and chip positioning was solved, ensuring the reliability and repeatability of experimental results and preventing chip breakage and cross-contamination.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU LASSO BIOCHIP TECH CO LTD
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-24
AI Technical Summary
Existing spatial transcription chip clamping devices are not well-suited to PCR instruments in terms of temperature control and chip positioning, resulting in poor accuracy and reliability of experimental results, and the chips are easily broken.
A clamping mold comprising a heating base, a clamping component, a diaphragm component, and a chip holder was designed. The separate design of the heating base and the chip holder ensures temperature consistency and stability, while the diaphragm component prevents chip breakage and cross-contamination.
This improves the reliability and repeatability of experimental results, prevents chip breakage, ensures temperature uniformity and airtightness, and reduces the risk of cross-contamination.
Smart Images
Figure CN224548406U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of spatial transcriptomics technology, and in particular to a spatial transcription chip clamping mold. Background Technology
[0002] Spatial transcriptomics combines high-throughput sequencing with spatial localization techniques to achieve precise localization and analysis of gene expression information within tissues. It addresses the problem of traditional transcriptome sequencing (such as RNA-seq) completely losing spatial location information about gene expression.
[0003] The spatial transcriptomics process involves a series of biochemical reactions on tissue sections, including permeabilization, reverse transcription, and second-strand synthesis. These biochemical reactions require precise temperature and time control. Therefore, it is crucial to isolate specific tissue regions on the spatial transcriptomics chip and perform precise temperature and time control. Existing spatial transcription chip clamping devices, such as the one disclosed in utility model patent CN216979132U, include: a base, a cover, and an elastic element; wherein, the cover has a fastened state and an open state. In the fastened state, the cover is fastened to the base, and in the open state, the cover is opened from the base; a spatial transcription chip can be installed on the side of the cover that is fastened to the base. The first end of the elastic element is connected to the base, and the second end protrudes from the base to abut against the spatial transcription chip. The first end of the elastic element is connected to the base, and the second end abuts against the spatial transcription chip. Under the pressure of the base and the spatial transcription chip, the spatial transcription chip can be pressed tightly to prevent it from loosening. Furthermore, there is a sealing effect between the elastic element and the base, and between the elastic element and the cover, so as not to leak liquid.
[0004] In existing spatial transcriptomics experiments, the chip is usually placed in a PCR instrument for reaction. Therefore, the compatibility of the clamping mold used to position the chip with the PCR instrument, as well as the consistency and stability of the chip temperature with the PCR instrument plate, directly affect the accuracy and reliability of the experimental results. The existing technologies mentioned above have not made any improvements to the consistency of the chip temperature with the PCR instrument plate.
[0005] In addition, since this technology usually uses specially made glass slide gene chips, it is necessary to ensure that the chips are not crushed or cracked when assembling and pressing the chips with clamping molds, especially at the corners of the chips, where stress concentration can easily cause the chips to break. Utility Model Content
[0006] Therefore, in order to solve the above problems, this utility model provides a spatial transcription chip clamping mold.
[0007] This utility model is achieved through the following technical solution:
[0008] A spatial transcription chip clamping mold, comprising:
[0009] A heating base, wherein a heating plate is provided on the top of the heating base and multiple heat-conducting columns are arranged on the bottom of the heating base;
[0010] The clamping component includes a clamping cover and positioning components rotatably connected to both sides of the bottom of the clamping cover. The inner side of the clamping cover is provided with a mounting groove, and the top of the mounting groove is provided with a reaction hole.
[0011] A diaphragm component, disposed within the mounting groove, includes a plurality of mutually isolated through holes, the through holes being disposed opposite to the reaction holes;
[0012] A chip holder is disposed between the positioning member and the clamping cover. The upper surface of the chip holder is provided with a chip receiving groove for positioning the chip. The chip receiving groove is located at the bottom of the diaphragm member, and the bottom of the chip receiving groove is provided with a clearance hole. The heating plate passes through the clearance hole, so that the upper surface of the heating plate is located at the bottom of the chip receiving groove, forming a heating surface for placing the chip.
[0013] Preferably, each positioning element includes a support portion for supporting the chip holder and a connecting portion vertically disposed at both ends of the support portion. The four connecting portions are connected to the four corners of the clamping cover, and the chip holder is assembled between the clamping cover and the support portion.
[0014] Preferably, each of the connecting parts is rotatably connected to the corner of the clamping cover by a pin.
[0015] Preferably, the chip holder has limiting grooves at its four corners to avoid the connecting part.
[0016] Preferably, the bottom of the clamping cover is provided with a positioning pin, and the chip holder is provided with a positioning pin hole corresponding to the positioning pin.
[0017] Preferably, the chip receiving slot is provided with first arc-shaped clearance slots extending outward at the four corners.
[0018] Preferably, a second arc-shaped clearance groove is provided at the four corners of the mounting groove on the inner side of the clamping cover.
[0019] Preferably, the heat-conducting columns at the bottom of the heating base are frustoconical in shape, and all heat-conducting columns have the same shape and size.
[0020] Preferably, an assembly space is formed between the support portions of the two positioning members, and the heating base extends into the assembly space.
[0021] The beneficial effects of this utility model's technical solution are mainly reflected in:
[0022] 1. The clamping components include positioning components and clamping caps. The chip holder is located between the positioning components and the clamping caps, ensuring the stability and accuracy of chip positioning. The heating plate on the heating base passes through the clearance holes of the chip holder and directly contacts the chip placed in the chip receiving slot. On the one hand, this ensures a tight fit between the heating base, the chip holder, and the clamping components. The multiple heat-conducting pillars and heating plates arranged at the bottom of the heating base, which are compatible with the PCR instrument heating plate, together form an efficient heat transfer path. This ensures that the temperature of each reaction area of the chip is highly consistent with the set temperature of the PCR instrument heating plate, providing a crucial uniform and stable thermal environment for temperature-sensitive steps in space transcriptomics, greatly improving the reliability and reproducibility of experimental results. On the other hand, the chip holder can completely surround the outer periphery of the chip, ensuring that the temperature around the chip is consistent with the temperature of the base, avoiding temperature inconsistencies around the chip due to the presence of chip pick-up and drop holes, and preventing the chip from breaking when the clamping cap is pressed down.
[0023] 2. The diaphragm between the clamping cap and the chip can serve as both an elastic buffer structure and an isolation structure on the top of the chip. On the one hand, it can prevent direct hard contact with the chip surface when the clamping cap is pressed down, thus avoiding damage to the chip. On the other hand, the through holes of the diaphragm form an independent sealed reaction chamber above the chip reaction area, effectively preventing the evaporation loss of the reaction liquid and ensuring the airtightness between different reaction chambers, thereby avoiding the risk of cross-contamination.
[0024] 3. The diaphragm is installed in the mounting groove inside the clamping cover for easy replacement. When different chips need to be tested, there is no need to change the clamping mold. Cross-contamination between different chips can be avoided by directly replacing the diaphragm. The second arc-shaped clearance groove is set at the four corners of the mounting groove, making the disassembly and replacement of the diaphragm more convenient.
[0025] 4. The separate design of the heating base and the chip socket reduces the risk of chip breakage during placement. At the same time, the heating base, the chip socket, and the clamping components can be disassembled and combined, making operation more convenient. By setting the first arc-shaped relief groove at the four corners of the chip socket, it can be ensured that the chip socket does not make hard contact with the corners of the chip, avoiding stress concentration at the corners of the chip and thus preventing chip breakage. Attached Figure Description
[0026] Figure 1 This is a 3D view of the space transcription chip clamping mold;
[0027] Figure 2 This is a top view of the space transcription chip clamping mold;
[0028] Figure 3 yes Figure 2 A sectional view along the middle AA;
[0029] Figure 4 This is a 3D view of the space transcription chip clamping mold (the clamping cap is omitted here).
[0030] Figure 5 This is in Embodiment 1 of this utility model;
[0031] Figure 6 This is an exploded view of the space transcription chip clamping mold. Detailed Implementation
[0032] To make the objectives, advantages, and features of this utility model clearer and more detailed, the following non-limiting description of preferred embodiments will be illustrated and explained. These embodiments are merely typical examples of applying the technical solutions of this utility model; any technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this utility model.
[0033] It should also be stated that, in the description of the solution, the terms "center", "upper", "lower", "left", "right", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0034] Furthermore, the terms "first" and "second" in this solution are used for descriptive purposes only and should not be construed as indicating or implying a ranking of importance, or implicitly specifying the number of technical features shown. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In this utility model, "multiple" means two or more, unless otherwise explicitly specified.
[0035] This utility model discloses a spatial transcription chip clamping mold, such as Figure 1 , Figure 6 As shown, it includes:
[0036] A heating base 1 is provided with a heating plate 2 on its top and multiple heat-conducting columns 3 arranged on its bottom. The heat-conducting columns 3 are matched with the reaction holes 402 on the heating base plate of the PCR instrument. Under the heat conduction of the heat-conducting columns 3 and the heating plate 2, the temperature of each reaction area of the chip 6 is kept highly consistent with the set temperature of the heating base plate of the PCR instrument. In a preferred embodiment, the heat-conducting columns 3 at the bottom of the heating base 1 are frustoconical in shape, and all heat-conducting columns 3 are the same in shape and size. The number and arrangement of the heat-conducting columns 3 at the bottom of the heating base 1 can be matched according to the number and position of the reaction slots on the heating base plate of the PCR instrument. The materials of the heat-conducting columns 3, the heating base 1 and the heating plate 2 can be metal or other materials with good thermal conductivity, which will not be elaborated here.
[0037] The clamping component includes a clamping cover 4 and positioning components 5 rotatably connected to the bottom sides of the clamping cover 4. The inner side of the clamping cover 4 is provided with a mounting groove 401, and the top of the mounting groove 401 is provided with a reaction hole 402.
[0038] The diaphragm component 8 is disposed in the mounting groove 401 and includes a plurality of mutually isolated through holes 801, the through holes 801 being disposed opposite to the reaction holes 402;
[0039] A chip holder 7 is disposed between the positioning member 5 and the clamping cover 4. The upper surface of the chip holder 7 is provided with a chip receiving groove 701 for positioning the chip 6. The height of the chip receiving groove 701 is preferably matched with the thickness of the chip 6. The chip receiving groove 701 is located at the bottom of the diaphragm member 8, and the bottom of the chip receiving groove 701 is provided with a clearance hole 704. The heating plate 2 passes through the clearance hole 704, so that the upper surface of the heating plate 2 is located at the bottom of the chip receiving groove 701, forming a heating surface for placing the chip 6. When the chip 6 is placed in the chip receiving groove 701, the bottom of the chip 6 is in direct contact with the heating surface, realizing temperature conduction between the chip 6 and the heating base plate of the PCR instrument.
[0040] like Figure 1 , Figure 3As shown, in the above structure, since the chip receiving groove 701 is located at the bottom of the diaphragm 8, after the chip 6 is assembled, when the clamping cover 4 clamps the chip holder 7, the bottom of the diaphragm 8 abuts against the upper surface of the chip 6, and the multiple through holes 801 on the diaphragm 8 and the detection area on the upper surface of the chip 6 together form multiple mutually isolated reaction chambers. The analyte can enter the reaction chamber through the reaction hole 402 for detection. The diaphragm 8 is made of elastic material, so when the diaphragm 8 abuts against the upper surface of the chip 6, it can ensure the airtightness between each reaction chamber and ensure that each reaction chamber does not interfere with each other. At the same time, the diaphragm 8 also forms a buffer between the clamping cover 4 and the chip 6, thereby avoiding hard contact between the clamping cover 4 and the chip 6 and causing the chip 6 to break. In a preferred embodiment, the diaphragm 8 can also use existing low-absorption diaphragm material, thereby avoiding the diaphragm from adsorbing together with the chip 6 due to excessive clamping time.
[0041] like Figure 1 , Figure 3 , Figure 4 As shown, in some embodiments, each positioning element 5 includes a support portion 501 for supporting the chip holder 7 and a connecting portion 502 vertically disposed at both ends of the support portion 501. The connecting portion 502 is used to connect the clamping cover 4. The four connecting portions 502 are sequentially connected to the four corners of the clamping cover 4. The chip holder 7 is assembled between the clamping cover 4 and the support portion 501, thereby achieving the stability of the chip 6 assembly. Figure 4 As shown, in some embodiments, each connecting part 502 is rotatably connected to the corner of the clamping cover 4 via a pin 9. Each connecting part 502 has a pin hole on its contact surface with the clamping cover 4. The pin 9 passes through the connecting part 502 and corresponds one-to-one with the pin hole, thus allowing the connecting part 502 to be rotatably connected to the clamping cover 4. Furthermore, two connecting parts 502 on the same positioning member 5 are respectively attached to the two ends of the clamping cover 4. The relative positions of the positioning member 5 and the clamping cover 4 are changed by rotation to achieve the assembly and disassembly of the chip holder 7 and the clamping cover 4. Specifically, when assembling the chip holder 7, one of the positioning members 5 is first rotated to the bottom of the clamping cover 4, and one side of the chip holder 7 is fixed between the positioning member 5 and the clamping cover 4. Then, the other positioning member 5 is also rotated to the bottom of the clamping cover 4, and the other side of the chip holder 7 is simultaneously fixed between the positioning member 5 and the clamping cover 4. When disassembling the chip holder 7, the chip holder 7 can be removed by rotating one of the positioning members 5.
[0042] like Figure 4As shown, in some embodiments, the four corners of the chip holder 7 are recessed inward and respectively form limiting grooves 703 for avoiding the connecting part 502. The connecting part 502 passes through the limiting grooves 703 at the corners of the chip holder 7 and connects to the pressing cover 4.
[0043] like Figure 4 , Figure 5 As shown, in some embodiments, a positioning pin 404 is also provided at the bottom of the clamping cover 4, and a positioning pin hole 705 corresponding to the positioning pin 404 is provided on the chip holder 7. The number and position of the positioning pin 404 can be adjusted according to actual needs. In one embodiment, two positioning pins 404 are provided at the bottom of the clamping cover 4, and the two positioning pins 404 are arranged diagonally to ensure the accuracy of positioning of the clamping cover 4 and the chip holder 7.
[0044] like Figure 6 As shown, in order to avoid stress concentration at the four corners of the chip 6 and cause the chip 6 to break, in some embodiments, the four corners of the chip receiving groove 701 are provided with a first arc-shaped clearance groove 702 extending outward, thereby avoiding hard contact between the corners of the chip 6 and the chip receiving groove 701, and ensuring that the chip 6 is not easily broken when it is placed and pressed.
[0045] like Figure 5 As shown, in order to make the same mold repeatable, it is necessary to replace the diaphragm 8 that is in direct contact with the chip 6 while replacing different chips 6. Therefore, in some embodiments, the four corners of the mounting groove 401 on the inner side of the clamping cover 4 are provided with second arc-shaped clearance grooves 403 extending outward, so as to facilitate the quick removal of the diaphragm 8 in the mounting groove 401 and the assembly of new diaphragm 8.
[0046] In some embodiments, an assembly space is formed between the support portions 501 of the two positioning members 5, and the heating base 1 extends into the assembly space, further improving the compactness of the clamping mold in the longitudinal direction. At the same time, after the chip holder 7 with the chip 6 is assembled with the clamping member, it can be directly placed on the heating base 1. At this time, the assembly space between the two support portions 501 is used to position the heating base 1, so that the heating plate 2 on the top of the heating base 1 extends into the clearance hole 704.
[0047] This utility model has many other embodiments. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this utility model.
Claims
1. A spatial transcription chip clamping mold, characterized in that: include: Heating base (1), the top of the heating base (1) is provided with a heating plate (2), and the bottom of the heating base (1) is arranged with multiple heat-conducting columns (3). The clamping component includes a clamping cover (4) and a positioning component (5) rotatably connected to both sides of the bottom of the clamping cover (4). The clamping cover (4) has an installation groove (401) on its inner side and a reaction hole (402) on its top. A diaphragm element (8) is disposed in the mounting groove (401) and includes a plurality of mutually isolated through holes (801), wherein the through holes (801) are disposed opposite to the reaction holes (402); A chip holder (7) is disposed between the positioning member (5) and the clamping cover (4). The upper surface of the chip holder (7) is provided with a chip receiving groove (701) for positioning the chip (6). The chip receiving groove (701) is located at the bottom of the diaphragm member (8), and the bottom of the chip receiving groove (701) is provided with a clearance hole (704). The heating plate (2) passes through the clearance hole (704) so that the upper surface of the heating plate (2) is located at the bottom of the chip receiving groove (701), forming a heating surface for placing the chip (6).
2. The spatial transcription chip clamping mold according to claim 1, characterized in that: Each positioning component (5) includes a support portion (501) for supporting the chip holder (7) and a connecting portion (502) vertically disposed at both ends of the support portion (501). The four connecting portions (502) are connected to the four corners of the pressing cover (4). The chip holder (7) is assembled between the pressing cover (4) and the support portion (501).
3. The spatial transcription chip clamping mold according to claim 2, characterized in that: Each of the connecting parts (502) is rotatably connected to the corner of the clamping cover (4) by a pin (9).
4. The spatial transcription chip clamping mold according to claim 2, characterized in that: The chip holder (7) is provided with limiting grooves (703) at its four corners to avoid the connecting part (502).
5. The spatial transcription chip clamping mold according to claim 1, characterized in that: The bottom of the pressing cover (4) is provided with a positioning pin (404), and the chip holder (7) is provided with a positioning pin (404) hole (705) corresponding to the positioning pin (404).
6. The spatial transcription chip clamping mold according to claim 1, characterized in that: The chip receiving slot (701) has a first arc-shaped clearance slot (702) extending outward from its four corners.
7. The spatial transcription chip clamping mold according to claim 1, characterized in that: The mounting groove (401) inside the clamping cover (4) has a second arc-shaped clearance groove (403) extending outward from the four corners.
8. The spatial transcription chip clamping mold according to claim 1, characterized in that: The heat-conducting columns (3) at the bottom of the heating base (1) are in the shape of a frustum, and all heat-conducting columns (3) are the same in shape and size.
9. The spatial transcription chip clamping mold according to claim 2, characterized in that: An assembly space is also formed between the support portions (501) of the two positioning members (5), and the heating base (1) extends into the assembly space.