Space transcription chip clamping die
By designing a spatial transcription chip clamping mold with a heating base, clamping components, and diaphragm components, the problem of inconsistent temperature control and chip positioning was solved, ensuring the reliability and repeatability of experimental results and preventing chip breakage and cross-contamination.
Patent Information
- Application Number
- CN202521742000.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-24
- Estimated Expiration
- 2035-08-15
AI Technical Summary
Existing spatial transcription chip clamping devices are not well-suited to PCR instruments in terms of temperature control and chip positioning, resulting in poor accuracy and reliability of experimental results, and the chips are easily broken.
A clamping mold comprising a heating base, a clamping component, a diaphragm component, and a chip holder was designed. The separate design of the heating base and the chip holder ensures temperature consistency and stability, while the diaphragm component prevents chip breakage and cross-contamination.
This improves the reliability and repeatability of experimental results, prevents chip breakage, ensures temperature uniformity and airtightness, and reduces the risk of cross-contamination.