Surface plating structure of a conductive terminal

Abstract

The utility model provides a kind of surface plating structure of conductive terminal, including terminal body and composite coating, composite coating includes from inside to outside: base layer;Nickel plating layer, the outer surface of base layer is configured;Nickel tungsten alloy layer, the outer surface of nickel plating layer is configured;Gold plating layer, on nickel tungsten alloy layer is configured;Silver plating layer, on gold plating layer is configured;Platinum ruthenium alloy layer, the outer surface of silver plating layer is configured;Wherein, the gradient structure design of nickel plating layer, nickel tungsten alloy layer, the binding force between each plating layer and between plating layer and terminal body is strengthened, and inside gold plating, silver plating layer guarantees excellent conductivity and low contact resistance, platinum ruthenium alloy layer greatly enhances the mechanical wear resistance and environmental corrosion resistance of terminal, effectively cope with frequently plugged working condition, through the synergistic effect of each functional layer, solve the problem of poor charging caused by plating layer easy to wear, easy to corrode, significantly prolong the terminal life, improve the reliability and user satisfaction of product.

Description

Technical Field

[0001] This utility model relates to the field of terminal electroplating, and in particular to a surface electroplating structure for conductive terminals. Background Technology

[0002] As mobile phones become increasingly integrated into people's lives, their usage frequency leads to faster power consumption, resulting in more frequent charging. Technological advancements have also increased the durability of mobile phones. However, the plating on existing mobile phone charging terminals has a limited lifespan. The plating on ordinary terminals is mostly copper alloy with nickel or gold plating to ensure conductivity and corrosion resistance.

[0003] The lifespan of the plating decreases with the number of plugging and unplugging cycles, and wear and tear may even occur, causing the phone to function normally but with poor charging performance, requiring the replacement of the charging terminal. This can lead to a negative impression of the phone brand among consumers. Therefore, providing a charging terminal plating that is resistant to plugging and unplugging, corrosion, and wear has become a problem that needs to be overcome. Utility Model Content

[0004] (a) Technical problems to be solved In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a surface electroplating structure for conductive terminals, which solves the technical problem that the durability of charging terminals decreases with the increase of charging and unplugging cycles.

[0005] (II) Technical Solution The purpose of this utility model is to provide a surface electroplating structure for a conductive terminal, which includes a terminal body and a composite plating layer disposed on the outer surface of the terminal body. The composite plating layer includes, from the inside to the outside, the following components on the surface of the terminal body: base layer; A nickel plating layer is disposed on the outer surface of the base layer; A nickel-tungsten alloy layer is disposed on the outer surface of the nickel-plated layer; A gold plating layer is disposed on the nickel-tungsten alloy layer; and A silver plating layer is disposed on top of the gold plating layer; A platinum-ruthenium alloy layer is disposed on the outer surface of the silver plating layer. The platinum-ruthenium alloy layer improves the wear resistance of the conductive terminals under frequent insertion and removal conditions and the corrosion resistance in harsh environments.

[0006] Preferably, the base layer is made of copper or its alloy and has a thickness of 0.5 to 5 µm.

[0007] Preferably, the thickness of the nickel-tungsten alloy layer is 0.5 to 5 µm.

[0008] Preferably, the thickness of the gold plating layer is 0.025 to 0.5 µm.

[0009] Preferably, the thickness of the silver plating layer is 0.125 to 3 µm.

[0010] Preferably, the thickness of the platinum-ruthenium alloy layer is 0.125 to 3 µm.

[0011] Preferably, the terminal body is made of copper or its alloy.

[0012] (III) Beneficial Effects The structure, from the inside out, comprises a base layer, a nickel plating layer, a nickel-tungsten alloy layer, a gold plating layer, a silver plating layer, and an outermost platinum-ruthenium alloy layer. The gradient structure design of the nickel plating layer and the nickel-tungsten alloy layer enhances the bonding force between the plating layers and between the plating layer and the terminal body. The inner gold and silver plating layers ensure excellent conductivity and low contact resistance. The outer platinum-ruthenium alloy layer greatly enhances the terminal's resistance to mechanical wear and environmental corrosion, effectively coping with frequent insertion and removal conditions. Through the synergistic effect of each functional layer, the problem of poor charging caused by easy wear and corrosion of the plating layer is fundamentally solved, significantly extending the terminal's lifespan and improving product reliability and user satisfaction. Attached Figure Description

[0013] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain the technical solution of this utility model, and do not constitute a limitation on the technical solution of this utility model.

[0014] Figure 1 This is a schematic diagram of the surface electroplating structure of the conductive terminal;

[0015] Explanation of reference numerals in the attached figures: 1. Terminal body; 2. Base layer; 3. Nickel plating layer; 4. Nickel-tungsten alloy layer; 5. Gold plating layer; 6. Silver plating layer; 7. Platinum-ruthenium alloy layer. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0017] The following is in conjunction with the appendix Figure 1 To further describe, this utility model discloses a surface electroplating structure for a conductive terminal, including a terminal body 1 and a composite plating layer disposed on the outer surface of the terminal body 1. The composite plating layer, from the inside to the outside of the surface of the terminal body 1, includes, in sequence: First, a base layer 2 is deposited on the surface of the terminal body 1 by electroplating. The terminal body 1 is preferably made of high-conductivity copper, such as C5191 phosphor bronze or C1100 pure copper, to provide excellent conductivity and mechanical formability. The base layer 2 is also made of copper or its alloy as a stress buffer layer and bonding reinforcement layer, and its thickness is controlled between 0.5 and 5 µm. In this way, the base layer 2 effectively masks the micro-defects of the terminal body 1 and provides an excellent adhesion substrate for the subsequent nickel plating layer 3, preventing the layers from peeling off due to mechanical stress.

[0018] Next, a nickel plating layer 3 is applied to the outer surface of the base layer 2 by electroplating. Its main function is to serve as a high-performance barrier layer. Since the standard potential of nickel is more positive than that of copper, it can effectively electrochemically protect the internal copper terminal body 1. The crystal structure of the nickel plating layer 3 can significantly block the inward penetration of external corrosive media and the outward diffusion of internal copper atoms.

[0019] Furthermore, the nickel-tungsten alloy layer 4 is formed by electroplating co-depositing nickel and 8% to 12% by weight of tungsten to enhance its hardness; the thickness of this layer is between 0.5 and 5 µm, which provides relatively solid support for the relatively soft gold and silver plating layers on the outside, preventing the noble metal layer from collapsing or deforming due to point contact stress during insertion and extraction, thereby exposing the underlying nickel plating layer 3.

[0020] Furthermore, the gold plating layer 5 is deposited on the nickel-tungsten alloy layer 4 in an extremely thin manner by electroplating, with its thickness controlled between 0.025 and 0.5 µm. Its function is to ensure the reliability of the initial electrical contact. Specifically, based on the extremely high chemical inertness of the gold plating layer 5, it ensures that the conductive terminal can achieve a low-impedance and stable electrical connection at the moment of contact with the mating part. In addition, the gold plating layer 5 also seals the underlying nickel-tungsten alloy layer 4 to prevent its potential surface passivation.

[0021] Furthermore, a silver plating layer 6 is deposited on top of the gold plating layer 5, with a thickness between 0.125 and 3 µm. Since silver has excellent volume conductivity among conductive metals, its main function in this structure is to carry large currents. In fast charging applications, the silver plating layer 6 can greatly reduce the bulk resistance of the entire conductive path, reduce Joule heat loss during energy transmission, improve charging efficiency, and prevent overheating of the conductive terminals.

[0022] Furthermore, the platinum-ruthenium alloy layer 7, as the outermost functional layer of the entire composite coating, is formed by electroplating and co-depositing platinum with 10% to 20% ruthenium, which further enhances the wear resistance and hardness of the alloy layer. The thickness of the platinum-ruthenium alloy layer 7 is 0.125 to 3 µm, and its hardness can reach over 600 HV, directly resisting abrasive wear and adhesive wear during insertion and extraction. In terms of corrosion resistance, it can withstand various corrosive media in sweat, salt spray, and industrial atmosphere.

[0023] In a preferred embodiment, the terminal body 1 is made of copper or its alloy.

[0024] In summary, this structure, from the inside out, comprises a base layer, a nickel plating layer, a nickel-tungsten alloy layer, a gold plating layer, a silver plating layer, and an outermost platinum-ruthenium alloy layer. The gradient structure design of the nickel plating layer and the nickel-tungsten alloy layer enhances the bonding force between the plating layers and between the plating layer and the terminal body. The inner gold and silver plating layers ensure excellent conductivity and low contact resistance. The outer platinum-ruthenium alloy layer greatly enhances the terminal's resistance to mechanical wear and environmental corrosion, effectively coping with frequent insertion and removal conditions. Through the synergistic effect of each functional layer, the problem of poor charging caused by easy wear and corrosion of the plating layers is fundamentally solved, significantly extending the terminal's lifespan and improving product reliability and user satisfaction.

[0025] Although embodiments of the present invention have been shown above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications and variations to the above embodiments, but such modifications are all included within the broad scope of the foregoing disclosure, drawings and claims.

Claims

1. A surface electroplating structure for a conductive terminal, comprising a terminal body and a composite plating layer disposed on the outer surface of the terminal body, characterized in that, The composite plating layer, from the inside to the outside of the terminal body surface, includes: base layer; A nickel plating layer is disposed on the outer surface of the base layer; A nickel-tungsten alloy layer is disposed on the outer surface of the nickel-plated layer; A gold plating layer is disposed on the nickel-tungsten alloy layer; and A silver plating layer is disposed on top of the gold plating layer; A platinum-ruthenium alloy layer is disposed on the outer surface of the silver plating layer. The platinum-ruthenium alloy layer improves the wear resistance of the conductive terminals under frequent insertion and removal conditions and the corrosion resistance in harsh environments.

2. The surface electroplating structure of the conductive terminal according to claim 1, characterized in that: The base layer is made of copper or its alloy and has a thickness of 0.5 to 5 µm.

3. The surface electroplating structure of the conductive terminal according to claim 1, characterized in that: The thickness of the nickel-tungsten alloy layer is 0.5 to 5 µm.

4. The surface electroplating structure of the conductive terminal according to claim 1, characterized in that: The thickness of the gold plating layer is 0.025 to 0.5 µm.

5. The surface electroplating structure of the conductive terminal according to claim 1, characterized in that: The thickness of the silver plating layer is 0.125 to 3 µm.

6. The surface electroplating structure of the conductive terminal according to claim 1, characterized in that: The thickness of the platinum-ruthenium alloy layer is 0.125 to 3 µm.

7. The surface electroplating structure of the conductive terminal according to claim 1, characterized in that: The terminal body is made of copper or its alloy.

Images