Environment-friendly momi microcrystalline felt plate with high-temperature resistance function

Abstract

The utility model relates to the technical field of microcrystal felt board, especially to an environmental protection momi microcrystal felt board with high temperature resistance, which comprises a microcrystal surface layer, a honeycomb heat insulation layer arranged on the inner side of the microcrystal surface layer, multiple groups of springs arranged on the two sides of the honeycomb heat insulation layer, a back plate arranged on one side of the honeycomb heat insulation layer, a first annular side plate arranged on the inner side of the back plate, and a second annular side plate arranged on the inner side of the microcrystal surface layer. The microcrystal surface layer improves the high temperature resistance of the felt board surface, the back plate fixes the position of the felt board, the honeycomb heat insulation layer increases the internal surface area of the cutting board, disperses thermal stress, the springs improve the shock resistance of the felt board, and the internal heat dissipation space of the felt board is ensured. The first annular side plate is slidably connected to the second annular side plate, the position of the microcrystal surface layer and the back plate is stable, the multi-layer heat insulation mode enhances the heat dissipation capacity of the felt board, improves the high temperature resistance of the felt board, ensures the service life of the felt board in a high temperature environment, and effectively enhances the practical value of the felt board.

Description

Technical Field

[0001] This utility model relates to the field of microcrystalline felt technology, and in particular to an environmentally friendly momi microcrystalline felt with high temperature resistance. Background Technology

[0002] Microcrystalline felt is a new type of environmentally friendly composite material, mainly composed of microcrystalline minerals and high-strength fiber felt through a high-temperature and high-pressure process. This material combines the wear resistance, high temperature resistance, and corrosion resistance of microcrystalline materials with the flexibility, lightweight, and sound absorption properties of fiber felt. At the same time, it achieves green environmental protection through formaldehyde-free adhesives and recyclable processes.

[0003] Most current microcrystalline felt boards have a relatively simple structure and limited high-temperature resistance. When used in high-temperature environments for a long time, the felt board structure will still be damaged, which greatly shortens the service life of the felt board in high-temperature environments, resulting in a higher replacement frequency, increased usage costs, and inconvenience during use.

[0004] Therefore, given the relatively simple structure and limited high-temperature resistance of existing microcrystalline felt boards, an environmentally friendly momi microcrystalline felt board with high-temperature resistance can be designed. By using multi-layer insulation, the heat dissipation capacity of the felt board can be enhanced, its high-temperature resistance can be improved, and its service life in high-temperature environments can be guaranteed, thereby effectively enhancing the practical value of the felt board. Utility Model Content

[0005] In order to overcome the problem that most microcrystalline felt boards have a relatively simple structure and limited high-temperature resistance, and the felt board structure will still be damaged when used in high-temperature environments for a long time, resulting in a significant reduction in the service life of the felt board in high-temperature environments, this utility model is proposed.

[0006] The technical solution of this utility model is as follows: an environmentally friendly momi microcrystalline felt board with high temperature resistance, comprising a microcrystalline surface layer, a honeycomb heat insulation layer, springs, a back plate, a first annular side plate and a second annular side plate. The honeycomb heat insulation layer is provided on the inner side of the microcrystalline surface layer, and multiple sets of springs are provided on both sides of the honeycomb heat insulation layer. A back plate is provided on one side of the honeycomb heat insulation layer, and a first annular side plate is provided on the inner side of the back plate. A second annular side plate is provided on the inner side of the microcrystalline surface layer.

[0007] Preferably, by setting a microcrystalline surface layer to improve the high-temperature resistance of the felt board surface, using a back plate to fix the position of the felt board, increasing the internal surface area of ​​the anvil board through a honeycomb insulation layer to disperse thermal stress, using springs to improve the shock resistance of the felt board, and at the same time ensuring the internal heat dissipation space of the felt board, the first annular side plate is slidably connected to the second annular side plate to ensure the stability of the position of the microcrystalline surface layer and the back plate, thereby achieving the effects of enhancing the heat dissipation capacity of the felt board, improving the high-temperature resistance of the felt board, ensuring the service life of the felt board in high-temperature environments, and enhancing the practical value of the felt board.

[0008] Preferably, the back plate and the microcrystalline surface are symmetrically positioned, with one outer end of one side of the spring located on the inner side of the microcrystalline surface, and one outer end of the other side of the spring located on the inner side of the back plate, and the first annular side plate located on the outer side of the second annular side plate.

[0009] Preferably, the front end of the microcrystalline surface is provided with a high-emissivity coating, the high-emissivity coating material including but not limited to carbide-based coating, silicide-based coating, oxide-based coating or composite coating.

[0010] Preferably, a sealing groove is provided on the inner side of the first annular side plate, and a sealing strip is provided on the outer side of the second annular side plate.

[0011] Preferably, multiple sets of sealing slots are provided at equal intervals, and multiple sets of sealing strips are provided at equal intervals, with the sealing strips and sealing slots being fitted and slidably connected.

[0012] Preferably, a T-shaped groove is provided on the outer front side of the honeycomb insulation layer, and a T-shaped slider is provided on the inner side of the microcrystalline surface layer.

[0013] Preferably, multiple sets of T-shaped grooves are equally spaced, and multiple sets of T-shaped sliders are equally spaced, with the T-shaped sliders and T-shaped grooves engaging and slidingly connected.

[0014] The beneficial effects of this utility model are: When using felt boards, the high-temperature resistance of the felt board surface is improved by the microcrystalline surface layer, the position of the felt board is fixed by the back plate, the internal surface area of ​​the felt board is increased by the honeycomb heat insulation layer to disperse thermal stress, and the spring is used to improve the shock resistance of the felt board. At the same time, it can also ensure the heat dissipation space inside the felt board. The first annular side plate is slidably connected to the second annular side plate to ensure the stability of the position of the microcrystalline surface layer and the back plate. This solves the problem that most microcrystalline felt boards have a relatively simple structure and limited high-temperature resistance. When used in high-temperature environments for a long time, the felt board structure will still be damaged, which will greatly shorten the service life of the felt board in high-temperature environments. This enhances the practical value of the felt board. Attached Figure Description

[0015] Figure 1 The diagram shows a three-dimensional structural schematic of an environmentally friendly momi microcrystalline felt board with high-temperature resistance according to this utility model. Figure 2 The diagram shown is a cross-sectional three-dimensional structural schematic of an environmentally friendly momi microcrystalline felt board with high temperature resistance according to this utility model. Figure 3 The diagram shown is a three-dimensional structural schematic of the internal structure of an environmentally friendly momi microcrystalline felt board with high temperature resistance according to this utility model. Figure 4 The diagram shows a three-dimensional structure of the microcrystalline surface layer and the honeycomb insulation layer of an environmentally friendly momi microcrystalline felt board with high temperature resistance according to this utility model.

[0016] Explanation of reference numerals in the attached drawings: 1. Microcrystalline surface layer; 101. High-emissivity coating; 2. Honeycomb insulation layer; 3. Spring; 4. Back plate; 5. First annular side plate; 501. Sealing groove; 6. Second annular side plate; 601. Sealing strip; 701. T-shaped groove; 702. T-shaped slider. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Example 1 Please see Figure 1 and Figure 2 This utility model provides an embodiment: an environmentally friendly momi microcrystalline felt board with high temperature resistance, comprising a microcrystalline surface layer 1, a honeycomb heat insulation layer 2, springs 3, a back plate 4, a first annular side plate 5, and a second annular side plate 6. The honeycomb heat insulation layer 2 is disposed on the inner side of the microcrystalline surface layer 1, and multiple sets of springs 3 are disposed on both sides of the honeycomb heat insulation layer 2. The back plate 4 is disposed on one side of the honeycomb heat insulation layer 2, and the back plate 4 is symmetrical to the microcrystalline surface layer 1. One outer end of one spring 3 is disposed on the inner side of the microcrystalline surface layer 1, and the outer end of the other spring 3 is disposed on the inner side of the back plate 4. The first annular side plate 5 is disposed on the inner side of the back plate 4, and the second annular side plate 6 is disposed on the inner side of the microcrystalline surface layer 1. The first annular side plate 5 is disposed on the outer side of the second annular side plate 6.

[0019] Please see Figure 3 In this embodiment, a high-emissivity coating 101 is provided at the front end of the microcrystalline surface layer 1. The high-emissivity coating 101 is made of materials including but not limited to carbide-based coating, silicide-based coating, oxide-based coating or composite coating. The high-emissivity coating 101 enhances the heat reflection capability of the felt board, reduces heat penetration, and isolates some heat. The inner side of the first annular side plate 5 is provided with a sealing groove 501, and multiple sets of sealing grooves 501 are equally spaced. The outer side of the second annular side plate 6 is provided with a sealing strip 601, and multiple sets of sealing strips 601 are equally spaced. The sealing strip 601 is fitted and slidably connected with the sealing groove 501. When the microcrystalline surface layer 1 compresses the spring 3 and extends, the first annular side plate 5 slides along the second annular side plate 6, thereby fixing the relative position of the microcrystalline surface layer 1 and the back plate 4, and driving the sealing strip 601 to slide along the sealing groove 501. The heat is isolated from the outside by the first annular side plate 5 and the second annular side plate 6.

[0020] When using the felt board, the felt board is fixed in the specified high-temperature environment by the back plate 4. The high-emissivity coating 101 is used to reflect the high temperature. The remaining heat penetrates into the microcrystalline surface layer 1 and the heat dissipation area is expanded by the honeycomb insulation layer 2. During vibration, the microcrystalline surface layer 1 compresses the spring 3, causing the first annular side plate 5 to slide into the second annular side plate 6, so that the sealing strip 601 slides synchronously along the sealing groove 501.

[0021] Example 2 Please see Figure 1 and Figure 2 This utility model provides an embodiment: an environmentally friendly momi microcrystalline felt board with high temperature resistance, comprising a microcrystalline surface layer 1, a honeycomb heat insulation layer 2, springs 3, a back plate 4, a first annular side plate 5, and a second annular side plate 6. The honeycomb heat insulation layer 2 is disposed on the inner side of the microcrystalline surface layer 1, and multiple sets of springs 3 are disposed on both sides of the honeycomb heat insulation layer 2. The back plate 4 is disposed on one side of the honeycomb heat insulation layer 2, and the back plate 4 is symmetrical to the microcrystalline surface layer 1. One outer end of one spring 3 is disposed on the inner side of the microcrystalline surface layer 1, and the outer end of the other spring 3 is disposed on the inner side of the back plate 4. The first annular side plate 5 is disposed on the inner side of the back plate 4, and the second annular side plate 6 is disposed on the inner side of the microcrystalline surface layer 1. The first annular side plate 5 is disposed on the outer side of the second annular side plate 6.

[0022] Please see Figure 3 and Figure 4 In this embodiment, a high-emissivity coating 101 is provided at the front end of the microcrystalline surface layer 1. The high-emissivity coating 101 is made of materials including but not limited to carbide-based coatings, silicide-based coatings, oxide-based coatings, or composite coatings. The high-emissivity coating 101 enhances the heat reflection capability of the felt board, reduces heat penetration, and isolates some heat. A sealing groove 501 is provided on the inner side of the first annular side plate 5. Multiple sets of sealing grooves 501 are provided at equal intervals. A sealing strip 601 is provided on the outer side of the second annular side plate 6. Multiple sets of sealing strips 601 are provided at equal intervals. The sealing strip 601 is fitted and slidably connected with the sealing groove 501. When the microcrystalline surface layer 1 compresses the spring 3, the first annular side plate 5 slides along the second annular side plate 6, thereby fixing the relative position of the microcrystalline surface layer 1 and the back plate 4, and driving the sealing strip 601 to slide along the sealing groove 501. The heat is isolated from the outside by the first annular side plate 5 and the second annular side plate 6. A T-shaped groove 701 is provided on the outer front side of the honeycomb insulation layer 2. Multiple sets of T-shaped grooves 701 are provided at equal intervals. A T-shaped slider 702 is provided on the inner side of the microcrystalline surface layer 1. Multiple sets of T-shaped sliders 702 are provided at equal intervals. The T-shaped sliders 702 are engaged and slidably connected with the T-shaped grooves 701. When the microcrystalline surface layer 1 compresses the spring 3, the T-shaped sliders 702 slide along the T-shaped grooves 701. The T-shaped sliders 702 are used to support and connect the honeycomb insulation layer 2, ensuring the stability of the position of the honeycomb insulation layer 2.

[0023] When using the felt board, the felt board is fixed in the specified high-temperature environment by the back plate 4. The high-emissivity coating 101 is used to reflect the high temperature. The remaining heat penetrates into the microcrystalline surface layer 1 and the heat dissipation area is expanded by the honeycomb insulation layer 2. During vibration, the microcrystalline surface layer 1 compresses and extends the spring 3, causing the first annular side plate 5 to slide into the second annular side plate 6, so that the sealing strip 601 slides synchronously along the sealing groove 501. In this embodiment, when the spring 3 extends and extends, the T-shaped slider 702 slides synchronously along the T-shaped groove 701, which enhances the stability of the connection between the honeycomb insulation layer 2 and the microcrystalline surface layer 1. This is suitable for felt boards with a large area and ensures a stable connection between the overall structure of the felt board.

[0024] Through the above steps, the high-temperature resistance of the felt board surface is improved by setting the microcrystalline surface layer 1, the position of the felt board is fixed by the back plate 4, the internal surface area of ​​the anvil board is increased by the honeycomb insulation layer 2 to disperse thermal stress, the shock resistance of the felt board is improved by the spring 3, and the internal heat dissipation space of the felt board is also guaranteed. The first annular side plate 5 is slidably connected to the second annular side plate 6 to ensure the stability of the position of the microcrystalline surface layer 1 and the back plate 4, thereby enhancing the heat dissipation capacity of the felt board, improving the high-temperature resistance of the felt board, and ensuring the service life of the felt board in high-temperature environments.

[0025] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. An environmentally friendly momeris microcrystalline felt board with high temperature resistance, comprising a microcrystalline surface layer (1), characterized in that: It also includes a honeycomb insulation layer (2), a spring (3), a back plate (4), a first annular side plate (5) and a second annular side plate (6). The honeycomb insulation layer (2) is provided on the inner side of the microcrystalline surface layer (1). Multiple sets of springs (3) are provided on both sides of the honeycomb insulation layer (2). A back plate (4) is provided on one side of the honeycomb insulation layer (2). A first annular side plate (5) is provided on the inner side of the back plate (4). A second annular side plate (6) is provided on the inner side of the microcrystalline surface layer (1).

2. The environmentally friendly momi microcrystalline felt board with high-temperature resistance according to claim 1, characterized in that: The back plate (4) and the microcrystalline surface layer (1) are symmetrically positioned. One side of the spring (3) is located on the inner side of the microcrystalline surface layer (1), and the other side of the spring (3) is located on the inner side of the back plate (4). The first annular side plate (5) is located on the outer side of the second annular side plate (6).

3. The environmentally friendly momi microcrystalline felt board with high-temperature resistance according to claim 1, characterized in that: The front end of the microcrystalline surface layer (1) is provided with a high-emissivity coating (101), and the high-emissivity coating (101) material includes, but is not limited to, a carbide-based coating, a silicide-based coating, an oxide-based coating, or a composite coating.

4. The environmentally friendly momi microcrystalline felt board with high-temperature resistance according to claim 1, characterized in that: A sealing groove (501) is provided on the inner side of the first annular side plate (5), and a sealing strip (601) is provided on the outer side of the second annular side plate (6).

5. The environmentally friendly momi microcrystalline felt board with high-temperature resistance according to claim 4, characterized in that: Multiple sets of sealing grooves (501) are equally spaced, and multiple sets of sealing strips (601) are equally spaced. The sealing strips (601) are fitted and slidably connected to the sealing grooves (501).

6. The environmentally friendly momi microcrystalline felt board with high-temperature resistance according to claim 1, characterized in that: A T-shaped groove (701) is provided on the outer side of the front end of the honeycomb insulation layer (2), and a T-shaped slider (702) is provided on the inner side of the microcrystalline surface layer (1).

7. The environmentally friendly momi microcrystalline felt board with high-temperature resistance according to claim 6, characterized in that: Multiple sets of T-shaped grooves (701) are equally spaced, and multiple sets of T-shaped sliders (702) are equally spaced. The T-shaped sliders (702) and T-shaped grooves (701) are fitted and slidably connected.

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