Automobile headlamp heat dissipation structure and automobile headlamp
By designing mounting slots and an intermediate layer on the heat sink of automotive headlights, the problems of excessive LED chip spacing and poor heat dissipation were solved, resulting in improved light pattern and heat dissipation performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHONGSHAN KABAS ELECTRONIC TECH CO LTD
- Filing Date
- 2023-12-27
- Publication Date
- 2026-07-24
AI Technical Summary
The spacing between LED beads in existing automotive headlights is too large, affecting the light pattern, and the heat sink is not thick enough, resulting in poor heat dissipation.
The first and second mounting slots are designed on the heat sink to reduce the distance between the two LED beads. An intermediate layer is set between the first and second bottom surfaces to increase heat dissipation efficiency. The thermal and electrical conductivity and ductility of the copper heat sink are used to achieve rapid heat dissipation.
The reduced spacing between LED beads provides a good light pattern, while the rapid heat dissipation through the overlapping parts achieves excellent heat dissipation.
Smart Images
Figure CN224551351U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of car light, especially the heat dissipation structure of automobile headlamp and automobile headlamp. BACKGROUND
[0002] Because LED lamp bead has the advantages such as energy saving, low price, current automobile headlamp usually adopts LED lamp bead. LED lamp bead usually is directly welded on one side or both sides of the heat dissipation plate, and the heat dissipation plate needs to be heat-conducting and supporting, so it needs certain thickness to meet the demand. This leads to the spacing between two LED lamp beads being too large, which affects the light pattern. SUMMARY
[0003] To solve the above problems, the technical scheme provides a heat dissipation structure of automobile headlamp.
[0004] To achieve the above purpose, the technical scheme is as follows:
[0005] The heat dissipation structure of automobile headlamp comprises a heat dissipation plate, a first mounting groove recessed on the front face of the heat dissipation plate and used for mounting an LED lamp bead, and a second mounting groove recessed on the back face of the heat dissipation plate and used for mounting another LED lamp bead, the first mounting groove comprises a first bottom face, the second mounting groove comprises a second bottom face, and the projection of the first bottom face along the thickness direction of the heat dissipation plate at least partially overlaps the second bottom face.
[0006] The heat dissipation structure of automobile headlamp as described above, the heat dissipation plate comprises an intermediate layer between the first bottom face and the second bottom face, and the first mounting groove and the second mounting groove are symmetrically arranged on the front face and the back face of the heat dissipation plate with the intermediate layer.
[0007] The heat dissipation structure of automobile headlamp as described above, the thickness of the heat dissipation plate is 1.5 mm, and the thickness of the intermediate layer is 0.7 mm.
[0008] The heat dissipation structure of automobile headlamp as described above, an insulating layer is arranged on the heat dissipation plate and covers the outer periphery thereof.
[0009] The heat dissipation structure of automobile headlamp as described above, the insulating layer is provided with a lamp bead positive electrode conductive port and a lamp bead negative electrode conductive port which communicate the heat dissipation plate with the outside.
[0010] The heat dissipation structure of automobile headlamp as described above, the heat dissipation plate comprises a plate body, a first leg and a second leg which are integrally connected with the plate body, and a first step, a second step and a third step which are arranged in the direction of approaching each other and are arranged on the first leg and the second leg, a space for mounting a heat dissipation fan is formed between the two first steps, a support space for mounting a circuit board is formed between the two second steps, and a heat dissipation space is formed between the two third steps.
[0011] As described above, in the heat dissipation structure of the car headlight, the insulating layer is provided with a first power interface connecting the first pin to the outside, and the insulating layer is provided with a second power interface connecting the second pin to the outside.
[0012] As described above, in the heat dissipation structure of the automotive headlight, the first mounting slot and the second mounting slot have the same dimensions. The first mounting slot has a length of 6mm, a width of 4.5mm, and a depth of 0.4mm.
[0013] In the heat dissipation structure of the car headlight described above, the first mounting slot is offset from the center of the heat sink so that the LED chip is aligned with the center line of the heat sink.
[0014] The automotive headlight includes a heat dissipation structure as described above, LED beads disposed on the first mounting slot and the second mounting slot, and a headlight housing connected to the heat dissipation plate.
[0015] The beneficial effects of this application are:
[0016] This invention provides a heat dissipation structure for automotive headlights. By providing a first mounting groove and a second mounting groove on the heat sink, the spacing between two LED beads is reduced, resulting in a better light pattern. Simultaneously, because the overlapping portion of the first and second bottom surfaces is thinner, while the surrounding heat sink is thicker, the heat absorption effect is rapid, and the heat from the overlapping portion quickly diffuses to the surrounding area, achieving a good heat dissipation effect. The heat sink can be made of copper, which also has good thermal and electrical conductivity and ductility. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.
[0018] Figure 1 This is a schematic diagram of the heat dissipation structure of a car headlight;
[0019] Figure 2 yes Figure 1 A half-section view;
[0020] Figure 3 This is a structural diagram of a car headlight. Detailed Implementation
[0021] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0022] The heat dissipation structure of the automotive headlight includes a heat sink 11, a first mounting groove 12 recessed on the front of the heat sink 11 for mounting an LED, and a second mounting groove 13 recessed on the back of the heat sink 11 for mounting another LED. The first mounting groove 12 includes a first bottom surface 121, and the second mounting groove 13 includes a second bottom surface 131. The projection of the first bottom surface 121 along the thickness direction of the heat sink 11 at least partially overlaps with the second bottom surface 131.
[0023] This invention provides a heat dissipation structure for automotive headlights. By providing a first mounting groove and a second mounting groove on the heat sink, the spacing between two LED beads is reduced, resulting in a better light pattern. Simultaneously, because the overlapping portion of the first and second bottom surfaces is thinner, while the surrounding heat sink is thicker, the heat absorption effect is rapid, and the heat from the overlapping portion quickly diffuses to the surrounding area, achieving a good heat dissipation effect. The heat sink can be made of copper, which also has good thermal and electrical conductivity and ductility.
[0024] Furthermore, as a preferred embodiment of this solution and not a limitation, the heat sink 11 includes an intermediate layer 14 located between the first bottom surface 121 and the second bottom surface 131. The first mounting groove 12 and the second mounting groove 13 are symmetrically arranged on the front and back surfaces of the heat sink 11 with respect to the intermediate layer 14. The projection of the first bottom surface along the thickness direction of the heat sink coincides with the second bottom surface. The first mounting groove and the second mounting groove share the intermediate layer.
[0025] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the thickness of the heat sink 11 is 1.5 mm, and the thickness of the intermediate layer 14 is 0.7 mm.
[0026] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the heat sink 11 is provided with an insulating layer 15 covering its outer periphery. The insulating layer may be an alumina coating, a phosphate-based inorganic binder coating, etc.
[0027] Furthermore, as a preferred embodiment of this solution and not a limitation, the insulating layer 15 is provided with a positive electrode conductive port 151 and a negative electrode conductive port 152 for the LED bead, connecting the heat sink 11 to the outside. No additional wiring is required.
[0028] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the heat sink 11 includes a plate body 111, a first support leg 112 and a second support leg 113 integrally connected to the plate body 111, and a first step 114, a second step 115 and a third step 116 disposed on the first support leg 112 and the second support leg 113 and disposed in a direction toward each other. A clearance space 117 for mounting a cooling fan is formed between the two first steps 114, a support space 118 for mounting a circuit board is formed between the two second steps 115, and a heat dissipation space 119 is formed between the two third steps 116.
[0029] Furthermore, as a preferred embodiment of this solution and not a limitation, the insulating layer 15 is provided with a first power interface 153 connecting the first support 112 to the outside, and the insulating layer 15 is provided with a second power interface 154 connecting the second support 113 to the outside. No additional wiring is required.
[0030] Furthermore, as a preferred embodiment of this solution and not a limitation, the first mounting groove 12 and the second mounting groove 13 have the same dimensions, with the first mounting groove 12 having a length of 6mm, a width of 4.5mm, and a depth of 0.4mm.
[0031] Furthermore, as a preferred embodiment of this solution and not a limitation, the first mounting groove 12 is offset from the center of the heat sink 11, so that the LED chip is aligned with the center line of the heat sink 11. This allows the heat generated by the chip to be evenly diffused to the heat sink.
[0032] The car headlight includes a heat dissipation structure 1 as described above, LED beads 2 disposed on the first mounting groove 12 and the second mounting groove 13, and a headlight housing 3 connected to the heat dissipation plate 11.
[0033] The above description is only a preferred embodiment of this application and is not intended to limit the scope of implementation of this application. Any other embodiments whose principles and basic structures are the same as or similar to those of this application are within the protection scope of this application.
Claims
1. A heat dissipation structure for automotive headlights, characterized in that: Includes a heat sink (11), a first mounting groove (12) recessed on the front of the heat sink (11) for mounting LED beads, and a second mounting groove (13) recessed on the back of the heat sink (11) for mounting another LED bead. The first mounting groove (12) includes a first bottom surface (121), and the second mounting groove (13) includes a second bottom surface (131). The projection of the first bottom surface (121) along the thickness direction of the heat sink (11) at least partially overlaps with the second bottom surface (131). The heat sink (11) includes an intermediate layer (14) located between the first bottom surface (121) and the second bottom surface (131), and the first mounting groove (12) and the second mounting groove (13) are symmetrically arranged on the front and back of the heat sink (11) with respect to the intermediate layer (14).
2. The heat dissipation structure for an automotive headlight according to claim 1, characterized in that: The thickness of the heat sink (11) is 1.5 mm, and the thickness of the intermediate layer (14) is 0.7 mm.
3. The heat dissipation structure for automotive headlights according to claim 1, characterized in that: The heat sink (11) is provided with an insulating layer (15) covering its outer periphery.
4. The heat dissipation structure for an automotive headlight according to claim 3, characterized in that: The insulating layer (15) is provided with a positive electrode conductive port (151) and a negative electrode conductive port (152) for the lamp bead that connect the heat sink (11) to the outside.
5. The heat dissipation structure for an automotive headlight according to claim 3, characterized in that: The heat sink (11) includes a body (111), a first leg (112) and a second leg (113) integrally connected to the body (111), and a first step (114), a second step (115) and a third step (116) disposed on the first leg (112) and the second leg (113) in a direction toward each other. A clearance space (117) for installing a cooling fan is formed between the two first steps (114), a support space (118) for installing a circuit board is formed between the two second steps (115), and a heat dissipation space (119) is formed between the two third steps (116).
6. The heat dissipation structure for an automotive headlight according to claim 5, characterized in that: The insulating layer (15) is provided with a first power interface (153) that connects the first foot (112) to the outside, and the insulating layer (15) is provided with a second power interface (154) that connects the second foot (113) to the outside.
7. The heat dissipation structure for an automotive headlight according to claim 3, characterized in that: The first mounting groove (12) and the second mounting groove (13) have the same dimensions. The first mounting groove (12) has a length of 6 mm, a width of 4.5 mm, and a depth of 0.4 mm.
8. The heat dissipation structure for an automotive headlight according to claim 1, characterized in that: The first mounting slot (12) is offset from the center of the heat sink (11) so that the LED chip is positioned corresponding to the center line of the heat sink (11).
9. A car headlight, characterized in that: The headlight includes a heat dissipation structure (1) as described in any one of claims 1-8, LED beads (2) disposed on the first mounting groove (12) and the second mounting groove (13), and a headlight housing (3) connected to the heat dissipation plate (11).