Tension sensor structure capable of reducing influence of dynamic temperature shock

Abstract

The application provides a tension sensor structure capable of reducing the influence of dynamic temperature impact, comprising a tension sensor elastic body, a strain gauge, a transmitter box, a transmitter circuit board, a socket and a protection plate, and further comprising a thermal stress release hole. The tension sensor structure changes the distribution state of the thermal stress of the sensor by processing the thermal stress release hole on both sides of the tension sensor elastic body and pasting the strain gauge in the thermal stress release hole, so that the thermal stress at the pasting position of the strain gauge is more uniform or counteracts each other, effectively reduces the signal jump caused by the dynamic temperature impact such as outdoor light change and rapid temperature change in the test box, ensures that the output signal is always within the qualified range, solves the limitation that the sensor in the prior art can only work normally when the temperature is constant, ensures the stability of the output signal even in the case of uneven local heating during temperature rise, meets the demand of all-weather continuous operation of the equipment, and avoids the paralysis of the equipment caused by excessive signal fluctuation.

Description

Technical Field

[0001] This invention belongs to the field of strain gauge tension sensor technology, and more specifically, relates to a tension sensor structure that can reduce the impact of dynamic temperature shock. Background Technology

[0002] Strain gauge tensile sensors are widely used in force measurement, and their measurement accuracy is closely related to temperature stability. Temperature compensation technology is the core of ensuring their performance. Existing temperature compensation technologies for strain gauge tensile sensors are all based on static isothermal environments and are mainly implemented in two ways: one is hardware compensation, which involves selecting strain gauge materials with specific temperature coefficients (such as constantan or Karma alloy) to match their temperature coefficient of resistance with the thermal expansion coefficient of the substrate material (such as steel or aluminum) within a certain range, thereby reducing heat output; the other is software compensation, which involves establishing mathematical models of temperature and signal at different static isothermal points and using algorithms to correct for temperature effects.

[0003] The implementation of the above compensation technique relies on the static environment inside the constant temperature test chamber. The output signal needs to be compensated only when the chamber temperature is completely constant (different volumes require different constant temperature times due to the sensor material being alloy steel). This technique ignores fluctuations during dynamic temperature changes and can only guarantee signal quality after the temperature field stabilizes.

[0004] However, in practical applications, tensile sensors are often exposed to dynamic temperature environments. For example, when used outdoors, changes in sunlight lead to uneven absorption of solar radiation and heat by the sensor, resulting in localized temperature differences. Or, in high or low temperature test chambers, the internal temperature changes rapidly. In these situations, due to localized heating and uneven heating of internal components, the sensor's output signal fluctuates wildly, far exceeding the required specifications, and may even cause equipment failure, failing to meet the needs of all-weather use. Existing technologies, having failed to address the problem of uneven thermal stress distribution under dynamic temperature shocks, are no longer suitable for real-world applications. Therefore, there is an urgent need for a tensile sensor structure that reduces the impact of dynamic temperature shocks through structural optimization. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides a tensile sensor structure that can reduce the impact of dynamic temperature shocks, achieved through the following specific technical means:

[0006] A tensile sensor structure capable of reducing the impact of dynamic temperature shock includes a tensile sensor elastic body, strain gauges, a transmitter box, a transmitter circuit board, a socket, and a protection plate. It also includes thermal stress relief holes symmetrically arranged on both sides of the tensile sensor elastic body. The strain gauges are attached to the inner wall of the thermal stress relief holes and connected by wires to form a Wheatstone bridge. The transmitter circuit board is electrically connected to the Wheatstone bridge and encapsulated within the transmitter box. The socket is located on the transmitter box and electrically connected to the transmitter circuit board.

[0007] Furthermore, there are two thermal stress relief holes, distributed on both sides of the elastic body of the tension sensor perpendicular to the direction of tension.

[0008] Furthermore, the strain gauge is attached to the area near the center of the elastic body of the tension sensor inside the thermal stress relief hole.

[0009] Furthermore, the strain gauge is attached to the thermal stress relief hole using a curved surface attachment method.

[0010] Furthermore, the protective plate is located outside the transmitter housing to prevent it from being damaged by impact.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] I. This tensile sensor structure alters the distribution of thermal stress by machining thermal stress relief holes on both sides of the elastic body of the tensile sensor and then attaching the strain gauges to these holes. This makes the thermal stress distribution at the strain gauge attachment point more uniform or mutually cancels out the stress, effectively reducing signal jumps caused by dynamic temperature shocks such as changes in outdoor light intensity or rapid temperature changes in the test chamber. This ensures that the output signal remains within the acceptable range, overcoming the limitation of existing sensors that can only operate normally at constant temperatures. Even in cases of uneven heating during temperature rise, the output signal remains stable, meeting the requirements for continuous operation of the equipment around the clock and preventing equipment failure due to excessive signal fluctuations.

[0013] Second, the symmetrical thermal stress relief hole design on both sides improves the structural symmetry of the elastic body of the tensile sensor, reduces the net strain in the central area, makes the overall thermal deformation of the sensor more uniform, further reduces the influence of temperature fluctuations on the strain gauge, and improves the measurement accuracy. Compared with the existing technology that relies on static compensation in constant temperature test chambers, this structure directly improves the thermal stress distribution through hardware design, without the need for additional dynamic temperature compensation algorithms or complex software corrections, simplifying the usage process and reducing dependence on the environment. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the tensile sensor of the present invention, which can reduce the impact of dynamic temperature shock.

[0015] Figure 2 This is a schematic diagram showing the cross-section of the elastic body of the tension sensor of the present invention.

[0016] Figure 3 This is a schematic diagram of the protective plate of the present invention.

[0017] Figure 4 This is a schematic diagram of the transmitter box of the present invention.

[0018] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0019] 1. Elastic body of tension sensor; 2. Thermal stress relief hole; 3. Transmitter box; 4. Transmitter circuit board; 5. Socket; 6. Protective board; 7. Strain gauge mounting position (existing technology). Detailed Implementation

[0020] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0021] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Example:

[0024] As attached Figure 1 To be continued Figure 4 As shown:

[0025] This invention provides a tensile sensor structure that can reduce the impact of dynamic temperature shock. The tensile sensor includes an elastic body 1, a strain gauge (not shown), a transmitter box 3, a transmitter circuit board 4, a socket 5, and a protection plate 6. It also includes a thermal stress relief hole 2. The strain gauge is installed in the thermal stress relief hole 2. The thermal stress relief holes 2 are symmetrically arranged on both sides of the elastic body 1 of the tensile sensor and are connected. The two relief holes 2 are connected. The strain gauge is pasted to the inner wall of the thermal stress relief hole 2 and connected by wires to form a Wheatstone bridge. The transmitter circuit board 4 is electrically connected to the Wheatstone bridge and is encapsulated in the transmitter box 3. The multi-hole design method can change the distribution of thermal stress in the tensile sensor, making the thermal stress at the strain gauge pasting point more uniform or mutually canceling, solving the impact of dynamic temperature changes on the tensile sensor and ensuring that the signal output of the tensile sensor remains stable in dynamic temperature environments.

[0026] There are two thermal stress relief holes 2, which are distributed on both sides of the elastic body 1 of the tension sensor along the direction perpendicular to the tension. The double small hole design on both sides improves the symmetry, reduces the net strain in the central area, and makes the thermal deformation more uniform. The strain gauge is attached to this position and is less affected by thermal stress, which makes the temperature change in the attachment area more gradual and reduces the abnormal fluctuation of the strain gauge output signal.

[0027] The strain gauge is attached to the area inside the thermal stress relief hole 2 near the center of the elastic body 1 of the tension sensor. The thermal stress relief hole 2 is located in an area with lower or more stable thermal strain.

[0028] The elastic body 1 is made of alloy steel and is used to withstand external tensile forces and generate elastic deformation;

[0029] Both thermal stress relief holes 2 are circular through holes;

[0030] The strain gauge is attached to the thermal stress relief hole 2 using a curved surface attachment method;

[0031] Socket 5 is located on transmitter box 3 and electrically connected to transmitter circuit board 4; socket 6 is used to connect external devices via cable to achieve signal transmission.

[0032] The protection plate 6 is located on the outside of the transmitter box 3 to prevent it from being damaged by impact;

[0033] like Figure 4 As shown: Strain gauge attachment position 7 is the position where strain gauges are attached in the prior art;

[0034] The working principle of this embodiment:

[0035] Step 1: The elastic body 1 of the tension sensor mainly bears the tensile force. Through elastic deformation, it drives the strain gauges attached inside to generate micro-strain, thereby sensing the change in force value on the elastic body 1. The voltage signal is then converted and transmitted through the Wheatstone bridge composed of strain gauges. The electrical signal is then converted into an analog 4-20mA current signal by the transmitter circuit board 4. The transmitter circuit board 4 is encapsulated in the transmitter box 3. The transmitter box 3 has a socket 5. The 4-20mA current signal is connected to the equipment cable through the socket 5 to complete the working electrical connection.

[0036] Step 2: On both sides of the elastic body 1 of the tension sensor, thermal stress relief holes 2 are machined. The original strain gauges are then pasted into the thermal stress relief holes 2. The multi-hole design method can change the distribution of thermal stress in the tension sensor, making the thermal stress at the strain gauge pasting point more uniform or mutually canceling. The thermal stress relief holes 2 on both sides are located in areas with lower or more stable thermal strain. At the same time, the double small hole design on both sides improves symmetry, reduces the net strain in the central area, and makes the thermal deformation more uniform. The strain gauge is less affected by thermal stress when pasted in this position, making the temperature change in the pasting area more gradual. The abnormal fluctuations of the strain gauge output signal are also reduced synchronously, solving the problem of the tension sensor being affected by dynamic temperature changes and ensuring that the signal output of the tension sensor remains stable in dynamic temperature environments.

[0037] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A tensile sensor structure capable of reducing the impact of dynamic temperature shock, comprising a tensile sensor elastic body (1), a strain gauge, a transmitter housing (3), a transmitter circuit board (4), a socket (5), and a protection plate (6), characterized in that: It also includes a thermal stress relief hole (2), which is symmetrically arranged on both sides of the elastic body (1) of the tension sensor. The strain gauge is attached to the inner wall of the thermal stress relief hole (2) and connected by wires to form a Wheatstone bridge. The transmitter circuit board (4) is electrically connected to the Wheatstone bridge and encapsulated in the transmitter box (3). The socket (5) is located on the transmitter box (3) and electrically connected to the transmitter circuit board (4).

2. The tensile sensor structure as described in claim 1, characterized in that: The number of thermal stress relief holes (2) is two, which are distributed on both sides of the elastic body (1) of the tension sensor along the direction perpendicular to the tension.

3. The tensile sensor structure as described in claim 2, characterized in that: The strain gauge is attached to the area inside the thermal stress relief hole (2) near the center of the elastic body (1) of the tension sensor.

4. The tensile sensor structure as described in claim 3, characterized in that: The strain gauge is attached to the thermal stress relief hole (2) by a curved surface attachment method.

5. The tensile sensor structure as described in claim 4, characterized in that: The protective plate (6) is located outside the transmitter box (3) to prevent it from being damaged by impact.

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