A magnetoelectric current sensor and a packaging structure
By using two injection molding processes and epoxy resin materials, the sensing head and the magnetic field generating unit are isolated, which solves the stability problem caused by PI film delamination, improves the performance and measurement accuracy of the magnetocurrent sensor, and reduces packaging costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI NAXI MICROELECTRONICS CO LTD
- Filing Date
- 2025-08-28
- Publication Date
- 2026-07-24
AI Technical Summary
In the prior art, the PI film is prone to delamination from the injection molding material during the injection molding stage, resulting in poor isolation stability between the magnetic sensing element and other structures, which affects the performance and measurement accuracy of the magnetic current sensor.
The system employs a two-stage injection molding process, using epoxy resin to form the main injection molding structure and the encapsulation structure. This isolates the induction head from the magnetic field generating unit, ensuring the stability of the withstand voltage distance. Furthermore, the isolation design between the lead frame and the signal processing unit enhances the packaging stability.
This improves the isolation stability of the sensing head from other structures, enhances the performance and measurement accuracy of the magnetocurrent sensor, and reduces packaging costs.
Smart Images
Figure CN224553355U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of sensor technology, specifically to a magnetocurrent sensor and its packaging structure. Background Technology
[0002] Magnetocurrent sensors measure current magnitude based on the principle of electromagnetic induction. When current passes through a magnetic field generating unit, a magnetic field is generated around the unit, and this magnetic field can be used to measure the current magnitude. A magnetocurrent sensor contains a magnetic sensing element that detects the magnetic field strength and converts it into an electrical signal.
[0003] To ensure the performance and measurement accuracy of the magnetocurrent sensor, a certain withstand voltage distance needs to be maintained between the magnetic sensing element and other structures within the sensor, such as the frame metal and the magnetic field generating unit. In related technologies, a PI (Polyimide Film) film can be placed on the back of the frame, and the magnetic sensing element can be attached to the PI film to achieve isolation between the magnetic sensing element and other structures.
[0004] However, PI film is prone to delamination from the injection molding material during the injection molding stage, and its isolation effect is not stable. Utility Model Content
[0005] In view of the above-mentioned deficiencies of the prior art, the technical problem to be solved by this application is how to improve the stability of the isolation between the induction head and other structures.
[0006] To address at least one of the aforementioned technical problems, this application discloses a magnetocurrent sensor and its packaging structure.
[0007] According to one aspect of this application, a magnetic current sensor is provided, comprising:
[0008] Magnetic field generating unit;
[0009] The first injection-molded structure adjacent to the magnetic field generating unit has a receiving cavity;
[0010] The induction head, located inside the accommodating cavity, is used to collect the magnetic field generated by the current flowing through the magnetic field generating unit and output the first signal.
[0011] Optionally, the magnetocurrent sensor also includes a second injection-molded structure.
[0012] The second injection-molded structure encapsulates the magnetic field generating unit, the first injection-molded structure, and the induction magnetic head.
[0013] Optionally, the first injection molding structure includes an injection molding body structure.
[0014] The accommodating cavity is located within the main injection molding structure.
[0015] Optionally, the sensing head and the magnetic field generating unit are isolated by an injection-molded main structure.
[0016] Optionally, the first injection molding structure further includes a first injection flow channel structure connected to the injection molding body structure.
[0017] Optionally, the induction head and the magnetic field generating unit are arranged along a first direction; the induction head has a first center, which is the geometric center of the induction head; the magnetic field generating unit has a second center, which is located at the center point of the magnetic field generating unit in a second direction, and the second direction is perpendicular to the first direction; the first center and the second center are arranged along the first direction.
[0018] Optionally, the magnetocurrent sensor also includes:
[0019] Lead frame;
[0020] A signal processing unit fixed to the lead frame is coupled to the induction head. The signal processing unit is used to process the first signal to output the second signal.
[0021] Optionally, the lead frame includes:
[0022] The support structure is coupled to the signal processing unit and is used to support the signal processing unit.
[0023] Multiple lead structures connected to the support structure are coupled to the signal processing unit through the support structure to output a second signal to the outside.
[0024] Optionally, the first injection molding structure includes an injection molding main structure, and the distance between the supporting structure and the injection molding main structure is greater than 300 μm.
[0025] According to another aspect of this application, a packaging structure is provided, comprising:
[0026] Several device regions and flow channel regions located between the several device regions;
[0027] A magnetocurrent sensor located in the device area, the magnetocurrent sensor being as described above;
[0028] The second injection molding flow channel structure located in the flow channel region is connected to the first injection molding flow channel structure included in the first injection molding structure of the magnetocurrent sensor in each of the several device regions.
[0029] Optionally, several device regions are arranged in an array along a first direction and a second direction; the flow channel region and several device regions are arranged along the second direction; the second injection flow channel structure extends along the first direction, and the second direction is perpendicular to the first direction.
[0030] Optionally, the magnetic current sensor further includes a second injection molding structure covering the magnetic field generating unit, the first injection molding structure, and the sensing magnetic head. The packaging structure also includes a third injection molding flow channel structure connected to the second injection molding structure, the third injection molding flow channel structure being located in the flow channel region.
[0031] Optionally, a plurality of device regions are arranged in an array along a first direction and a second direction, and the flow channel region and the plurality of device regions are arranged along the second direction;
[0032] The third injection runner structure extends along the first direction.
[0033] In the magnetocurrent sensor of this application embodiment, the sensing head for collecting current and outputting a first signal is placed in the receiving cavity of the first injection molding structure, so that the sensing head and the magnetic field generating unit are isolated by the first injection molding structure, thereby improving the stability and reliability of isolating the sensing head from other structures.
[0034] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description
[0035] To more clearly illustrate the technical solutions of this application, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0036] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.
[0037] Figure 1 A schematic diagram of a magnetocurrent sensor provided as an exemplary embodiment of the present disclosure;
[0038] Figure 2 A cross-sectional schematic diagram of a magnetocurrent sensor provided as an exemplary embodiment of this disclosure;
[0039] Figure 3 A schematic diagram of an encapsulation structure provided for an exemplary embodiment of this disclosure;
[0040] Figure 4 A schematic diagram of the second injection molding runner structure provided as an exemplary embodiment of this disclosure;
[0041] Figure 5 A schematic diagram of the third injection molding runner structure provided as an exemplary embodiment of this disclosure;
[0042] Figure 6Another schematic diagram of a magnetocurrent sensor provided as an exemplary embodiment of this disclosure;
[0043] Figure 7 Another schematic diagram of a magnetic current sensor provided as an exemplary embodiment of this disclosure.
[0044] Explanation of reference numerals in the attached figures:
[0045] 1-Magnetic current sensor; 2-Packaging structure;
[0046] 10 - Magnetic field generating unit, 11 - First part, 12 - Second part;
[0047] 20-First injection molding structure, 21-Accommodation cavity, 22-Injection molding main body structure, 23-First injection molding flow channel structure;
[0048] 30 - Induction head, 31 - Signal processing unit;
[0049] 40 - Second injection molding structure;
[0050] 50 - Lead frame, 51 - Support structure, 52 - Lead structure;
[0051] 60 - Device area;
[0052] 70 - Runner region, 71 - Second injection runner structure, 72 - Third injection runner structure. Detailed Implementation
[0053] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this specification, and not all of them. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this application.
[0054] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such as a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.
[0055] Various exemplary embodiments, features, and aspects of this disclosure will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.
[0056] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.
[0057] In this document, the term "and / or" describes a relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the term "at least one" in this document means any combination of at least two of any one or more elements. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.
[0058] Furthermore, to better illustrate this disclosure, numerous specific details are set forth in the following detailed description. Those skilled in the art will understand that this disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the main points of this disclosure.
[0059] A magnetocurrent sensor is a sensor that measures the magnitude of current based on electromagnetic principles. It typically includes a magnetic induction element, a magnetic field generating unit, a signal processing chip, and a lead frame. The current being measured flows through the magnetic field generating unit, creating a magnetic field around it. The magnetic induction element senses the magnetic field strength and converts it into an electrical signal, thus measuring the magnitude of the current being measured.
[0060] As a crucial component of magnetocurrent sensors, the stability of the magnetic induction element's fixed position during packaging significantly impacts the sensor's performance and measurement accuracy. Furthermore, a certain distance, known as a withstand voltage distance, must exist between the magnetic induction element and the lead frame and magnetic field generating unit to reduce the risks of electrical short circuits and insulation breakdown, thereby improving the reliability and safety of the magnetocurrent sensor.
[0061] Figure 1 A schematic diagram of the structure of a magnetocurrent sensor provided for an exemplary embodiment of this disclosure; Figure 2 A cross-sectional schematic diagram of a magnetic current sensor provided for an exemplary embodiment of this disclosure; Figure 2 for Figure 1 A schematic diagram of the cross-section at section AA is shown below. Figure 1 as well as Figure 2As shown, a magnetic current sensor includes:
[0062] Magnetic field generating unit 10;
[0063] The first injection molding structure 20, adjacent to the magnetic field generating unit 10, has a receiving cavity 21;
[0064] The sensing head 30 is located in the accommodating cavity 21 and is used to collect the magnetic field generated by the current flowing through the magnetic field generating unit 10 and output the first signal.
[0065] In some embodiments, the sensing head 30 is a magnetic sensing element. When a current flows through the magnetic field generating unit 10, the sensing head can sense the magnetic field strength generated by the current and convert it into a first signal output to measure the magnitude of the current. The number of sensing heads 30 can be one or more, for example... Figure 1 As shown, there are two induction heads 30.
[0066] In some embodiments, the magnetic field generating unit 10 can be a conductor through which current flows, and its shape, structure, etc., can be set according to specific needs. For example, the magnetic field generating unit 10 can be a "U-shaped" whole, or it can be like... Figure 1 The device is divided into a first part 11 and a second part 12, with a gap between them. The first part 11 and the second part 12 are U-shaped as a whole. The U-shaped magnetic field generating unit 10 can increase the magnetic flux by bending, thereby improving the measurement sensitivity of the magnetic current sensor 1.
[0067] In some embodiments, regarding the relative positional relationship between the magnetic field generating unit 10 and the sensing head 30, the sensing head 30 and the magnetic field generating unit 10 are arranged along a first direction; the sensing head 30 has a first center, which is the geometric center of the sensing head 30; the magnetic field generating unit 10 has a second center, which is located at the center point of the magnetic field generating unit 10 in a second direction, and the second direction is perpendicular to the first direction; the first center and the second center are arranged along the first direction.
[0068] like Figure 1 As shown, the first direction is the y-direction, the second direction is the x-direction, and the x-direction is perpendicular to the y-direction. The magnetic field generating unit 10 and at least one induction head 30 are arranged along the y-direction. The induction head 30 has a first center, and the magnetic field generating unit 10 has a second center located at the center point of the magnetic field generating unit 10 in the x-direction. The first center of the at least one induction head 30 and the second center of the magnetic field generating unit 10 are arranged along the y-direction and are on the same straight line. The second center of the magnetic field generating unit 10 is determined by considering the first part 11, the second part 12, and the distance between them as a whole.
[0069] In some embodiments, when there is only one sensing head 30, the first center of the sensing head 30 and the second center of the magnetic field generating unit 10 are arranged along a first direction and lie on the same straight line. When there are multiple sensing heads 30, the geometric center of each sensing head 30 is the first center, and the first center of at least one of the multiple sensing heads 30 and the second center of the magnetic field generating unit 10 are arranged along the first direction and lie on the same straight line. At the center position, the sensing head 30 can sense a uniform magnetic field distribution, which helps to reduce measurement errors caused by positional offset and improves the sensitivity and measurement accuracy of the magnetic current sensor 1.
[0070] In some embodiments, the magnetocurrent sensor 1 further includes a first injection molding structure 20 having a accommodating cavity 21. The first injection molding structure 20 includes an injection molding body structure 22 and a first injection molding flow channel structure 23 connected to the injection molding body structure 22. The accommodating cavity 21 is located within the injection molding body structure 22, and the sensing magnetic head 30 is isolated from the magnetic field generating unit 10 by the injection molding body structure 22.
[0071] like Figure 1 and Figure 2 As shown, the injection-molded main body structure 22 has a receiving cavity 21, and the sensing magnetic head 30 is fixed in the receiving cavity 21, so that the injection-molded main body structure 22 can surround the sensing magnetic head 30 circumferentially, thereby isolating the sensing magnetic head 30 from the outside world through the injection-molded main body structure 22. The sensing magnetic head 30 can be fixed in the receiving cavity 21 by dispensing adhesive. By limiting the position of the sensing magnetic head 30 in the receiving cavity 21 and cooperating with dispensing adhesive fixation, the stability and reliability of the fixing of the sensing magnetic head 30 can be improved.
[0072] In some embodiments, such as Figure 1 As shown, the distance between the sensing magnetic head 30 and the magnetic field generating unit 10 along the first direction and the distance along the second direction can both be the withstand pressure distance. This application does not limit the specific range of the withstand pressure distance. The sensing magnetic head 30 and the magnetic field generating unit 10 are stably isolated by the injection-molded main body structure 22, thereby stably forming the withstand pressure distance and avoiding withstand pressure failure caused by delamination during the packaging process due to the use of PI film isolation.
[0073] In some embodiments, injection molding material can be introduced through the first injection channel structure 23 to form the injection molding body structure 22. The injection molding material, i.e., the material of the injection molding body structure 22, can be epoxy resin. Since the sensing head 30 is located inside the accommodating cavity 21, the position of the injection molding body structure 22 during injection molding can be determined according to the position of the sensing head 30.
[0074] like Figure 1 or Figure 2As shown, the magnetic current sensor 1 also includes a second injection-molded structure 40, which covers the magnetic field generating unit 10, the first injection-molded structure 20, and the sensing magnetic head 30.
[0075] In some embodiments, the magnetocurrent sensor 1 can be considered to be encapsulated through two injection molding processes. The first injection molding forms the main injection molding structure 22, and the second injection molding forms the second injection molding structure 40. The second injection molding structure 40 encapsulates the magnetic field generating unit 10, the first injection molding structure 20, and the sensing magnetic head 30, thereby encapsulating the magnetocurrent sensor 1. The material of the second injection molding structure 40 can be the same as that of the first injection molding structure 20, which is also epoxy resin. Compared to the use of a PI film for isolation in related technologies, the consistent material in both injection molding processes in this application reduces manufacturing costs.
[0076] like Figure 1 or Figure 2 As shown, the magnetic current sensor 1 also includes a lead frame 50 and a signal processing unit 31 fixed to the lead frame 50.
[0077] The signal processing unit 31 is coupled to the induction head 30. The signal processing unit 31 is used to process the first signal to output the second signal.
[0078] The lead frame 50 includes a support structure 51 and a plurality of lead structures 52 connected to the support structure 51.
[0079] The support structure 51 is coupled to the signal processing unit 31 and is used to support the signal processing unit 31. The distance between the support structure 51 and the injection molding body structure 22 is greater than 300 μm; multiple lead structures 52 are coupled to the signal processing unit 31 through the support structure 51 to output a second signal to the outside.
[0080] In some embodiments, the magnetic current sensor 1 further includes a lead frame 50 disposed along a first direction with the magnetic field generating unit 10 and the sensing head 30, and a signal processing unit 31 for fixing the lead frame 50. The lead frame 50 includes a support structure 51 and a plurality of lead structures 52; the signal processing unit 31 is fixed to the support structure 51 and coupled to the sensing head 30 and the lead structures 52 to receive a first signal from the sensing head 30, process the first signal to obtain a second signal, and output the second signal through the lead structures 52. For example, the signal processing unit 31 may have a signal amplification function so that the first signal can be amplified by the signal processing unit 31 to obtain the second signal.
[0081] In some embodiments, since the lead frame 50 can be made of metal, there is also a pressure-resistant distance between the induction head 30 and the support structure 51, and the injection-molded main body structure 22 can also isolate the induction head 30 from the lead frame 50. The distance between the support structure 51 and the injection-molded main body structure 22 along the first direction can be greater than 300 μm.
[0082] In some embodiments, in addition to providing a support structure 51 to fix the signal processing unit 31, the signal processing unit 31 may also be electrically connected to the support structure 51.
[0083] Accordingly, the technical solution of this application also discloses a packaging structure for packaging the magnetocurrent sensor 1. Figure 3 A schematic diagram of an encapsulation structure provided for an exemplary embodiment of this disclosure; Figure 4 A schematic diagram of the second injection molding runner structure provided as an exemplary embodiment of this disclosure; Figure 5 A schematic diagram of the third injection molding runner structure provided as an exemplary embodiment of this disclosure; as shown Figures 3 to 5 As shown, a packaging structure 2 includes:
[0084] A plurality of device regions 60 and a flow channel region 70 located between the plurality of device regions 60; the plurality of device regions 60 are arranged in an array along a first direction and a second direction; the flow channel region 70 and the plurality of device regions 60 are arranged along the second direction.
[0085] A magnetocurrent sensor 1 is located in several device regions 60, and the magnetocurrent sensor 1 is as described in any of the above embodiments;
[0086] The second injection molding flow channel structure 71 is located in the flow channel region 70. The second injection molding flow channel structure 71 extends along the first direction and is connected to the first injection molding flow channel structure 23 in the magnetocurrent sensor 1 of the plurality of device regions 60.
[0087] In some embodiments, the packaging structure 2 may include a flow channel region 70 and a device region 60. The device region 60 is used to place the magnetocurrent sensor 1; the flow channel region 70 is connected to the device region 60 and is used to input injection molding material into the device region 60 to encapsulate the magnetocurrent sensor 1 as in any of the above embodiments.
[0088] In some embodiments, the flow channel region 70 may include a plurality of second injection molding flow channel structures 71, such as Figure 3 and Figure 4As shown, the flow channel region 70 includes two second injection molding flow channel structures 71, and several device regions 60 arranged in an array are disposed on both sides of the two second injection molding flow channel structures 71. The second injection molding flow channel structures 71 are connected to the first injection molding flow channel structure 23 in the magnetocurrent sensor 1, so that the injection molding material flows through the second injection molding flow channel structure 71 and the first injection molding flow channel structure 23, forming the injection molding body structure 22, thus completing the first injection molding of the magnetocurrent sensor 1.
[0089] In some embodiments, such as Figure 1 As shown, a portion of the first injection molding runner structure 23 protrudes from the second injection molding structure 40, facilitating connection with the second injection molding runner structure 71. After the injection molding main structure 22 is formed and the first injection molding is completed, the first injection molding runner structure 23 can be partially or completely removed, and the space after the partial or complete removal of the first injection molding runner structure 23 can be filled with a material of the same material as the second injection molding structure 40.
[0090] In some embodiments, such as Figure 3 and Figure 5 As shown, the flow channel region 70 also includes a third injection molding flow channel structure 72, which is located between the two second injection molding flow channel structures 71 and extends along the first direction. The third injection molding flow channel structure 72 is used to input injection molding material into the device region 60 to injection mold a second injection molding structure 40 covering the magnetic field generating unit 10, the injection molding main body structure 22, the sensing magnetic head 30, the signal processing unit 31, and the lead frame 50, thereby completing the second injection molding of the magnetic current sensor 1 and realizing the encapsulation of the magnetic current sensor 1.
[0091] Furthermore, the third injection channel structure 72 can be connected to the portion where the second injection structure 40 intersects with the first injection channel structure 23, so that the injection material input into the third injection channel structure 72 can fill the first injection channel structure 23 while forming the second injection structure 40. Specifically, when the first injection channel structure 23 is completely removed, the injection material input from the third injection channel structure 72 fills the space left after the removal of the first injection channel structure 23. When the first injection channel structure 23 is not removed, the injection material fills the interior of the first injection channel structure 23. When the first injection channel structure 23 is partially removed, the injection material fills the space left after removal in the removed portion, and in the portion of the first injection channel structure 23 that is not removed, the injection material fills its interior.
[0092] Figure 6 Another schematic diagram of the structure of the magnetocurrent sensor 1 provided as an exemplary embodiment of this disclosure; Figure 7 This is yet another schematic diagram of the structure of the magnetocurrent sensor 1 provided as an exemplary embodiment of this disclosure. (See diagram below.) Figure 6 As shown, the portion of the first injection molding runner structure 23 protruding from the second injection molding structure 40 can be removed; or, as... Figure 7 As shown, the first injection molding runner structure 23 can be completely removed.
[0093] The design of the third injection molding flow channel structure 72, multiple second injection molding flow channel structures 71, and several device regions 60 enables the simultaneous encapsulation of multiple magnetocurrent sensors 1, thereby improving the encapsulation efficiency of the magnetocurrent sensors 1. Furthermore, the encapsulation structure 2 enables two injection molding processes for the magnetocurrent sensors 1, forming an injection molding main structure 22 to fix and isolate the sensing magnetic head 30, and forming a second injection molding structure 40 to encapsulate and seal the various structures of the magnetocurrent sensors 1. Compared to related technologies, this improves the performance and measurement accuracy of the magnetocurrent sensors 1 while reducing encapsulation costs.
[0094] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0095] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0096] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.
[0097] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent variations, or alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application. The terminology used herein is chosen to best explain the principles, practical applications, or technical improvements to the market of the various embodiments, or to enable other persons skilled in the art to understand the various embodiments disclosed herein.
Claims
1. A magnetic current sensor, characterized in that, The magnetocurrent sensor includes: Magnetic field generating unit; The first injection-molded structure adjacent to the magnetic field generating unit has a receiving cavity; The sensing head, located inside the accommodating cavity, is used to collect the magnetic field generated by the current flowing through the magnetic field generating unit and output a first signal.
2. The magnetocurrent sensor according to claim 1, characterized in that, The magnetocurrent sensor also includes a second injection-molded structure. The second injection-molded structure covers the magnetic field generating unit, the first injection-molded structure, and the induction magnetic head.
3. The magnetocurrent sensor according to claim 1, characterized in that, The first injection molding structure includes an injection molding main body structure. The accommodating cavity is located within the injection-molded main structure.
4. The magnetocurrent sensor according to claim 3, characterized in that, The inductive magnetic head and the magnetic field generating unit are isolated by the injection-molded main body structure.
5. The magnetocurrent sensor according to claim 3, characterized in that, The first injection molding structure further includes a first injection flow channel structure connected to the injection molding main structure.
6. The magnetocurrent sensor according to claim 1, characterized in that, The inductive magnetic head and the magnetic field generating unit are arranged along a first direction; The inductive magnetic head has a first center, which is the geometric center of the inductive magnetic head; the magnetic field generating unit has a second center, which is located at the center point of the magnetic field generating unit in a second direction, which is perpendicular to the first direction; the first center and the second center are arranged along the first direction.
7. The magnetocurrent sensor according to claim 1, characterized in that, The magnetocurrent sensor also includes: Lead frame; A signal processing unit fixed to the lead frame, the signal processing unit being coupled to the induction magnetic head, the signal processing unit being used to process the first signal to output a second signal.
8. The magnetocurrent sensor according to claim 7, characterized in that, The lead frame includes: A support structure is coupled to the signal processing unit, and the support structure is used to support the signal processing unit; Multiple lead structures connected to the support structure, the multiple lead structures being coupled to the signal processing unit through the support structure, so as to output the second signal to the outside.
9. The magnetocurrent sensor according to claim 8, characterized in that, The first injection molding structure includes an injection molding main structure, and the distance between the supporting structure and the injection molding main structure is greater than 300 μm.
10. A packaging structure, characterized in that, include: Several device regions and flow channel regions located between the several device regions; A magnetocurrent sensor located in the plurality of device regions, the magnetocurrent sensor being as described in any one of claims 1 to 9; The second injection molding flow channel structure located in the flow channel region is connected to the first injection molding flow channel structure included in the first injection molding structure of the magnetocurrent sensor in each of the plurality of device regions.
11. The packaging structure according to claim 10, characterized in that, The plurality of device regions are arranged in an array along a first direction and a second direction; the flow channel region and the plurality of device regions are arranged along the second direction; the second injection molding flow channel structure extends along the first direction, and the second direction is perpendicular to the first direction.
12. The packaging structure according to claim 10, characterized in that, The magnetocurrent sensor further includes a magnetic field generating unit, a first injection molding structure, and a second injection molding structure for the sensing magnetic head. The encapsulation structure also includes a third injection molding flow channel structure connected to the second injection molding structure, and the third injection molding flow channel structure is located in the flow channel region.
13. The packaging structure according to claim 12, characterized in that, The plurality of device regions are arranged in an array along a first direction and a second direction, and the flow channel region is arranged along the second direction with the plurality of device regions. The third injection molding channel structure extends along the first direction.