Wafer burn-in test system

Abstract

The utility model discloses a wafer aging test system, including wafer transport equipment, the wafer loading and unloading equipment is set up in one side of wafer transport equipment, wafer aging test equipment, wafer aging test equipment includes at least one wafer aging test device, at least one wafer aging test device sets up in at least one side of wafer transport equipment, any wafer aging test device and wafer transport equipment opposite formation first transport passage, wafer transport equipment includes wafer taking and placing material device, and the second transport passage is formed in wafer transport equipment, and any first transport passage and second transport passage intercommunication, and wafer taking and placing material device bears wafer and is controlled in the second transport passage or any first transport passage and moves to realize the loading or unloading of wafer. Utilize the utility model discloses embodiment can expand multiple test sites parallel test, improve test efficiency, improve the flexibility and rationality of equipment layout simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a wafer aging test system. Background Technology

[0002] In the semiconductor wafer testing process, wafers are typically loaded, unloaded, and moved between loading / unloading equipment and testing equipment using transport equipment. Due to limitations in transport conditions and space, conventional equipment layouts often involve loading / unloading equipment, a single transport device, and a single testing device, resulting in limited testing positions and low testing efficiency. Utility Model Content

[0003] To address the aforementioned problems in the prior art, this utility model discloses a wafer aging test system capable of expanding parallel testing to multiple test positions, thereby improving testing efficiency and enhancing the flexibility and rationality of equipment layout. The technical solution disclosed in this utility model is as follows:

[0004] According to one aspect of the embodiments disclosed in this utility model, a wafer aging test system is provided, the wafer aging test system comprising:

[0005] Wafer transport equipment;

[0006] The wafer loading and unloading equipment is located on one side of the wafer transport equipment;

[0007] A wafer aging test equipment, the wafer aging test equipment including at least one wafer aging test device, the at least one of the wafer aging test devices being disposed on at least one side of the wafer transport equipment; any one of the wafer aging test devices and the wafer transport equipment forming a first transport channel;

[0008] The wafer transport equipment includes a wafer loading and unloading device, and a second transport channel is formed inside the wafer transport equipment. Any of the first transport channels is connected to the second transport channel. The wafer loading and unloading device carries the wafer and is controlled to move in the second transport channel or any of the first transport channels to realize the loading or unloading of the wafer.

[0009] Optionally, the wafer aging test system includes at least two wafer aging test devices, the wafer transport device includes at least two wafer transport boxes connected in sequence, the wafer loading and unloading device is disposed on one side of the at least two wafer transport boxes, and at least two wafer aging test devices are disposed on at least one side of the at least two wafer transport boxes; the first transport channels corresponding to the wafer aging test devices on the same layer of two adjacent wafer aging test devices are connected.

[0010] Optionally, along the extension direction of the first transport channel, the wafer loading and unloading equipment and at least two wafer aging test devices are sequentially arranged on the same side of at least two wafer transport boxes.

[0011] Optionally, along the extension direction of the first transport channel, at least two of the wafer aging test devices are sequentially arranged on the other side of at least two of the wafer transport boxes; the wafer loading and unloading device is also used to rotate between the two sides of at least two of the wafer transport boxes.

[0012] Optionally, at least two of the wafer aging test devices are respectively arranged on both sides of at least two of the wafer transport boxes. Along the extension direction of the first transport channel, the wafer loading and unloading equipment and at least one of the wafer aging test devices are sequentially arranged on one side of at least two of the wafer transport boxes; the wafer loading and unloading device is also used to rotate between the two sides of at least two of the wafer transport boxes.

[0013] Optionally, the wafer transport equipment further includes a first lifting mechanism and a moving mechanism, wherein the first lifting mechanism is slidably connected to the moving mechanism, the wafer picking and placing device is slidably connected to the first lifting mechanism, and the wafer transport equipment corresponds to one wafer picking and placing device and one first lifting mechanism;

[0014] The wafer loading and unloading device is controlled to slide along the second transport channel on the first lifting mechanism, and the first lifting mechanism is controlled to slide along the first transport channel on the moving mechanism.

[0015] Optionally, any of the wafer aging test devices extends into the wafer transport equipment. The wafer aging test device includes a heat sink assembly, an alignment mechanism, and a mounting bracket. The mounting bracket extends into the wafer transport equipment. The heat sink assembly is disposed on the alignment mechanism. The alignment mechanism moves along the mounting bracket into the wafer transport equipment. A first transport channel is formed above the heat sink assembly to realize wafer loading or unloading between the wafer pick-and-place device and the wafer aging test device.

[0016] The first transport channel is arranged in a horizontal direction, and the second transport channel is arranged in a vertical direction. The wafer pick-and-place device is controlled to move horizontally in either of the first transport channels and vertically in either of the second transport channels.

[0017] Optionally, the wafer loading and unloading device includes a wafer loading device and a wafer unloading device arranged side by side. The wafer loading device includes a first support, and the wafer unloading device includes a second support. Adsorption mechanisms are respectively provided on the first support and the second support.

[0018] The first support and the corresponding adsorption mechanism are connected by a second lifting mechanism, which is used to drive the corresponding adsorption mechanism to move along the first support to complete the wafer loading action; the second support and the corresponding adsorption mechanism are connected by a third lifting mechanism, which is used to drive the corresponding adsorption mechanism to move along the second support to complete the wafer unloading action.

[0019] Optionally, the adsorption mechanism includes:

[0020] The third support is ring-shaped;

[0021] Multiple adsorption elements are arranged at intervals along the circumference of the third support and connected to the third support. The multiple adsorption elements are configured to simultaneously provide adsorption force to the bottom of the wafer so that the wafer is attached to the heat sink.

[0022] Multiple snap-fit ​​components are arranged circumferentially around the third support and connected to the third support. The multiple snap-fit ​​components are configured to simultaneously snap onto the heat sink carrying the wafer in a controlled manner.

[0023] Optionally, the third support includes a first annular support and a second annular support, which are concentric and rotate relative to each other about the center axis; the plurality of adsorption elements and the plurality of snap-fit ​​elements are disposed on the second annular support.

[0024] Optionally, the wafer pick-and-place device is connected to the first lifting mechanism via a correction mechanism. The correction mechanism includes a first connecting component and a second connecting component. The first connecting component is used to correct the tilt of the wafer pick-and-place device in a first direction, and the second connecting component is used to correct the tilt of the wafer pick-and-place device in a second direction. The first direction and the second direction are horizontal directions that are perpendicular to each other.

[0025] Optionally, the wafer transport box includes a first fixing member and a moving mechanism. The moving mechanism extends horizontally, and the moving mechanisms of two adjacent wafer transport boxes are connected. The moving mechanism is disposed on the first fixing member, and each first fixing member is provided with a leveling component.

[0026] The moving mechanism is used to move the wafer pick-and-place device along the horizontal direction, and the leveling component is used to level the first fixing member so that the moving mechanisms of the two adjacent wafer transport boxes are aligned.

[0027] Optionally, the leveling assembly includes a first horizontal leveling assembly, a second horizontal leveling assembly, and a vertical leveling assembly. The moving mechanism is disposed on one side of the first fixing member, the first horizontal leveling assembly and the second horizontal leveling assembly are disposed on the other side of the first fixing member, and the vertical leveling assembly is disposed at the bottom of the first fixing member.

[0028] The first horizontal leveling component is used to level the first fixing member along the extension direction of the moving mechanism;

[0029] The second horizontal leveling component is used to level the first fixing member in a direction perpendicular to the side of the first fixing member;

[0030] The vertical leveling component is used to level the first fixing member in a direction parallel to the side of the first fixing member.

[0031] Optionally, the wafer transport equipment further includes a first connecting structure, a second connecting structure, and a housing. The first fixing member, the moving mechanism, and the wafer loading and unloading device are all disposed within the housing. The first connecting structure spans the first fixing members of two adjacent wafer transport boxes to connect them. The housings of two adjacent wafer transport boxes are connected by the second connecting structure.

[0032] The technical solutions provided by the embodiments disclosed in this utility model have at least the following beneficial effects:

[0033] The wafer aging test system provided by this utility model includes: a wafer transport device; a wafer loading and unloading device disposed on one side of the wafer transport device; and a wafer aging test device, which includes at least one wafer aging test unit disposed on at least one side of the wafer transport device, thereby enabling parallel testing of multiple test positions, improving testing efficiency, and enhancing the flexibility and rationality of the equipment layout; any wafer aging test unit and the wafer transport device form a first transport channel relative to each other; the wafer transport device includes a wafer picking and unloading device; a second transport channel is formed within the wafer transport device; any first transport channel is connected to the second transport channel; and the wafer picking and unloading device carries the wafer and is controlled to move within the second transport channel or any first transport channel to achieve wafer loading or unloading.

[0034] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0035] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the disclosure of this utility model and, together with the description, serve to explain the principles of this disclosure, but do not constitute an undue limitation on the disclosure of this utility model.

[0036] Figure 1 This is a schematic diagram of the structure of a wafer aging test system provided in an embodiment of this application;

[0037] Figure 2 This is a schematic diagram of the structure of a wafer transport device provided in an embodiment of this application;

[0038] Figure 3 This is a side cross-sectional view of a wafer transport device and a wafer aging test device provided in the embodiments of this application;

[0039] Figure 4 This is a top view of a wafer transport device and a wafer aging test device provided in an embodiment of this application;

[0040] Figure 5 This is a perspective view of a second transport channel and a first transport channel provided in an embodiment of this application;

[0041] Figure 6 This is a schematic diagram of another wafer aging test system provided in an embodiment of this application;

[0042] Figure 7 This is a schematic diagram of another wafer aging test system provided in an embodiment of this application;

[0043] Figure 8 This is a schematic diagram of the structure of a wafer aging test device provided in an embodiment of this application;

[0044] Figure 9 This is a schematic diagram of the structure of a wafer loading and unloading device provided in an embodiment of this application;

[0045] Figure 10 This is a top view of a wafer loading and unloading device provided in an embodiment of this application;

[0046] Figure 11 This is a schematic diagram of a wafer pick-and-place device provided in an embodiment of this application;

[0047] Figure 12 This is a schematic state diagram of another wafer pick-and-place device provided in the embodiments of this application;

[0048] Figure 13 This is a schematic diagram of the adsorption mechanism provided in the embodiments of this application;

[0049] Figure 14This is a partially enlarged view of the adsorption mechanism provided in the embodiments of this application;

[0050] Figure 15 This is a schematic diagram of the structure of the third support provided in the embodiments of this application;

[0051] Figure 16 This is a schematic diagram of a first guide member and a second guide member provided in an embodiment of this application;

[0052] Figure 17 This is a schematic diagram of a wafer loading and unloading device provided in an embodiment of this application moving horizontally between two adjacent wafer transport boxes;

[0053] Figure 18 This is a schematic diagram of the vertical movement of a wafer pick-and-place device provided in an embodiment of this application;

[0054] Figure 19 This is a schematic diagram of the structure of a wafer loading and unloading device and a correction mechanism provided in an embodiment of this application;

[0055] Figure 20 This is a schematic diagram of the corrective mechanism provided in the embodiments of this application;

[0056] Figure 21 This is a schematic diagram of another wafer loading and unloading device and a correction mechanism provided in the embodiments of this application;

[0057] Figure 22 This is a schematic diagram of a second connection structure provided in an embodiment of this application;

[0058] Figure 23 This is a schematic diagram of a leveling component provided in an embodiment of this application;

[0059] Figure 24 This is an enlarged schematic diagram of a leveling component provided in an embodiment of this application;

[0060] In the figure, the corresponding reference numerals are: 1-Wafer transport equipment; 10-Wafer transport box; 11-First fixing component; 12-Second fixing component; 13-Third fixing component; 14-Moving mechanism; 141-First guide component; 151-Wafer loading and unloading device; 152-First lifting mechanism; 153-Second guide component; 16-First transport channel; 17-Second transport channel; 110-Wafer loading device; 111-First support; 112-Second lifting mechanism; 120-Wafer unloading device; 121-Second support; 122-Third lifting mechanism; 200-Adsorption mechanism; 210-Third support; 211-First annular support; 212-Second annular support; 220-Adsorption component; 230-Snap-fit ​​component; 240-Sliding component; 250-Driver component; 260-Limiting component; 261-First sensor; 262- 263-Second sensor; 264-Second limiting part; 300-Heat sink; 500-Correction mechanism; 510-First connecting assembly; 511-First connector; 512-Second connector; 513-First pin; 520-Second connecting assembly; 521-Third connector; 522-Fourth connector; 523-Second pin; 16-Leveling assembly; 161-First horizontal leveling assembly; 162-Second horizontal leveling assembly; 163-Vertical leveling assembly; 164-First leveling component; 165-Second leveling component; 17-First connecting structure; 18-Second connecting structure; 181-First sub-connecting structure; 182-Second sub-connecting structure; 2-Wafer loading and unloading equipment; 3-Wafer aging test equipment; 31-Wafer aging test device; 32-Mounting bracket; 33-Heat sink assembly; 34-Alignment mechanism. Detailed Implementation

[0061] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0062] It should be noted that in the specification, claims, and accompanying drawings of the embodiments of this application, the terms "upper," "lower," "top," "bottom," etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data used can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, in the description of the embodiments, unless otherwise stated, "a plurality of" means two or more. In addition, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, or product that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0063] To make the objectives, technical solutions, and advantages disclosed in the embodiments of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the embodiments of this application and are not intended to limit the embodiments of this application.

[0064] The following is in conjunction with the appendix Figure 1-24 The technical solutions in the embodiments of this application are introduced.

[0065] Please see Figure 1-5 This application provides a wafer aging test system, which includes a wafer transport device 1; a wafer loading / unloading device 2 disposed on one side of the wafer transport device 1; and a wafer aging test device 3, which includes at least one wafer aging test unit 31 disposed on at least one side of the wafer transport device 1. Each wafer aging test unit 31 forms a first transport channel 16 opposite to the wafer transport device 1. The wafer transport device 1 includes a wafer pick-and-place device 151, and a second transport channel 17 is formed within the wafer transport device 1. Each first transport channel 16 communicates with the second transport channel 17. The wafer pick-and-place device 151 carries a wafer and is controlled to move within the second transport channel 17 or any of the first transport channels 16 to achieve wafer loading or unloading.

[0066] In one specific embodiment, the wafer loading / unloading device 2 is used to retrieve a wafer to be tested from a wafer cassette and transfer it to a preset position in the wafer transport device 1, so that the wafer pick-and-place device 151 can pick up the wafer to be tested from the preset position, and retrieve the tested wafer placed at the preset position by the wafer pick-and-place device 151 and put it into the wafer cassette. The wafer aging test device 3 can be a device for performing aging tests on wafers. The wafer pick-and-place device 151 can be used to carry wafers or a heat sink carrying wafers.

[0067] In one specific embodiment, the number of devices in the wafer aging test system can be set according to actual application requirements. For example... Figure 1 As shown by the structure on the right side of the dashed line, the wafer aging test system may include a wafer loading / unloading device 2, a wafer transport device 1, and a wafer aging test device 3. In practical applications, to improve wafer testing efficiency, multiple wafer aging test units 31 of the wafer aging test device 3 can be added to form multiple test positions for parallel testing, thereby improving testing efficiency. Optionally, multiple wafer aging test units 31 can be stacked to form multiple test positions across multiple layers, with each layer corresponding to a first transport channel.

[0068] Optionally, the wafer aging test system includes at least two wafer aging test devices 3, the wafer transport device 1 includes at least two wafer transport boxes 10 connected in sequence, the wafer loading and unloading device 2 is located on one side of the at least two wafer transport boxes 10, and at least two wafer aging test devices 31 are located on at least one side of the at least two wafer transport boxes 10; the first transport channels 16 corresponding to the wafer aging test devices 31 on the same layer of two adjacent wafer aging test devices 3 are connected.

[0069] In practical applications, multiple wafer transport boxes 10 can be sequentially connected to corresponding multiple wafer aging test devices 3 to achieve long-distance wafer transport and further enable multiple wafer aging test devices 31 in the multiple wafer aging test devices 3 to perform wafer aging tests simultaneously. Optionally, the wafer loading and unloading equipment 2 is set on one side of at least two wafer transport boxes 10, and at least two wafer aging test devices 3 are set on at least one side of at least two wafer transport boxes 10, so that the wafer aging test devices 3 can be flexibly expanded according to actual application needs, making it highly adaptable.

[0070] In one specific embodiment, the wafer pick-and-place device 151 is used to move along a first transport channel 16 and a second transport channel 17 in at least two wafer transport boxes 10 to pick up wafers to be tested from the wafer loading / unloading equipment 2, pick up wafers that have completed testing from any wafer aging test device 31, and transport and place the wafers to be tested on each wafer aging test device 31 for the next round of testing. The tested wafers are then transported back to the wafer loading / unloading equipment 2 and subsequently recycled into a wafer cassette for storage. The number of first transport channels 16 is consistent with the number of layers of wafer aging test devices 31 in the wafer aging test equipment 3. The wafer pick-and-place device 151 can move along a first transport channel 16 to the wafer aging test devices 31 on the same layer of the corresponding multiple wafer aging test equipment 3.

[0071] Optionally, the area within the wafer aging test equipment 3 corresponding to the space between two adjacent wafer aging test equipment 3 can also form a second transport channel 17, thereby expanding the movement path of the wafer pick-and-place device 151 and facilitating wafer handling. The space between two adjacent wafer aging test equipment 3 can also be used as a maintenance channel to facilitate maintenance of the wafer aging test equipment 3.

[0072] In some embodiments, such as Figure 1 As shown, along the channel direction and along the extension direction of the first transport channel 16, the wafer loading and unloading equipment 2 and at least two wafer aging test devices 31 are sequentially arranged on the same side of at least two wafer transport boxes 10.

[0073] Specifically, the wafer pick-and-place device 151 is used to move in the second transport channel 17 and the first transport channel 16 to realize the transfer and handling of wafers to be tested and wafers that have been tested.

[0074] In some embodiments, such as Figure 6 As shown, along the extension direction of the first transport channel 16, at least two wafer aging test devices 31 are sequentially arranged on the other side of at least two wafer transport boxes 10; the wafer loading and unloading device 151 is also used to rotate between the two sides of at least two wafer transport boxes 10.

[0075] Specifically, the wafer loading / unloading equipment 2 and the wafer aging test equipment 3 are respectively set on both sides of the wafer transport box 10. The wafer picking and placing device 151 moves in the second transport channel 17 and the first transport channel 16, and also rotates between the two sides of the wafer transport box 10 to realize the loading, unloading and handling of wafers to be tested and wafers that have completed testing between the wafer loading / unloading equipment 2 and each wafer aging test equipment 31.

[0076] In some embodiments, such as Figure 7As shown, at least two wafer aging test devices 31 are respectively arranged on both sides of at least two wafer transport boxes 10. Along the extension direction of the first transport channel 16, the wafer loading and unloading equipment 2 and at least one wafer aging test device 31 are sequentially arranged on one side of at least two wafer transport boxes 10; the wafer loading and unloading device 151 is also used to rotate between the two sides of at least two wafer transport boxes 10.

[0077] Specifically, multiple wafer aging test devices 3 are respectively arranged on both sides of the wafer transport box 10, and the wafer loading / unloading device 2 is arranged on any side of the wafer transport box 10. The devices arranged on both sides of the wafer transport device 1 are arranged sequentially at intervals. The wafer loading / unloading device 151 moves in the second transport channel 17 and the first transport channel 16, and also rotates between the two sides of at least two wafer transport boxes 10 to realize the loading, unloading and handling of wafers to be tested and wafers that have been tested between the wafer loading / unloading device 2 and other wafer aging test devices 3. Among them, the other wafer aging test devices 3 are the wafer aging test devices 3 other than at least one wafer aging test device 3.

[0078] In one specific embodiment, such as Figure 3-5 and Figure 8 As shown, any wafer aging test device 31 extends into the wafer transport device 1. The wafer aging test device 31 includes a heat sink assembly 33, an alignment mechanism 34, and a mounting bracket 32. The mounting bracket 32 ​​extends into the wafer transport device 1. The heat sink assembly 33 is disposed on the alignment mechanism 34. The alignment mechanism 34 moves along the mounting bracket 32 ​​into the wafer transport device 1. A first transport channel 16 is formed above the heat sink assembly 33 to realize wafer loading or unloading between the wafer pick-and-place device 151 and the wafer aging test device 31. The first transport channel 16 is arranged in a horizontal direction, and the second transport channel 17 is arranged in a vertical direction. The wafer pick-and-place device 151 is controlled to move horizontally in any of the first transport channels 16 and vertically in any of the second transport channels 17.

[0079] In one specific embodiment, during the testing of the wafer by each wafer aging test apparatus 31, the heat sink assembly 33 and the alignment mechanism 34 are located within each wafer aging test apparatus 31. After the test is completed, the heat sink assembly 33, along with the alignment mechanism 34, moves from each wafer aging test apparatus 31 to the wafer transport device 1. The aforementioned first transport channel 16 is formed above the heat sink assembly 33. The wafer pick-and-place device 151 moves through the first transport channel 16 to the wafer aging test apparatus 31 to pick up the tested wafer (or wafers carrying test wafers). The test wafer heat sink is completed, and the wafer to be tested (or the heat sink carrying the wafer to be tested) is placed on the wafer aging test device 31. The heat sink assembly 33 is moved into the wafer aging test device 31 along with the alignment mechanism 34, so that the wafer aging test device 31 can perform the next round of testing on the wafer placed on it. This realizes the wafer loading or unloading between the wafer loading and unloading device 151 and the wafer aging test device 31, so that interference can be avoided during the wafer transportation process when each wafer aging test device 31 extends into the platform of the wafer transportation equipment 1.

[0080] In practical applications, the wafer pick-and-place device 151 picks up the wafer to be tested from the wafer loading and unloading equipment 2, moves vertically along the second transport channel 17 in the wafer transport equipment 1 to the connection point between the first transport channel 16 and the second transport channel 17 corresponding to the target wafer aging test device 31, and then moves horizontally along the first transport channel 16 to the target wafer aging test device 31. First, it picks up the wafer that has been tested by the target wafer aging test device 31 (i.e., wafer unloading), and then places the wafer to be tested on the target wafer aging test device 31 (i.e., wafer loading) for testing. During the testing of the wafer to be tested by the target wafer aging test device 31, the wafer pick-and-place device 151 moves along the first transport channel 16 to the connection point with the second transport channel 17, and moves along the second transport channel 17 to the wafer loading and unloading equipment 2, placing the tested wafer on the wafer loading and unloading equipment 2 so that the wafer loading and unloading equipment 2 can put the tested wafer into the wafer box for storage. The target wafer aging test device 31 can be any one of the multiple wafer aging test devices 31.

[0081] Optional, such as Figure 9-10As shown, the wafer loading and unloading device 151 includes a wafer loading device 110 and a wafer unloading device 120 arranged side by side. The wafer loading device 110 includes a first support 111, and the wafer unloading device 120 includes a second support 121. Adsorption mechanisms 200 are respectively provided on the first support 111 and the corresponding adsorption mechanism 200. The first support 111 and the corresponding adsorption mechanism 200 are connected by a second lifting mechanism 112. The second lifting mechanism 112 is used to drive the corresponding adsorption mechanism 200 to move along the first support 111 to complete the wafer loading action (i.e., picking up the corresponding wafer). The second support 121 and the corresponding adsorption mechanism 200 are connected by a third lifting mechanism 122. The third lifting mechanism 122 is used to drive the corresponding adsorption mechanism 200 to move along the second support 121 to complete the wafer unloading action (i.e., placing the corresponding wafer).

[0082] Specifically, the first support 111 serves as the main frame of the wafer loading device 110, supporting and fixing other components. It is typically a rigid structure to ensure stable support during wafer loading. The second lifting mechanism 112 is connected to the first support 111 and drives the adsorption mechanism 200 to move up and down along the first support 111. Internally, it can use screw drives, cylinder drives, or other methods to achieve precise height adjustment to adapt to wafer loading requirements at different positions and complete the wafer loading action. The second support 121 is arranged side-by-side with the first support 111, forming the main frame of the wafer unloading device 120. It also possesses good rigidity and stability, providing support for the adsorption mechanism 200 during the unloading process. The third lifting mechanism 122 connects the second support 121 and the adsorption mechanism 200. Similar to the second lifting mechanism 112, it drives the adsorption mechanism 200 to move up and down along the second support 121 through a specific transmission mechanism, performing the wafer unloading action and removing the tested wafer from the test chamber. In this embodiment, the second lifting mechanism 112 is disposed on both sides of the adsorption mechanism 200 corresponding to the wafer loading device 110, and the third lifting mechanism 122 is disposed on both sides of the adsorption mechanism 200 corresponding to the wafer unloading device 120. In other embodiments, the positions and number of the second lifting mechanism 112 and the third lifting mechanism 122 can be set according to actual needs.

[0083] Specifically, the wafer pick-and-place device 151 is used to move back and forth between the test position of the wafer aging test equipment 3 and the wafer loading / unloading device 2, which is used to place the heat sink 300 carrying the wafer. When the wafer pick-and-place device 151 is at the test position of the wafer aging test equipment 3, it removes the heat sink 300 carrying the tested wafer from the wafer aging test device 31 of the wafer aging test equipment 3, and then places the heat sink 300 carrying the wafer to be tested on the wafer aging test device 31 of the wafer aging test equipment 3. When the wafer pick-and-place device 151 is at the wafer loading / unloading device 2, it places the heat sink 300 carrying the tested wafer at the wafer loading / unloading device 2, removes the heat sink 300 carrying the wafer to be tested from the wafer loading / unloading device 2, and then proceeds to the test position to prepare for the next round of testing. Specifically, when the wafer loading and unloading device 151 is located at the wafer loading and unloading equipment 2, the wafer unloading device 120 places the heat sink 300 carrying the tested wafer at the wafer loading and unloading equipment 2, and the wafer loading device 110 takes the heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 2 to the test position, in preparation for the next round of testing.

[0084] Specifically, when the wafer loading and unloading device 151 is located at the test position of the wafer aging test equipment 3, the second lifting mechanism 112 and the third lifting mechanism 122 alternately lift and lower, such as... Figure 11 As shown, the third lifting mechanism 122 first drives the corresponding adsorption mechanism 200 to descend, so that the adsorption mechanism 200 of the wafer unloading device 120 performs the wafer unloading action. After the wafer unloading is completed, the third lifting mechanism 122 drives the adsorption mechanism 200 to reset, as shown. Figure 12 As shown, the second lifting mechanism 112 drives the corresponding adsorption mechanism 200 to descend, so that the adsorption mechanism 200 of the wafer loading device 110 performs the wafer loading action. After the wafer loading is completed, the second lifting mechanism 112 drives the adsorption mechanism 200 to reset. When the wafer loading and unloading device 151 is located in the wafer loading and unloading equipment 2, the second lifting mechanism 112 and the third lifting mechanism 122 can lift and unload alternately or synchronously. That is, there is no requirement for the order of the two actions: the wafer unloading device 120 placing the wafer to be tested in the wafer loading and unloading equipment 2, and the wafer loading device 110 taking the wafer to be tested out of the wafer loading and unloading equipment 2. Normally, the wafer unloading device 120 can first place the wafer to be tested in the wafer loading and unloading equipment 2, and then the wafer loading device 110 can take the wafer to be tested out of the wafer loading and unloading equipment 2.

[0085] In the above embodiments, the wafer loading and unloading device 151 achieves close connection between the unloading and loading actions through the wafer loading device 110 and the wafer unloading device 120 arranged side by side, which greatly saves the time required to pick up the wafer between unloading and loading, effectively improves the efficiency of the entire production process, and reduces production costs.

[0086] In one specific embodiment, such as Figure 13 As shown, the adsorption mechanism 200 includes a third support 210, multiple adsorption elements 220, and multiple locking elements 230. The third support 210 is annular; the multiple adsorption elements 220 are spaced apart circumferentially along the third support 210 and connected to it, and are configured to simultaneously provide adsorption force to the bottom of the wafer, allowing the wafer to adhere to the heat sink 300; the multiple locking elements 230 are also spaced apart circumferentially along the third support 210 and connected to it, and are configured to simultaneously and controllably lock the heat sink 300 carrying the wafer, providing adsorption force to prevent the heat sink 300 carrying the wafer from detaching during movement with the adsorption mechanism 200. Specifically, the multiple adsorption elements 220 and the multiple locking elements 230 are staggered, so that they are evenly distributed on the third support 210.

[0087] Continue to refer to Figure 13 The adsorption mechanism 200 also includes multiple sliding components 240, each corresponding to a latching member 230, for slidingly connecting the latching member 230 to the third support 210, so that the latching member 230 slides radially along the third support 210 in a controlled manner, thereby switching between a first position engaged with the heat sink 300 and a second position separated from the heat sink 300. Specifically, the multiple sliding components 240 simultaneously drive the corresponding latching members 230 to move towards the center of the third support 210, thereby simultaneously supporting the heat sink 300. At this time, the latching member 230 is located in the first position. When the multiple sliding components 240 simultaneously drive the corresponding latching members 230 to return to their original positions, that is, to move away from the center of the third support 210, the support for the heat sink 300 can be removed. At this time, the latching member 230 is located in the second position.

[0088] In one specific embodiment, such as Figure 14As shown, the adsorption mechanism 200 also includes multiple driving elements 250, each driving element 250 corresponding to a latching element 230. The driving elements 250 are mounted on the third support 210 and cooperate with the corresponding sliding components 240 of the latching element 230 to simultaneously switch the latching element 230 between a first position and a second position under controlled conditions. The driving element 250 is used to drive the corresponding sliding component 240 to move the corresponding latching element 230. The driving element 250 is mounted on the third support 210. Specifically, the driving element 250 is a cylinder; in other embodiments, other driving structures can also be used. In this embodiment, the number of driving elements 250 is the same as the number of latching elements 230. In other embodiments, the number of driving elements 250 can be set according to specific design requirements. For example, multiple latching elements 230 correspond to one driving element 250, such as two latching elements 230 corresponding to one driving element 250.

[0089] For details, please refer to Figure 13-14 The adsorption mechanism 200 also includes multiple limiting components 260, each limiting component 260 corresponding to a latching member 230, used to restrict the movement of the latching member 230 between a first position and a second position. Specifically, the limiting component 260 includes a first sensor 261, a first limiting part 262, a second sensor 263, and a second limiting part 264. The first sensor 261 and the second sensor 263 are mounted on the third bracket 210, and the first limiting part 262 and the second limiting part 264 are disposed on the upper sliding member 241 of the sliding component 240. The first sensor 261 cooperates with the first limiting part 262 to detect whether the corresponding latching member 230 is located in the first position, and the second sensor 263 cooperates with the second limiting part 264 to detect whether the corresponding latching member 230 is located in the second position. When the first sensor 261 senses the first limiting part 262, it indicates that the latching member 230 has reached the first position. When the second sensor 263 senses the second limiting part 264, it indicates that the latching member 230 has reached the second position.

[0090] In the above embodiments, multiple adsorption elements 220 adsorb the bottom of the wafer, causing it to adhere to the heat sink 300, preventing the wafer from moving or falling off. Additionally, multiple locking elements 230 simultaneously lock the heat sink 300 carrying the wafer, providing both adsorption and support to the heat sink 300, thus preventing it from falling off during transport and improving its stability. By adsorbing not only the wafer but also the heat sink 300, this dual adsorption ensures the stability of both the wafer and the heat sink 300 during transport, preventing them from detaching from the adsorption mechanism 200.

[0091] In some embodiments, such as Figure 15As shown, the third support 210 includes a first annular support 211 and a second annular support 212 that are concentric. The second annular support 212 and the first annular support 211 rotate relative to each other about the center axis. A plurality of adsorption elements 220 and a plurality of snap-fit ​​elements 230 are disposed on the second annular support 212.

[0092] Specifically, the first annular support 211 serves as the basic support, being ring-shaped and providing a stable support frame for the entire adsorption mechanism 200. The second annular support 212 is also ring-shaped, concentrically positioned with the first annular support 211, and the second annular support 212 and the first annular support 211 rotate relative to each other about their center. Optionally, the second annular support 212 and the first annular support 211 can be connected by a sliding connection. This sliding connection can be achieved by providing guide structures such as slide rails or grooves on the first annular support 211, and simultaneously providing matching sliders or other sliding components on the second annular support 212, allowing the second annular support 212 to rotate circumferentially along the first annular support 211. Multiple adsorption elements 220 and multiple snap-fit ​​elements 230 are mounted on the second annular support 212. As the second annular support 212 rotates, the positions of the adsorption elements 220 and snap-fit ​​elements 230 can be adjusted circumferentially accordingly, so that each snap-fit ​​element 230 corresponds to the position of the corresponding notch on the heat sink 300, and each adsorption element 220 corresponds to the position of the corresponding air passage on the heat sink 300.

[0093] Specifically, the third support 210 is configured as two concentric annular supports, with the second annular support 212 rotating relative to the first annular support 211 about the center axis, allowing for flexible adjustment of the adsorption mechanism 200 during operation. In actual wafer loading and unloading operations, the positions of the adsorption component 220 and the snap-fit ​​component 230 may need to be optimized based on factors such as the wafer's size, shape, and specific installation location. This sliding connection method allows for better matching of the adsorption component 220 and the snap-fit ​​component 230 with the wafer and heat sink 300 simply by adjusting the position of the second annular support 212, without changing the relative positions of the entire adsorption mechanism 200 with other components, thereby improving the accuracy and reliability of adsorption and snap-fit.

[0094] Specifically, such as Figure 2 and Figure 16As shown, the wafer transport equipment 1 also includes a first lifting mechanism 152 and a moving mechanism 14. The first lifting mechanism 152 and the moving mechanism 14 are slidably connected, and the wafer pick-and-place device 151 is slidably connected to the first lifting mechanism 152. The wafer transport equipment 1 corresponds to one wafer pick-and-place device 151 and one first lifting mechanism 152. The wafer pick-and-place device 151 is controlled to slide along the second transport channel 17 on the first lifting mechanism 152, and the first lifting mechanism 152 is controlled to slide along the first transport channel 16 on the moving mechanism 14. Specifically, multiple wafer transport boxes 10 correspond to one wafer pick-and-place device 151 and one first lifting mechanism 152.

[0095] In one specific embodiment, the moving mechanism 14 includes a first guide member 141 and a first driving mechanism. The first guide member 141 extends horizontally, and the first guide members 141 of two adjacent wafer transport boxes 10 are connected. The first driving mechanism is drivenly connected to the wafer pick-and-place device 151, and the wafer pick-and-place device 151 is slidably connected to the first guide member 141. The first driving mechanism is used to drive the wafer pick-and-place device 151 to move horizontally along the first guide member 141. Specifically, the first guide member 141 can be a track, and the first driving mechanism can be a linear motor.

[0096] Specifically, a limiting member is provided on the first guide member 141. In the multiple wafer transport boxes 10 connected in sequence, the limiting member is provided at both ends of the connected first guide member 141 to limit the maximum movable distance of the wafer pick-and-place device 151 in the extension direction (horizontal direction) of the moving mechanism 14.

[0097] In one specific embodiment, the wafer transport box 10 includes a first fixing member 11 and a moving mechanism 14. The moving mechanism 14 extends horizontally, and the moving mechanisms 14 of two adjacent wafer transport boxes 10 are connected to each other. The moving mechanism 14 is disposed on the first fixing member 11. Specifically, the wafer transport box 10 also includes a housing, and the first fixing member 11 is installed on the inner side of the back housing of the corresponding wafer transport box 10.

[0098] In one specific embodiment, such as Figure 16 As shown, the first lifting mechanism 152 includes a second guide member 153 and a second driving mechanism (not shown). The second driving mechanism is drivenly connected to the wafer pick-and-place device 151, and the wafer pick-and-place device 151 is slidably connected to the second guide member 153. Under the drive of the second driving mechanism, the wafer pick-and-place device 151 slides vertically along the second guide member 153. The second guide member 153 can be a track, and the second driving mechanism can be a drive motor. Specifically, limiters are provided at both ends of the second guide member 153 to limit the maximum movable distance of the wafer pick-and-place device 151 in the vertical direction, such as... Figure 17-18 As shown, Figure 17 The maximum horizontal movement distance of the wafer pick-and-place device 151 is shown. Figure 18 The maximum movable distance of the wafer pick-and-place device 151 in the vertical direction is shown. It can realize the pick-and-place and handling of wafers in multiple wafer aging test equipment 3 and multiple test points in each wafer aging test equipment 3. The dotted line in the figure indicates the connection between the first fixing member 11 and the moving mechanism 14 in two adjacent wafer transport boxes 10.

[0099] Optional, such as Figure 19-21 As shown, the wafer pick-and-place device 151 is connected to the first lifting mechanism 152 through a correction mechanism 500. The correction mechanism 500 includes a first connecting component 510 and a second connecting component 520. The first connecting component 510 is used to correct the tilt of the wafer pick-and-place device 151 in a first direction, and the second connecting component 520 is used to correct the tilt of the wafer pick-and-place device 151 in a second direction. The first direction and the second direction are horizontal directions that are perpendicular to each other.

[0100] Specifically, the first connecting assembly 510 includes a first connector 511 connected to the wafer pick-and-place device 151, and a second connector 512 slidably connected to the first lifting mechanism 152. The first connector 511 and the second connector 512 are connected by a first pin 513, the axis of which is parallel to a second direction. The first connector 511 drives the wafer pick-and-place device 151 to rotate around the axis of the first pin 513, and the second connector 512 drives the wafer pick-and-place device 151 to move under the drive of the first lifting mechanism 152. Specifically, the first connector 511 is directly connected to the wafer pick-and-place device 151, and is usually fixed at a specific position on the wafer pick-and-place device 151 by bolts, flanges, or other suitable connection methods, serving as an interface for transmitting motion and force. The second connector 512 is slidably connected to the first lifting mechanism 152. This slidable connection can be achieved through a structure such as a guide rail or a slide, allowing the second connector to drive the wafer pick-and-place device 151 to move along a predetermined path under the drive of the first lifting mechanism 152. The first pin 513 connects the first connector 511 and the second connector 512, with its axis parallel to the second direction. The first pin not only serves as a connector but also acts as a rotation axis, enabling the first connector 511 to drive the wafer pick-and-place device 151 to rotate around its axis, thereby correcting the tilt of the wafer pick-and-place device 151 in the first direction.

[0101] Specifically, the second connecting assembly 520 includes a third connecting member 521 fixedly connected to the wafer pick-and-place device 151, and a fourth connecting member 522 fixedly connected to the first connecting member 511. The third connecting member 521 and the fourth connecting member 522 are connected by a second pin 523, the axis of which is parallel to the first direction. The third connecting member 521 is used to drive the wafer pick-and-place device 151 to rotate around the axis of the second pin 523. Specifically, the fourth connecting member 522 is fixedly connected to the first connecting member 511, forming a stable connecting frame that transmits motion and force. The second pin 523 connects the third connecting member 521 and the fourth connecting member 522, and its axis is parallel to the first direction. The rotation of the third connecting member 521 around the axis of the second pin 523 corrects the tilt of the wafer pick-and-place device 151 in the second direction.

[0102] In specific implementation, the correction mechanism 500 includes a second connecting component 520 corresponding to the wafer loading device 110 and a second connecting component 520 corresponding to the wafer unloading device 120. Correspondingly, the fourth connecting component 522 corresponding to the wafer loading device 110 and the fourth connecting component 522 corresponding to the wafer unloading device 120 are fixedly connected to the first connecting component 511 on both sides. The first connecting component 511 is also fixedly connected to the first support 111 and the second support 121. The third connecting component 521 corresponding to the wafer loading device 110 is fixedly connected to the first support 111, and the third connecting component 521 corresponding to the wafer unloading device 120 is fixedly connected to the second support 121.

[0103] In specific implementation, the first bracket 111 and the second bracket 121 include a back plate near the first lifting mechanism 152. The first connecting component 510 and the second connecting component 520 are distributed on both sides of the back plate. An opening is provided on the back plate, and the fourth connecting component 522 passes through the opening and is fixedly connected to the first connecting component 511.

[0104] Specifically, during wafer handling, the wafer pick-and-place device 151 may tilt due to factors such as equipment manufacturing errors, uneven installation, changes in mechanical load, or mechanical deformation caused by long-term use, affecting the accurate placement and removal of the wafer. The correction mechanism 500, through the coordinated action of the first connecting component 510 and the second connecting component 520, independently adjusts the tilt of the wafer pick-and-place device 151 in two mutually perpendicular horizontal directions. When it is necessary to correct the tilt of the wafer pick-and-place device 151 in the first direction, the first connector 511 in the first connecting component 510 is rotated around the axis of the first pin 513, causing the wafer pick-and-place device 151 to make a fine adjustment in the first direction. When it tilts in the second direction, the adjustment is achieved by rotating the third connector 521 in the second connecting component 520 around the axis of the second pin 523. This adjustment method can accurately adjust the posture of the wafer pick-and-place device 151 without changing its overall position, ensuring precise docking of the adsorption mechanism 200 with the wafer and the test chamber.

[0105] In one specific embodiment, such as Figure 2 As shown, the wafer transport box 10 also includes a first connecting structure 17 and a second connecting structure 18. The first fixing member 11, the moving mechanism 14 and the wafer loading and unloading device 151 are all disposed inside the housing. The first connecting structure 17 spans the first fixing member 11 of two adjacent wafer transport boxes 10 to connect them. The housings of two adjacent wafer transport boxes 10 are connected by the second connecting structure 18.

[0106] Specifically, the second connection structure 18 can connect two adjacent wafer transport boxes 10 as a whole. The specific setting of the second connection structure 18 can be determined according to the actual application requirements. For example, the second connection structure 18 can be set inside or outside the shell at the connection point of the wafer transport boxes 10, or further, it can be set on the bottom or side of the shell at the connection point.

[0107] Optional, such as Figure 22 As shown, the second connection structure 18 includes a first sub-connection structure 181 and a second sub-connection structure 182. The first sub-connection structure 181 and the second sub-connection structure 182 are respectively disposed on the housings of two adjacent wafer transport boxes 10. The first sub-connection structure 181 and the second sub-connection structure 182 are inserted into each other to connect the housings of two adjacent wafer transport boxes 10.

[0108] Specifically, one of the first sub-connection structure 181 and the second sub-connection structure 182 can be a convex structure and the other can be a corresponding concave structure. The connection between the housings is achieved by inserting the convex structure and the corresponding concave structure at the joint of the housings of two adjacent wafer transport boxes 10. On this basis, the first fixing members 11 of the adjacent wafer transport boxes 10 are in contact with each other, and the moving mechanisms 14 are in contact with each other.

[0109] Specifically, in two adjacent wafer transport boxes 10, one end of the first connecting structure 17 is fixed to the first fixing member 11 of one wafer transport box 10, and the other end is fixed to the first fixing member 11 of the other wafer transport box 10, so that the first fixing members 11 of the two adjacent wafer transport boxes 10 are connected, thereby connecting the tracks of the two moving mechanisms 14 installed on the corresponding first fixing members 11 in the two adjacent wafer transport boxes 10. In practical applications, the specific structure of the first connecting structure 17 can be set according to application requirements, for example, it can be strip-shaped.

[0110] Optionally, each first fixing member 11 is provided with a leveling component; the moving mechanism 14 is used to move the wafer pick-and-place device 151 in the horizontal direction, and the leveling component is used to level the first fixing member 11 so that the moving mechanisms 14 of two adjacent wafer transport boxes 10 are aligned.

[0111] In one specific embodiment, based on the connection between the housings of two adjacent wafer transport boxes 10 and the connection between the moving mechanisms 14 of two adjacent wafer transport boxes 10, the leveling component 16 can fine-tune the corresponding first fixing member 11 to align the moving mechanisms 14, thereby improving the connection accuracy. The leveling component 16 can level the corresponding first fixing member 11 in the x-axis, y-axis, and z-axis directions to align the moving mechanisms 14 disposed on the corresponding first fixing member 11, wherein the y-axis direction is the extending direction of the moving mechanism 14. Optionally, the first fixing members 11 of the multiple wafer transport boxes 10 can all be non-fixed on the corresponding wafer transport boxes 10, and can be adjusted by their respective leveling components 16 to achieve alignment and leveling. Alternatively, one of the first fixing members 11 can be fixedly installed on the corresponding wafer transport box 10, while the other first fixing members 11 are not fixedly installed on the corresponding wafer transport boxes 10. Using the fixedly installed first fixing member 11 as a reference, the other first fixing members 11 can be adjusted to align and level with the fixedly installed first fixing member 11, thereby aligning the moving mechanism 14 on the first fixing member 11 (i.e., track alignment), achieving high-precision splicing. As a result, the wafer loading and unloading device 151 can move smoothly and steadily within the multiple wafer transport boxes 10, avoiding obstruction or jamming at the connection points of adjacent wafer transport boxes 10, and improving the accuracy and stability of long-distance transportation.

[0112] In one specific embodiment, such as Figure 23 As shown, the leveling assembly includes a first horizontal leveling assembly 161, a second horizontal leveling assembly 162, and a vertical leveling assembly 163. The moving mechanism 14 is disposed on one side of the first fixing member 11, the first horizontal leveling assembly 161 and the second horizontal leveling assembly 162 are disposed on the other side of the first fixing member 11, and the vertical leveling assembly 163 is disposed at the bottom of the first fixing member 11. The first horizontal leveling assembly 161 is used to level the first fixing member 11 along the extending direction of the moving mechanism 14; the second horizontal leveling assembly 162 is used to level the first fixing member 11 in a direction perpendicular to the side of the first fixing member 11; and the vertical leveling assembly 163 is used to level the first fixing member 11 in a direction parallel to the side of the first fixing member 11.

[0113] Specifically, the first horizontal leveling component 161 is used to level the first fixing member 11 in the y-axis direction, the second horizontal leveling component 162 is used to level the first fixing member 11 in the x-axis direction, and the vertical leveling component 163 is used to level the first fixing member 11 in the z-axis direction. In this embodiment of the specification, based on the front view of the wafer transport device 1, the moving mechanism 14 is disposed on the front of the first fixing member 11, and the first horizontal leveling component 161 and the second horizontal leveling component 162 are disposed on the back of the first fixing member 11.

[0114] In the above embodiments, Figure 23 The structure of the leveling assembly 16 is shown using one wafer transport box 10 as an example; other wafer transport boxes 10 have the same configuration.

[0115] In one specific embodiment, such as Figure 24 As shown, the first leveling component 161 includes a first leveling component 164 and a second leveling component 165. A second fixing component 12 is arranged parallel to the other side of the first fixing component 11. The size of the second fixing component 12 is smaller than that of the first fixing component 11. The second leveling component 165 is disposed on the second fixing component 12, and the first leveling component 164 is disposed on the first fixing component 11 relative to the second leveling component 165.

[0116] Specifically, the first leveling component 164 and the second leveling component 165 are arranged opposite each other and have a preset distance. The first leveling component 164 and the second leveling component 165 can have a block structure. The first fixing component is leveled and aligned in the y-axis direction by fitting the opposite surfaces of the first leveling component 164 and the second leveling component 165 together. In practical applications, multiple first leveling components 164 and corresponding second leveling components 165 can be set to adjust different positions of the first fixing component 11 to ensure precise leveling. Specifically, the preset distance is relatively small and can be set according to actual application requirements.

[0117] Specifically, a third fixing member 13 is arranged parallel to the other side of the first fixing member 11. The third fixing member 13 is smaller than the first fixing member 11, and a second horizontal leveling assembly 162 is disposed on the third fixing member 13. The second horizontal leveling assembly 162 includes at least four leveling screws. Specifically, the four leveling screws can be considered as a group, and multiple groups of leveling screws can be spaced apart on the other side of the first fixing member 11 to adjust different positions of the first fixing member 11. Optionally, such as Figure 23 and Figure 24 As shown in the rightmost setting, the second leveling component 165 and the leveling screw can be set on the same fixing component.

[0118] In the embodiments described in this specification, the first fixing member 11, the second fixing member 12, and the third fixing member 13 can be fixing plates. Based on the front view of the wafer transport device 1, the second fixing member 12 and the third fixing member 13 are both located on the back of the first fixing member 11.

[0119] Specifically, the vertical leveling component 163 can be used to support the first fixing member 11. The vertical leveling component 163 includes multiple vertical leveling components, which are spaced apart at the bottom of the first fixing member 11 to adjust different positions of the first fixing member 11.

[0120] Optionally, the wafer aging test system also includes a leveling detection device, which is used to detect whether the moving mechanisms 14 of two adjacent wafer transport boxes 10 are leveled and aligned. Specifically, the leveling detection device can indicate whether the moving mechanisms 14 are leveled and aligned using pointers or the like.

[0121] In the above embodiments, the connection methods include detachable connections and non-detachable connections, such as fastener connections and integrated connections.

[0122] As can be seen from the technical solutions provided in the embodiments of this specification above, the wafer aging test system in this specification includes a wafer transport device; a wafer loading and unloading device, which is disposed on one side of the wafer transport device; and a wafer aging test device, which includes at least one wafer aging test unit. The at least one wafer aging test unit is disposed on at least one side of the wafer transport device, thereby enabling parallel testing of multiple test positions, improving testing efficiency, and enhancing the flexibility and rationality of the equipment layout. Any wafer aging test unit and the wafer transport device form a first transport channel relative to each other. The wafer transport device includes a wafer pick-and-place device, and a second transport channel is formed within the wafer transport device. Any first transport channel is connected to the second transport channel. The wafer pick-and-place device carries the wafer and is controlled to move within the second transport channel or any first transport channel to realize wafer loading or unloading.

[0123] In one specific implementation, the process of performing aging tests on wafers based on the above-described wafer aging test system can be carried out according to the following steps:

[0124] Wafer loading and unloading equipment provides wafers to be tested;

[0125] The wafer pick-and-place device picks up the wafer to be tested and moves under control in the second transport channel and the first transport channel corresponding to the target wafer aging test device to the target wafer aging test device. The device then unloads the wafer that has completed testing in the target wafer aging test device and loads the wafer to be tested. The target wafer aging test device can be any wafer aging test device in the wafer aging test equipment.

[0126] The wafer loading and unloading device is controlled to move in the first and second transport channels corresponding to the target wafer aging test device to the wafer loading and unloading equipment, and performs testing to complete the wafer unloading.

[0127] In one specific embodiment, after the target wafer aging test device completes the wafer testing, the wafer pick-and-place device picks up the wafer to be tested, moves vertically along the second transport channel in the wafer transport equipment, and moves horizontally along the first transport channel corresponding to the target wafer aging test device to the target wafer aging test device. It then picks up the wafer that has completed testing in the target wafer aging test device and places the wafer to be tested on the target wafer aging test device. The target wafer aging test device can be any wafer aging test device. During the testing process of the target wafer aging test device, the wafer pick-and-place device moves horizontally along the first transport channel corresponding to the target wafer aging test device in the wafer transport equipment, and moves vertically along the first transport channel to the wafer loading / unloading device. It then places the tested wafer on the wafer loading / unloading device so that the wafer loading / unloading device can place the tested wafer into a wafer cassette for storage. Optionally, the wafer pick-and-place device can be used to transport a heat sink carrying a wafer.

[0128] Optionally, the aforementioned wafer loading and unloading device may include a wafer loading device and a wafer unloading device arranged side by side. Accordingly, the wafer loading and unloading device picks up the wafer to be tested and moves under control in the second transport channel and the first transport channel corresponding to the target wafer aging test device to the target wafer aging test device. The unloading of the wafer that has completed testing in the target wafer aging test device and the loading of the wafer to be tested may include:

[0129] The wafer loading device picks up the wafer to be tested, and the wafer loading device and the wafer unloading device are controlled to move to the target wafer aging test device in the second transport channel and the first transport channel corresponding to the target wafer aging test device.

[0130] The wafer feeding device completes the wafer feeding process in the target wafer aging test device;

[0131] The wafer loading device loads the wafers to be tested.

[0132] Optionally, the wafer unloading process completed by the aforementioned wafer handling device includes:

[0133] The wafer unloading device completes the wafer unloading process after testing.

[0134] Specifically, the wafer loading device includes a first support, and the wafer unloading device includes a second support. Adsorption mechanisms are respectively installed on the first and second supports. The first support is connected to the corresponding adsorption mechanism via a second lifting mechanism, and the second support is connected to the corresponding adsorption mechanism via a third lifting mechanism. Accordingly, the wafer picking and placing can be achieved through the following steps: the second lifting mechanism moves the corresponding adsorption mechanism along the first support to pick up the wafer; the third lifting mechanism moves the corresponding adsorption mechanism along the second support to place the wafer.

[0135] Specifically, when the wafer loading and unloading device is located at the test position of the wafer aging test equipment, the first lifting mechanism and the second lifting mechanism can lift alternately or simultaneously.

[0136] Optionally, the process of performing aging tests on wafers based on the above-mentioned wafer aging test system may also include the following steps:

[0137] The second annular support rotates relative to the first annular support about the center axis to adjust the position of the adsorption component and the snap-fit ​​component.

[0138] Specifically, multiple adsorption components and multiple snap-fit ​​components are installed on the second annular support. As the second annular support slides, the positions of the adsorption components and snap-fit ​​components can be adjusted circumferentially accordingly, so that each snap-fit ​​component corresponds to the position of each notch on the heat sink, and each adsorption component corresponds to the position of each third air passage on the heat sink.

[0139] Optionally, the process of performing aging tests on wafers based on the above-mentioned wafer aging test system may also include the following steps:

[0140] The correction mechanism adjusts the tilt of the wafer pick-and-place device in two mutually perpendicular horizontal directions through the first connecting component and the second connecting component.

[0141] Specifically, when it is necessary to correct the tilt of the wafer pick-and-place device in the first direction, the first connector in the first connecting assembly is rotated around the axis of the first pin, thereby causing the wafer pick-and-place device to make a fine adjustment in the first direction. When it is tilted in the second direction, the adjustment is achieved by rotating the third connector in the second connecting assembly around the axis of the second pin. This adjustment method can precisely adjust the posture of the wafer pick-and-place device without changing its overall position, ensuring precise docking between the adsorption mechanism and the wafer and the test chamber.

[0142] Optionally, the process of performing aging tests on wafers based on the above-mentioned wafer aging test system may also include the following steps:

[0143] The first fixing member is leveled by the leveling assembly to align the moving mechanisms of the two adjacent wafer transport boxes.

[0144] Specifically, the leveling components are used to level the corresponding first fixing components in the x, y, and z axes to align the moving mechanisms mounted on the first fixing components. This alignment of the moving mechanisms on the first fixing components achieves high-precision splicing, allowing the wafer loading and unloading device to move smoothly and stably within multiple wafer transport boxes. This avoids obstruction or jamming at the connection points of adjacent wafer transport boxes, improving the accuracy and stability of long-distance transport. The y-axis direction is the extension direction of the moving mechanism.

[0145] In one specific embodiment, the leveling assembly includes a first horizontal leveling assembly, a second horizontal leveling assembly, and a vertical leveling assembly. The leveling of the first fixing member via the leveling assembly may include:

[0146] The first fixing member is leveled by the first horizontal leveling assembly along the extension direction of the moving mechanism;

[0147] In a direction perpendicular to the side of the first fastener, the first fastener is leveled by the second horizontal leveling assembly;

[0148] The first fastener is leveled using a vertical leveling assembly in a direction parallel to the side of the first fastener.

[0149] Specifically, the direction parallel to the side of the first fixing member is the x-axis direction, and the direction perpendicular to the side of the first fixing member is the z-axis direction.

[0150] Specifically, the wafer aging test system also includes a control mechanism, which is communicatively connected to the wafer loading and unloading equipment, the wafer transport equipment, and the wafer aging test equipment. The control mechanism is used to execute the above-described process steps in the embodiments of this specification.

[0151] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0152] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer aging test system, characterized in that, The wafer aging test system includes: Wafer transport equipment; The wafer loading and unloading equipment is located on one side of the wafer transport equipment; A wafer aging test equipment, the wafer aging test equipment including at least one wafer aging test device, the at least one of the wafer aging test devices being disposed on at least one side of the wafer transport equipment; any one of the wafer aging test devices and the wafer transport equipment forming a first transport channel; The wafer transport equipment includes a wafer loading and unloading device, and a second transport channel is formed inside the wafer transport equipment. Any of the first transport channels is connected to the second transport channel. The wafer loading and unloading device carries the wafer and is controlled to move in the second transport channel or any of the first transport channels to realize the loading or unloading of the wafer.

2. The wafer aging test system according to claim 1, characterized in that, The wafer aging test system includes at least two wafer aging test devices, the wafer transport device includes at least two wafer transport boxes connected in sequence, the wafer loading and unloading device is located on one side of the at least two wafer transport boxes, and at least two wafer aging test devices are located on at least one side of the at least two wafer transport boxes; the first transport channels corresponding to the wafer aging test devices on the same layer of two adjacent wafer aging test devices are connected.

3. The wafer aging test system according to claim 2, characterized in that, Along the extension direction of the first transport channel, the wafer loading and unloading equipment and at least two wafer aging test devices are sequentially arranged on the same side of at least two wafer transport boxes.

4. The wafer aging test system according to claim 2, characterized in that, Along the extension direction of the first transport channel, at least two of the wafer aging test devices are sequentially arranged on the other side of at least two of the wafer transport boxes; the wafer loading and unloading device is also used to rotate between the two sides of at least two of the wafer transport boxes.

5. The wafer aging test system according to claim 2, characterized in that, At least two of the wafer aging test devices are respectively disposed on both sides of at least two of the wafer transport boxes. Along the extension direction of the first transport channel, the wafer loading and unloading equipment and at least one of the wafer aging test devices are sequentially disposed on one side of at least two of the wafer transport boxes; the wafer loading and unloading device is also used to rotate between the two sides of at least two of the wafer transport boxes.

6. The wafer aging test system according to any one of claims 1 to 5, characterized in that, The wafer transport equipment further includes a first lifting mechanism and a moving mechanism. The first lifting mechanism is slidably connected to the moving mechanism. The wafer picking and placing device is slidably connected to the first lifting mechanism. The wafer transport equipment corresponds to one wafer picking and placing device and one first lifting mechanism. The wafer loading and unloading device is controlled to slide along the second transport channel on the first lifting mechanism, and the first lifting mechanism is controlled to slide along the first transport channel on the moving mechanism.

7. The wafer aging test system according to any one of claims 1 to 5, characterized in that, Any of the wafer aging test devices extends into the wafer transport equipment. The wafer aging test device includes a heat sink assembly, an alignment mechanism, and a mounting bracket. The mounting bracket extends into the wafer transport equipment. The heat sink assembly is disposed on the alignment mechanism. The alignment mechanism moves along the mounting bracket into the wafer transport equipment. A first transport channel is formed above the heat sink assembly to realize wafer loading or unloading between the wafer pick-and-place device and the wafer aging test device. The first transport channel is arranged in a horizontal direction, and the second transport channel is arranged in a vertical direction. The wafer pick-and-place device is controlled to move horizontally in either of the first transport channels and vertically in either of the second transport channels.

8. The wafer aging test system according to any one of claims 1 to 5, characterized in that, The wafer loading and unloading device includes a wafer loading device and a wafer unloading device arranged side by side. The wafer loading device includes a first support, and the wafer unloading device includes a second support. Adsorption mechanisms are respectively provided on the first support and the second support. The first support and the corresponding adsorption mechanism are connected by a second lifting mechanism, which is used to drive the corresponding adsorption mechanism to move along the first support to complete the wafer loading action; the second support and the corresponding adsorption mechanism are connected by a third lifting mechanism, which is used to drive the corresponding adsorption mechanism to move along the second support to complete the wafer unloading action.

9. The wafer aging test system according to claim 8, characterized in that, The adsorption mechanism includes: The third support is ring-shaped; Multiple adsorption elements are arranged at intervals along the circumference of the third support and connected to the third support. The multiple adsorption elements are configured to simultaneously provide adsorption force to the bottom of the wafer so that the wafer is attached to the heat sink. Multiple snap-fit ​​components are arranged circumferentially around the third support and connected to the third support. The multiple snap-fit ​​components are configured to simultaneously snap onto the heat sink carrying the wafer in a controlled manner.

10. The wafer aging test system according to claim 9, characterized in that, The third support includes a first annular support and a second annular support, which are concentric and rotate relative to each other about the center axis; the plurality of adsorption elements and the plurality of snap-fit ​​elements are disposed on the second annular support.

11. The wafer aging test system according to claim 6, characterized in that, The wafer pick-and-place device is connected to the first lifting mechanism via a correction mechanism. The correction mechanism includes a first connecting component and a second connecting component. The first connecting component is used to correct the tilt of the wafer pick-and-place device in a first direction, and the second connecting component is used to correct the tilt of the wafer pick-and-place device in a second direction. The first direction and the second direction are horizontal directions that are perpendicular to each other.

12. The wafer aging test system according to any one of claims 2 to 5, characterized in that, The wafer transport box includes a first fixing member and a moving mechanism. The moving mechanism extends horizontally and is connected to the moving mechanisms of two adjacent wafer transport boxes. The moving mechanism is disposed on the first fixing member, and each first fixing member is provided with a leveling component. The moving mechanism is used to move the wafer pick-and-place device along the horizontal direction, and the leveling component is used to level the first fixing member so that the moving mechanisms of the two adjacent wafer transport boxes are aligned.

13. The wafer aging test system according to claim 12, characterized in that, The leveling assembly includes a first horizontal leveling assembly, a second horizontal leveling assembly, and a vertical leveling assembly. The moving mechanism is disposed on one side of the first fixing member, the first horizontal leveling assembly and the second horizontal leveling assembly are disposed on the other side of the first fixing member, and the vertical leveling assembly is disposed at the bottom of the first fixing member. The first horizontal leveling component is used to level the first fixing member along the extension direction of the moving mechanism; The second horizontal leveling component is used to level the first fixing member in a direction perpendicular to the side of the first fixing member; The vertical leveling component is used to level the first fixing member in a direction parallel to the side of the first fixing member.

14. The wafer aging test system according to claim 12, characterized in that, The wafer transport equipment further includes a first connecting structure, a second connecting structure, and a housing. The first fixing member, the moving mechanism, and the wafer loading and unloading device are all disposed within the housing. The first connecting structure spans the first fixing members of two adjacent wafer transport boxes to connect them. The housings of two adjacent wafer transport boxes are connected by the second connecting structure.

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