sensing module

Abstract

The utility model provides a kind of sensing module, including substrate, frame, light-emitting component, sensing component, shielding structure and ground structure.Frame is configured to substrate to form mutually isolated emission area and receiving area.Emission area has emission opening.Receiving area has receiving opening.Light-emitting component is configured to substrate and is located emission area.Light-emitting component is used to provide sensing light beam.Sensing component is configured to substrate and is located receiving area.Sensing component is used to receive reflected light beam.Shielding structure is connected to cover the surface of frame.Ground structure is configured to the junction of frame and substrate, and is connected between shielding structure and substrate.Therefore, the sensing module of the utility model can effectively guide electromagnetic interference to ground through ground structure, thereby providing the effect of shielding electromagnetic interference for mobile device, avoiding affecting other electronic components in surrounding, while sensing module has smaller size, lower cost and larger ground area.

Description

Technical Field

[0001] This utility model relates to an electronic device, and more particularly to a sensing module. Background Technology

[0002] Direct Time-of-Flight (dToF) ranging sensors accurately calculate the distance between an object and the sensor by emitting pulsed light signals and measuring their round-trip time. This type of sensing technology features non-contact operation, high resolution, and fast response, and is widely used in autonomous driving, gesture recognition, augmented reality, robotics, and smart devices. To achieve miniaturization and low-power system integration, dToF ranging sensors often employ a single-chip design and are integrated with functional modules such as digital signal processors and high-speed timing circuits.

[0003] However, in practical applications, to achieve sufficient sensing distance and time resolution, direct time-of-flight ranging sensors require high-frequency, high-current driving of their laser emitters. This operating mode generates significant electromagnetic interference (EMI), especially under high-pulse current switching and high-speed timing drive, where the interference spectrum can easily spread to commonly used mobile communication frequency bands. If this EMI is not properly handled, it will interfere with the wireless communication modules integrated in mobile devices (such as 3G, 4G, 5G, and GPS), reducing the signal-to-noise ratio (SNR) at the receiver. This forces the system to increase transmission power or retransmission frequency to maintain normal communication, thereby reducing communication efficiency and increasing power consumption. Furthermore, there are clear regulations or testing standards (such as 3GPP and CISPR) worldwide for the electromagnetic compatibility (EMC) and communication performance of mobile communication devices. Failure to effectively suppress the EMI generated by the direct time-of-flight ranging module may result in failure to pass the corresponding tests, limiting product market access.

[0004] Current common electromagnetic interference (EMI) protection methods often employ metal shields (such as iron shields or metal cover) to cover the chip, providing physical electromagnetic shielding. While these methods are effective in reducing EMI, they also have several major drawbacks. For example, metal shields typically require additional fabrication, assembly, and soldering, increasing manufacturing costs; the physical shielding structure occupies space, hindering module miniaturization; to achieve effective shielding, the metal shield needs to be connected to a large ground plane, limiting its layout flexibility within a limited space; or the metal structure may affect package heat dissipation and overall process integration. Therefore, how to effectively suppress the EMI generated by direct time-of-flight ranging sensing modules without relying on traditional metal shields, while simultaneously considering cost, size, and system integration, has become a pressing issue in this technical field. Utility Model Content

[0005] This invention provides a sensing module that can effectively conduct electromagnetic interference to the ground through a grounding structure, thereby providing electromagnetic interference shielding for mobile devices and preventing it from affecting other surrounding electronic components. At the same time, the sensing module has a small size, low cost, and a large grounding area.

[0006] This utility model discloses a sensing module, comprising a substrate, a frame, a light-emitting component, a sensing component, a shielding structure, and a grounding structure. The frame is disposed on the substrate to form mutually isolated emitting and receiving areas. The emitting area has an emitting opening. The receiving area has a receiving opening. The light-emitting component is disposed on the substrate and located in the emitting area. The light-emitting component provides a sensing beam. The sensing component is disposed on the substrate and located in the receiving area. The sensing component receives the reflected beam. The shielding structure is connected to cover the surface of the frame. The grounding structure is disposed at the junction of the frame and the substrate, and connects the shielding structure and the substrate.

[0007] In one embodiment of this utility model, the grounding structure and the shielding structure are located on the same side surface of the frame.

[0008] In one embodiment of this utility model, the above-mentioned grounding structure is ring-shaped and surrounds the light-emitting component and the sensing component.

[0009] In one embodiment of the present invention, the shielding structure includes a conductive layer and a rust-proof layer, wherein the conductive layer is disposed between the rust-proof layer and the frame.

[0010] In one embodiment of this utility model, the shielding structure described above is connected to the outer surface of the frame.

[0011] In one embodiment of the present invention, the sensing module further includes a first anti-reflection layer, which is only connected to the top surface of the frame shielding structure.

[0012] In one embodiment of the present invention, the shielding structure includes a conductive layer and a rust-proof layer, and the rust-proof layer is connected between the conductive layer and the first anti-reflection layer.

[0013] In one embodiment of the present invention, the sensing module further includes a second anti-reflection layer connected to the inner surface of the frame in the emission area.

[0014] In one embodiment of this utility model, the shielding structure described above is connected to the inner surface of the frame.

[0015] In one embodiment of the present invention, the sensing module further includes a first anti-reflective layer, which is only connected to the top surface of the frame.

[0016] In one embodiment of the present invention, the sensing module further includes a second anti-reflection layer connected to the shielding structure.

[0017] In one embodiment of the present invention, the shielding structure includes a conductive layer and a rust-proof layer, and the rust-proof layer is connected between the conductive layer and the second anti-reflection layer.

[0018] In one embodiment of the present invention, the sensing module further includes a light-diffusing component, which is disposed on the transmission path of the sensing beam transmitted by the light-emitting component.

[0019] In one embodiment of the present invention, the sensing module further includes a lens assembly disposed on the transmission path of the reflected light beam, and the sensing component is located on the transmission path of the reflected light beam transmitted by the lens assembly.

[0020] Based on the above, the sensing module of this utility model includes a substrate, a frame, a light-emitting component, a sensing component, a shielding structure, and a grounding structure. The shielding structure is connected to cover the outer or inner surface of the frame to shield against electromagnetic interference. The grounding structure is disposed at the junction of the frame and the substrate and connects the shielding structure and the substrate to provide a grounding effect. In this way, electromagnetic interference can be effectively conducted to ground through the grounding structure, thereby providing electromagnetic interference shielding for the mobile device and preventing it from affecting other surrounding electronic components. Simultaneously, the sensing module has a small size, low cost, and a large grounding area.

[0021] To make the above-mentioned features and advantages of this utility model more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a cross-sectional schematic diagram of a sensing module according to the present invention;

[0023] Figure 2 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0024] Figure 3 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0025] Figure 4 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0026] Figure 5 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0027] Figure 6 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0028] Figure 7 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0029] Figure 8 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0030] Figure 9 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0031] Figure 10 This is a cross-sectional schematic diagram of another sensing module according to the present invention;

[0032] Figure 11 This is a cross-sectional schematic diagram of another sensing module according to the present invention.

[0033] Explanation of reference numerals in the attached figures

[0034] 10: Protective cover plate;

[0035] 100, 100A~100J: Sensing module;

[0036] 120, 120A: Frame;

[0037] 130: Light-emitting component;

[0038] 140: Sensing component;

[0039] 150, 150A: Shielding structure;

[0040] 152: Conductive layer;

[0041] 154: Rust-proof coating;

[0042] 160: Grounding structure;

[0043] 170: Light homogenizing component;

[0044] 180: Lens assembly;

[0045] 190: First anti-reflective layer;

[0046] 200: Second anti-reflective layer;

[0047] A1: Launch area;

[0048] A2: Receiving area;

[0049] L0: Stray light;

[0050] L1: Sensing beam;

[0051] L2: Reflected beam;

[0052] O1: Emission opening;

[0053] O2: Receiving opening;

[0054] S1: Outer surface;

[0055] S2: Inner surface;

[0056] S3, S4: Top surface. Detailed Implementation

[0057] Figure 1 This is a cross-sectional schematic diagram of a sensing module according to the present invention. This embodiment provides a sensing module 100, such as a ranging sensor using Direct Time of Flight (dToF) technology, for mounting in a portable electronic device (e.g., a smartphone, tablet computer) to perform ranging measurements.

[0058] The sensing module 100 includes a substrate 110, a frame 120, a light-emitting component 130, a sensing component 140, a shielding structure 150, and a grounding structure 160. The substrate 110 is, for example, a circuit board; this invention does not limit its type. The frame 120 is disposed on the substrate 110 to form mutually isolated emitting areas A1 and receiving areas A2. The emitting area A1 has an emitting opening O1, and the receiving area A2 has a receiving opening O2. The material of the frame 120 is, for example, ABS resin, plastics, polymer materials, etc., which have certain light absorption properties.

[0059] The light-emitting component 130 is disposed on the substrate 110 and located in the emission region A1. The light-emitting component 130 is, for example, a laser with high current and high frequency characteristics, used to provide a sensing beam L1 (wavelength, for example, 940 nm) to transmit through the emission opening O1. For example, the light-emitting component 130 is, for example, a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), or a laser diode (LD), but the present invention is not limited thereto.

[0060] Sensing component 140 is disposed on substrate 110 and located in receiving area A2. Sensing component 140 is, for example, a photosensing component, used to receive reflected light beam L2 through receiving opening O2 to detect the light signal reflected back by the object. Sensing component 140 is, for example, a single-photon avalanche diode (SPAD), an avalanche photodiode (APD), or a silicon photomultiplier (SiPM), but the present invention is not limited thereto.

[0061] In this embodiment, the sensing module 100 further includes a light-diffusing component 170 and a lens assembly 180. The light-diffusing component 170 is disposed on the transmission path of the sensing beam L1 transmitted by the light-emitting component 130. In this embodiment, the light-diffusing component 170 is configured to cover the emission opening O1. The light-diffusing component 170 is, for example, a light-diffusing sheet or a light-diffusing sheet, used to diffuse the light, improve the uniformity of the distribution, avoid excessively strong light spots or hot spots, and ensure a sufficient detection emission range (Field of...). This improves the overall imaging or ranging quality by enhancing light emission (FOI). On the other hand, the lens assembly 180 is positioned along the transmission path of the reflected beam L2, and the sensing component 140 is disposed on the substrate 110 and used to receive the reflected beam L2 reflected from the object back through the lens assembly 180. In this embodiment, the lens assembly 180 is configured to cover the receiving opening O2. The lens assembly 180 is, for example, a light-collecting lens or objective lens, used to provide effects such as focusing light, limiting the field of view, improving the signal-to-noise ratio, optimizing resolution, and / or adjusting ranging accuracy and distance; however, this invention is not limited to these applications.

[0062] A shielding structure 150 is connected to cover the outer surface S1 or inner surface S2 of the frame 120 to shield against electromagnetic interference (EMI), thereby providing the mobile device with EMI shielding and preventing it from affecting other surrounding electronic components. In this embodiment, the shielding structure 150 includes a conductive layer 152 and a rust-proof layer 154, with the conductive layer 152 disposed between the rust-proof layer 154 and the frame 120. The conductive layer 152 is made of a material with high conductivity, such as copper, silver, or gold, but this invention is not limited to these. The rust-proof layer 154 is made of a material such as nickel or stainless steel. In this embodiment, the layers in the shielding structure 150 can be coated and formed on the surface of the frame 120 in different ways, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), or electroplating, but this invention is not limited to these methods.

[0063] A grounding structure 160 is disposed at the junction of the frame 120 and the substrate 110, and connects the shielding structure 150 and the substrate 110 to provide a grounding effect. Specifically, the grounding structure 160 and the shielding structure 150 are located on the same side surface of the frame 120. In this embodiment, both the grounding structure 160 and the shielding structure 150 are located on the outer surface S1 of the frame 120. Furthermore, the grounding structure 160 is ring-shaped, surrounding the light-emitting component 130 and the sensing component 140. The material of the grounding structure 160 is, for example, copper, silver, or gold, but the present invention is not limited to these.

[0064] In this way, the sensing module 100 designed according to the present invention can effectively conduct electromagnetic interference to the ground through the grounding structure 160, thereby providing the mobile device with the effect of shielding electromagnetic interference and avoiding affecting other electronic components in the vicinity. At the same time, the sensing module 100 has a small size, low cost and a large grounding area.

[0065] Figure 2 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 2 The displayed sensing module 100A is similar to Figure 1 The sensing module 100 is shown. The difference between the two is that, in this embodiment, the sensing module 100A further includes a first anti-reflective layer 190, for example, a black material, connected only to the top surface S3 of the shielding structure 150, i.e., the side of the shielding structure 150 facing away from the substrate 110. Specifically, the first anti-reflective layer 190 is disposed on the surface of the anti-rust layer 154 facing away from the substrate 110. Therefore, the first anti-reflective layer 190 can absorb and attenuate stray light L0 reflected when the sensing beam L1 passes through the protective cover 10. In this way, the sensing module 100A can attenuate the intensity of stray light L0 reflected by the protective cover 10, thereby reducing the chance of stray light L0 being received by the sensing component 140, helping to reduce noise interference received by the sensing component 140, and thus improving sensing accuracy.

[0066] Figure 3 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 3 The displayed sensing module 100B is similar to Figure 2The sensing module 100A is shown. The difference between the two is that, in this embodiment, the sensing module 100B further includes a second anti-reflective layer 200, which can be the same as the first anti-reflective layer 190, for example, made of a black material. The second anti-reflective layer 200 is connected to the inner surface S2 of the frame 120. Therefore, stray light generated by the sensing beam L1 inside the frame 120 can be absorbed by the second anti-reflective layer 200. In this way, the sensing module 100B can attenuate the intensity of stray light from the sensing beam L1 inside the frame 120, thereby reducing the chance of stray light being received by the sensing component 140, helping to reduce noise interference received by the sensing component 140, and thus improving sensing accuracy.

[0067] Figure 4 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 4 The displayed sensing module 100C is similar to Figure 1 The sensing module 100 is shown. The difference between the two is that, in this embodiment, the material of the shielding structure 150A is changed to, for example, a single-layer copper-nickel alloy or other types of alloy structure to enhance the protection capability and at the same time provide the effect of shielding electromagnetic interference, but the present invention is not limited thereto.

[0068] Figure 5 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 5 The displayed sensing module 100D is similar to Figure 4 The sensing module 100C is shown. The difference between the two is that, in this embodiment, the sensing module 100D further includes a first anti-reflective layer 190, for example, a black material, connected only to the top surface S3 of the shielding structure 150A, i.e., the side of the shielding structure 150A facing away from the substrate 110. Specifically, the first anti-reflective layer 190 is disposed on the surface of the shielding structure 150A facing away from the substrate 110. Therefore, the first anti-reflective layer 190 can absorb and attenuate stray light reflected when the sensing beam L1 passes through the protective cover. In this way, the sensing module 100D can attenuate the intensity of stray light reflected by the protective cover, thereby reducing the chance of stray light being received by the sensing component 140, helping to reduce noise interference received by the sensing component 140, and thus improving sensing accuracy. In another preferred embodiment, it can be further configured as follows... Figure 3 The second anti-reflective layer 200 is connected to the inner surface S2 of the frame 120, so that stray light generated by the sensing beam L1 inside the frame 120 is absorbed by the second anti-reflective layer 200. In this way, the sensing module 100D can attenuate the intensity of stray light of the sensing beam L1 inside the frame 120, thereby reducing the chance of stray light being received by the sensing component 140, which helps to reduce noise interference received by the sensing component 140 and thus improve sensing accuracy. However, the present invention is not limited to this.

[0069] Figure 6 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 6 The displayed sensing module 100E is similar to Figure 1 The sensing module 100 is shown. The difference between the two is that, in this embodiment, the shielding structure 150 is connected to cover the inner surface S2 of the frame 120, wherein the conductive layer 152 is disposed between the anti-rust layer 154 and the frame 120. Furthermore, since the grounding structure 160 is disposed at the junction of the frame 120 and the substrate 110, and is connected between the shielding structure 150 and the substrate 110, in this embodiment, both the grounding structure 160 and the shielding structure 150 are located on the inner surface S2 of the frame 120. In this way, the size of the sensing module 100E can be reduced while maintaining good electromagnetic interference shielding.

[0070] Figure 7 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 7 The displayed sensing module 100F is similar to Figure 6 The sensing module 100E is shown. The difference between the two is that, in this embodiment, the sensing module 100F further includes a first anti-reflective layer 190, for example, a black material, connected only to the top surface S4 of the frame 120, i.e., the side of the frame 120 facing away from the substrate 110. Therefore, the first anti-reflective layer 190 can absorb and attenuate stray light L0 reflected when the sensing beam L1 passes through the protective cover 10. In this way, the sensing module 100F can attenuate the intensity of stray light L0 reflected by the protective cover 10, thereby reducing the chance of stray light L0 being received by the sensing component 140, helping to reduce noise interference received by the sensing component 140, and thus improving sensing accuracy.

[0071] Figure 8 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 8 The displayed sensing module 100G is similar to Figure 7The sensing module 100F is shown. The difference between the two is that, in this embodiment, the sensing module 100G further includes a second anti-reflective layer 200, which can be the same as the first anti-reflective layer 190, for example, made of a black material. The second anti-reflective layer 200 is connected to the inner surface S2 of the frame 120. Specifically, the second anti-reflective layer 200 is disposed on the anti-rust layer 154 located in the emitting area A1. Therefore, the first anti-reflective layer 190 can absorb and attenuate stray light generated by the sensing beam L1 inside the frame 120. In this way, the sensing module 100G can attenuate the stray light intensity of the sensing beam L1 inside the frame 120, thereby reducing the chance of stray light being received by the sensing component 140, helping to reduce noise interference received by the sensing component 140, and thus improving sensing accuracy.

[0072] Figure 9 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 9 The displayed sensing module 100H is similar to Figure 6 The sensing module 100E is shown. The difference between the two is that, in this embodiment, the material of the frame 120A is, for example, a material with anti-reflective properties, so that stray light L0 reflected when the sensing beam L1 passes through the protective cover 10 is absorbed and attenuated in the frame 120A. In this way, the sensing module 100H can attenuate the intensity of stray light L0 reflected by the protective cover 10, thereby reducing the chance of stray light L0 being received by the sensing component 140, helping to reduce noise interference received by the sensing component 140, and thus improving sensing accuracy. In another preferred embodiment, it can be further configured as follows... Figure 8 The second anti-reflective layer 200 is connected to the inner surface S2 of the frame 120A, so that stray light generated by the sensing beam L1 inside the frame 120A is absorbed by the second anti-reflective layer 200. In this way, the sensing module can attenuate the intensity of stray light of the sensing beam L1 inside the frame 120, thereby reducing the chance of stray light being received by the sensing component 140, which helps to reduce noise interference received by the sensing component 140 and thus improve sensing accuracy. However, the present invention is not limited to this.

[0073] Figure 10 This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 10 The displayed sensing module 100I is similar to Figure 6 The sensing module 100E is shown. The difference between the two is that, in this embodiment, the material of the shielding structure 150A is changed to, for example, a single-layer copper-nickel alloy or other types of alloy structure to enhance the protection capability and at the same time provide the effect of shielding electromagnetic interference, but the present invention is not limited thereto.

[0074] Figure 11This is a cross-sectional schematic diagram of another sensing module according to the present invention. Figure 11 The displayed sensing module 100J is similar to Figure 10 The sensing module 100J is shown. The difference between the two is that, in this embodiment, the sensing module 100J further includes a first anti-reflective layer 190, for example, a black material, connected only to the top surface S4 of the frame 120A, i.e., the side of the frame 120A facing away from the substrate 110. Therefore, the first anti-reflective layer 190 allows stray light reflected when the sensing beam L1 passes through the protective cover to be absorbed by the first anti-reflective layer 190. In this way, the sensing module 100J can attenuate the intensity of stray light reflected by the protective cover, thereby reducing the chance of stray light being received by the sensing component 140, helping to reduce noise interference received by the sensing component 140, and thus improving sensing accuracy. In another preferred embodiment, it can be further configured as follows... Figure 8 The second anti-reflective layer 200 shown is connected to the inner surface S2 of the frame 120, so that stray light generated by the sensing beam L1 inside the frame 120 is absorbed by the second anti-reflective layer 200. In this way, the light absorption capacity can be increased to reduce stray light interference, thereby improving the sensing accuracy, but the present invention is not limited thereto.

[0075] In summary, the sensing module of this invention includes a substrate, a frame, a light-emitting component, a sensing component, a shielding structure, and a grounding structure. The shielding structure is connected to cover the outer or inner surface of the frame to shield against electromagnetic interference. The grounding structure is disposed at the junction of the frame and the substrate and connects the shielding structure and the substrate to provide a grounding effect. In this way, electromagnetic interference can be effectively conducted to ground through the grounding structure, thereby providing electromagnetic interference shielding for the mobile device and preventing it from affecting other surrounding electronic components. Simultaneously, the sensing module has a small size, low cost, and a large grounding area.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A sensing module, characterized in that, include: substrate; A frame is disposed on the substrate to form a mutually isolated transmitting area and a receiving area, the transmitting area having a transmitting opening and the receiving area having a receiving opening; A light-emitting component is disposed on the substrate and located in the emission region, the light-emitting component being used to provide a sensing beam; A sensing component is disposed on the substrate and located in the receiving area, the sensing component being used to receive a reflected light beam; A shielding structure is connected to cover the surface of the frame; as well as A grounding structure is disposed at the junction of the frame and the substrate, and is connected between the shielding structure and the substrate.

2. The sensing module according to claim 1, characterized in that, The grounding structure and the shielding structure are located on the same side surface of the frame.

3. The sensing module according to claim 1, characterized in that, The grounding structure is ring-shaped and surrounds the light-emitting component and the sensing component.

4. The sensing module according to claim 1, characterized in that, The shielding structure includes a conductive layer and a rust-proof layer, with the conductive layer disposed between the rust-proof layer and the frame.

5. The sensing module according to claim 1, characterized in that, The shielding structure is connected to the outer surface of the frame.

6. The sensing module according to claim 5, characterized in that, The sensing module also includes a first anti-reflective layer, which is connected only to the top surface of the shielding structure.

7. The sensing module according to claim 6, characterized in that, The shielding structure includes a conductive layer and a rust-proof layer, and the rust-proof layer is connected between the conductive layer and the first anti-reflective layer.

8. The sensing module according to claim 5, characterized in that, The sensing module also includes a second anti-reflective layer connected to the inner surface of the frame in the emission area.

9. The sensing module according to claim 1, characterized in that, The shielding structure is connected to the inner surface of the frame.

10. The sensing module according to claim 9, characterized in that, The sensing module also includes a first anti-reflective layer, which is only connected to the top surface of the frame.

11. The sensing module according to claim 9, characterized in that, The sensing module also includes a second anti-reflective layer connected to the shielding structure.

12. The sensing module according to claim 11, characterized in that, The shielding structure includes a conductive layer and a rust-proof layer, and the rust-proof layer is connected between the conductive layer and the second anti-reflective layer.

13. The sensing module according to claim 1, characterized in that, The sensing module further includes a light-diffusing component, which is disposed on the transmission path of the sensing beam transmitted by the light-emitting component.

14. The sensing module according to claim 1, characterized in that, The sensing module further includes a lens assembly disposed on the transmission path of the reflected light beam, and the sensing assembly is located on the transmission path of the reflected light beam transmitted by the lens assembly.

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